CN104602457A - Novel method for manufacturing circuit board and circuit board manufactured through novel method for manufacturing circuit board - Google Patents
Novel method for manufacturing circuit board and circuit board manufactured through novel method for manufacturing circuit board Download PDFInfo
- Publication number
- CN104602457A CN104602457A CN201510014220.4A CN201510014220A CN104602457A CN 104602457 A CN104602457 A CN 104602457A CN 201510014220 A CN201510014220 A CN 201510014220A CN 104602457 A CN104602457 A CN 104602457A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- circuit
- etching
- solder mask
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a novel method for manufacturing a circuit board and the circuit board manufactured through the novel method for manufacturing the circuit board. The novel method specifically comprises the steps that a layer of solder resist ink is printed on a copper-clad laminate, soldering pads and circuit gaps are exposed, then a layer of etching-resistant ink is printed on the exposed soldering pads, a circuit is etched, copper in the circuit gaps is removed to form the circuit, a film is withdrawn, only the etching-resistant ink is removed, the solder resist ink is not removed, so that the circuit board is formed through manufacturing. Compared with a conventional method for manufacturing the circuit board, the novel method for manufacturing the circuit board has the advantages that firstly, the solder resist ink is printed, then the etching-resistant ink is printed, finally, the circuit is etched, and therefore the problem that after conventional etching is accomplished, due to the facts that the change of increase and decrease of the size of the circuit board is large, and the size of the circuit board is unstable, printing of the solder resist ink cannot be easily conducted is solved, full-automatic continuous repeated printing can be achieved more easily, the production efficiency is improved, the cost is reduced, and consistency of products is improved.
Description
Technical field
The invention belongs to circuit-board industry, be specifically related to first print welding resistance in copper-clad plate, then print etching resisting ink, then a kind of new method making wiring board of just circuit etching.
Background technology
The method of traditional fabrication wiring board, usually be all first print circuit anti-etching printing ink in copper-clad plate after, circuit etching stripping anti-etching printing ink, and then print solder mask and character literal ink, be difficult to accomplish anti-etching printing ink, solder mask and character literal ink automatic printing continuously on one wire simultaneously like this, and the size harmomegathus change of wiring board often after etching greatly, instability, and causes the problems such as bad print welding resistance.
In order to overcome above defect and deficiency, the present invention adopts and first prints welding resistance, then etching resisting ink is printed again, then the method for just circuit etching, overcomes the change of conventional etch rear board size harmomegathus greatly, the defect of instability, and more easily realize full-automatic continuous several times printing, improve production efficiency, reduce cost, improve homogeneity of product simultaneously.
Summary of the invention
The present invention relates to and a kind ofly make the new method of wiring board and the wiring board of making thereof.Specifically, copper-clad plate first stamps one deck solder mask, exposed pad and trace clearance, then on the pad exposed, one deck anti-etching printing ink is stamped, circuit etching, the copper on removing trace clearance forms circuit, moves back film and only removes etching resisting ink, solder mask does not strip, and has so just been made into wiring board.
Compared with the method for traditional fabrication wiring board, the present invention adopts and first prints welding resistance, then print etching resisting ink again, then just circuit etching, overcome the change of conventional etch rear board size harmomegathus greatly, unstable, and cause the problem of bad print welding resistance, and more easily realize full-automatic continuous several times printing, improve production efficiency, reduce cost, improve homogeneity of product simultaneously.
According to the present invention, provide a kind of new method making wiring board, comprise: in copper-clad plate, first stamp one deck solder mask, exposed pad and trace clearance, then on the pad exposed, stamp one deck anti-etching printing ink, circuit etching, copper on removing trace clearance forms circuit, and move back film and only remove etching resisting ink, solder mask does not strip, surface anti-oxidation process, is made into wiring board.
According to one embodiment of the invention, described a kind of new method making wiring board, it is characterized in that, when wiring board needs print character word, after print solder mask, print character literal or print character literal or print character literal after the etching after print anti-etching printing ink.
According to one embodiment of the invention, described a kind of new method making wiring board, is characterized in that, described wiring board, and the circuit flank side surface metal after etching is exposed.
According to one embodiment of the invention, described a kind of new method making wiring board, is characterized in that, the metal that described circuit flank side surface is exposed, can be hidden by stencil in trace clearance after the etching.
According to the present invention, provide the wiring board that a kind of new method making wiring board makes, comprising: solder mask; Line layer; Base material; It is characterized in that, trace clearance is without solder mask, and circuit flank side surface metal is exposed.If need to hide the exposed metal of circuit flank side surface, then stamp solder mask in trace clearance after the etching to be hidden or when print character word ink, in trace clearance, stamp one deck character literal ink to be hidden simultaneously, form double-sided wiring board.
According to the present invention, additionally provide the wiring board that a kind of new method making wiring board makes, comprising: front solder mask; Front line layer; Base material; Back side line layer; Back side solder mask; It is characterized in that, front circuit and back side trace clearance are without solder mask, and circuit flank side surface metal is exposed.If need to hide the exposed metal of circuit flank side surface, then stamp solder mask in trace clearance after the etching to be hidden or when print character word ink, in trace clearance, stamp one deck character literal ink to be hidden simultaneously, form double-sided wiring board.
According to one embodiment of the invention, the wiring board that described a kind of new method making wiring board makes is the wiring board of flexible circuit board or rigidity.
Following in the description of the drawings and specific embodiments, one or more embodiments of the detail of the present invention will be set forth.From these descriptions, accompanying drawing and claim, other features, objects and advantages of the present invention can be known.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of copper-clad plate.
Fig. 2 is the schematic diagram stamp one deck solder mask in copper-clad plate after.
Fig. 3 is the schematic diagram stamp one deck anti-etching printing ink on the pad exposed after.
Fig. 4 is after circuit etching, moves back film removing etching resisting ink, the schematic diagram of the single line plate that itemize is shaping.
Fig. 5 is the schematic cross-section of the one-sided circuit board that the present invention makes.
Fig. 6 is the schematic cross-section of the double-sided wiring board that the present invention makes.
Embodiment
Be described in more detail to a kind of specific embodiment making the new method of wiring board and the wiring board of making thereof of the present invention below.
But it will be appreciated by those skilled in the art that the following stated is only illustrate and describe some preferred implementations, some other similar or equivalent execution mode equally also can be used for implementing the present invention.
On automatic printing line, one deck solder mask (2) is first stamped by the Copper Foil of copper-clad plate (1) as shown in Figure 1, exposed pad (3.1), (3.2), and trace clearance (4) (as shown in Figure 2) (3.3), solidify in drying section, and then in the pad exposed (3.1), (3.2), (3.3) stamp on one deck anti-etching printing ink (5) (as shown in Figure 3), solidify in drying section, then circuit etching, copper in removing trace clearance (4) forms circuit, move back film and only remove etching resisting ink (5), solder mask (2) is also stayed above wiring board and is not stripped, then the anti-oxidation process of surperficial OSP, die-cut external form itemize, check, packaging, so just be made into wiring board (as shown in Figure 4).
As shown in Figure 5, for the schematic cross-section of the one-sided circuit board of making, it is characterized in that, mark (6) is base material, mark (7) is the line layer after etching, trace clearance (4) is without solder mask (2), circuit flank side surface metal (7.1) is exposed, certainly can be hidden or when print character word ink, be hidden at the inner one deck character literal ink that stamps of trace clearance (4) simultaneously by the inner solder mask that stamps of trace clearance (4) after the etching as required.
Fig. 6 is the schematic cross-section of the double-sided wiring board made, it is characterized in that, mark (6) is base material, mark (7) is the front line layer after etching, mark (7.2) is the back side line layer after etching, mark (2.1) is back side solder mask, trace clearance (4) is without solder mask (2), circuit flank side surface metal (7.1) is exposed, certainly can the inner solder mask that stamps of trace clearance (4) after the etching be hidden as required, or when print character word ink, hidden at the inner one deck character literal ink that stamps of trace clearance (4) simultaneously.
The present invention adopts and first prints welding resistance, then etching resisting ink is printed again, then the method for just circuit etching, overcome the change of conventional etch rear board size harmomegathus greatly, unstable defect, and more easily realize full-automatic continuous several times printing, improve production efficiency, reduce cost, improve homogeneity of product simultaneously.
Below by reference to the accompanying drawings by method specific embodiment to invention has been detailed description.But it will be appreciated by those skilled in the art that the above is only illustrate and describe some embodiments, to scope of the present invention, the especially scope of claim, does not have any restriction.
Claims (7)
1. make a new method for wiring board, comprising:
Copper-clad plate first stamps one deck solder mask, exposed pad and trace clearance, then on the pad exposed, stamp one deck anti-etching printing ink, circuit etching, the copper on removing trace clearance forms circuit, moves back film and only removes etching resisting ink, solder mask does not strip, and is made into wiring board.
2. a kind of new method making wiring board according to claim 1, it is characterized in that, when wiring board needs print character word, after print solder mask, print character literal or print character literal or print character literal after the etching after print anti-etching printing ink.
3. a kind of new method making wiring board according to claim 1, is characterized in that, described wiring board, and the circuit flank side surface metal after etching is exposed.
4. a kind of new method making wiring board according to claim 3, is characterized in that, the metal that described circuit flank side surface is exposed, can be hidden by stencil in trace clearance after the etching.
5. the wiring board that the new method making wiring board makes, comprising:
Solder mask;
Line layer;
Base material;
It is characterized in that, trace clearance is without solder mask, and circuit flank side surface metal is exposed.
If need to hide the exposed metal of circuit flank side surface, then stamp solder mask in trace clearance after the etching to be hidden or when print character word ink, in trace clearance, stamp one deck character literal ink to be hidden simultaneously, form one-sided circuit board.
6. the wiring board that the new method making wiring board makes, comprising:
Front solder mask;
Front line layer;
Base material;
Back side line layer;
Back side solder mask;
It is characterized in that, front circuit and back side trace clearance are without solder mask, and circuit flank side surface metal is exposed.
If need to hide the exposed metal of circuit flank side surface, then stamp solder mask in trace clearance after the etching to be hidden or when print character word ink, in trace clearance, stamp one deck character literal ink to be hidden simultaneously, form double-sided wiring board.
7. the wiring board that a kind of new method making wiring board according to claim 5 or 6 makes is the wiring board of flexible circuit board or rigidity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510014220.4A CN104602457A (en) | 2015-01-01 | 2015-01-01 | Novel method for manufacturing circuit board and circuit board manufactured through novel method for manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510014220.4A CN104602457A (en) | 2015-01-01 | 2015-01-01 | Novel method for manufacturing circuit board and circuit board manufactured through novel method for manufacturing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104602457A true CN104602457A (en) | 2015-05-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510014220.4A Pending CN104602457A (en) | 2015-01-01 | 2015-01-01 | Novel method for manufacturing circuit board and circuit board manufactured through novel method for manufacturing circuit board |
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|---|---|
| CN (1) | CN104602457A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882549A (en) * | 2018-08-27 | 2018-11-23 | 江西省木林森光电科技有限公司 | A kind of screen printing device and production method of single-sided flexible circuit board |
| CN112437552A (en) * | 2019-08-24 | 2021-03-02 | 王定锋 | Solder resist is double-layer wire circuit board of ink solder resist and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066003A (en) * | 1992-06-18 | 1994-01-14 | Hitachi Ltd | Flexible circuit and manufacture thereof |
| US20070069360A1 (en) * | 2005-09-27 | 2007-03-29 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same |
| CN103687320A (en) * | 2012-09-20 | 2014-03-26 | 东洋铝株式会社 | Making method of circuit composition |
-
2015
- 2015-01-01 CN CN201510014220.4A patent/CN104602457A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066003A (en) * | 1992-06-18 | 1994-01-14 | Hitachi Ltd | Flexible circuit and manufacture thereof |
| US20070069360A1 (en) * | 2005-09-27 | 2007-03-29 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same |
| CN103687320A (en) * | 2012-09-20 | 2014-03-26 | 东洋铝株式会社 | Making method of circuit composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882549A (en) * | 2018-08-27 | 2018-11-23 | 江西省木林森光电科技有限公司 | A kind of screen printing device and production method of single-sided flexible circuit board |
| CN108882549B (en) * | 2018-08-27 | 2024-01-30 | 新余木林森电子有限公司 | Silk screen printing equipment of single-sided flexible circuit board and manufacturing method |
| CN112437552A (en) * | 2019-08-24 | 2021-03-02 | 王定锋 | Solder resist is double-layer wire circuit board of ink solder resist and manufacturing method thereof |
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Application publication date: 20150506 |
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