CN113260174A - Pattern electroplating method of FPC board - Google Patents
Pattern electroplating method of FPC board Download PDFInfo
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- CN113260174A CN113260174A CN202110388008.XA CN202110388008A CN113260174A CN 113260174 A CN113260174 A CN 113260174A CN 202110388008 A CN202110388008 A CN 202110388008A CN 113260174 A CN113260174 A CN 113260174A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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Abstract
The invention is suitable for the technical field of flexible circuit boards, and provides a pattern electroplating method of an FPC board, which comprises the following steps: providing a substrate, and drilling holes on the substrate; attaching a reinforcing film at the edge of at least one surface of the substrate to reinforce the strength of the edge of the substrate; pressing the reinforced film and the substrate; pasting a dry film on the substrate, exposing and developing to make the dry film window above the hole; and carrying out pattern electroplating on the developed substrate so as to plate copper in the holes. The pattern electroplating method of the FPC board solves the problems that the FPC board is easy to clamp and wrinkles are generated in the manufacturing process of the FPC board, and improves the production efficiency.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a pattern electroplating method of an FPC board.
Background
In a production process of a Flexible Printed Circuit (FPC) board, copper is usually plated in holes of the FPC board by a pattern plating method, so that the multilayer circuits of the FPC board are electrically connected.
The conventional process flow of the pattern electroplating product comprises the following steps: cutting, drilling, black holes, outer layer circuits, pattern electroplating, outer layer film removing, outer layer circuits, outer layer acid etching, outer layer film removing and post-processing. For the FPC board with the thickness not more than 36 μm, the clamping board or the wrinkles are easy to be poor due to the fact that the FPC board is thin in thickness and is directly produced in a horizontal line. At present, the conventional improvement method is to stick the guide plate for production, wherein the processes of black holes, pattern pretreatment cleaning lines and over etching lines all need to stick the guide plate by using adhesive tapes, however, the actions of sticking the adhesive tapes and tearing the adhesive tapes repeatedly seriously affect the production efficiency.
Disclosure of Invention
The invention provides a pattern electroplating method of an FPC board, which aims to solve the problems that the FPC board is easy to clamp and generate wrinkles and the production efficiency is low in the manufacturing process of the FPC board.
The embodiment of the invention provides a pattern electroplating method of an FPC board, which comprises the following steps:
providing a substrate, and drilling holes on the substrate;
attaching a reinforcing film at the edge of at least one surface of the substrate to reinforce the strength of the edge of the substrate;
pressing the reinforced film and the substrate;
pasting a dry film on the substrate, exposing and developing to make the dry film window above the hole;
and carrying out pattern electroplating on the developed substrate so as to plate copper in the holes.
In one embodiment, the reinforcing film comprises three edge strips, and the three edge strips are respectively attached to the edges of the three sides of the FPC production board; the width of the edge strip is 5 mm-15 mm.
In one embodiment, the reinforcing film is a covering film with a glue layer, and the thickness of the glue layer is 5-25 μm; attaching a reinforcing film at an edge of at least one side of the substrate, comprising: drilling a first positioning hole on the reinforced film and cutting the reinforced film into a concave shape, wherein the cut reinforced film comprises three edge strips which are sequentially connected; placing the substrate on a positioning jig provided with a second positioning hole, and inserting a positioning pin into the corresponding first positioning hole and the second positioning hole; and sticking the reinforced film on the FPC board.
In one embodiment, when the reinforcing film and the FPC board are pressed, a four-opening press or a vacuum press is used for pressing; the pressing parameters of the vacuum press include: the pressing temperature is 170-190 ℃, the pre-pressing is carried out for 5-15 s, the forming time is 100-150 s, and the pressure is 1.8-2.2 Mpa; the pressing parameters of the four-opening press comprise: the pressing temperature is 170-190 ℃, the pre-pressing is carried out for 5-15 s, the forming time is 100-150 s, and the pressure is 120kg/cm2～160kg/cm2。
In one embodiment, after laminating the reinforcing film and the substrate, the method further includes: and curing the laminated substrate and the reinforced film at the curing temperature of 150-170 ℃ for 20-30 min.
In one embodiment, the reinforced film is a high temperature resistant adhesive tape, and the thickness of the reinforced film is 15 μm to 35 μm; pressing the reinforced film and the substrate by a vacuum press; the pressing temperature of the vacuum press is 80-100 ℃, the forming time is 10-35 s, and the pressure is 1.8-2.2 Mpa.
In one embodiment, when a dry film is attached to the substrate, if the thickness of the enhancement film is less than 30um, the dry film with the thickness of 25um to 30um is selected; if the thickness of the reinforced film is greater than or equal to 30um, selecting a dry film of 30 um-40 um;
when a dry film is pasted, pressing the film from the direction parallel to the long edge of the substrate, and then pressing the film from the direction parallel to the short edge of the substrate again; the temperature of the film is 90-110 ℃, the speed of the film is 0.9-1.2 m/min, and the pressure of the film is 0.3-0.5 Mpa.
In one embodiment, after laminating the reinforcing film and the FPC board, the pattern plating method further includes: and carrying out black hole treatment on the FPC board through the black hole line.
In one embodiment, the reinforcing film includes a first reinforcing material layer and a second reinforcing material layer, and the first reinforcing material layer is provided between the second reinforcing material layer and the FPC board in the thickness direction of the substrate.
In one embodiment, one side of the first reinforcing material layer close to the middle of the substrate exceeds the second reinforcing material layer by 1-3 mm.
According to the pattern electroplating method of the FPC board, the reinforcing film is attached to the edge of at least one surface of the substrate before copper plating, so that the edge strength of the substrate can be enhanced, and the phenomenon that the substrate is poor in clamping plate or wrinkle due to horizontal line production is prevented. According to the pattern electroplating method of the FPC board, the guide plate does not need to be attached by using the adhesive tape, and the problem of low production efficiency caused by actions of attaching the adhesive tape and tearing the adhesive tape for multiple times is solved. Therefore, the pattern electroplating method of the FPC board solves the problems of easy board clamping and wrinkle generation in the manufacturing process of the FPC board, and improves the production efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a flow chart of a method for pattern plating of an FPC board according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a substrate and a reinforcing film provided by an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a positioning fixture according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a positioning fixture, a substrate and an enhancement film according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a substrate and a reinforcing film according to another embodiment of the present invention;
fig. 6 is a side view of a partial structure of the substrate and the reinforcing film shown in fig. 5.
The designations in the figures mean:
10. a substrate; 20. a reinforcing film; 21. edging; 211. a first layer of reinforcement material; 212. a second layer of reinforcement material; 200. positioning a jig; 210. a second positioning hole; 220. and positioning the contact pin.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
It should be noted that, in the embodiments of the present invention, the same reference numerals are used to denote the same components or parts, and for the same components or parts in the embodiments of the present invention, only one of the components or parts may be labeled with the reference numeral, and it should be understood that the reference numerals are also applicable to other similar components or parts.
To illustrate the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
Referring to fig. 1, an embodiment of the invention provides a method for electroplating a pattern of an FPC board, including the following steps.
Step S1: a substrate is provided and holes are drilled in the substrate.
Optionally, cutting the copper-clad plate raw material into a substrate with a set size, and then drilling holes on the substrate. Wherein, the copper-clad plate can be a double-sided copper-clad plate, and the thickness of the substrate can be less than or equal to 36 μm. In one embodiment, the FPC product roll is cut into 250mm × 220-400 mm substrates, and the substrates are packaged by a cold punching plate and a phenolic plate and then drilled according to the drilling data. It will be appreciated that the size of the substrate may be cut as desired.
In one embodiment, the holes drilled in the substrate are through holes, and it is understood that the holes drilled in the substrate may also include both through holes and blind holes.
Step S2: and attaching a reinforcing film at the edge of at least one surface of the substrate to reinforce the strength of the edge of the substrate.
Referring to fig. 2, in an embodiment, the enhancement film 20 includes three edge strips 21, and the three edge strips 21 are respectively attached to edges of three sides of the substrate 10; the width of the edge strip 21 is 5 mm-15 mm. The reinforcing film 20 may be located at the edge of the three-sided scrap region of the substrate 10 and need not be torn off during manufacture.
The reinforcing film 20 can enhance the strength and toughness of the plate edge and improve the supporting force of the substrate 10. Because the three edge strips 21 are respectively attached to the edges of the three edges of the substrate 10, the reinforcing film 20 is not attached to the other edge of the substrate 10, and the edge to which the reinforcing film 20 is not attached can be used as an electroplating clamping edge in the subsequent electroplating process. For example, one side of the substrate 10 having a length of 250mm is attached with a reinforcing film, and the other side having a length of 250mm is not attached with a reinforcing film.
It is understood that the reinforcing film 20 may be attached to one, both, or four sides of the substrate 10.
In one embodiment, the reinforcing film 20 is attached to both sides of the substrate 10, but it is understood that the reinforcing film 20 may be attached to only one side of the substrate 10.
Alternatively, the reinforcing film 20 may be a cover film or a high temperature resistant tape. Thus, the attaching process of the reinforcing film 20 is convenient and efficient.
Step S3: the reinforcing film 20 and the substrate 10 are pressed.
The reinforcing film 20 and the substrate 10 are pressed together, so that the reinforcing film 20 is tightly attached to the substrate 10, and the edge strength of the substrate 10 is enhanced. Wherein the pressing may be performed using a four-opening press or a vacuum press.
Optionally, after laminating the enhancement film 20 and the substrate 10, the pattern plating method further includes: the substrate 10 is subjected to black hole processing through a black hole line to adhere a conductive carbon powder layer to the inner wall surface of the hole. Wherein, the black hole treatment can be carried out in the plate feeding direction at the side with the length of 250mm and the attached reinforcing film, and the linear speed of the black hole is 2.0-2.5 m/min.
Step S4: a dry film is attached to the substrate 10 and exposed and developed, so that the dry film is windowed above the hole.
When the dry film is attached to the substrate 10, the dry film having a corresponding thickness is selected according to the thickness of the reinforcing film. If the thickness of the reinforced film 20 is less than 30um, selecting a dry film with the thickness of 25 um-30 um; if the thickness of the reinforced film 20 is greater than or equal to 30um, a dry film of 30um to 40um is selected. Thus, the dry film can be favorably stuck to the substrate 10 and the reinforcing film 20, and the sticking failure can be avoided.
Optionally, when the dry film is pasted, pressing a film from a direction (a direction in fig. 2) parallel to the long side of the substrate 10, namely pressing a film perpendicular to the step direction, so that a roller can better press and fill the dry film at the step position, and then pressing back once from a direction (B direction in fig. 2) parallel to the short side of the substrate 10, so that the dry film at the short side step position is tightly attached to the board surface, and the problem of incompact pressing of the dry film at the step position generated by the reinforcing film 20 and the board surface is reduced; standing for 2-6 h after film pasting.
Optionally, the film sticking temperature is 90-110 ℃, the film sticking speed is 0.9-1.2 m/min, and the film sticking pressure is 0.3-0.5 Mpa. Thus, the dry film can be tightly attached to the surface of the substrate 10, and the film attaching cavity can be avoided.
Then, the dry film is exposed and developed, so that the dry film is windowed over the hole to be plated with copper to expose the hole, and the rest part is still covered by the dry film.
Step S5: the developed substrate 10 is pattern-plated to plate copper in the holes.
Specifically, during plating, the femto jig performs copper plating while sandwiching the substrate 10 without the reinforcing film, and thus copper is plated in the hole. Optionally, the current density of electroplating is 0.6 ASD-1.5 ASD, and the electroplating time is 10-15 minutes. During copper plating, the position pasted with the reinforced film is protected by the dry film, copper cannot be plated, and poor plate surface pressure points and poor copper particles caused by falling of copper plating due to insufficient binding force are avoided.
And after the electroplating plated hole is finished, the step of transferring to a graphic process to perform dry film removing treatment, wherein the side which is 250mm in length and is adhered with the reinforcing film 20 is taken as a board feeding direction to feed the board when the dry film is removed.
Thus, the process of pattern plating the substrate 10 of the FPC board is completed. Next, the substrate 10 may be cleaned in a horizontal cleaning line, and the side of the substrate where the reinforcing film 20 is attached is taken as a feeding direction during cleaning; then, the substrate 10 after the development is subjected to etching and film removal processing after film sticking, exposure and development to manufacture the outer layer circuit of the FPC board, and the process is shifted to the next process production after the film removal until the FPC board is manufactured.
According to the pattern electroplating method of the FPC board, the reinforcing film 20 is attached to the edge of at least one side of the substrate 10 before copper plating, so that the strength and toughness of the edge of the substrate 10 can be enhanced, and the phenomenon that the substrate 10 is poor in clamping plate or wrinkle caused by horizontal line production is prevented. According to the pattern electroplating method of the FPC board, the guide plate does not need to be attached by using the adhesive tape, the reinforcing film 20 does not need to be torn off after the reinforcing film is attached, the FPC board can be produced to a finished product all the time, and the problem that the production efficiency is low due to actions of attaching the adhesive tape and tearing the adhesive tape for many times is solved. Therefore, the pattern electroplating method of the FPC board solves the problems of easy board clamping and wrinkle generation in the manufacturing process of the FPC board, and improves the production efficiency.
Further, the reinforcing film 20 is attached before the dry film is attached, so that the phenomenon that the substrate after a black hole is blocked or wrinkled is avoided, the phenomenon that the blocking plate is scrapped when the substrate 10 is rolled into a roller due to the fact that the thickness of the substrate is thin when the dry film is attached is avoided, and the phenomenon that the position of the wrinkle before the dry film is attached is deformed to affect film attachment and exposure is avoided; during development, the guide plate does not need to be attached to be developed horizontally, so that poor wrinkling of the clamping plate is avoided; in addition, the substrate is thin and can be arbitrarily bent, and the reinforcing film 20 is stably attached to the substrate 10, so that the reinforcing film is not easy to fall off, and cannot be adhered to the surface of the substrate to cause short circuit failure in subsequent pattern fabrication.
The following describes a pattern plating method of an FPC board with reference to specific embodiments.
Example one
In the first embodiment, the reinforcing film 20 is a covering film with a glue layer, and the thickness of the glue layer is 5 μm to 25 μm. The reinforcing film 20 comprises three edge strips 21, which three edge strips 21 can be connected in sequence. Optionally, the cover film is a PI (polyimide) film, which may have a thickness of 0.5 mil.
In step S1, a substrate is provided and holes are drilled in the substrate.
In step S2, attaching the reinforcing film 20 at the edge of at least one side of the substrate 10 includes the following steps.
First, a first positioning hole is drilled in the reinforced film 20 and the reinforced film 20 is cut into a concave shape, and the cut reinforced film 20 includes three edge strips 21 connected in sequence, that is, a first edge strip and a second edge strip vertically connected to both sides of the first edge strip. The diameter of the first positioning hole may be 1.0mm, and the position of the first positioning hole corresponds to the positioning hole on the edge of the substrate 10.
Next, referring to fig. 3 and 4, the substrate 10 is placed on the positioning fixture 200 having the second positioning hole 210, and the positioning pins 220 are inserted into the corresponding first positioning hole and the second positioning hole 210. It is understood that the positioning pins 220 are simultaneously inserted into the corresponding first positioning holes, second positioning holes 210 and positioning holes of the substrate 10.
Then, the reinforcing film 20 is attached to the substrate 10. Because the reinforcing film 20 comprises the three edge strips 31 which are connected in sequence, the three edge strips 21 can be attached through one-time attaching process, and the reinforcing film 20 does not need to be attached to each side edge of the substrate 10 independently; moreover, the substrate 10 and the reinforcing film 20 can be accurately positioned by the positioning jig 200, and the attaching accuracy is improved.
It is understood that the reinforcing films 20 may be disposed on both sides of the substrate 10, and in this case, after the substrate 10 is turned over, the above steps are repeated to attach the substrate.
It is understood that the reinforcing film 20 may be cut into three strips 21, and the three strips 21 may be attached to the substrate 10.
In step S3, the substrate 10 may be pressed using a four-opening press or a vacuum press to bond the reinforcing film 20 and the substrate 10. Wherein, the pressing parameters of the vacuum press comprise: the pressing temperature is 170-190 ℃, the pre-pressing is carried out for 5-15 s, the forming time is 100-150 s, and the pressure is 1.8-2.2 Mpa, such as 2 Mpa; the pressing parameters of the four-opening press comprise: the pressing temperature is 170-190 DEG CPrepressing for 5-15 s, forming time of 100-150 s, and pressure of 120-160 kg/cm2E.g. 140kg/cm2. By adopting the pressing parameters, the reinforced film 20 can be tightly attached to the substrate 10, and the substrate is prevented from being damaged.
After step S3 and before step S4, the method for pattern plating of the FPC board further includes: and curing the laminated substrate 10 and the reinforced film 20 at the curing temperature of 150-170 ℃ for 20-30 min. By the curing treatment, the adhesive layer on the cover film can be cured to adhere the cover film to the substrate 10.
Example two
In the second embodiment, the reinforcing film 20 is a high temperature resistant adhesive tape, has a width of 5-15 mm and a thickness of 15-35 μm.
Accordingly, in step S2, the high temperature resistant adhesive tape may be attached by hand. The high-temperature resistant adhesive tape is a coil material, the position of the edge of the plate edge is used as alignment during pasting, manual pasting is carried out, and the plate is cut off by a blade after pasting one strip. It can be understood that the high-temperature resistant adhesive tape can also be attached through an automatic film sticking machine.
In step S3, pressing with a vacuum press; the pressing temperature of the vacuum press is 80-100 ℃, the forming time is 10-35 s, and the pressure is 1.8-2.2 MPa, such as 2 MPa. After pressing, no curing step is required.
Steps S4 and S5 may be substantially the same as those in the first embodiment, and are not described herein again.
EXAMPLE III
Referring to fig. 5 and 6, in an embodiment, the enhancement film 20 includes a first enhancement material layer 211 and a second enhancement material layer 212, and the first enhancement material layer 211 is disposed between the second enhancement material layer 212 and the substrate 10. The first reinforcing material layer 211 and the second reinforcing material layer 212 may be selected from a cover film or a high temperature resistant adhesive tape.
One side of the first reinforcing material layer 211 close to the edge of the substrate 10 is flush with the second reinforcing material layer 212, and is flush with the edge of the substrate 10; one side of the first reinforcing material layer 211 close to the middle of the substrate 10 exceeds the second reinforcing material layer by 1mm to 3mm, i.e. the width of the first reinforcing material layer 211 is 1mm to 3mm larger than that of the second reinforcing material layer 212. It is understood that the first reinforcing material layer 211 may extend beyond the second reinforcing material layer 212 by a certain width on both sides.
In step S2, the first reinforcing material layer 211 is first attached to the edge of the substrate 10, and then the second reinforcing material layer 212 is attached to the first reinforcing material layer 211, i.e., the lamination is performed by using the superposition method.
The method described in example three can be applied to the case where the total thickness of the reinforcing film 20 is equal to or greater than 30 μm. By adopting the technical scheme, the step height difference between the reinforcing film 20 and the substrate 10 when the dry film is pasted can be reduced, and the problem that the dry film cannot be pasted in a real manner due to the large step height difference is avoided.
The pattern electroplating method for the FPC board can solve the problems of easy board clamping and wrinkle generation in the manufacturing process of the FPC board, and improves the production efficiency.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A pattern electroplating method of an FPC board is characterized by comprising the following steps:
providing a substrate, and drilling holes on the substrate;
attaching a reinforcing film at the edge of at least one surface of the substrate to reinforce the strength of the edge of the substrate;
pressing the reinforced film and the substrate;
pasting a dry film on the substrate, exposing and developing to make the dry film window above the hole;
and carrying out pattern electroplating on the developed substrate so as to plate copper in the holes.
2. The graphic electroplating method of the FPC board according to claim 1, wherein the reinforcing film comprises three edge strips, and the three edge strips are respectively attached to the edges of three sides of the FPC production board; the width of the edge strip is 5 mm-15 mm.
3. The pattern plating method of FPC board according to claim 2, wherein said reinforcing film is a coverlay film with a glue layer, and the thickness of said glue layer is 5 μm to 25 μm;
attaching a reinforcing film at an edge of at least one side of the substrate, comprising:
drilling a first positioning hole on the reinforced film and cutting the reinforced film into a concave shape, wherein the cut reinforced film comprises three edge strips which are sequentially connected;
placing the substrate on a positioning jig provided with a second positioning hole, and inserting a positioning pin into the corresponding first positioning hole and the second positioning hole;
and sticking the reinforced film on the FPC board.
4. The pattern plating method of FPC board as claimed in claim 3, characterized in that, in laminating said reinforcing film and said FPC board, pressing is performed using a four-opening press or a vacuum press;
the pressing parameters of the vacuum press include: the pressing temperature is 170-190 ℃, the pre-pressing is carried out for 5-15 s, the forming time is 100-150 s, and the pressure is 1.8-2.2 Mpa;
the pressing parameters of the four-opening press comprise: the pressing temperature is 170-190 ℃, the pre-pressing is carried out for 5-15 s, the forming time is 100-150 s, and the pressure is 120kg/cm2～160kg/cm2。
5. The pattern plating method of an FPC board as recited in claim 4, further comprising, after the reinforcing film and the substrate are bonded,:
and curing the laminated substrate and the reinforced film at the curing temperature of 150-170 ℃ for 20-30 min.
6. The pattern plating method of FPC board as claimed in claim 2, wherein the reinforcing film is a high temperature resistant tape and the thickness of the reinforcing film is 15 μm to 35 μm;
pressing the reinforced film and the substrate by a vacuum press;
the pressing temperature of the vacuum press is 80-100 ℃, the forming time is 10-35 s, and the pressure is 1.8-2.2 Mpa.
7. The pattern electroplating method of the FPC board according to claim 1, wherein when a dry film is attached to the substrate, if the thickness of the reinforcing film is less than 30um, the dry film with the thickness of 25um to 30um is selected; if the thickness of the reinforced film is greater than or equal to 30um, selecting a dry film of 30 um-40 um;
when a dry film is pasted, pressing the film from the direction parallel to the long edge of the substrate, and then pressing the film from the direction parallel to the short edge of the substrate again; the temperature of the film is 90-110 ℃, the speed of the film is 0.9-1.2 m/min, and the pressure of the film is 0.3-0.5 Mpa.
8. The pattern plating method of an FPC board as recited in claim 1, further comprising, after the laminating the reinforcing film and the FPC board, the step of pattern plating: and carrying out black hole treatment on the FPC board through the black hole line.
9. The pattern plating method for an FPC board according to any one of claims 1 to 8, wherein the reinforcing film includes a first reinforcing material layer and a second reinforcing material layer, the first reinforcing material layer being provided between the second reinforcing material layer and the FPC board in the thickness direction of the substrate.
10. The pattern plating method of an FPC board according to claim 9, wherein one side of the first reinforcing material layer near the middle of the substrate exceeds the second reinforcing material layer by 1mm to 3 mm.
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| CN114710887A (en) * | 2022-04-07 | 2022-07-05 | 江门荣信电路板有限公司 | Method for improving dog tooth defect at top of line |
| CN114710887B (en) * | 2022-04-07 | 2024-02-23 | 江门荣信电路板有限公司 | Method for improving defects of dog teeth at top of line |
| CN115440600A (en) * | 2022-09-14 | 2022-12-06 | 江门市和美精艺电子有限公司 | Machining method for inner fishing groove of BOC product and packaging substrate |
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