CN202335068U - Dual-sided flexible circuit board with hollow fingers - Google Patents
Dual-sided flexible circuit board with hollow fingers Download PDFInfo
- Publication number
- CN202335068U CN202335068U CN2011204454359U CN201120445435U CN202335068U CN 202335068 U CN202335068 U CN 202335068U CN 2011204454359 U CN2011204454359 U CN 2011204454359U CN 201120445435 U CN201120445435 U CN 201120445435U CN 202335068 U CN202335068 U CN 202335068U
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- pure copper
- copper layer
- layer
- circuit board
- glue
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- Expired - Lifetime
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a dual-sided flexible circuit board with hollow fingers, which comprises a covering film layer, a first pure copper layer, a first glue layer, a second pure copper layer and a second glue layer, wherein the first pure copper layer is connected with the covering film layer through the first glue layer, the second pure copper layer is connected with the covering film layer through the second glue layer, the first pure copper layer and the second pure copper layer are communicated through a through hole in the circuit board, a hollow area is arranged on the circuit board, multiple fingers are formed by the second pure copper layer and mutually arranged on the hollow area on the circuit board at intervals; preferably, the thicknesses of the first pure copper layer and the second pure copper layer are equal; the space between every two fingers is less than 0.4mm; and preferably, the covering film layer is a polyimide layer. Smaller space exists between every two hollow fingers, and can realizes, and the front surface and the back surface of the same finger are welded through tin climbing of metal copper on the side surface.
Description
Technical field
The utility model relates to the flexible PCB technical field, especially a kind of double-sided flex circuit plate that has the hollow out finger.
Background technology
The existing double-sided flex circuit plate great majority that have the hollow out finger are to adopt the base material that has two-sided Copper Foil to make; Because having one deck to cover rete in the middle of the base material is the PI layer; This PI layer can't use the chemical medicinal liquid etching to reject, and therefore makes the hollow out finger in the above, can only accomplish by die cutting die; Because the blade of die cutting die has certain width, and the spacing between the finger can't be accomplished with die cutting die less than 0.4mm; On the other hand, the finger that adopts die cutting die to complete, the centre comprises one deck PI layer equally, is not easy to make the positive back metal copper of same finger to climb soldering through the side and connects.
The utility model content
The technical problem that the utility model will solve provides a kind of double-sided flex circuit plate that has hollow out finger, and the spacing between the hollow out finger is less, and can realize that the positive back side of same finger climbs soldering through side metal copper and connect.
For achieving the above object; The technical scheme of the utility model is: a kind of double-sided flex circuit plate that has the hollow out finger; Comprise and cover rete, first pure copper layer, first glue-line, second pure copper layer, second glue-line; First pure copper layer is connected with the covering rete through first glue-line, and second pure copper layer is connected with the covering rete through second glue-line, and first pure copper layer and second pure copper layer connect through the through hole that is arranged on the circuit board; Circuit board is provided with the hollow out zone, and a plurality of fingers are made up of second pure copper layer and the space is arranged at the hollow out zone on the circuit board.
The thickness of preferred described first pure copper layer and second pure copper layer equates, is convenient to guarantee first pure copper layer and the etched uniformity of second pure copper layer.
Spacing between preferred described each finger can better satisfy requirement of client less than 0.4mm, in unit are, makes more finger.
Preferred described covering rete is a polyimide layer, and cost is lower.
The utility model is because circuit board is provided with the hollow out zone; A plurality of fingers are made up of second pure copper layer and the space is arranged at the hollow out zone on the circuit board; Therefore the spacing between a plurality of fingers can be accomplished through etch process, and the spacing between a plurality of fingers can be done lessly, and its spacing can be less than 0.4mm in the actual fabrication; In unit are, can make more finger like this, satisfy different requirements of customers.
On the other hand, because a plurality of fingers are made up of second pure copper layer, can realize that the positive back side of same finger climbs soldering through side metal copper and connect.
Description of drawings
Fig. 1 is the utility model vertical view;
Fig. 2 is the utility model upward view;
Fig. 3 is the A-A cutaway view of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and concrete execution mode the utility model is done further explain.
Fig. 1, Fig. 2, shown in Figure 3; A kind of double-sided flex circuit plate that has the hollow out finger; Comprise and cover rete 1, first pure copper layer 2, first glue-line 3, second pure copper layer 4, second glue-line 5; First pure copper layer 2 is connected with covering rete 1 through first glue-line 3, and second pure copper layer 4 is connected with covering rete 1 through second glue-line 5, and first pure copper layer 2 and second pure copper layer 4 connect through the through hole 6 that is arranged on the circuit board; Circuit board is provided with hollow out zone 7, and a plurality of fingers 41 are made up of second pure copper layer 4 and the space is arranged at the hollow out zone 7 on the circuit board.
The thickness of preferred described first pure copper layer 2 and second pure copper layer 4 equates.
Because each finger 41 is made up of second pure copper layer 4, the spacing between the finger 41 can be accomplished through etch process, and the spacing between therefore described each finger can be less than 0.4mm.
Preferred described covering rete is a polyimide layer.
Below only be preferred embodiment of the utility model, the change that those skilled in the art does to be equal to by claim all falls into the protection range of this case.
Claims (4)
1. one kind has the double-sided flex circuit plate that hollow out is pointed; Comprise and cover rete, first pure copper layer, first glue-line, second pure copper layer, second glue-line; First pure copper layer is connected with the covering rete through first glue-line; Second pure copper layer is connected with the covering rete through second glue-line; It is characterized in that: first pure copper layer and second pure copper layer connect through the through hole that is arranged on the circuit board, and circuit board is provided with the hollow out zone, and a plurality of fingers are made up of second pure copper layer and the space is arranged at the hollow out zone on the circuit board.
2. a kind of double-sided flex circuit plate that has the hollow out finger according to claim 1, it is characterized in that: the thickness of described first pure copper layer and second pure copper layer equates.
3. a kind of double-sided flex circuit plate that has the hollow out finger according to claim 1 and 2 is characterized in that: the spacing between described each finger is less than 0.4mm.
4. a kind of double-sided flex circuit plate that has the hollow out finger according to claim 1 and 2, it is characterized in that: described covering rete is a polyimide layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204454359U CN202335068U (en) | 2011-11-11 | 2011-11-11 | Dual-sided flexible circuit board with hollow fingers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204454359U CN202335068U (en) | 2011-11-11 | 2011-11-11 | Dual-sided flexible circuit board with hollow fingers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202335068U true CN202335068U (en) | 2012-07-11 |
Family
ID=46447030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204454359U Expired - Lifetime CN202335068U (en) | 2011-11-11 | 2011-11-11 | Dual-sided flexible circuit board with hollow fingers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202335068U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413251A (en) * | 2015-07-31 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof, and electronic apparatus employing circuit board |
| CN111263525A (en) * | 2020-03-23 | 2020-06-09 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
| CN111328203A (en) * | 2020-03-16 | 2020-06-23 | 深圳市实锐泰科技有限公司 | Method for manufacturing thick copper hollowed-out gold finger plug circuit |
-
2011
- 2011-11-11 CN CN2011204454359U patent/CN202335068U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413251A (en) * | 2015-07-31 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof, and electronic apparatus employing circuit board |
| CN106413251B (en) * | 2015-07-31 | 2019-01-25 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and its manufacturing method, the electronic device using the circuit board |
| CN111328203A (en) * | 2020-03-16 | 2020-06-23 | 深圳市实锐泰科技有限公司 | Method for manufacturing thick copper hollowed-out gold finger plug circuit |
| CN111328203B (en) * | 2020-03-16 | 2023-11-03 | 深圳市实锐泰科技有限公司 | Method for manufacturing thick copper hollowed-out golden finger plug circuit |
| CN111263525A (en) * | 2020-03-23 | 2020-06-09 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
| CN111263525B (en) * | 2020-03-23 | 2021-04-20 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120711 |