CN102238809B - Flexible printed circuit (FPC) hollowed board and manufacturing method thereof - Google Patents
Flexible printed circuit (FPC) hollowed board and manufacturing method thereof Download PDFInfo
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- CN102238809B CN102238809B CN 201010160293 CN201010160293A CN102238809B CN 102238809 B CN102238809 B CN 102238809B CN 201010160293 CN201010160293 CN 201010160293 CN 201010160293 A CN201010160293 A CN 201010160293A CN 102238809 B CN102238809 B CN 102238809B
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Abstract
The invention provides a flexible printed circuit (FPC) hollowed board and a manufacturing method thereof. The manufacturing method of the FPC hollowed board sequentially comprises the following steps of: S1, boring: boring a via hole in a double-faced copper foil, wherein the via hole is positioned in an area for manufacturing fingers of double-faced copper foil; S2, blackening the via hole and plating copper: blackening the via hole in the double-faced copper foil and plating copper; S3, manufacturing a circuit and the fingers: forming the circuit and a first finger on one surface of the double-faced copper foil and forming a second finger on the other surface of the double-faced copper foil; S4, adhering a covering film: adhering the covering film to the copper foil surface of the double-faced copper foil where the circuit is formed; and S5, punching: and punching off the base material at the first finger and the base material at the second finger to form a hollowed board. The FPC hollowed board has the advantages that the circuit is difficult to damage, the circuit is excellent and product yield is high.
Description
Technical field
The present invention relates to a kind of hollowed-out board, relate in particular to hollowed-out board of a kind of flexible print circuit board and preparation method thereof.
Background technology
FPC (flexible print circuit board) is widely used in the various electronic products owing to it has the good advantages such as bending property.Portions of electronics product needed FPC is hollowed-out board, and the FPC hollowed-out board is to be the flexible print circuit board of hollow out between the fingerboard left-hand seat refers to.The hollow out finger needs upper tin and the hollow out installing space is provided, so that it is socketed on other parts.The FPC hollowed-out board not only will be realized two sides good welds performance, also needs to have good assigning and connects form, and therefore, the FPC hollowed-out board has very high requirement to the evenness of unsettled finger.
In order to realize the welding of FPC hollowed-out board and to assign the good serviceability that connects, at present, normally adopting pure copper foil is that raw material are made the FPC hollowed-out board, and it is as follows that it makes flow process: pure copper foil severing → boring → paste epiphragma A → gland film A → baking → circuit in the one side of Copper Foil to press dry film → developments → etching → paste the zinc-plated → punching press of epiphragma B → gland film B → baking → pointing → entirely examine at the another side of Copper Foil; As shown in Figure 1, it is the structural representation of a kind of FPC hollowed-out board in the prior art.
Wherein, boring mainly is at the location hole of Copper Foil brill with the compound usefulness of epiphragma; The main circuit etching of etching and hollow out finger; Punching press is for punch extermal form; Epiphragma A and epiphragma B are the epiphragma with opening; epiphragma A is mainly used in supporting Copper Foil so that it forms circuit; epiphragma A need to reserve at the making hollow out finger place of Copper Foil opening accordingly to carry out the postorder processing simultaneously, and epiphragma B is used for the circuit that forms is protected.But owing to the characteristic of the intrinsic frivolous and highly-flexible of pure copper foil, following problem appears in FPC hollowed-out board easily in the manufacturing process of reality: 1, epiphragma is separately pasted on the two sides, and the registration that is fitted in the two sides is difficult for assurance; 2, it forms circuit again for pasting first epiphragma A.And has opening on the epiphragma, the property effect epiphragma A of the high jump that epiphragma forms at the hollow out finger place of windowing and the frivolous highly-flexible of Copper Foil and the applying of Copper Foil, and so that when the laminated photosensitive dry film, form easily bubble at the jump position, and then affect the shaping of circuit, also can in other process that circuit is shaped, affect the making of circuit, and then cause follow-up circuit damaged bad, so that reduce the qualification rate of product.
3, after circuit is shaped fully, unsettled finger in subsequent handling is made easily distortion wrinkle occurs unbuttoning or divest one's upper garment and pull etc. bad.
In a word, because the soft frivolous characteristic of Copper Foil, and the opening of epiphragma, cause the evenness of the FPC hollowed-out board that pure copper foil makes impaired, thereby greatly affected circuit, and then product percent of pass is a greater impact.
Summary of the invention
Technical problem to be solved by this invention is that the easily lower defective of impaired, yields of wrinkle, circuit appears in FPC hollowed-out board for prior art easily, and a kind of FPC hollowed-out board that is difficult for wrinkle, rate of good quality rate that circuit is good is provided.
The technical solution adopted for the present invention to solve the technical problems provides a kind of manufacture method of FPC hollowed-out board, and it may further comprise the steps successively:
S1, boring: bore via at two-sided Copper Foil, described via is positioned at the zone that is used for making finger on the Copper Foil, and it is used for the finger on the Copper Foil of conducting two sides;
S2, black hole and copper facing: the via on the two-sided Copper Foil is deceived hole and copper facing;
S3, making circuit and finger: the one side at two-sided Copper Foil forms circuit and the first finger, and forms second finger at the another side of two-sided Copper Foil;
S4, applying epiphragma: at the copper-clad surface that is formed with circuit of the two-sided Copper Foil epiphragma of fitting;
S5, punching press: the base material between the first finger and the base material punching press between the second finger are fallen to form hollowed-out board.
In the manufacture method of above-mentioned FPC hollowed-out board, the two-sided Copper Foil that also is included in the epiphragma of will having fitted between step S4 and the step S5 toasts.
In the manufacture method of above-mentioned FPC hollowed-out board, also be included between step S4 and the step S5 and carry out surface treatment to form conductive protecting layer on the top layer of finger.
In the manufacture method of above-mentioned FPC hollowed-out board, described conductive protecting layer is the tin layer.
In the manufacture method of above-mentioned FPC hollowed-out board, described copper facing is hole plating or plate plating.
In the manufacture method of above-mentioned FPC hollowed-out board, described step S3 comprises successively and press dry film, exposure, development, and etching.
In the manufacture method of above-mentioned FPC hollowed-out board, described etching comprises that etching forms circuit, the first finger, reaches second finger.
In the manufacture method of above-mentioned FPC hollowed-out board, also comprise full inspection after the described step S5.
In order further to solve the problems of the technologies described above, the present invention also provides a kind of FPC hollowed-out board, it comprises base material and is arranged on the Copper Foil on base material two sides, wherein a Copper Foil comprises circuit and the first finger, the another side Copper Foil comprises second finger, described the first finger and second finger all are at least two, also be provided with the via for conducting the first finger and second finger on the described hollowed-out board, be formed with on the copper-clad surface of circuit and be fitted with epiphragma, and between the first finger and be hollow out between the second finger.
In above-mentioned FPC hollowed-out board, be provided with the tin layer on the top layer of described the first finger and second finger.
FPC hollowed-out board provided by the invention and preparation method thereof, it is by the support of the base material of two-sided Copper Foil, can the road moulding of advanced line, and the epiphragma of fitting again, avoid high jump that the opening of epiphragma forms on fitting and the impact of circuit moulding, avoided the impaired of the wrinkle of hollowed-out board and circuit; It arranges via with the finger on conducting two sides at two-sided Copper Foil, thereby the FPC hollowed-out board that provides has been avoided circuit wrinkle and impaired, has good circuit and yields.
Description of drawings
Fig. 1 is the schematic diagram of the FPC hollowed-out board that pure copper foil is made in the prior art;
Fig. 2 is the structural representation in the front of FPC hollowed-out board in the preferred embodiment provided by the invention;
Fig. 3 is the structural representation at the back side of FPC hollowed-out board in the preferred embodiment provided by the invention.
Embodiment
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The present invention is by adopting two-sided Copper Foil to make the FPC hollowed-out board, and the circuit of having avoided traditional employing pure copper foil to make the FPC hollowed-out board is subject to undermine the lower defective of yields.Referring to Fig. 2 to 3, Fig. 2 is the structural representation in the front of FPC hollowed-out board in one embodiment of the invention, and Fig. 3 is the structural representation at the FPC hollowed-out board back side among the embodiment.The manufacture method of FPC hollowed-out board provided by the invention is elaborated in conjunction with Fig. 2 and Fig. 3, and in a preferred embodiment, its making step is as follows successively:
At first, be that two-sided Copper Foil cuts with raw material, raw material are generally web-like, and it is cut into individual; Two-sided Copper Foil after cutting is holed, bore location hole and via 4, for example hole by NC, when being used for postorder applying epiphragma 5, location hole is convenient to contraposition, via 4 is positioned at the zone that is used for making finger on the two-sided Copper Foil, in another embodiment of the present invention, also can only bore via after cutting, and epiphragma applying location is that the sign on the product is located after the employing etching, or adopts alternate manner realization epiphragma applying location in the prior art; Via 4 is deceived hole and copper facing, because base material 6 is nonconducting, by black hole and copper facing the hole wall of via 4 also can be conducted electricity, thereby the finger on the Copper Foil on two sides is conducted, preferably, copper facing is hole plating or plate plating; Make circuit 1 and finger: namely making needs the wire that is electrically connected on the FPC plate, its manufacturing process steps is same as the prior art, namely press dry successively film, exposure, develop, and etching, but the present invention only forms the circuit 1 of circuit at a facet etch of two-sided Copper Foil, the one side with circuit-line 1 (being the front of product) at two-sided Copper Foil etches the first finger 2, etch second finger 3 in the one side (being the reverse side of product) without circuit-line 1, the circuit 1 in two-sided Copper Foil front, the moulding of the second finger 3 of the first finger 2 and reverse side thereof is carried out simultaneously, and its technique is simple; Applying epiphragma 5: will be posted on the face with circuit 1 of two-sided Copper Foil with the epiphragma 5 of opening, and gland film 5 is fitted with protection circuit 1 epiphragma 5 and two-sided Copper Foil; Punching press: finger all is at least two in the hollowed-out board, referring to Fig. 2 and Fig. 3, this step is removed the base material 6 between the first finger 2, also the base material 6 between the second finger 3 is removed, and first the finger 2 with second finger 3 between can be electrically connected conducting by via 4, thereby formed hollowed-out board; Then entirely examine and get final product.
Preferably, behind the applying epiphragma, before the punching press, two-sided Copper Foil is toasted, thereby strengthen curing agent epiphragma 5 and two-sided Copper Foil are better fitted.Further preferred, before the 5 rear punching presses of applying epiphragma, carry out surface treatment on the top layer of the first finger 2 and second finger 3 respectively, for example by zinc-plated or turmeric, preferred to form conductive protecting layer on its surface, adopt tin coating.
FPC hollowed-out board provided by the invention namely is made into by said method, the Copper Foil that it comprises base material 6 and is arranged on base material 6 two sides, namely adopt two-sided Copper Foil to make raw material, the thickness of the thickness of Copper Foil and base material 6 is selected dissimilar two-sided Copper Foils according to user's demand, and the thickness of Copper Foil is 35 microns usually.Wherein a Copper Foil comprises circuit 1 and the first finger 2, and the another side Copper Foil comprises that second finger 3, the first fingers 2 and second finger 3 all are at least two to form hollowed-out board.Usually, the first finger 2 and second finger 3 are positioned at the same position place on the two sides of two-sided Copper Foil, and namely both positions are corresponding.Also comprise the via 4 for conducting the first finger 2 and second finger 3 on the hollowed-out board, and the base material 6 of the first finger between 2 is by hollow out, equally, the base material 6 between the second finger 3 has been removed to form hollowed-out board, is fitted with the epiphragma 5 with opening on the copper-clad surface with circuit 1.
In the present invention, positive etched remaining circuit 1 of Copper Foil and the first finger 2, the Copper Foil of reverse side is etched on a large scale, only the Copper Foil at remaining second finger 3 places; The finger mutual conduction on two sides, thus guaranteed that product can be electrically connected with other product.
The present invention forms first the circuit epiphragma of fitting again, and they are different from method and principle that pure copper foil is made the FPC hollowed-out board; It forms circuit at single face, and at the single-sided lamination epiphragma, and bore via at finger, the making of its manufacture method and principle and double sided board and principle are also different, and (double sided board forms circuit on the two sides, two sides applying epiphragma, punching makes the two sides line conduction at the pad place).
In a word, the present invention adopts two-sided Copper Foil to do raw material, thereby can form first circuit 1 epiphragma 5 of only fitting again, the support of base material 6 is so that circuit 1 is difficult for impaired, and at finger via 4 is set, thereby in the simple while of manufacture craft, had both realized the FPC hollowed-out board, also effectively avoid circuit impaired, it has improved the yields of FPC hollowed-out board greatly.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the manufacture method of the hollowed-out board of a flexible print circuit board is characterized in that, may further comprise the steps successively:
S1, boring: bore via at two-sided Copper Foil, described via is positioned at the zone that is used for making finger on the Copper Foil, and it is used for the finger on the Copper Foil of conducting two sides;
S2, black hole and copper facing: the via on the two-sided Copper Foil is deceived hole and copper facing;
S3, making circuit and finger: the one side at two-sided Copper Foil forms circuit and the first finger, and forms second finger at the another side of two-sided Copper Foil;
S4, applying epiphragma: at the copper-clad surface that is formed with circuit of the two-sided Copper Foil epiphragma of fitting;
S5, punching press: the base material between the first finger and the base material punching press between the second finger are fallen to form hollowed-out board.
2. the manufacture method of hollowed-out board as claimed in claim 1 is characterized in that, the two-sided Copper Foil that also is included in the epiphragma of will having fitted between step S4 and the step S5 toasts.
3. the manufacture method of hollowed-out board as claimed in claim 1 is characterized in that, also is included between step S4 and the step S5 to carry out surface treatment to form conductive protecting layer on the top layer of the first finger and second finger.
4. the manufacture method of hollowed-out board as claimed in claim 3 is characterized in that, described conductive protecting layer is the tin layer.
5. the manufacture method of hollowed-out board as claimed in claim 1 is characterized in that, described copper facing is hole plating or plate plating.
6. the manufacture method of hollowed-out board as claimed in claim 1 is characterized in that, described step S3 comprises successively and press dry film, exposure, development, and etching.
7. the manufacture method of hollowed-out board as claimed in claim 6 is characterized in that, described etching comprises that etching forms circuit, the first finger, reaches second finger.
8. the manufacture method of hollowed-out board as claimed in claim 1 is characterized in that, also comprises full inspection after the described step S5.
9. the hollowed-out board of a flexible print circuit board, it is characterized in that, comprise base material and be arranged on the Copper Foil on base material two sides, wherein a Copper Foil comprises circuit and the first finger, the another side Copper Foil comprises second finger, and described the first finger and second finger all are at least two, also is provided with the via for conducting the first finger and second finger on the described hollowed-out board, be formed with on the copper-clad surface of circuit and be fitted with epiphragma, and between the first finger and be hollow out between the second finger.
10. hollowed-out board as claimed in claim 9 is characterized in that, is provided with the tin layer on the top layer of described the first finger and second finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010160293 CN102238809B (en) | 2010-04-23 | 2010-04-23 | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010160293 CN102238809B (en) | 2010-04-23 | 2010-04-23 | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN102238809A CN102238809A (en) | 2011-11-09 |
| CN102238809B true CN102238809B (en) | 2013-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010160293 Active CN102238809B (en) | 2010-04-23 | 2010-04-23 | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869756B (en) * | 2015-06-10 | 2018-01-23 | 金达(珠海)电路版有限公司 | A kind of preparation method of hollowed-out board |
| CN106604570A (en) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | Flexible laminated board and making method thereof |
| CN107046092B (en) * | 2017-03-04 | 2019-05-31 | 浙江大学 | Wearable thermoelectric generator and preparation method thereof with engraved structure substrate |
| CN106817850A (en) * | 2017-03-06 | 2017-06-09 | 深圳市三德冠精密电路科技有限公司 | The preparation method of FPC cover layers |
| WO2019095287A1 (en) * | 2017-11-17 | 2019-05-23 | 盐城天顺机械科技有限公司 | Fpc provided with heat dissipation structure and used for backlight source |
| CN108495452B (en) * | 2018-03-27 | 2021-04-30 | 厦门市铂联科技股份有限公司 | Manufacturing method of flexible circuit board with suspended plugging fingers and product |
| CN108521724B (en) * | 2018-04-08 | 2020-01-03 | 深圳市比亚迪电子部品件有限公司 | Manufacturing method of high-flexibility high-density flexible printed circuit board |
| CN111328203B (en) * | 2020-03-16 | 2023-11-03 | 深圳市实锐泰科技有限公司 | Method for manufacturing thick copper hollowed-out golden finger plug circuit |
| CN111263525B (en) * | 2020-03-23 | 2021-04-20 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201039586Y (en) * | 2006-12-02 | 2008-03-19 | 比亚迪股份有限公司 | A flexible line board for preventing gold fingers from breaking |
| CN201234406Y (en) * | 2008-06-27 | 2009-05-06 | 比亚迪股份有限公司 | Flexible printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036644A (en) * | 1998-07-17 | 2000-02-02 | Canon Inc | Double-sided flexible printed board |
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- 2010-04-23 CN CN 201010160293 patent/CN102238809B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201039586Y (en) * | 2006-12-02 | 2008-03-19 | 比亚迪股份有限公司 | A flexible line board for preventing gold fingers from breaking |
| CN201234406Y (en) * | 2008-06-27 | 2009-05-06 | 比亚迪股份有限公司 | Flexible printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2000-36644A 2000.02.02 |
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Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150910 |
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Effective date of registration: 20150910 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: 518118 Pingshan Road, Pingshan Town, Shenzhen, Guangdong, No. 3001, No. Patentee before: Biyadi Co., Ltd. |
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Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |