JPH066003A - Flexible circuit and manufacture thereof - Google Patents

Flexible circuit and manufacture thereof

Info

Publication number
JPH066003A
JPH066003A JP4159397A JP15939792A JPH066003A JP H066003 A JPH066003 A JP H066003A JP 4159397 A JP4159397 A JP 4159397A JP 15939792 A JP15939792 A JP 15939792A JP H066003 A JPH066003 A JP H066003A
Authority
JP
Japan
Prior art keywords
conductors
flexible circuit
connector
pads
connection pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4159397A
Other languages
Japanese (ja)
Inventor
Genta Ogawa
源太 小川
Mitsuyuki Niwa
光之 丹羽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4159397A priority Critical patent/JPH066003A/en
Publication of JPH066003A publication Critical patent/JPH066003A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To secure the insulating property between the adjacent pads, and to improve the peeling strength of a connection pad by a method wherein the tip part to be inserted into a connector is insulated. CONSTITUTION:When a plurality of conductors 20 are formed in parallel on an insulated substrate 1 by etching, the coupling conductor parts 8, with which all the adjacent conductors 20 will be connected to arbitrary positions, are etched in such a manner that the dimension a-component is masked so that the tip of the conductors 20 is not exposed as far as to the circuit end part. Then, after the electrode 7 for electroplating has been connected to one end of the coupling conductors 8, an over-coating 30 is provided in such a manner that the coupling positions of connection pads 50 and the coupling conductors 8 will be opened. In this state, after the prescribed plating has been conducted on the connection pads 50 by applying a current to the electrode 7 of the coupling conductors 8, the coupling conductor pads 8 only, with which the connection pads 5 are connected, is removed by etching. In this case, the plating formed on the connection pads 5 functions as an etching resist. Lastly, the electrode 7, which is used for plating, is cut from the edge face.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、フレキシブルサーキッ
ト及びその製造方法に係り、特にコネクタに装着した際
に隣接パッド間の絶縁性を確保し、且つパッドの機械的
強度向上を図ることができるフレキシブルサーキット及
びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit and a method for manufacturing the same, and more particularly, to a flexible circuit which can secure insulation between adjacent pads and improve mechanical strength of the pads when mounted on a connector. The present invention relates to a circuit and a manufacturing method thereof.

【0002】[0002]

【従来の技術】一般にフレキシブルプリント基板および
フレキシブルフラットケーブル(これらを総称してフレ
キシブルサーキットと呼ぶ)のコネクタと接続する接栓
部は、たとえば特公報60ー13274号公報に記載さ
れているように、フレキシブルサーキットの端部に突出
する導電性の補強部を設けて、この補強部をプリント基
板の接続用コネクタに装着するものや、フレキシブルサ
ーキットの端部を単に露出させてコネクタ接続するもの
が提案されている。
2. Description of the Related Art Generally, a connector for connecting a flexible printed circuit board and a flexible flat cable (collectively referred to as a flexible circuit) to a connector is disclosed in, for example, Japanese Patent Publication No. 60-13274. Proposals have been made in which a conductive reinforcing portion that protrudes at the end of the flexible circuit is provided and this reinforcing portion is attached to the connector for connecting to the printed circuit board, or one in which the end of the flexible circuit is simply exposed for connector connection. ing.

【0003】しかしながらこの様な接続手段は簡易で且
つ安価な方式であるが、高密度化により接栓部の導体間
ピッチが狭小化するに従って、隣接する導体部との沿面
距離が小さくなり、フレキシブルサーキットの隣接導体
間での絶縁劣化が問題となってくる。
However, although such a connecting means is a simple and inexpensive method, as the pitch between the conductors of the plugging portion becomes narrower due to the higher density, the creeping distance between the adjacent conductor portions becomes smaller and the connecting means becomes flexible. Insulation deterioration between adjacent conductors in the circuit becomes a problem.

【0004】この従来技術による不具合を図5乃至図7
を用いて説明する。まずフレキシブルサーキットは、図
5に示す如く、絶縁基材1の上に複数導体2をエッチン
グで並列的に作成し、この複数導体2上にオーバーコー
ト3を被膜することによって各導体2間を絶縁し、次い
でフレキシブルサーキットの端部のオーバーコート3を
剥離することによって複数の接続パッド5から成る接栓
部4を形成する。この接栓部4は、機械的強度が弱いた
め及びコネクタとの電気的接続維持するため、複数の接
続パッド5に電気メッキ用の電極7を接続して錫、金な
いし半田等の鍍金を行ない、該電極7は鍍金処理の後に
カットライン10の位置でカットされる。このため従来
技術によるフレキシブルサーキットの端部(接栓部先
端)は、導体の端面が必ず露出することになる。尚、フ
レキシブルフラットケーブルについても、製法が異なる
が、接栓部の構成は全く同一である。
The disadvantages of this prior art are shown in FIGS.
Will be explained. First, in the flexible circuit, as shown in FIG. 5, a plurality of conductors 2 are formed in parallel on an insulating substrate 1 by etching, and an overcoat 3 is coated on the plurality of conductors 2 to insulate the conductors 2 from each other. Then, the overcoat 3 at the end of the flexible circuit is peeled off to form the plug portion 4 including the plurality of connection pads 5. Since the plug portion 4 has low mechanical strength and maintains an electrical connection with the connector, electrodes 7 for electroplating are connected to a plurality of connection pads 5 and plating such as tin, gold or solder is performed. The electrode 7 is cut at the position of the cut line 10 after the plating process. Therefore, the end surface of the flexible circuit according to the conventional technique (the tip of the plug portion) always exposes the end surface of the conductor. The flexible flat cable also has the same configuration of the plug portion, although the manufacturing method is different.

【0005】この様に構成されたフレキシブルサーキッ
トをコネクタに挿入した状態を図6及び図7を用いて説
明する。まずコネクタ11は、内部には該サーキットの
接栓部4と弾性的に接触する端子13と、該コネクタ1
1内部に体積した塵埃12の付着を防止するための突起
11aが設けられており、挿入されたフレキシブルサー
キットは端部が突起11aに乗り上げた状態で接栓部4
がコネクタ11の端子13と接触する様に接続される。
A state in which the flexible circuit thus configured is inserted into the connector will be described with reference to FIGS. 6 and 7. First, the connector 11 includes a terminal 13 inside which is elastically contacted with the connector 4 of the circuit, and the connector 1
1 is provided with a protrusion 11a for preventing adhesion of dust 12 accumulated therein, and the inserted flexible circuit has the end portion riding on the protrusion 11a and the plug portion 4
Are connected so as to come into contact with the terminals 13 of the connector 11.

【0006】[0006]

【発明が解決しようとする課題】しかしながら前記フレ
キシブルサーキット及びコネクタの接続は、該サーキッ
トの接続パッド5の間のピッチが狭くなるに従って、突
起11aとの接触部分に結露や挿抜による金属摩耗分等
の塵埃12が体積して隣接する接続パッド5間の絶縁が
著しく低下し、ショートの可能性があると言う不具合が
ある。ここでサーキットの接栓部をコネクタ底部まで挿
入せず、コネクタの肩で受ける方法が考えられるが、フ
レキシフルサーキットの場合は、素材の強度が不十分で
あり適用することができず、またフレキシブルフラット
ケーブルのように、テープ状の素材をカットして製造さ
れるものにたいしては、任意の形状に加工することが困
難である。
However, in the connection of the flexible circuit and the connector, as the pitch between the connection pads 5 of the circuit becomes narrower, dew condensation or metal wear due to insertion / extraction at the contact portion with the protrusion 11a occurs. There is a problem that the dust 12 is accumulated and the insulation between the adjacent connection pads 5 is significantly reduced, which may cause a short circuit. It is possible to use the shoulder of the connector without inserting the plug of the circuit to the bottom of the connector, but in the case of a flexible circuit, the strength of the material is insufficient and it can not be applied, and it is flexible. It is difficult to process a tape-shaped material such as a flat cable manufactured by cutting a tape-shaped material into an arbitrary shape.

【0007】また高密度化によって接続パッドの面積も
小さくなるため、絶縁基材と導体との接着強度が低下
し、コネクタ挿抜時に接続パッドに加わる摩擦力によっ
て、パッドハガレが発生し易くなる恐れもあった。
Further, since the area of the connection pad is reduced due to the high density, the adhesive strength between the insulating base material and the conductor is reduced, and the pad peeling may easily occur due to the frictional force applied to the connection pad when the connector is inserted and removed. It was

【0008】本発明の目的は、上記従来技術による不具
合を除去することであり、隣接したパッド間の絶縁性を
確保し且つ接続パッドの剥離強度向上を図ることができ
るフレキシブルサーキット及びその製造方法を提供する
ことである。
An object of the present invention is to eliminate the above-mentioned problems caused by the prior art, and to provide a flexible circuit capable of ensuring insulation between adjacent pads and improving peel strength of connection pads, and a manufacturing method thereof. Is to provide.

【0009】[0009]

【課題を解決するための手段】前記目的を達成するため
に本発明によるフレキシブルサーキットは、コネクタに
挿入される先端部を絶縁したことを第1特徴とし、千鳥
状に配置した接続パッド位置を除いた全導体を絶縁する
ことを第2の特徴とする。
In order to achieve the above-mentioned object, the flexible circuit according to the present invention is characterized in that the tip portion inserted into the connector is insulated, except for the connection pad positions arranged in a staggered manner. The second characteristic is to insulate all the conductors.

【0010】また本発明によるフレキシブルサーキット
の製造方法は、絶縁基材上に複数導体を一部が連結導体
部により導通すると共に複数導体の端部が絶縁基板端部
に露出しない様に並列的に配置し、前記複数導体の一部
及び連結導体部が露出するオーバーコートを施し、前記
連結導体部に電気鍍金用電力を供給して前記複数導体の
一部に鍍金して接続パッドを構成した後に、前記連結導
体部を除去することによってコネクタに挿入される先端
部を絶縁したことを第3の特徴とする。
Further, in the method for manufacturing a flexible circuit according to the present invention, a plurality of conductors are arranged in parallel on the insulating base material so that some of the conductors are electrically connected by the connecting conductor portion and the end portions of the plurality of conductors are not exposed at the end portion of the insulating substrate. After arranging, applying an overcoat to expose a part of the plurality of conductors and the connecting conductor portion, and supplying electric power for electroplating to the connecting conductor portion to form a connection pad by plating part of the plurality of conductors. A third feature is that the tip portion inserted into the connector is insulated by removing the connecting conductor portion.

【0011】[0011]

【作用】前記第1の発明によるフレキシブルサーキット
は、コネクタに挿入される先端部を電気的に絶縁したこ
とによって、前記複数導体間が結露や挿抜によって体積
する金属摩耗粉等に起因する短絡を防止し且つ接続パッ
ドの剥離強度を向上することができる。前記第2の発明
によるフレキシブルサーキットは、第1の特徴同様に導
体間の短絡を防止すると共に、導体ピッチを少なくして
接続パッドを高密度に配置することができる。
In the flexible circuit according to the first aspect of the present invention, by electrically insulating the tip portion inserted into the connector, the short circuit caused by the metal abrasion powder or the like accumulated between the plurality of conductors due to dew condensation or insertion / removal is prevented. In addition, the peel strength of the connection pad can be improved. The flexible circuit according to the second aspect of the present invention can prevent short-circuiting between the conductors as in the first aspect, and can reduce the conductor pitch to arrange the connection pads at a high density.

【0012】また第3の特徴であるフレキシブルサーキ
ットの製造方法は、複数導体の端部が絶縁基板端部に露
出しない様に並列的に配置し、且つ接続パッド箇所以外
の導体をオーバーコートすることによって短絡を防止し
且つ接続パッドの剥離強度を向上することができる。
In the method for manufacturing a flexible circuit, which is the third feature, the plurality of conductors are arranged in parallel so that the ends thereof are not exposed at the end of the insulating substrate, and the conductors other than the connection pad portions are overcoated. Thus, short circuit can be prevented and the peel strength of the connection pad can be improved.

【0013】[0013]

【実施例】以下に、本発明によるフレキシブルサーキッ
ト及びその製造方法を図面を参照して詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A flexible circuit and a method of manufacturing the same according to the present invention will be described below in detail with reference to the drawings.

【0014】図1は、本実施例による製造方法を用いて
製造したフレキシブルサーキットの接栓部構造を示す図
であり、このフレキシブルサーキットは、図4(a)に
示す如く絶縁基材1の上に複数導体20をエッチングで
並列的に作成する際、任意の位置において隣接する導体
20間を全て接続する連結導体部8も併せてエッチング
すると共に、複数導体20の先端がサーキット端部まで
露出しない様に寸法a分マスクした状態でエッチングす
る。即ち、この状態の導体は、先端が露出しないと共に
一部が連結されたほぼ「王」形状にエッチングされる。
FIG. 1 is a diagram showing the structure of a plug portion of a flexible circuit manufactured by the manufacturing method according to this embodiment. This flexible circuit is formed on an insulating base material 1 as shown in FIG. 4 (a). When the plurality of conductors 20 are formed in parallel by etching, the connecting conductor portions 8 that connect all the conductors 20 adjacent to each other at arbitrary positions are also etched, and the tips of the plurality of conductors 20 are not exposed to the circuit end portion. Similarly, etching is performed with the mask for the dimension a. That is, the conductor in this state is etched into a substantially "king" shape in which the tips are not exposed and some are connected.

【0015】次にフレキシブルサーキットは、図4
(b)に示す如く前記連結導体8の一端に電気鍍金用電
極7を接続した後、接続パッド50及び連結導体8の連
結位置が開口する様にオーバーコート30を行なう。こ
の状態で前記連結導体8の電極7に通電して接続パッド
50に所定の鍍金をおこなった後、各導体20間を接続
する連結導体部8のみをエッチング除去する。この場合
接続パッド5に施された鍍金はエッチングレジストとし
て作用し、最後に鍍金に使用した電極7を端面より切断
する。
Next, the flexible circuit is shown in FIG.
After connecting the electrode 7 for electroplating to one end of the connecting conductor 8 as shown in (b), an overcoat 30 is applied so that the connecting position of the connecting pad 50 and the connecting conductor 8 is opened. In this state, the electrodes 7 of the connecting conductors 8 are energized to predetermined plating on the connection pads 50, and then only the connecting conductor portions 8 connecting the conductors 20 are removed by etching. In this case, the plating applied to the connection pad 5 acts as an etching resist, and finally the electrode 7 used for plating is cut from the end face.

【0016】この様にして製造したフレキシブルサーキ
ットは、その端部にはコネクタのコンタクトと接触する
ための接続パッド50を千鳥状に配置し、且つ導体20
の端部が外部に露出しない接栓部40を形成するもので
ある。この導体2の接続パッド50より先端側について
は、絶縁基材1の端面より内側の位置(寸法a)で、か
つ接続パッド50よりも先端側の位置(寸法b;余長寸
法)で止まっている構造となっている。前記接続パッド
50を千鳥状に配列したことにより、本実施例によるフ
レキシブルサーキットは、隣接するパッドとの沿面距離
を小さくすることができ、高密度に接続パッド50を配
置することができる。尚、このパッド部5の配列は、コ
ネクタ側のコンタクト接触位置に一致させることは言う
までもない。また先端からの寸法aおよび導体の余長寸
法bは、コネクタの挿入深さから決定される。以上の構
成にすることによって、導体間の絶縁性は、平面上のパ
ッド間距離のみに依存し、またパッドに加わる外力に対
して導体の剥離強度を向上することができる。
In the flexible circuit thus manufactured, the connection pads 50 for contacting the contacts of the connector are arranged in a zigzag pattern at the ends thereof, and the conductors 20 are formed.
The end portion of the plug is formed as a plug 40 that is not exposed to the outside. The tip end side of the connection pad 50 of the conductor 2 stops at a position inside the end surface of the insulating base material 1 (dimension a) and at a tip end side of the connection pad 50 (dimension b; extra length dimension). It has a structure. By arranging the connection pads 50 in a zigzag pattern, the flexible circuit according to the present embodiment can reduce the creepage distance between the adjacent pads and can arrange the connection pads 50 at high density. Needless to say, the arrangement of the pad portions 5 is matched with the contact contact position on the connector side. Further, the dimension a from the tip and the extra length dimension b of the conductor are determined from the insertion depth of the connector. With the above configuration, the insulation between the conductors depends only on the distance between the pads on the plane, and the peel strength of the conductor can be improved against the external force applied to the pads.

【0017】図2は本発明によるフレキシブルサーキッ
トの第2の実施例を示す図である。本実施例によるフレ
キシブルサーキットは、前述した製造方法において導体
21にオーバーコートを施す際に長方形状にオーバコー
トが開口する様にオーバーコート31及び端部のオーバ
ーコート3aを設けたものである。本実施例によるフレ
キシブルサーキットは、前記実施例同様に導体間の絶縁
性を確保し、且つパッドに加わる外力に対して導体の剥
離強度を向上することができる。尚、本実施例において
はオーバーコートを長方形状に開口する例を示したが接
続パッド51のみが平行に露出するようにしても良い。
FIG. 2 is a diagram showing a second embodiment of the flexible circuit according to the present invention. The flexible circuit according to the present embodiment is provided with the overcoat 31 and the end overcoat 3a so that the overcoat is opened in a rectangular shape when the conductor 21 is overcoated in the above-described manufacturing method. The flexible circuit according to the present embodiment can secure the insulation between the conductors and improve the peel strength of the conductor against an external force applied to the pad, as in the above embodiments. In this embodiment, the example in which the overcoat is opened in a rectangular shape is shown, but only the connection pad 51 may be exposed in parallel.

【0018】図3は他の実施例によるフレキシブルサー
キットを示す斜視図である。本実施例によるフレキシブ
ルサーキットは、従来の製造方法において導体22への
オーバーコートを施す際にフレキシブルサーキットの端
部が全て露出する様にオーバーコート32を施した後
に、この端部を折曲して折り曲げ部6を形成することに
よって、端部の絶縁性を確保したものである。本実施例
によるフレキシブルサーキットは、前記実施例同様に導
体間の絶縁性を確保できるようにし、且つ折曲によって
強度が更に向上することができる。
FIG. 3 is a perspective view showing a flexible circuit according to another embodiment. In the flexible circuit according to the present embodiment, when the conductor 22 is overcoated in the conventional manufacturing method, the flexible circuit is overcoated so that the entire end of the flexible circuit is exposed, and then the end is bent. By forming the bent portion 6, the insulation of the end portion is secured. In the flexible circuit according to the present embodiment, the insulation between the conductors can be ensured as in the above embodiments, and the strength can be further improved by bending.

【0019】この様に本実施例によるフレキシブルサー
キットは、まず接栓部先端での導体露出がないため、コ
ネクタとの接続時に生ずる沿面距離の不確定性がなくな
り、隣接導体間の絶縁性が確保でき、信頼性が向上す
る。また接続パッドの剥離強度が上がることから、接続
パッドの面積を小さくすることができ、全体として接栓
の狭ピッチ化が可能となる。
As described above, in the flexible circuit according to the present embodiment, since the conductor is not exposed at the tip of the plugging portion, the uncertainty of the creepage distance generated when the connector is connected is eliminated, and the insulation between adjacent conductors is secured. It is possible and reliability is improved. Further, since the peeling strength of the connection pad is increased, the area of the connection pad can be reduced, and the pitch of the contact plugs can be narrowed as a whole.

【0020】[0020]

【発明の効果】以上述べた如く本発明によるフレキシブ
ルサーキットは、コネクタに挿入される先端部を電気的
に絶縁したことによって、前記複数導体間が結露や挿抜
によって堆積する金属摩耗粉等に起因する短絡を防止し
且つ接続パッドの剥離強度を向上することができる。ま
た本発明によるフレキシブルサーキットの製造方法は、
複数導体の端部が絶縁基板端部に露出しない様に並列的
に配置し、且つ接続パッド箇所以外の導体をオーバーコ
ートすることによって短絡を防止し且つ接続パッドの剥
離強度を向上することができる。
As described above, the flexible circuit according to the present invention is caused by metal abrasion powder or the like accumulated between the plurality of conductors due to dew condensation or insertion and removal by electrically insulating the tip end portion inserted into the connector. It is possible to prevent a short circuit and improve the peel strength of the connection pad. The method for manufacturing a flexible circuit according to the present invention is
Short-circuiting can be prevented and peeling strength of the connection pad can be improved by arranging the end portions of the plurality of conductors in parallel so as not to be exposed at the end portion of the insulating substrate and overcoating the conductors other than the connection pad portion. .

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるフレキシブルサーキットの第1の
実施例を示す図。
FIG. 1 is a diagram showing a first embodiment of a flexible circuit according to the present invention.

【図2】本発明によるフレキシブルサーキットの第2の
実施例を示す図。
FIG. 2 is a diagram showing a second embodiment of the flexible circuit according to the present invention.

【図3】本発明によるフレキシブルサーキットの第3の
実施例を示す図。
FIG. 3 is a diagram showing a third embodiment of a flexible circuit according to the present invention.

【図4】本発明によるフレキシブルサーキットの製造方
法を説明するための図。
FIG. 4 is a diagram for explaining a method of manufacturing a flexible circuit according to the present invention.

【図5】従来技術によるフレキシブルサーキットの製造
方法を説明するための図。
FIG. 5 is a diagram for explaining a method for manufacturing a flexible circuit according to a conventional technique.

【図6】従来技術によるフレキシブルサーキットのコネ
クタ接続状態を示す図。
FIG. 6 is a view showing a connector connection state of a flexible circuit according to a conventional technique.

【図7】従来技術によるフレキシブルサーキットのコネ
クタ接続状態を示す図。
FIG. 7 is a view showing a connector connection state of a flexible circuit according to a conventional technique.

【符号の説明】[Explanation of symbols]

1:絶縁基材,2:導体,3:オーバーコート,4:接
栓部,5:接続パッド,6:折り曲げ部,7:鍍金電
極,8:導体連結部,9:エッチング用クリアーパッ
ド,10:カットライン,11:コネクタ,11a:モ
ールド突起,12:塵埃。
1: Insulating substrate, 2: Conductor, 3: Overcoat, 4: Plug part, 5: Connection pad, 6: Bent part, 7: Plating electrode, 8: Conductor connecting part, 9: Clear pad for etching, 10 : Cut line, 11: Connector, 11a: Mold protrusion, 12: Dust.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 並設された複数導体の一部を露出した接
続パッドを備え、該接続パツドがコネクタの端子に接触
することによって導通するフレキシブルサーキットにお
いて、コネクタに挿入される先端部を絶縁したことを特
徴とするフレキシブルサーキット。
1. A flexible circuit, which comprises a connection pad exposing a part of a plurality of conductors arranged in parallel, and which is electrically connected when the connection pad comes into contact with a terminal of the connector, insulates a tip portion inserted into the connector. A flexible circuit characterized by that.
【請求項2】 並設された複数導体の一部を露出した接
続パッドを備え、該接続パツドがコネクタの端子に接触
することによって導通するフレキシブルサーキットにお
いて、千鳥状に配置した接続パッド位置を除いた全導体
を絶縁することを特徴とするフレキシブルサーキット。
2. In a flexible circuit, which is provided with connection pads exposing a part of a plurality of conductors arranged in parallel, and which conducts when the connection pads come into contact with the terminals of the connector, the connection pads arranged in a staggered pattern are excluded. A flexible circuit characterized by insulating all conductors.
【請求項3】 並設された複数導体の一部を露出した接
続パッドを備えるフレキシブルサーキットの製造方法で
あって、絶縁基材上に複数導体を一部が連結導体部によ
り導通すると共に複数導体の端部が絶縁基板端部に露出
しない様に並列的に配置し、前記複数導体の一部及び連
結導体部が露出するオーバーコートを施し、前記連結導
体部に電気鍍金用電力を供給して前記複数導体の一部に
鍍金して接続パッドを構成した後に、前記連結導体部を
除去することによってコネクタに挿入される先端部を絶
縁したことを特徴とするフレキシブルサーキットの製造
方法。
3. A method for manufacturing a flexible circuit, comprising a connection pad exposing a part of a plurality of conductors arranged in parallel, wherein the plurality of conductors are partially conducted by a connecting conductor portion on an insulating base material. Are arranged in parallel so as not to expose the end portions of the insulating substrate to the end portions of the insulating substrate, and an overcoat is applied to expose a part of the plurality of conductors and the connecting conductor portion, and electric power for electroplating is supplied to the connecting conductor portion. A method for manufacturing a flexible circuit, characterized in that, after forming a connection pad by plating a part of the plurality of conductors, the connecting conductor portion is removed to insulate a tip portion inserted into a connector.
JP4159397A 1992-06-18 1992-06-18 Flexible circuit and manufacture thereof Pending JPH066003A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4159397A JPH066003A (en) 1992-06-18 1992-06-18 Flexible circuit and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4159397A JPH066003A (en) 1992-06-18 1992-06-18 Flexible circuit and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH066003A true JPH066003A (en) 1994-01-14

Family

ID=15692889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4159397A Pending JPH066003A (en) 1992-06-18 1992-06-18 Flexible circuit and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH066003A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7314268B2 (en) 2001-07-30 2008-01-01 Seiko Epson Corporation Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
JP2013522890A (en) * 2010-03-17 2013-06-13 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Control equipment
CN104602457A (en) * 2015-01-01 2015-05-06 王定锋 Novel method for manufacturing circuit board and circuit board manufactured through novel method for manufacturing circuit board
KR20150100940A (en) * 2013-03-28 2015-09-02 미츠비시 히타치 파워 시스템즈 가부시키가이샤 Engine fault detection method, engine control device implementing this method, and power generation plant equipped with this device
US9370093B2 (en) 2013-05-10 2016-06-14 Nichia Corporation Wiring board and light emitting device using same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7314268B2 (en) 2001-07-30 2008-01-01 Seiko Epson Corporation Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
JP2013522890A (en) * 2010-03-17 2013-06-13 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Control equipment
KR20150100940A (en) * 2013-03-28 2015-09-02 미츠비시 히타치 파워 시스템즈 가부시키가이샤 Engine fault detection method, engine control device implementing this method, and power generation plant equipped with this device
US9370093B2 (en) 2013-05-10 2016-06-14 Nichia Corporation Wiring board and light emitting device using same
CN104602457A (en) * 2015-01-01 2015-05-06 王定锋 Novel method for manufacturing circuit board and circuit board manufactured through novel method for manufacturing circuit board

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