CN111836481A - Manufacturing method of rigid-flex board - Google Patents
Manufacturing method of rigid-flex board Download PDFInfo
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- CN111836481A CN111836481A CN202010488625.2A CN202010488625A CN111836481A CN 111836481 A CN111836481 A CN 111836481A CN 202010488625 A CN202010488625 A CN 202010488625A CN 111836481 A CN111836481 A CN 111836481A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing a rigid-flexible printed circuit board, which is characterized in that blind cutting is performed on the back surface of a rigid board along the edge of a pre-opening cover area in advance before the rigid-flexible printed circuit board is laminated, specifically, a rigid layer insulating layer is cut to a rigid layer conducting layer from the edge of the rigid layer insulating layer corresponding to the pre-opening cover area, and only one section of connecting strip is reserved to avoid the rigid layer insulating layer of the pre-opening cover area from being cut off. When outer circuit is manufactured after the soft board and the hard board are pressed, the rigid layer conducting layer in the uncovering area is directly etched and removed, the exposed rigid layer insulating layer in the uncovering area connected only through the connecting strip can be directly torn off, windowing is safely finished, a laser machine is not needed to be used for cutting and windowing, and the problem that the soft board is damaged due to the fact that the tangent windowing depth is improperly controlled in the original manufacturing method is solved.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a rigid-flex printed circuit board.
Background
The birth and development of FPC and PCB have promoted a new product of soft and hard combined board. The rigid-flex printed circuit board (FPC) is a circuit board with FPC and PCB characteristics formed by combining a flexible circuit board and a rigid circuit board through processes such as pressing and the like according to relevant process requirements. The rigid-flex printed circuit board has the advantages that the regularity and toughness of the conventional rigid board and the flexibility and smallness of the flexible board are considered, the rigid-flex printed circuit board can move, bend, fold and twist, three-dimensional wiring is realized, and the installation space of electronic components is greatly saved.
The rigid-flex bonded panel includes a rigid layer and a flexible layer, the region of the flexible layer exposed is referred to as the flexible region, and the region of the rigid layer opposite the flexible region during fabrication is referred to as the cut-out region. The method for manufacturing the window is characterized in that the flexible area is formed by partially exposing the flexible layer through pressing and manufacturing the window, the core step of manufacturing the rigid-flex combined board is to manufacture the window in various modes, and the traditional method is to directly cut and open the window in the hard board area by using a laser cutting depth-fixing mode before the soft and hard boards are directly pressed and finished products are delivered. Or the back of the precut area of the hard board area is cut in a blind way to a certain depth before lamination, and then the front of the precut area of the hard board area is cut in a laser way to a certain depth before finished products are cut into windows in a laser way, so that the defects that the depth precision of laser cutting is different, the equipment precision of each laser cutting machine is different, the energy control stability is different, the cutting depth is easy to have errors, the products are generally thin, and the soft board body can be directly cut and damaged if the cutting depth is improperly controlled, so that the product function is influenced.
Disclosure of Invention
The invention solves the problem of improving the manufacturing process of the rigid-flexible printed circuit board and avoiding the damage of the rigid printed circuit board caused by improper depth control when the rigid printed circuit board is windowed.
In order to solve the above problems, the present invention provides a method for manufacturing a rigid-flex board, comprising the following steps,
s1: manufacturing a rigid layer: after a circuit is manufactured on the rigid core board, blind cutting is carried out on the back face of the rigid core board along the edge of the pre-opening cover area, wherein the rigid core board comprises a rigid layer conducting layer and a rigid layer insulating layer which are stacked, the rigid layer conducting layer is radium-cut on the rigid layer insulating layer along the edge of the pre-opening cover area, and a section of connecting strip is reserved to connect the pre-opening cover area and the rigid layer insulating layer of other areas;
manufacturing a flexible layer: manufacturing a circuit on the flexible core board and attaching a cover film;
manufacturing a bonding layer: performing advanced punching type windowing on the prepreg corresponding to the position of the pre-cap opening area;
s2: laminating and pressing the flexible layer, the bonding layer and the rigid layer into a whole to form a multilayer production plate, and sequentially drilling, depositing copper and electroplating;
s3: manufacturing an outer layer circuit: carrying out exposure pattern on the multilayer production board, then developing, etching and removing a film to complete circuit manufacturing, and etching and removing the edge of the uncapping area on the conductive layer of the rigid layer during circuit etching;
s4: carrying out solder mask, character screen printing and surface treatment on the multilayer production board;
s5: and (3) molding the multilayer production plate, and directly tearing off the cover opening area rigid layer after molding to expose the flexible layer.
Preferably, in step S1, after the cover area is cut blindly on the back surface of the rigid core board and the connecting strips are reserved, a second blind cut is performed on the connecting strips to reduce the thickness of the connecting strips and form micro-connections.
Preferably, the thickness of the connecting strip after the secondary blind cutting is 10% -40% of the thickness of the insulating layer of the rigid layer.
Preferably, the length of the reserved connecting strip is 0.3-0.5 mm.
Compared with the prior art, the technical scheme of the invention has the following advantages:
according to the manufacturing method of the rigid-flexible printed circuit board, before the rigid-flexible printed circuit board is laminated, blind cutting is performed on the back of the rigid printed circuit board in advance along the edge of the pre-opening cover area, specifically, the rigid layer insulating layer is cut to the rigid layer conducting layer from the edge of the rigid layer insulating layer corresponding to the pre-opening cover area, and only one section of connecting strip is reserved to prevent the rigid layer insulating layer of the pre-opening cover area from being cut off. When outer circuit is manufactured after the soft board and the hard board are pressed, the rigid layer conducting layer in the uncovering area is directly etched and removed, the exposed rigid layer insulating layer in the uncovering area connected only through the connecting strip can be directly torn off, windowing is safely finished, a laser machine is not needed to be used for cutting and windowing, and the problem that the soft board is damaged due to the fact that the tangent windowing depth is improperly controlled in the original manufacturing method is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a flow chart of a method for manufacturing a rigid-flex circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a laminated structure of a flexible board coated with a film according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a partial laminated structure of a multi-layer production board after lamination of soft and hard plates according to an embodiment of the invention;
FIG. 4 is a schematic view of a partially laminated structure after resistance welding of a multi-layer production panel in accordance with an embodiment of the present invention;
FIG. 5 is a schematic view of a partially laminated structure after windowing a multi-layer production panel in accordance with an embodiment of the invention;
fig. 6 is a schematic structural diagram of a rigid layer obtained by cutting a section of the rigid layer in a blind cut manner according to the embodiment of the present invention.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Examples
Referring to fig. 1 to 6, the present invention provides a method for manufacturing a rigid-flex board, including the following steps,
s1: manufacturing a rigid layer: after a circuit is manufactured on the rigid core board, blind cutting is carried out on the back surface of the rigid core board along the edge corresponding to the pre-opening cover area, wherein the rigid core board comprises a rigid layer conducting layer and a rigid layer insulating layer which are stacked, the rigid layer conducting layer is radium-cut to the rigid layer insulating layer along the edge corresponding to the pre-opening cover area on the rigid layer insulating layer, and a section of connecting strip is reserved to connect the pre-opening cover area and the rigid layer insulating layer of other areas; the rigid layer conductive layer is generally a front side copper layer, and a laser cutting machine is used to control the cutting depth from the back side of the hard plate to the front side copper layer. As shown in fig. 3, the rigid layer may be a double-sided arrangement, comprising rigid layer conductive layers 101a, 101b, and rigid layer insulating layers 102a, 102b, leaving double- sided connection strips 103a, 103 b.
Preferably, in step S1, after the edges of the cover area are cut blindly on the back surface of the rigid core board and the connecting strips are reserved, secondary blind cutting may be performed on the connecting strips to reduce the thickness of the connecting strips to form micro-connections, which are then easily torn. As shown in fig. 6, the connection bar 103a is left by blind cutting for the first time, H1 is blind cut on both sides of the connection bar 103a to a depth exposing the rigid layer conductive layer 101a, and H2 is blind cut on the connection bar 103a for the second time. Reducing the thickness of the connecting strips forms a micro-connection that is easily torn.
Preferably, the thickness of the connecting strip after the secondary blind cutting is 10 to 40 percent of the thickness of the insulating layer of the rigid layer.
Preferably, the length of the reserved connecting strip is 0.3-0.5 mm.
Manufacturing a flexible layer: as shown in fig. 2, the flexible layer may include a middle flexible layer insulating layer 201, double-sided flexible layer substrates 202a and 202b, and double- sided coverlay films 203a and 203 b;
manufacturing a bonding layer: performing advanced punching type windowing on the prepregs corresponding to the pre-cap opening area, as shown in fig. 3, arranging double- sided prepregs 301a and 301 b;
s2: and laminating and pressing the flexible layer, the bonding layer and the rigid layer into a whole to form a multilayer production plate, and sequentially drilling, depositing copper and electroplating.
The specific plate arrangement sequence can be that a rigid layer, a prepreg, a flexible layer, the prepreg and the rigid layer are arranged from top to bottom, rivets are firstly used for riveting at preset rivet holes, and then the laminated plates are pressed together under proper lamination conditions according to plate materials to form the multilayer production plate. Drilling an outer layer: and measuring the expansion and shrinkage sizes after the multilayer production plate is pressed, acquiring drilling parameters, and drilling inner and outer layer through holes and other tool holes on the multilayer production plate by using a mechanical drilling mode. Copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m. Electroplating: according to the mechanism of electrochemical reaction, a layer of copper is electroplated on the basis of copper deposition, the thickness of the hole copper is ensured to meet the product requirement, and electroplating parameters are set according to the thickness of the finished hole copper.
S3: manufacturing an outer layer circuit: and carrying out development etching and film removal on the multilayer production board after the exposure pattern is carried out to complete the circuit manufacturing, and etching and removing the edge of the uncovering area on the conducting layer of the rigid layer during the circuit etching, namely etching and removing the front copper layer of the hard board according to the edge of the uncovering area.
S4: carrying out solder mask, character screen printing and surface treatment on the multilayer production board;
solder resist and silk screen printing of characters: by making a green oil layer on the outer layer of the multilayer production board and silk-screen printing characters, the thickness of the green oil is as follows: 10-50 μm, so that the influence of environmental change on the production plate can be reduced in the subsequent use process. As shown in fig. 4, solder resists 401a and 401b are formed on both surfaces of the outer layer.
Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-7 μm; the thickness of the gold layer is as follows: 0.05-0.2 μm.
S5: and (3) molding the multilayer production plate, and directly tearing off the cover opening area rigid layer after molding to expose the flexible layer.
The method also comprises the following steps after forming:
electrical testing: and testing the electrical conduction performance of the finished board, wherein the test method is a flying probe test.
FQC: and checking whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
Packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
According to the manufacturing method of the rigid-flexible printed circuit board, before the rigid-flexible printed circuit board is laminated, blind cutting is performed on the back of the rigid printed circuit board in advance along the edge of the pre-opening cover area, specifically, the rigid layer insulating layer is cut to the rigid layer conducting layer from the edge of the rigid layer insulating layer corresponding to the pre-opening cover area, and only one section of connecting strip is reserved to prevent the rigid layer insulating layer of the pre-opening cover area from being cut off. When outer circuit is manufactured after the soft board and the hard board are pressed, the rigid layer conducting layer in the uncovering area is directly etched and removed, the exposed rigid layer insulating layer in the uncovering area connected only through the connecting strip can be directly torn off, windowing is safely finished, a laser machine is not needed to be used for cutting and windowing, and the problem that the soft board is damaged due to the fact that the tangent windowing depth is improperly controlled in the original manufacturing method is solved.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (4)
1. A method for manufacturing a rigid-flex board is characterized by comprising the following steps,
s1: manufacturing a rigid layer: after a circuit is manufactured on the rigid core board, blind cutting is carried out on the back face of the rigid core board along the edge of the pre-opening cover area, wherein the rigid core board comprises a rigid layer conducting layer and a rigid layer insulating layer which are stacked, the rigid layer conducting layer is radium-cut on the rigid layer insulating layer along the edge of the pre-opening cover area, and a section of connecting strip is reserved to connect the pre-opening cover area and the rigid layer insulating layer of other areas;
manufacturing a flexible layer: manufacturing a circuit on the flexible core board and attaching a cover film;
manufacturing a bonding layer: performing advanced punching type windowing on the prepreg corresponding to the position of the pre-cap opening area;
s2: laminating and pressing the flexible layer, the bonding layer and the rigid layer into a whole to form a multilayer production plate, and sequentially drilling, depositing copper and electroplating;
s3: manufacturing an outer layer circuit: carrying out exposure pattern on the multilayer production board, then developing, etching and removing a film to complete circuit manufacturing, and etching and removing the edge of the uncapping area on the conductive layer of the rigid layer during circuit etching;
s4: carrying out solder mask, character screen printing and surface treatment on the multilayer production board;
s5: and (3) molding the multilayer production plate, and directly tearing off the cover opening area rigid layer after molding to expose the flexible layer.
2. The method of claim 1, wherein in step S1, after the cover area is cut in advance and the connection strips are reserved on the back of the rigid core board, a second blind cut is performed on the connection strips to reduce the thickness of the connection strips and form micro-connections.
3. The method for manufacturing the rigid-flex board according to claim 2, wherein the thickness of the connecting strip after the secondary blind cutting is 10-40% of the thickness of the insulating layer of the rigid layer.
4. The manufacturing method of the rigid-flex board as claimed in claim 1, wherein the length of the reserved connecting strip is 0.3-0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010488625.2A CN111836481A (en) | 2020-06-02 | 2020-06-02 | Manufacturing method of rigid-flex board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010488625.2A CN111836481A (en) | 2020-06-02 | 2020-06-02 | Manufacturing method of rigid-flex board |
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| CN111836481A true CN111836481A (en) | 2020-10-27 |
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| CN202010488625.2A Pending CN111836481A (en) | 2020-06-02 | 2020-06-02 | Manufacturing method of rigid-flex board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115442982A (en) * | 2022-08-22 | 2022-12-06 | 台山市精诚达电路有限公司 | Method for manufacturing soft and hard board |
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| CN101378625A (en) * | 2007-08-27 | 2009-03-04 | 南亚电路板股份有限公司 | Preparation method for soft and hard composite boards |
| CN103648240A (en) * | 2013-12-19 | 2014-03-19 | 博敏电子股份有限公司 | Method for manufacturing symmetrical rigid-flexible printed circuit board |
| CN106163143A (en) * | 2016-07-13 | 2016-11-23 | 博罗县精汇电子科技有限公司 | A kind of blind technique cut of multilamellar Rigid Flex outer layer |
| CN108207092A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board laser takes off lid cut wound flex plate |
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2020
- 2020-06-02 CN CN202010488625.2A patent/CN111836481A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070281499A1 (en) * | 2006-05-30 | 2007-12-06 | Kiyomi Muro | Printed wiring board, its bending method, and electronic apparatus |
| CN101378625A (en) * | 2007-08-27 | 2009-03-04 | 南亚电路板股份有限公司 | Preparation method for soft and hard composite boards |
| CN103648240A (en) * | 2013-12-19 | 2014-03-19 | 博敏电子股份有限公司 | Method for manufacturing symmetrical rigid-flexible printed circuit board |
| CN106163143A (en) * | 2016-07-13 | 2016-11-23 | 博罗县精汇电子科技有限公司 | A kind of blind technique cut of multilamellar Rigid Flex outer layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115442982A (en) * | 2022-08-22 | 2022-12-06 | 台山市精诚达电路有限公司 | Method for manufacturing soft and hard board |
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Application publication date: 20201027 |