CN111328203A - Method for manufacturing thick copper hollowed-out gold finger plug circuit - Google Patents
Method for manufacturing thick copper hollowed-out gold finger plug circuit Download PDFInfo
- Publication number
- CN111328203A CN111328203A CN202010180804.XA CN202010180804A CN111328203A CN 111328203 A CN111328203 A CN 111328203A CN 202010180804 A CN202010180804 A CN 202010180804A CN 111328203 A CN111328203 A CN 111328203A
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- Prior art keywords
- punching
- finger plug
- copper
- hollowed
- manufacturing
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Links
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 101
- 239000010949 copper Substances 0.000 title claims abstract description 101
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 99
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 52
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 49
- 239000010931 gold Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004080 punching Methods 0.000 claims abstract description 81
- 238000005530 etching Methods 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000005498 polishing Methods 0.000 claims abstract description 13
- 244000137852 Petrea volubilis Species 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000012216 screening Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 17
- 239000010410 layer Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a thick copper hollowed-out golden finger plug circuit, which comprises the following steps: selecting a thick copper smooth copper plate as a copper plate base material for manufacturing the hollowed-out gold finger plug circuit board; manufacturing a hollowed-out gold finger plug by combining an etching punching indication line and punching; polishing the punched golden finger plug; the invention provides a method for manufacturing a thick copper hollowed-out gold finger plug circuit, which comprises the steps of firstly etching, etching a part of thickness of a punching lower cutter position, and forming a punching indicating line; and the method of punching and sanding is adopted to replace an etching method to manufacture the gold finger plug in the thick copper area, so that the problems of large side etching or circuit breakage and the like caused by directly etching the gold finger plug are effectively avoided, and the reliability of the circuit manufacturing of the hollowed-out gold finger plug is effectively improved.
Description
Technical Field
The invention relates to the technical field of manufacturing of printed circuit board golden finger plug circuits, in particular to a method for manufacturing thick copper hollowed golden finger plug circuits.
Background
The thickness of a copper layer is more than or equal to 2OZ (70 microns) generally, namely the copper layer is regarded as a thick copper circuit board, on special electronic devices such as certain high-current and high-heat-dissipation connectors and the like, the thick copper circuit board is needed, particularly, the requirement on the thickness of copper at the position of a golden finger plug of the circuit board is thicker, the difficulty of the thick copper flexible circuit board in manufacturing the hollowed-out golden finger plug is larger, and the product characteristics mainly comprise two points: one is thick copper, and the other is a hollowed-out gold finger.
At present, a gold finger plug for thick copper is generally manufactured by directly pasting a photosensitive film, developing, exposing and etching, and has the following defects:
(1) the copper is thick, and the problems of sinking, wrinkling and the like are easy to generate when the photosensitive film is pasted;
(2) thick copper etching is carried out, and the golden finger needs to be hollowed out, so that the problems of large side etching, even circuit breakage and the like are easily caused during etching;
(3) the cost of the etching solution is high, and the cost is multiplied when thick copper is etched.
Therefore, the inventor provides a method for manufacturing a thick copper hollowed-out golden finger plug circuit, and solves the problems of large depression, wrinkle and side etching, breakage, high processing cost and the like in the direct etching manufacturing process of the thick copper hollowed-out golden finger plug.
Disclosure of Invention
The invention aims to provide a method for manufacturing a thick copper hollowed-out gold finger plug circuit, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for manufacturing a thick copper hollowed-out gold finger plug circuit comprises the following steps:
s1, selecting a thick copper smooth copper plate as a copper plate base material for manufacturing the hollowed-out gold finger plug circuit board;
s2, manufacturing a hollow-out gold finger plug by combining an etching punching indication line and punching;
and S3, polishing the punched golden finger plug.
The optical copper plate is adopted to facilitate coating of a photosensitive wet film, etching and punching are facilitated, and an insulating layer and a bonding layer are formed in a covering film pasting mode before the optical copper plate can be processed into a final circuit; the method is characterized in that a method of combining an etching punching indication line and punching is adopted to manufacture the hollow-out golden finger plug, the manufacturing of the golden finger plug is divided into two steps, the indication line is firstly etched to reduce the copper thickness and facilitate punching, and the punching precision is ensured by giving an auxiliary positioning indication of punching; the method has the advantages that the method for polishing the punched golden finger plug is adopted to replace an etching mode, namely a physical mode is adopted to replace a chemical mode, the problems of excessive pitting and the like of a circuit caused by multiple etching are prevented, and the smoothness of the golden finger can be ensured.
As a further scheme of the invention: s2 manufacturing the hollow-out gold finger plug by adopting a mode of combining etching and punching indication lines and punching comprises the following steps:
s201, reducing copper at the position of the contour line of the lower punching cutter in an etching mode to form a punching indicating line;
and S202, blanking along the blanking indicating line to form the golden finger plug.
As a further scheme of the invention: s201, reducing copper at the position of the lower die cutting contour line by adopting an etching mode, and forming a die cutting indicating line comprises the following steps:
s2011, silk-screening photosensitive wet films on the upper and lower surfaces of the copper plate base material;
s2012, making exposure windowing along the contour line of the lower punching cutter on the wet film of the lower punching cutter surface, and completely exposing the other surface;
s2013, carrying out development treatment on the exposed wet film to form a development pattern;
s2014, etching and reducing copper of the copper plate base material after the development treatment to form a punching indication line;
s2015, stripping after etching.
As a further scheme of the invention: and (3) making an exposure window of 0.1mm on the wet film of the lower tool face of the S2012 hedging die-cut along the contour line of the lower tool, and completely exposing the wet film on the other surface.
As a further scheme of the invention: and S2014, etching the copper plate base material after the development treatment to remove 1/3 copper in the total thickness of the copper plate base material, forming a punching indication line, and controlling the tolerance of the punching indication line to be within +/-10% of the standard value.
As a further scheme of the invention: and S202, punching by using a punch with the punching indication line of more than 20 tons to form the gold finger plug.
As a further scheme of the invention: and S1, selecting a thick copper smooth copper plate with the thickness of more than 70 microns as a copper plate base material for manufacturing the hollowed-out gold finger plug circuit board.
As a further scheme of the invention: and S3, polishing the punched golden finger plug, polishing the copper surface towards the pointing direction of the golden finger plug by using sand paper of more than 1200 meshes, and removing burrs and flanging.
Compared with the prior art, the method adopts a punching mode to replace direct etching to manufacture the hollowed-out golden finger plug, but simultaneously, because the copper base material is thick copper, the process of etching the punching indicating line is designed before punching, and the punching indicating line is manufactured by adopting the etching mode, so that the manufacturing method that the copper thickness of the position to be punched is reduced firstly and then punching is carried out is realized, and the damage to the golden finger plug and the damage to a punching cutter caused by direct punching when the copper thickness is too thick are prevented; in the punching process, due to the extrusion, friction and other actions between the copper plate and the punching cutter, the problems of burrs, flanges and the like of the copper plate at the punching position can be caused, so that the poor problems of the burrs, the flanges and the like can be effectively removed by adopting fine sand paper with more than 1200 meshes for polishing; therefore, the problems of overlarge side etching, breakage and the like of the golden finger plug are effectively solved, and the reliability of the circuit manufacturing of the hollowed-out golden finger plug is effectively improved.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a thick copper hollowed-out gold finger plug circuit.
FIG. 2 is a schematic cross-sectional structure diagram of a light-sensitive wet film silk-screened on both sides of an optical copper plate in a thick copper hollowed-out gold finger plug circuit manufacturing method.
FIG. 3 is a schematic cross-sectional view of a developed thick copper hollowed-out gold finger plug circuit manufacturing method.
Fig. 4 is a schematic cross-sectional structure diagram of a thick copper hollowed-out gold finger plug circuit after etching in the manufacturing method.
Fig. 5 is a schematic cross-sectional structure diagram of a thick copper hollowed-out gold finger plug circuit after stripping in the manufacturing method.
Fig. 6 is a schematic cross-sectional structure diagram of a thick copper hollowed-out gold finger plug circuit after punching in the manufacturing method.
Fig. 7 is a schematic plan view of a region removed by punching in the method for manufacturing a thick copper hollowed-out gold finger plug circuit.
Wherein: 1. a smooth copper plate; 11. punching a position; 12. punching out an area; 13. a gold finger plug; 2. wet film forming; 21. a wet film groove; 22. and punching an indicating line.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting, and that the term "and/or" as used in the description of the invention and the appended claims refers to any and all combinations of one or more of the associated listed items and includes such combinations.
Referring to FIGS. 1 to 7, a first embodiment of the present invention,
a method for manufacturing a thick copper hollowed-out gold finger plug circuit comprises the following steps:
(1) selecting a base material:
selecting a thick copper smooth copper plate base material: the copper plate substrate 1 for manufacturing the circuit board with the hollowed-out gold finger plug is made of a smooth copper plate without a resin layer as a raw material instead of a copper-clad plate, and a cover film can be used as an insulating protective layer subsequently;
(2) manufacturing a punching indicating line:
1) silk-screen printing photosensitive wet films 2 on the upper and lower surfaces of the smooth copper plate;
2) exposing and windowing the position of a lower cutter to be punched by 0.1mm on the front surface, and completely exposing the photosensitive wet film on the back surface;
3) developing the photosensitive wet film at the windowing position through development to form a developing tank 21;
4) then, through etching, copper is reduced to form a concave etching line at the lower cutting position of the punching, namely a punching indication line 22;
5) etching to reduce copper typically etches 1/3 thickness of the total copper thickness, and after etching, controlling the circuit tolerance of the punching indication line 22 to be within +/-10% of the standard value;
6) and stripping the film after etching.
(3) Punching a gold finger plug:
due to the adoption of the process and the manufacturing method, the copper thickness at the lower cutter is reduced, the lower cutter indicating line is given, and the punching mode is adopted to replace etching to form the punching groove;
further, a hollow-out gold finger plug is manufactured in a punching mode, and a chemical etching mode is adopted to replace the mode of etching out a gold finger hypergraph;
generally, punching thick copper requires punching with a heavy press of 20 tons or more; and punching according to the punching indication line to form a punching position 11, and removing the punching area 12 after punching to form a gold finger plug 13.
(4) Polishing the golden finger:
after punching, polishing the copper surface outwards towards the golden finger plug 13 by using fine sand paper with the granularity of more than 1200 meshes, particularly polishing the position of the golden finger plug 13;
and (4) polishing to remove burrs, flanging and the like, and then carrying out circuit etching manufacturing by combining the front and back surface coating films of the optical copper plate with the gold finger plug 13.
The working principle of the invention is as follows: the method for manufacturing the hollowed-out golden finger by using the punching mode instead of direct etching is adopted, but the golden finger is a thick copper plate golden finger, so that a manufacturing method for etching the punching indication line is designed before punching, and the manufacturing method for reducing the copper thickness of the position to be punched and punching are realized; namely, the position of the lower cutter to be punched is etched to remove a part of the thickness by etching, so that the thickness of the lower cutter is reduced for subsequent punching, and a punching indicating line is provided; furthermore, the gold finger plug in the thick copper area is manufactured by adopting a punching and sand paper grinding mode instead of an etching mode, so that the problems of large side etching or circuit breakage and the like caused by etching are effectively avoided; after punching, due to the extrusion, friction and other actions between the copper plate and a punching cutter, the problems of burrs, flanges and the like of the copper plate at the punching position can be caused, so that the bad problems of the burrs, the flanges and the like can be effectively removed by adopting fine sand paper with more than 1200 meshes for polishing; therefore, the problems of overlarge side etching, breakage and the like of the golden finger plug are effectively solved, and the reliability of the circuit manufacturing of the hollowed-out golden finger plug is effectively improved.
Unless otherwise specified, the "front side" and "back side" of the copper plate base material surface in the present specification refer to directional terms defined with reference to the punching lower blade direction, the copper plate base material surface corresponding to the punching lower blade direction is the "front side", and the back side of the copper plate base material corresponding to the punching lower blade direction is the "back side"; in addition, "outward" refers to the direction in which the gold finger plug points.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (8)
1. A method for manufacturing a thick copper hollowed-out gold finger plug circuit is characterized by comprising the following steps:
s1, selecting a thick copper smooth copper plate as a copper plate base material for manufacturing the hollowed-out gold finger plug circuit board;
s2, manufacturing a hollow-out gold finger plug by combining an etching punching indication line and punching;
and S3, polishing the punched golden finger plug.
2. The method for manufacturing the thick copper hollowed-out gold finger plug circuit according to claim 1, wherein the step of manufacturing the hollowed-out gold finger plug by combining etching and punching of the indication line at S2 comprises the steps of:
s201, reducing copper at the position of the contour line of the lower punching cutter in an etching mode to form a punching indicating line;
and S202, blanking along the blanking indicating line to form the golden finger plug.
3. The method for manufacturing the thick copper hollowed-out gold finger plug circuit according to claim 2, wherein the step S201 of reducing copper at the die-cut lower blade contour line by etching to form the die-cut indication line comprises the steps of:
s2011, silk-screening photosensitive wet films on the upper and lower surfaces of the copper plate base material;
s2012, making exposure windowing along the contour line of the lower punching cutter on the wet film of the lower punching cutter surface, and completely exposing the other surface;
s2013, carrying out development treatment on the exposed wet film to form a development pattern;
s2014, etching and reducing copper of the copper plate base material after the development treatment to form a punching indication line;
s2015, stripping after etching.
4. The method for manufacturing the thick copper hollowed-out gold finger plug circuit according to claim 3, wherein an exposure window of 0.1mm is made on the wet film of the lower cutting face of the S2012 opposite punching tool along the contour line of the lower cutting tool, and the wet film on the other face is completely exposed.
5. The method for manufacturing a thick copper hollowed-out gold finger plug circuit according to claim 3, wherein in the step S2014, 1/3 copper in the total thickness of the copper plate substrate is removed by etching the developed copper plate substrate, so as to form a punching indication line, and the tolerance of the punching indication line is controlled within +/-10% of a standard value.
6. The method for manufacturing a thick copper hollowed-out gold finger plug circuit according to claim 2, wherein the step S202 is performed by punching with a punch of 20 tons or more along the punching indication line to form the gold finger plug.
7. The method for manufacturing the thick-copper hollowed-out gold finger plug circuit according to any one of claims 1 to 6, wherein S1 selects a thick-copper smooth copper plate with a thickness of more than 70 microns as a copper plate substrate for manufacturing the hollowed-out gold finger plug circuit board.
8. The method for manufacturing the thick copper hollowed-out gold finger plug circuit according to claim 7, wherein S3 is used for polishing the punched gold finger plug, and the copper surface is polished towards the pointing direction of the gold finger plug by using sand paper with a size of more than 1200 meshes to remove burrs and flanges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010180804.XA CN111328203B (en) | 2020-03-16 | 2020-03-16 | Method for manufacturing thick copper hollowed-out golden finger plug circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010180804.XA CN111328203B (en) | 2020-03-16 | 2020-03-16 | Method for manufacturing thick copper hollowed-out golden finger plug circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111328203A true CN111328203A (en) | 2020-06-23 |
| CN111328203B CN111328203B (en) | 2023-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010180804.XA Active CN111328203B (en) | 2020-03-16 | 2020-03-16 | Method for manufacturing thick copper hollowed-out golden finger plug circuit |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715137A (en) * | 1993-01-22 | 1995-01-17 | Dainippon Printing Co Ltd | Manufacture of printed circuit board |
| CN102238809A (en) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof |
| CN202335068U (en) * | 2011-11-11 | 2012-07-11 | 厦门爱谱生电子科技有限公司 | Dual-sided flexible circuit board with hollow fingers |
| CN104411099A (en) * | 2014-12-04 | 2015-03-11 | 奥士康科技（益阳）有限公司 | Transfer method for circuitous pattern of heavy copper printed circuit board |
| CN106535508A (en) * | 2016-11-14 | 2017-03-22 | 福建世卓电子科技有限公司 | Multi-layer board flexible circuit board built-in golden finger exposure process |
| CN108495452A (en) * | 2018-03-27 | 2018-09-04 | 厦门市铂联科技股份有限公司 | A kind of manufacturing method and product of the flexible PCB with suspension plugging fingers |
-
2020
- 2020-03-16 CN CN202010180804.XA patent/CN111328203B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715137A (en) * | 1993-01-22 | 1995-01-17 | Dainippon Printing Co Ltd | Manufacture of printed circuit board |
| CN102238809A (en) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof |
| CN202335068U (en) * | 2011-11-11 | 2012-07-11 | 厦门爱谱生电子科技有限公司 | Dual-sided flexible circuit board with hollow fingers |
| CN104411099A (en) * | 2014-12-04 | 2015-03-11 | 奥士康科技（益阳）有限公司 | Transfer method for circuitous pattern of heavy copper printed circuit board |
| CN106535508A (en) * | 2016-11-14 | 2017-03-22 | 福建世卓电子科技有限公司 | Multi-layer board flexible circuit board built-in golden finger exposure process |
| CN108495452A (en) * | 2018-03-27 | 2018-09-04 | 厦门市铂联科技股份有限公司 | A kind of manufacturing method and product of the flexible PCB with suspension plugging fingers |
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|---|---|
| CN111328203B (en) | 2023-11-03 |
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