CN112074087A - Method for attaching surface covering film of wireless charging coil plate - Google Patents
Method for attaching surface covering film of wireless charging coil plate Download PDFInfo
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- CN112074087A CN112074087A CN202010871182.5A CN202010871182A CN112074087A CN 112074087 A CN112074087 A CN 112074087A CN 202010871182 A CN202010871182 A CN 202010871182A CN 112074087 A CN112074087 A CN 112074087A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a method for attaching a surface covering film of a wireless charging coil plate, which comprises the following steps: 1) preparing materials: preparing a flexible copper foil substrate to be laminated and a covering film with a corresponding size, wherein the covering film comprises a PI layer and an AD layer; 2) coating the film with glue: cold pressing a transparent carrier film on the cover film PI layer; 3) windowing the covering film: punching the covering film and the bearing film together by a die to open a window; 4) coating film laminating: taking down the cover film, removing the release paper on the cover film, sleeving PIN, and aligning and attaching; 5) cold pressing of a covering film: carrying out vacuum cold pressing on the covering film; 6) hot pressing of a covering film: carrying out hot pressing on the covering film; 7) curing the covering film: and tearing off the transparent bearing film on the surface of the PI cover film, and baking and curing to obtain the semi-finished FPC board. The laminating precision of the covering film is improved, and the problems of laminating offset and poor sol of the ultra-thin covering film are solved.
Description
Technical Field
The invention relates to a FPC cover film laminating process, in particular to a laminating method of a wireless charging coil panel surface cover film.
Background
The printed circuit board is a carrier of electronic devices, and is an essential part in an electronic product or electrical equipment. At present, with the development of electronic and electrical technologies, people have higher and higher requirements for printed circuit boards. Currently, the surface of the wireless charging coil plate is covered with a film. For the surface covering film of the wireless charging coil plate, the existing technology is that the covering film is directly punched and windowed after being fed, then the covering film is taken down to remove release paper, the cover PIN is aligned and attached to the surface of the FPC, and finally the covering film is cured on the surface of the FPC in a hot pressing and baking mode.
However, the film pasting process has the following problems: 1. after the release paper is torn off, the cover film can generate certain expansion and shrinkage changes, and can deviate from a standard position when being attached. Particularly, the ultra-thin CVL (total thickness of about 12.5um) used on the surface of the wireless charging coil plate is easy to have the problems of wrinkling, expansion and contraction, deformation and the like when tearing off the paper; 2. the cover film is cured by hot pressing after being attached, so that the cover film cannot be stretched and cannot fill the pitch of the circuits on the surface of the FPC in the pressing process, and the appearance and the product performance of the FPC are adversely affected by the sol of the cover film on the surface of the FPC.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for attaching a surface covering film of a wireless charging coil plate, which improves the attaching precision of the covering film and solves the problems of attaching offset and poor sol of an ultra-thin covering film.
The technical scheme adopted by the invention for solving the technical problems is as follows: a method for attaching a surface covering film of a wireless charging coil plate comprises the following steps:
1) preparing materials: preparing a flexible copper foil substrate to be laminated and a covering film with a corresponding size, wherein the covering film comprises a PI layer and an AD layer;
the step 1) also comprises a step 1.1) of sequentially drilling, blacking and electroplating the flexible copper foil base material, wherein the drilling is to drill hole sites on the flexible copper foil base material by adopting a mechanical tool; the black pores are formed by dip-coating fine graphite or carbon black coating (black pore liquid) on the pore walls to form a conductive layer; the electroplating is to electroplate a layer of copper on the basis of the black holes.
The step 1) also comprises a step 1.2), the soft copper foil base material obtained in the step 1.1) is subjected to microetching, film drying, exposure by adopting a fixed expansion and shrinkage ratio, development etching and film removal are carried out, and a circuit pattern is formed on the production board.
2) Coating the film with glue: cold pressing a transparent carrier film on the cover film PI layer;
3) windowing the covering film: punching the covering film and the bearing film together by a die to open a window;
4) coating film laminating: taking down the cover film, removing the release paper on the cover film, sleeving PIN, and aligning and attaching;
5) cold pressing of a covering film: carrying out vacuum cold pressing on the covering film;
6) hot pressing of a covering film: carrying out hot pressing on the covering film;
7) curing the covering film: and tearing off the transparent bearing film on the surface of the PI cover film, and baking and curing to obtain the semi-finished FPC board.
Further comprising the step 8) solder resist: manufacturing a green oil layer on the outer layer of the semi-finished FPC board obtained in the step 7) and silk-screening characters, wherein the thickness of the green oil is 10-50 mu m.
Further comprises the step 9) of surface treatment (nickel and gold deposition): uniformly depositing a nickel layer and a gold layer at the windowing position of the semi-finished FPC board by a chemical principle, wherein the thickness of the nickel layer is 3-5 mu m; the thickness of the gold layer is 0.05-0.1 μm.
Further comprising the step 10) silver foil: attaching the anti-electromagnetic silver foil which is drilled and punched in advance and the finished FPC board by means of a jig, then pressing by using a fast press, and transferring into an oven for baking and curing.
11) Assembling: the reinforcing material is arranged on an automatic laminating machine, and the automatic laminating machine aligns the FPC optical points, grabs the reinforcing material and laminates the reinforcing material on a semi-finished product FPC board (the FPC is fixed on a laminating jig).
12) Molding: the profile was stamped with a grinding tool according to the prior art and as designed, with a tolerance of +/-0.05 mm.
13) Electrical measurement: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
14) FQC: and checking whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
15) Packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
Further preferred embodiments of the present invention: the thickness of the transparent release film in the step 2) is 0.05-0.15 mm, and the coating temperature of the coating film is 40-60 ℃.
Further preferred embodiments of the present invention: in the step 2), a film pressing machine can be used for covering the film and distributing the glue, the glue distribution pressure is 2-5 kg, the glue distribution speed is 1-2 m/min, and the obtained covering film and the bearing film are in the standard of no wrinkle and no bubble.
Further preferred embodiments of the present invention: and 5) cold pressing can be carried out by using a vacuum press in the step 5), wherein the cold pressing temperature of the covering film is 70-90 ℃, and the pressure is 10-15 kg.
Further preferred embodiments of the present invention: and 6), hot pressing by using a vacuum rapid press, wherein the hot pressing temperature of the covering film is 150-180 ℃, and the pressure is 100-150 kg.
Compared with the prior art, the method has the advantages that the method for laminating the surface covering film of the wireless charging coil plate can effectively improve the laminating precision of the covering film, and meets the technical requirement of high-precision product design. The problem of expansion and contraction offset that produces when also can reduce to cover the membrane and tear the laminating, reduce the laminating and counterpoint the poor problem of quality that the deviation caused, the application of this technique has also effectively solved wireless charging coil board collocation ultra-thin type and has covered the membrane in addition, the skew problem and the bad problem of sol when the laminating.
Drawings
The present invention will be described in further detail below with reference to the drawings and preferred embodiments, but those skilled in the art will appreciate that the drawings are only drawn for the purpose of illustrating the preferred embodiments and therefore should not be taken as limiting the scope of the invention. Furthermore, unless specifically stated otherwise, the drawings are merely schematic representations based on conceptual representations of elements or structures depicted and may contain exaggerated displays and are not necessarily drawn to scale.
FIG. 1 is a schematic view of a portion of the process of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
A method for laminating a surface covering film of a wireless charging coil plate, in particular to a laminating and pressing technology aiming at dense lines matched with an ultra-thin covering film, which specifically comprises the following steps:
1) preparing materials: preparing a flexible copper foil substrate to be laminated and a covering film with a corresponding size, wherein the covering film comprises a PI layer and an AD layer; the AD layer is an adhesive layer to be attached to the base material copper of the FPC (printed circuit), and the PI layer is used for covering the bearing film.
The step 1) also comprises a step 1.1) of sequentially drilling, blacking and electroplating the flexible copper foil base material, wherein the drilling is to drill hole sites on the flexible copper foil base material by adopting a mechanical tool; the black pores are formed by dip-coating fine graphite or carbon black coating (black pore liquid) on the pore walls to form a conductive layer; the electroplating is to electroplate a layer of copper on the basis of the black holes.
The step 1) also comprises a step 1.2), the soft copper foil base material obtained in the step 1.1) is subjected to microetching, film drying, exposure by adopting a fixed expansion and shrinkage ratio, development etching and film removal are carried out, and a circuit pattern is formed on the production board.
The step 1) is to process the flexible copper foil base material (FCCL), which is a part of the processing step of manufacturing the FPC by the flexible copper foil base material.
2) Coating the film with glue: cold pressing a transparent carrier film on the cover film PI layer; the thickness of the transparent release film in the step 2) is 0.05-0.15 mm, and the coating temperature of the coating film is 40-60 ℃. In the step 2), a film pressing machine can be used for covering the film and distributing the glue, the pressure of the glue distribution (cold-pressed bearing film) is 2-5 kg, the speed of the glue distribution (cold-pressed bearing film) is 1-2 m/min, and the obtained covering film and the obtained bearing film are in the standard of no wrinkle and no bubble.
In the step 2), cold pressing of the carrier film at 40-60 ℃ is preferably adopted in the step of coating the cover film with glue. The bearing film can be ensured to be attached to the covering film, and the surface curing phenomenon of the AD layer of the covering film can be ensured.
3) Windowing the covering film: punching the covering film and the bearing film together by a die to open a window; in the process of windowing the cover film, attention needs to be paid to whether burrs exist at the opening obtained by punching, and the standard that no burrs exist is taken as a standard.
4) Coating film laminating: taking down the cover film, removing the release paper on the cover film, sleeving PIN, and aligning and attaching;
5) cold pressing of a covering film: carrying out vacuum cold pressing on the covering film; and 5) cold pressing can be carried out by using a vacuum press in the step 5), wherein the cold pressing temperature of the covering film is 70-90 ℃, and the pressure is 10-15 kg. Use special tool laminating, effectively promote to cover the membrane laminating precision.
6) Hot pressing of a covering film: carrying out hot pressing on the covering film; and 6), hot pressing by using a vacuum rapid press, wherein the hot pressing temperature of the covering film is 150-180 ℃, and the pressure is 100-150 kg.
7) Curing the covering film: and tearing off the transparent bearing film on the surface of the PI cover film, and baking and curing to obtain the semi-finished FPC board. This step may be carried out by transferring to an oven for curing.
8) Resistance welding: manufacturing a green oil layer on the outer layer of the semi-finished FPC board obtained in the step 7) and silk-screening characters, wherein the thickness of the green oil is 10-50 mu m. Therefore, the influence of environmental change on the FPC board can be reduced in the subsequent use process of the FPC board.
9) Surface treatment (nickel-gold deposition): uniformly depositing a nickel layer and a gold layer at the windowing position of the semi-finished FPC board by a chemical principle, wherein the thickness of the nickel layer is 3-5 mu m; the thickness of the gold layer is 0.05-0.1 μm.
10) Silver foil: attaching the anti-electromagnetic silver foil which is drilled and punched in advance and the finished FPC board by means of a jig, then pressing by using a fast press, and transferring into an oven for baking and curing.
11) Assembling: the reinforcing material is arranged on an automatic laminating machine, the automatic laminating machine aligns the FPC optical points, grabs the reinforcing material and laminates the reinforcing material on the semi-finished product FPC board (the semi-finished product FPC board at the moment is fixed on a laminating jig).
12) Molding: the profile was stamped with a grinding tool according to the prior art and as designed, with a tolerance of +/-0.05 mm.
13) Electrical measurement: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
14) FQC: and checking whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the finished board meet the requirements of customers.
15) Packaging: and hermetically packaging the finished boards according to the packaging mode and the packaging quantity required by the customer, putting a drying agent and a humidity card, and then delivering.
As shown in fig. 1, a part of the processing schematic diagram of the present invention specifically includes steps 1) to 7).
The method comprises the steps of performing roll type film pressing on the cover film (a layer of transparent carrier film is cold pressed on the surface of the cover film, wherein the carrier film can be transparent release paper), punching and windowing by adopting a die, taking down the cover film after windowing, removing the release paper, and sleeving PIN (positive intrinsic negative) for alignment and lamination. According to the invention, the problem of bonding offset of the cover film caused by expansion and shrinkage changes in the process of opening the window to take down the cover film and removing the release paper is avoided through the cover film. The release paper is not easy to wrinkle, swell and shrink and deform when being removed.
The attached covering film is subjected to cold pressing in vacuum (the cold pressing temperature is 70-90 ℃), which is a pre-stretching process. The invention laminates the cover film by vacuum cold pressing. The vacuum environment ensures that the covering film avoids the generation of bubbles in the laminating process. And 70 ~ 90 ℃ cold pressing can make the cover film slowly carry out deformation stretch filling. Of course, the cover film is not completely fixed in place at this point. Therefore, after the cold pressing of the covering film, the hot pressing of the covering film is carried out, wherein the hot pressing temperature of the covering film is 150-180 ℃, and the pressure is 100-150 kg. And further hot-pressing and curing the covering film, and further stretching and filling the space between the circuits on the surface of the FPC in the pressing process of the covering film. The problems that the coating film is attached and deviated, the coating film sol on the surface of an FPC (flexible printed circuit) adversely affects appearance and product performance and the like are solved for a wireless charging panel with dense surface coils and thick copper.
Finally, the transparent release film on the surface is torn off after hot pressing, so that the cover film attaching process with higher precision and higher quality can be obtained.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The present invention has been described in detail, and the principles and embodiments of the present invention have been described herein using specific examples, which are provided only to assist in understanding the present invention and the core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. A method for attaching a surface covering film of a wireless charging coil plate is characterized by comprising the following steps:
1) preparing materials: preparing a flexible copper foil substrate to be laminated and a covering film with a corresponding size, wherein the covering film comprises a PI layer and an AD layer;
2) coating the film with glue: cold pressing a transparent carrier film on the cover film PI layer;
3) windowing the covering film: punching the covering film and the bearing film together by a die to open a window;
4) coating film laminating: taking down the cover film, removing the release paper on the cover film, sleeving PIN, and aligning and attaching;
5) cold pressing of a covering film: carrying out vacuum cold pressing on the covering film;
6) hot pressing of a covering film: carrying out hot pressing on the covering film;
7) curing the covering film: and tearing off the transparent bearing film on the surface of the PI cover film, and baking and curing to obtain the semi-finished FPC board.
2. The method for attaching the surface covering film of the wireless charging coil plate according to claim 1, wherein the thickness of the transparent release film in the step 2) is 0.05-0.15 mm, and the temperature for spreading the covering film is 40-60 ℃.
3. The method for attaching the surface covering film of the wireless charging coil plate according to claim 1, wherein a film pressing machine is used for covering film glue distribution in the step 2), the glue distribution pressure is 2-5 kg, the glue distribution speed is 1-2 m/min, and the obtained covering film and the obtained carrier film are in the standard of no wrinkle and no bubble.
4. The method for attaching the surface covering film of the wireless charging coil plate according to claim 1, wherein the step 5) is performed by cold pressing with a vacuum press, and the temperature of the cold pressing of the covering film is 70-90 ℃ and the pressure of the cold pressing of the covering film is 10-15 kg.
5. The method for attaching the surface covering film of the wireless charging coil plate according to claim 1, wherein a vacuum rapid press can be used for hot pressing in step 6), and the hot pressing temperature of the covering film is 150-180 ℃ and the pressure is 100-150 kg.
6. The method for attaching the surface covering film of the wireless charging coil board according to claim 1, wherein the step 1) further comprises a step 1.1) of drilling, black hole drilling and electroplating the flexible copper foil substrate in sequence, wherein the drilling is to drill a hole on the flexible copper foil substrate by using a mechanical tool; the black pores are formed by dip-coating fine graphite or carbon black coating (black pore liquid) on the pore walls to form a conductive layer; the electroplating is to electroplate a layer of copper on the basis of the black holes.
7. The method for attaching the surface covering film of the wireless charging coil plate according to claim 6, wherein the step 1) further comprises a step 1.2) of drying the film after microetching the flexible copper foil substrate obtained in the step 1.1), exposing the film by adopting a fixed expansion and shrinkage ratio, and then developing, etching and removing the film to form a circuit pattern on a production plate.
8. The method for attaching the surface covering film of the wireless charging coil plate according to claim 1, further comprising the step 8) solder resist: manufacturing a green oil layer on the outer layer of the semi-finished FPC board obtained in the step 7) and silk-screening characters, wherein the thickness of the green oil is 10-50 mu m.
9. The method for attaching the surface covering film to the wireless charging coil panel according to claim 1, further comprising the step 9) of surface treatment: uniformly depositing a nickel layer and a gold layer at the windowing position of the semi-finished FPC board by a chemical principle, wherein the thickness of the nickel layer is 3-5 mu m; the thickness of the gold layer is 0.05-0.1 μm.
10. The method for attaching the surface covering film of the wireless charging coil plate according to claim 1, further comprising the step 10) of silver foil: attaching the anti-electromagnetic silver foil which is drilled and punched in advance and the finished FPC board by means of a jig, then pressing by using a fast press, and transferring into an oven for baking and curing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010871182.5A CN112074087A (en) | 2020-08-26 | 2020-08-26 | Method for attaching surface covering film of wireless charging coil plate |
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| CN202010871182.5A CN112074087A (en) | 2020-08-26 | 2020-08-26 | Method for attaching surface covering film of wireless charging coil plate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112770545A (en) * | 2020-12-29 | 2021-05-07 | 博罗县精汇电子科技有限公司 | Reverse pasting method for inner layer soft board covering film |
| CN113411973A (en) * | 2021-06-17 | 2021-09-17 | 珠海景旺柔性电路有限公司 | High-alignment-precision processing technology and manufacturing technology applied to laser fiber welding FPC |
| CN114007331A (en) * | 2021-10-15 | 2022-02-01 | 珠海杰赛科技有限公司 | Coil plate and processing method thereof |
| CN114900998A (en) * | 2022-06-06 | 2022-08-12 | 盐城维信电子有限公司 | Multilayer circuit board and processing method thereof |
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| CN113411973A (en) * | 2021-06-17 | 2021-09-17 | 珠海景旺柔性电路有限公司 | High-alignment-precision processing technology and manufacturing technology applied to laser fiber welding FPC |
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