CN111328203B - Method for manufacturing thick copper hollowed-out golden finger plug circuit - Google Patents
Method for manufacturing thick copper hollowed-out golden finger plug circuit Download PDFInfo
- Publication number
- CN111328203B CN111328203B CN202010180804.XA CN202010180804A CN111328203B CN 111328203 B CN111328203 B CN 111328203B CN 202010180804 A CN202010180804 A CN 202010180804A CN 111328203 B CN111328203 B CN 111328203B
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- Prior art keywords
- golden finger
- punching
- finger plug
- hollowed
- copper
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 96
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 96
- 239000010949 copper Substances 0.000 title claims abstract description 96
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004080 punching Methods 0.000 claims abstract description 80
- 238000005530 etching Methods 0.000 claims abstract description 45
- 238000005498 polishing Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 11
- 244000137852 Petrea volubilis Species 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 9
- 230000002829 reductive effect Effects 0.000 claims description 7
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 19
- 239000010410 layer Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000001151 other effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a thick copper hollowed-out golden finger plug circuit, which comprises the following steps: selecting a thick copper light copper plate as a copper plate base material for manufacturing a hollowed-out golden finger plug circuit board; manufacturing a hollowed-out golden finger plug by adopting a mode of combining etching and punching indication lines and punching; polishing the punched golden finger plug; the invention provides a method for manufacturing a thick copper hollowed-out golden finger plug circuit, which comprises the steps of firstly etching, and etching a part of thickness at a punching and cutting position to form punching indication lines; and then, the golden finger plug in the thick copper area is manufactured by adopting a punching and sand paper polishing mode instead of an etching mode, so that the problems of large side etching or line breakage and the like caused by directly etching the golden finger plug are effectively avoided, and the reliability of manufacturing the hollowed golden finger plug line is effectively improved.
Description
Technical Field
The invention relates to the technical field of manufacturing of gold finger plug lines of printed circuit boards, in particular to a manufacturing method of a thick copper hollowed-out gold finger plug line.
Background
The thickness of copper layer is more than or equal to 2OZ (70 microns), namely the copper circuit board is regarded as thick, on special electronic devices such as some heavy current, high heat dissipation connectors, etc., the copper thickness requirement of the thick copper circuit board, especially circuit board golden finger plug position is thicker, the thick copper flexible circuit board is great in the difficulty when making the golden finger plug of fretwork, its product characteristics mainly include two points: one is thick copper, and the other is a hollowed golden finger.
At present, a golden finger plug for thick copper is generally manufactured by directly pasting a photosensitive film, developing, exposing and etching, and has the following defects:
(1) The copper is thicker, so that problems such as sinking, wrinkling and the like are easy to occur when a photosensitive film is attached;
(2) Thick copper is etched, and the golden finger needs to be hollowed out, so that the problems of large side etching, even line breakage and the like are easy to generate during etching;
(3) The cost of etching liquid is high, and the cost is increased by times when thick copper is etched.
Therefore, the inventor provides a method for manufacturing a thick copper hollowed-out golden finger plug circuit, which solves the problems of sinking, wrinkling, large side etching, breakage, high processing cost and the like generated in the direct etching manufacturing process of the thick copper hollowed-out golden finger plug.
Disclosure of Invention
The invention aims to provide a method for manufacturing a thick copper hollowed-out golden finger plug circuit, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a method for manufacturing a thick copper hollowed-out golden finger plug circuit comprises the following steps:
s1, selecting a thick copper light copper plate as a copper plate base material for manufacturing a hollowed-out golden finger plug circuit board;
s2, manufacturing a hollowed-out golden finger plug by adopting a mode of combining etching and punching indication lines and punching;
s3, polishing the punched golden finger plug.
The adoption of the light copper plate is convenient for coating a photosensitive wet film, is convenient for etching and punching, and forms an insulating layer and an adhesive layer in a mode of pasting a cover film before a final circuit can be reprocessed; the method comprises the steps of manufacturing a hollowed golden finger plug by adopting a mode of combining etching and punching indication lines and punching, namely dividing the manufacturing of the golden finger plug into two steps, firstly etching the indication lines for reducing the copper thickness so as to facilitate punching, setting auxiliary positioning indication of punching and ensuring punching precision; polishing the punched golden finger plug, adopting a polishing mode to replace an etching mode, namely adopting a physical mode to replace a chemical mode, preventing excessive concave etching of a circuit caused by multiple times of etching and the like, and ensuring the smoothness of the golden finger.
As still further aspects of the invention: s2 adopt the mode that the die-cut pilot line of etching and die-cut combine together to make fretwork golden finger plug includes the step:
s201, copper is reduced at the position of the punching lower cutter contour line in an etching mode, so that a punching indication line is formed;
s202, cutting the die along the die-cutting indication line to form the golden finger plug.
As still further aspects of the invention: and S201, copper is reduced at the position of the punching lower cutter contour line in an etching mode, and the step of forming the punching indication line comprises the following steps:
s2011, silk-screen printing photosensitive wet films on the upper surface and the lower surface of a copper plate substrate;
s2012, performing exposure windowing on the wet film of the punching lower cutter surface along the contour line of the punching lower cutter, and performing full exposure on the other surface;
s2013, developing the exposure wet film to form a developed pattern;
s2014, etching and copper reduction is carried out on the copper plate base material after the development treatment, and punching indication lines are formed;
and S2015, removing the film after etching.
As still further aspects of the invention: and S2012, performing exposure windowing of 0.1mm on the wet film of the die-cut lower knife surface along the contour line of the die-cut lower knife, and performing full exposure on the wet film on the other surface.
As still further aspects of the invention: and S2014, etching the developed copper plate substrate to remove 1/3 copper of the total copper plate substrate thickness to form a punching indication line, and controlling the tolerance of the punching indication line to be within +/-10% of a standard value.
As still further aspects of the invention: and S202, stamping by using a stamping machine with the weight of more than 20 tons along the punching indication line to form the golden finger plug.
As still further aspects of the invention: and S1, selecting a thick copper light copper plate with the thickness larger than 70 microns as a copper plate base material for manufacturing the hollowed-out golden finger plug circuit board.
As still further aspects of the invention: and S3, polishing the punched golden finger plug, polishing a copper surface towards the pointing direction of the golden finger plug by adopting sand paper with more than 1200 meshes, and removing burrs and flanging.
Compared with the prior art, the method adopts a punching mode to replace the direct etching to manufacture the hollowed-out golden finger plug, but simultaneously designs a flow for etching the punching indication line before punching because the copper base material is thick copper, adopts the etching mode to manufacture the punching indication line, realizes the reduction of the copper thickness at the position to be punched firstly, and then carries out the manufacturing method of punching, and prevents the damage of the direct punching of the golden finger plug and the damage of the punching cutter caused by the excessive copper thickness; in the punching process, due to the extrusion, friction and other effects between the copper plate and the punching cutter, the problems of burrs, flanging and the like of the copper plate at the punching position can be caused, so that the fine sand paper with the particle size of more than 1200 meshes is adopted for polishing, and the adverse problems of burrs, flanging and the like can be effectively removed; therefore, the problems of overlarge side erosion, breakage and the like of the golden finger plug are effectively solved, and the reliability of manufacturing the hollowed golden finger plug circuit is effectively improved.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing a thick copper hollowed-out golden finger plug circuit.
Fig. 2 is a schematic cross-sectional structure of a photosensitive wet film on two sides of a bare copper plate in a method for manufacturing a thick copper hollowed-out golden finger plug circuit.
Fig. 3 is a schematic cross-sectional structure of a thick copper hollowed-out golden finger plug circuit after development in the manufacturing method.
Fig. 4 is a schematic cross-sectional structure of a thick copper hollowed-out gold finger plug circuit after etching in the manufacturing method.
Fig. 5 is a schematic cross-sectional structure of a thick copper hollowed-out golden finger plug circuit after film removal in the manufacturing method.
Fig. 6 is a schematic diagram of a cross-sectional structure of a thick copper hollowed-out golden finger plug circuit after punching in the manufacturing method.
Fig. 7 is a schematic plan view of a thick copper hollowed-out golden finger plug circuit manufacturing method, in which the punched area is removed after punching.
Wherein: 1. a light copper plate; 11. punching the position; 12. punching out the area; 13. a golden finger plug; 2. wet film; 21. a wet film tank; 22. and punching the indication line.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, as the term "and/or" as used in the description of the invention and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.
Referring to figures 1 to 7 of the drawings,
a method for manufacturing a thick copper hollowed-out golden finger plug circuit comprises the following steps:
(1) The base material is selected from:
selecting a thick copper light copper plate base material: as the copper plate base material 1 for manufacturing the circuit board with the hollowed-out golden finger plug, a layer of light copper plate without a resin layer is adopted as a raw material for manufacturing instead of the copper-clad plate, and a covering film can be used as an insulating protective layer in the follow-up process;
(2) Manufacturing punching indication lines:
1) Silk-screen printing photosensitive wet films 2 on the upper surface and the lower surface of the light copper plate;
2) Making an exposure window of 0.1mm on the front surface of the punching cutter, and fully exposing the photosensitive wet film on the back surface of the punching cutter;
3) Developing the photosensitive wet film at the windowed position by development to form a developing tank 21;
4) Then, copper is reduced by etching, so that a concave etched line at the punching and cutting knife, namely a punching indicating line 22 is formed;
5) Etching to reduce copper generally etches 1/3 of the total copper thickness, and after etching, controlling the line tolerance of the punching indication line 22 to be within +/-10% of a standard value;
6) And (5) film removal after etching.
(3) Punching a golden finger plug:
by adopting the flow and the manufacturing method, the copper thickness at the lower cutter is reduced, the lower cutter indication line is given, and a punching mode is adopted to replace etching to form punching grooves;
further, a hollowed-out golden finger plug is manufactured in a punching mode, and a golden finger hypergraph is etched instead of a chemical etching mode;
generally, punching thick copper requires punching using a heavy pressure punch of 20 tons or more; and punching according to the punching indication line to form a punching position 11, and removing the punching area 12 to form the golden finger plug 13 after punching is finished.
(4) Polishing the golden finger:
after punching, polishing copper surfaces outwards towards the golden finger plug 13 by using fine sand paper with the particle size of more than 1200 meshes, and particularly polishing the positions of the golden finger plug 13;
polishing to remove burrs, flanging and the like, and then carrying out circuit etching manufacture by combining the front and back cover films of the light copper plate with the golden finger plug 13.
The working principle of the invention is as follows: the method adopts a punching mode to replace direct etching to manufacture the hollowed golden finger, but simultaneously designs a manufacturing method for etching punching indication lines before punching because of the thick copper plate golden finger, so that the copper thickness of the position to be punched is reduced, and then the manufacturing method of punching is carried out; namely, the position of the lower cutter to be punched is etched to remove a part of thickness by adopting a mode of etching, so that the thickness is reduced for the subsequent punching lower cutter, and a punched indication line is provided; the golden finger plug for manufacturing the thick copper area is manufactured by adopting a punching and sand paper polishing mode instead of an etching mode, so that the problems of large side etching or line breakage and the like caused by etching are effectively avoided; after punching, due to the extrusion, friction and other effects between the copper plate and the punching cutter, the problems of burrs, flanging and the like of the copper plate at the punching position can be caused, so that the fine sand paper with the particle size of more than 1200 meshes is adopted for polishing, and the adverse problems of burrs, flanging and the like can be effectively removed; therefore, the problems of overlarge side erosion, breakage and the like of the golden finger plug are effectively solved, and the reliability of manufacturing the hollowed golden finger plug circuit is effectively improved.
If not explained specifically, the "front side" and "back side" of the copper plate substrate surface in the present specification refer to the nouns defined by referring to the direction of the punching and cutting knife, the copper plate substrate surface corresponding to the direction of the punching and cutting knife is the "front side", and the back side of the copper plate substrate corresponding to the direction of the punching and cutting knife is the "back side"; in addition, "outward" refers to the direction in which the golden finger plug points.
While the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes may be made without departing from the spirit of the present patent within the knowledge of one of ordinary skill in the art.
Claims (6)
1. A method for manufacturing a thick copper hollowed-out golden finger plug circuit is characterized by comprising the following steps:
s1, selecting a thick copper light copper plate as a copper plate base material for manufacturing a hollowed-out golden finger plug circuit board;
s2, manufacturing a hollowed-out golden finger plug by adopting a mode of combining etching and punching indication lines and punching, comprising the following steps:
s201, copper is reduced at the position of the punching lower cutter contour line in an etching mode, so that punching indication lines are formed, and the method comprises the following steps:
s2011, silk-screen printing photosensitive wet films on the upper surface and the lower surface of a copper plate substrate;
s2012, performing exposure windowing on the wet film of the punching lower cutter surface along the contour line of the punching lower cutter, and performing full exposure on the other surface;
s2013, developing the exposure wet film to form a developed pattern;
s2014, etching and copper reduction is carried out on the copper plate base material after the development treatment, and punching indication lines are formed;
s2015, removing the film after etching;
s202, blanking along a blanking indication line to form a golden finger plug;
s3, polishing the punched golden finger plug.
2. The method for manufacturing the thick copper hollowed-out golden finger plug circuit according to claim 1, wherein the step 2012 is characterized in that an exposure window of 0.1mm is made on the wet film with the die-cut lower knife surface along the outline of the die-cut lower knife, and the other wet film is completely exposed.
3. The method for manufacturing the thick copper hollowed-out golden finger plug circuit according to claim 1, wherein the step S2014 is to etch the developed copper plate substrate to remove 1/3 copper of the total copper plate substrate thickness, form a punching indication line and control the tolerance of the punching indication line to be within +/-10% of a standard value.
4. The method for manufacturing the thick copper hollowed-out golden finger plug circuit according to claim 1, wherein the step S202 is characterized in that the golden finger plug is formed by punching along a punching indication line by using a punching machine with the weight of more than 20 tons.
5. The method for manufacturing a thick copper hollowed-out golden finger plug circuit according to any one of claims 1 to 4, wherein the step S1 is characterized in that a thick copper light copper plate with the thickness of more than 70 microns is selected as a copper plate base material for manufacturing the hollowed-out golden finger plug circuit board.
6. The method for manufacturing the thick copper hollowed-out golden finger plug circuit is characterized in that the S3 polished and punched golden finger plug adopts sand paper with more than 1200 meshes, and the copper surface is polished towards the pointing direction of the golden finger plug, and burrs and flanging are removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010180804.XA CN111328203B (en) | 2020-03-16 | 2020-03-16 | Method for manufacturing thick copper hollowed-out golden finger plug circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010180804.XA CN111328203B (en) | 2020-03-16 | 2020-03-16 | Method for manufacturing thick copper hollowed-out golden finger plug circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111328203A CN111328203A (en) | 2020-06-23 |
| CN111328203B true CN111328203B (en) | 2023-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010180804.XA Active CN111328203B (en) | 2020-03-16 | 2020-03-16 | Method for manufacturing thick copper hollowed-out golden finger plug circuit |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715137A (en) * | 1993-01-22 | 1995-01-17 | Dainippon Printing Co Ltd | Manufacture of printed circuit board |
| CN102238809A (en) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof |
| CN202335068U (en) * | 2011-11-11 | 2012-07-11 | 厦门爱谱生电子科技有限公司 | Dual-sided flexible circuit board with hollow fingers |
| CN104411099A (en) * | 2014-12-04 | 2015-03-11 | 奥士康科技（益阳）有限公司 | Transfer method for circuitous pattern of heavy copper printed circuit board |
| CN106535508A (en) * | 2016-11-14 | 2017-03-22 | 福建世卓电子科技有限公司 | Multi-layer board flexible circuit board built-in golden finger exposure process |
| CN108495452A (en) * | 2018-03-27 | 2018-09-04 | 厦门市铂联科技股份有限公司 | A kind of manufacturing method and product of the flexible PCB with suspension plugging fingers |
-
2020
- 2020-03-16 CN CN202010180804.XA patent/CN111328203B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715137A (en) * | 1993-01-22 | 1995-01-17 | Dainippon Printing Co Ltd | Manufacture of printed circuit board |
| CN102238809A (en) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof |
| CN202335068U (en) * | 2011-11-11 | 2012-07-11 | 厦门爱谱生电子科技有限公司 | Dual-sided flexible circuit board with hollow fingers |
| CN104411099A (en) * | 2014-12-04 | 2015-03-11 | 奥士康科技（益阳）有限公司 | Transfer method for circuitous pattern of heavy copper printed circuit board |
| CN106535508A (en) * | 2016-11-14 | 2017-03-22 | 福建世卓电子科技有限公司 | Multi-layer board flexible circuit board built-in golden finger exposure process |
| CN108495452A (en) * | 2018-03-27 | 2018-09-04 | 厦门市铂联科技股份有限公司 | A kind of manufacturing method and product of the flexible PCB with suspension plugging fingers |
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| Publication number | Publication date |
|---|---|
| CN111328203A (en) | 2020-06-23 |
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