CN106163143A - A kind of blind technique cut of multilamellar Rigid Flex outer layer - Google Patents
A kind of blind technique cut of multilamellar Rigid Flex outer layer Download PDFInfo
- Publication number
- CN106163143A CN106163143A CN201610560265.6A CN201610560265A CN106163143A CN 106163143 A CN106163143 A CN 106163143A CN 201610560265 A CN201610560265 A CN 201610560265A CN 106163143 A CN106163143 A CN 106163143A
- Authority
- CN
- China
- Prior art keywords
- blind
- hardboard
- outer layer
- grooving
- described step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09836—Oblique hole, via or bump
Abstract
The invention provides a kind of blind technique cut of multilamellar Rigid Flex outer layer, comprise the steps: that A. carries out blind cutting at hardboard internal layer and forms the first blind grooving；B. the bonded adhesives holding window successfully is placed in hardboard internal layer, then soft board is attached on bonded adhesives；C. carrying out blind cutting at hardboard outer layer and form the second blind grooving, staggers with the first blind grooving position in the second blind grooving position.The invention has the beneficial effects as follows: the blind grooving on two sides of the present invention can be held in well-regulated dislocation, do not interfere with the overall dimensions of product, the bad control of laser energy can be prevented again, easily incised wound internal layer soft board problem, this addresses the problem the bad control of laser energy and hurt internal layer soft board problem, improve the production yield of this series products.
Description
Technical field
The present invention relates to the manufacturing process of the multilamellar Rigid Flex outer layer of FPC, particularly relate to a kind of multilamellar soft or hard and combine
The blind technique cut of plate outer layer.
Background technology
As it is shown in figure 1, at present my department utilize blind cut, blind slot (laser blind cut, the blind cutting process of gong plate) technology is at batch
Produce multilamellar Rigid Flex.Technological process is usually: hardboard and soft board faying face need hardboard position leapfrog of windowing swash
Light or gong plate, 3/5ths (forming the first blind grooving) of place's hardboard blind cutting depth about thickness of slab of windowing herein, will hold window successfully
Bonded adhesives to good hardboard face overlap soft board, pressing；Windowing so would not occur when doing product outer layer, be complete one
Block plate, also would not occur that outer layer hardboard is first windowed the shortcoming produced, to last (when rushing external form) general's above laser or gong plate again
Cross a local other laser of 3/5ths or 2/5ths (forming the second blind groovings) of the gong plate degree of depth about thickness of slab, in inciting somebody to action
Between region not take off.When solving soft or hard junction pressing plate, soft board occurs that step, plank deformation and outer layer silk screen ink amass
The problem of oil.
But, this type of production finds a problem in production in enormous quantities, and outer layer hardboard is to the inside blind cutting-in of one side
After spending 3/5ths of about thickness of slab, laser energy bad control during laser 2/5ths to the outside, easy incised wound internal layer
Soft board, affects yield.
Summary of the invention
The invention provides a kind of blind technique cut of multilamellar Rigid Flex outer layer, comprise the steps:
A. carry out blind cutting at hardboard internal layer and form the first blind grooving；
B. the bonded adhesives holding window successfully is placed in hardboard internal layer, then soft board is attached on bonded adhesives；
C. carrying out blind cutting at hardboard outer layer and form the second blind grooving, staggers with the first blind grooving position in the second blind grooving position.
As a further improvement on the present invention, in described step A, blind cutting depth is 3/5ths of hardboard thickness；?
In described step C, blind cutting depth is 2/5ths of hardboard thickness.
As a further improvement on the present invention, in described step C, the second blind grooving position is wrong with the first blind grooving position
Position 0.04-0.06 millimeter.
As a further improvement on the present invention, in described step C, the second blind grooving position is wrong with the first blind grooving position
Position 0.04-0.06 millimeter.
As a further improvement on the present invention, in described step A, after outer layer base material blanking successively through patch dry film, exposure,
Etching forms hardboard, is wherein etched to etch the line pattern of outer layer base material inwardly one side.
As a further improvement on the present invention, in described step B, the bonded adhesives holding window successfully is placed in hardboard internal layer,
Then soft board is attached on bonded adhesives, the most laminated, hole, heavy copper, copper facing, patch dry film, expose, develop, etch, print
Solder mask, expose, develop, cured printing ink, change gold, lettering symbol step, wherein, etching in stepb refers to etch outer layer
The circuit of base material outwards one side.
The invention has the beneficial effects as follows: the blind grooving on two sides of the present invention can be held in well-regulated dislocation, does not interferes with product
Overall dimensions, can prevent again the bad control of laser energy, easy incised wound internal layer soft board problem, this addresses the problem laser energy not
Good control hurts internal layer soft board problem, improves the production yield of this series products.
Accompanying drawing explanation
Fig. 1 is current production technology schematic diagram.
Fig. 2 is the process schematic representation of the present invention.
Detailed description of the invention
As in figure 2 it is shown, the invention discloses a kind of blind technique cut of multilamellar Rigid Flex outer layer, comprise the steps:
A. carry out blind cutting at hardboard internal layer and form the first blind grooving；
B. the bonded adhesives holding window successfully is placed in hardboard internal layer, then soft board is attached on bonded adhesives；
C. carrying out blind cutting at hardboard outer layer and form the second blind grooving, staggers with the first blind grooving position in the second blind grooving position.
In described step A, blind cutting depth is 3/5ths of hardboard thickness；In described step C, blind cutting depth is hard
2/5ths of plate thickness.
In described step C, the second blind grooving position and the first blind grooving location dislocation 0.04-0.06 millimeter.
As the preferred embodiments of the present invention, in described step C, the second blind grooving position is wrong with the first blind grooving position
0.05 millimeter, position.
In described step A, after outer layer base material blanking successively through patch dry film, expose, etch formed hardboard, be wherein etched to
Etch the line pattern of outer layer base material inwardly one side.
In described step B, the bonded adhesives holding window successfully is placed in hardboard internal layer, then soft board is attached on bonded adhesives,
The most laminated, hole, heavy copper, copper facing, patch dry film, expose, develop, etch, print solder mask, expose, develop, solidify
Ink, change gold, lettering symbol step, wherein, etching in stepb refers to etch outer layer base material circuit the most simultaneously.
In concrete implementation process: after outer layer base material blanking → patch dry film → exposure → etching (etch outer layer inside
The line pattern of one side) → laser or gong blind slot.Then, after internal layer is carried out → paste pure glue → lamination (outer layer hardboard and internal layer
Para-position stacks) → lamination → boring → (etching outer layer is outside in heavy copper → copper facing → patch dry film → exposure → development → etching
One side circuit) → print solder mask → exposure → development → cured printing ink → change gold → lettering symbol → laser or gong blind slot window
Flexible board area window, designs blind grooving position herein and inwardly misplaces 0.05 millimeter with blind grooving position the most simultaneously, then remove and need to open
Window position hardboard → inspection → shipment..
The blind grooving on two sides of the present invention can be held in well-regulated dislocation, does not interferes with the overall dimensions of product, can prevent from again swashing
The bad control of light energy, easy incised wound internal layer soft board problem, this addresses the problem the bad control of laser energy and hurt internal layer soft board
Problem, improves the production yield of this series products.
Above content is to combine concrete preferred implementation further description made for the present invention, it is impossible to assert
Being embodied as of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of present inventive concept, it is also possible to make some simple deduction or replace, all should be considered as belonging to the present invention's
Protection domain.
Claims (6)
1. the blind technique cut of multilamellar Rigid Flex outer layer, it is characterised in that comprise the steps:
A. carry out blind cutting at hardboard internal layer and form the first blind grooving；
B. the bonded adhesives holding window successfully is placed in hardboard internal layer, then soft board is attached on bonded adhesives；
C. carrying out blind cutting at hardboard outer layer and form the second blind grooving, staggers with the first blind grooving position in the second blind grooving position.
Technique the most according to claim 1, it is characterised in that in described step A, blind cutting depth is the five of hardboard thickness
/ tri-；In described step C, blind cutting depth is 2/5ths of hardboard thickness.
Technique the most according to claim 1, it is characterised in that in described step C, the second blind grooving position is blind with first
Grooving location dislocation 0.04-0.06 millimeter.
Technique the most according to claim 3, it is characterised in that in described step C, the second blind grooving position is blind with first
Grooving location dislocation 0.05 millimeter.
5. according to the technique described in any one of Claims 1-4, it is characterised in that in described step A, outer layer base material blanking
After successively through patch dry film, expose, etch formation hardboard, be wherein etched to etch outer layer base material line pattern the most simultaneously.
Technique the most according to claim 5, it is characterised in that in described step B, is placed in the bonded adhesives holding window successfully
Hardboard internal layer, is then attached to soft board on bonded adhesives, the most laminated, hole, heavy copper, copper facing, patch dry film, expose, aobvious
Shadow, etch, print solder mask, expose, develop, cured printing ink, change gold, lettering symbol step, wherein, etching in stepb is
Refer to the circuit of etching outer layer base material outwards one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610560265.6A CN106163143A (en) | 2016-07-13 | 2016-07-13 | A kind of blind technique cut of multilamellar Rigid Flex outer layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610560265.6A CN106163143A (en) | 2016-07-13 | 2016-07-13 | A kind of blind technique cut of multilamellar Rigid Flex outer layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106163143A true CN106163143A (en) | 2016-11-23 |
Family
ID=58059639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610560265.6A Pending CN106163143A (en) | 2016-07-13 | 2016-07-13 | A kind of blind technique cut of multilamellar Rigid Flex outer layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106163143A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107683021A (en) * | 2017-10-27 | 2018-02-09 | 汕头凯星印制板有限公司 | A kind of rigid-flexible combined circuit board |
| CN109152209A (en) * | 2018-09-03 | 2019-01-04 | 江门荣信电路板有限公司 | The integrally formed soft or hard combination PCB circuit board of one kind and its manufacturing method |
| CN111836481A (en) * | 2020-06-02 | 2020-10-27 | 江西一诺新材料有限公司 | Manufacturing method of rigid-flex board |
| CN113905544A (en) * | 2021-10-25 | 2022-01-07 | 恒赫鼎富(苏州)电子有限公司 | Process for preparing rigid-flex board by semi-radium method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122856A (en) * | 1993-10-20 | 1995-05-12 | Sumitomo Electric Ind Ltd | Flexible and rigid multilayer board and its manufacture |
| CN1212820A (en) * | 1997-01-29 | 1999-03-31 | 摩托罗拉公司 | Method and combined circuit board for preventing delamination and sagging in course of manufacturing complex circuit board |
| CN203279347U (en) * | 2013-03-22 | 2013-11-06 | 博罗县精汇电子科技有限公司 | Rigid-flexible printed circuit board and processing device thereof |
| CN203859936U (en) * | 2014-05-15 | 2014-10-01 | 深圳市华严慧海电子有限公司 | PCB connection plate |
-
2016
- 2016-07-13 CN CN201610560265.6A patent/CN106163143A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122856A (en) * | 1993-10-20 | 1995-05-12 | Sumitomo Electric Ind Ltd | Flexible and rigid multilayer board and its manufacture |
| CN1212820A (en) * | 1997-01-29 | 1999-03-31 | 摩托罗拉公司 | Method and combined circuit board for preventing delamination and sagging in course of manufacturing complex circuit board |
| CN203279347U (en) * | 2013-03-22 | 2013-11-06 | 博罗县精汇电子科技有限公司 | Rigid-flexible printed circuit board and processing device thereof |
| CN203859936U (en) * | 2014-05-15 | 2014-10-01 | 深圳市华严慧海电子有限公司 | PCB connection plate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107683021A (en) * | 2017-10-27 | 2018-02-09 | 汕头凯星印制板有限公司 | A kind of rigid-flexible combined circuit board |
| CN109152209A (en) * | 2018-09-03 | 2019-01-04 | 江门荣信电路板有限公司 | The integrally formed soft or hard combination PCB circuit board of one kind and its manufacturing method |
| CN111836481A (en) * | 2020-06-02 | 2020-10-27 | 江西一诺新材料有限公司 | Manufacturing method of rigid-flex board |
| CN113905544A (en) * | 2021-10-25 | 2022-01-07 | 恒赫鼎富(苏州)电子有限公司 | Process for preparing rigid-flex board by semi-radium method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |