CN112770545A - Reverse pasting method for inner layer soft board covering film - Google Patents
Reverse pasting method for inner layer soft board covering film Download PDFInfo
- Publication number
- CN112770545A CN112770545A CN202011594695.2A CN202011594695A CN112770545A CN 112770545 A CN112770545 A CN 112770545A CN 202011594695 A CN202011594695 A CN 202011594695A CN 112770545 A CN112770545 A CN 112770545A
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- film
- covering film
- covering
- attached
- inner layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
Abstract
The invention relates to the field of circuit board processing, and discloses a reverse laminating method for an inner layer soft board cover film, which comprises the following steps: blanking, namely cutting the covering film roll material into covering films, and cutting the carrier film roll material into carrier films; attaching, namely pre-attaching a bearing film on the PI surface of the covering film; pre-pressing, namely performing hot pressing on the cover film pre-attached with the carrier film; tearing the separation paper, namely tearing the separation paper on the covering film attached with the bearing film; cutting, namely performing laser depth control cutting on the windowing position area of the covering film, and removing waste materials in the windowing position area to obtain the covering film to be attached; attaching, namely providing an inner-layer substrate, and respectively attaching two cover films to be attached to two sides of the inner-layer substrate; and hot pressing, namely carrying out hot pressing treatment on the inner layer substrate attached with the covering film and tearing off the bearing film. Simple quick laminating is to the alignment degree height, and it is slow to have overcome original efficiency, and the action is loaded down with trivial details and still scald the some parts to scald easily at the alignment precision end.
Description
Technical Field
The invention relates to the field of circuit board processing, in particular to a reverse laminating method of an inner layer soft board cover film.
Background
At present, the inner layer soft board for producing the flexible multilayer circuit board in the industry needs to be manufactured by laminating a covering film. The windowing manufacturing process for the windowing position area of the inner layer soft board cover film is generally as follows: cutting, stacking, drilling, punching, fitting and pressing. Because some more special of inlayer of flexible multilayer circuit board can't link into a whole, can't carry out the monoblock laminating, need single laminating, scald the circuit layer easily in the manufacturing process, increase cost undoubtedly, the product circulation is also slow, and efficiency is not high.
Disclosure of Invention
The invention aims to provide a reverse laminating method of an inner layer soft board cover film, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the following technical scheme: a reverse laminating method of an inner layer soft board covering film comprises the following steps:
blanking: firstly, cutting a covering film roll material into required sizes to obtain single covering films, and cutting a bearing film roll material into required sizes to obtain single bearing films;
pasting: sequentially stacking a bearing film and a covering film and then pre-attaching the bearing film and the covering film, and pre-attaching the bearing film to the PI surface of the covering film;
pre-pressing: carrying out hot pressing on the covering film pre-attached with the carrier film to ensure that the carrier film is tightly attached to the PI surface of the covering film;
tearing and separating paper: tearing off the separation paper on the covering film attached with the bearing film;
cutting: carrying out laser depth control cutting on the windowing position area of the covering film, and removing waste materials in the windowing position area to obtain the covering film to be attached;
attaching: providing an inner layer substrate, and respectively attaching two cover films to be attached to two sides of the inner layer substrate;
hot pressing: and carrying out hot-pressing treatment on the inner-layer substrate attached with the covering film, and tearing off the bearing film to obtain the inner-layer flexible printed circuit board.
Further, the cutting step further comprises: and punching a positioning hole on the covering film through laser. The cover film and the inner substrate are aligned through matching with the alignment holes.
Further, the attaching step further includes: punching alignment holes on the inner-layer substrate, penetrating the alignment holes and positioning holes of the to-be-bonded cover films through jig positioning pins to ensure that the to-be-bonded cover films are aligned with the inner-layer substrate, and bonding the two to-be-bonded cover films to two sides of the inner-layer substrate respectively. The cover film and the inner substrate are aligned through the matching of the positioning holes and the alignment holes.
Further, carry out laminating in advance after stacking carrier film, cover film in proper order and include: the carrier film and the covering film are sequentially stacked and then pass through the upper roller and the lower roller, so that the carrier film and the covering film are preliminarily attached together, and air between the carrier film and the covering film is pressed. And extruding the air bubbles between the bearing film and the covering film.
Further, the step of performing hot-pressing treatment on the inner-layer substrate attached with the cover film in the hot-pressing step specifically includes: and (3) carrying out hot pressing on the covering film by using a manual hot press so as to enable the glue surface of the covering film to be adhered with the inner-layer substrate. The surface of the covering film is sticky and can be adhered to the flexible board, and the glue on the covering film is adhered to the inner substrate by a manual hot press.
Furthermore, punching the alignment holes on the inner layer substrate specifically comprises: and punching alignment holes on the inner layer substrate by a target punching method.
Further, the step of performing hot-pressing on the cover film pre-attached with the carrier film comprises: the covering film pre-attached with the bearing film is pressed between an upper heating roller and a lower heating roller in a hot pressing mode, the pressure between the two heating rollers is set to be 6-7 Kg/cm2, and the temperature is set to be 130-140 ℃. The bearing film and the covering film are hot-pressed through the upper heating roller and the lower heating roller, so that the bearing film and the covering film are tightly attached together.
Further, after the hot pressing step, conventional post processes are arranged, wherein the conventional post processes comprise pressing an inner-layer soft board and an outer-layer soft board together through a bonding sheet, manufacturing an outer-layer circuit, manufacturing a solder mask and performing surface treatment. And (4) switching to a normal flow after the inner layer soft board is manufactured, pressing the inner layer soft board and the outer layer soft board to manufacture an outer layer circuit, and finally forming the flexible multilayer circuit board.
The invention has the beneficial effects that: simple quick laminating is to the alignment degree height, and it is slow to have overcome original efficiency, and the action is loaded down with trivial details and still scald the some parts to scald easily at the alignment precision end.
Drawings
The figures further illustrate the invention, but the examples in the figures do not constitute any limitation of the invention.
Fig. 1 is a schematic structural diagram of a cover film after a pre-lamination step according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the cover film after the step of tearing the paper according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an inner-layer flexible printed circuit board according to an embodiment of the present invention.
The labels in the figure are: the laminated film comprises a carrier film 1, a carrier film adhesive layer 2, a PI layer 3, a cover film adhesive layer 4, a release paper layer 5 and an inner substrate 6.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
In the present invention, unless otherwise specified, the terms of orientation such as "upper, lower, left, right" used herein generally refer to the upper, lower, left, and right directions as shown in fig. 1. "inner and outer" refer to the inner and outer portions of a particular contour. "distal and proximal" refer to distal and proximal relative to a component.
As shown in fig. 1, an embodiment of the present invention provides a method for reverse attaching an inner-layer flexible printed circuit board cover film, including the following steps:
blanking: firstly, cutting a covering film roll material into required sizes to obtain single covering films, and cutting a bearing film roll material into required sizes to obtain single bearing films;
pasting: sequentially stacking the carrier film and the cover film and then passing through the upper roller and the lower roller to preliminarily adhere the carrier film and the cover film together, pressing air between the carrier film and the cover film, and preliminarily adhering the adhesive surface of the carrier film and the PI surface of the cover film together;
pre-pressing: carrying out hot pressing on the covering film pre-attached with the carrier film, wherein the covering film pre-attached with the carrier film is subjected to hot pressing from the upper heating roller to the lower heating roller, the pressure between the two heating rollers is set to be 6-7 Kg/cm2, the temperature is set to be 130-140 ℃, and the carrier film is tightly attached to the PI surface of the covering film;
tearing and separating paper: tearing off the separation paper on the covering film attached with the bearing film;
cutting: carrying out laser depth control cutting on a windowing position area of the covering film, punching positioning holes on four ends of the covering film through laser, removing waste materials in the windowing position area to obtain the covering film to be attached, cutting off a covering film adhesive layer and a covering film PI layer when the windowing position area is cut, and penetrating and cutting through the covering film adhesive layer, the covering film PI layer, a bearing film adhesive layer and the bearing film when the positioning holes are punched;
attaching: providing an inner layer substrate, punching alignment holes on the inner layer substrate in a target punching mode, wherein the size of a positioning hole of a cover film is consistent with that of the alignment holes on the inner layer substrate and the hole positions are corresponding to each other, a jig positioning pin penetrates through the alignment holes and the positioning holes of a cover film to be attached so as to ensure that the cover film to be attached is aligned with the inner layer substrate, then two cover films to be attached are respectively attached to two surfaces of the inner layer substrate, the cover films are attached to two surfaces of the inner layer substrate simultaneously, a layer of cover film is firstly placed at the bottom layer, the glue surface of the cover film is upward, the inner layer substrate is placed in the middle, the cover film is placed;
hot pressing: carrying out hot pressing treatment on the inner layer substrate attached with the covering film, carrying out hot pressing on the covering film by using a manual hot press, enabling the glue surface of the covering film to be adhered with the inner layer substrate, and tearing off the bearing film to obtain an inner layer soft board;
and (3) conventional post-processing: the conventional post-procedure comprises the steps of pressing an inner-layer flexible board and an outer-layer flexible board together through a bonding sheet, manufacturing an outer-layer circuit, manufacturing a solder mask and performing surface treatment to obtain the flexible multilayer circuit board.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. The reverse laminating method of the inner layer soft board covering film is characterized by comprising the following steps of: the method comprises the following steps:
blanking: firstly, cutting a covering film roll material into required sizes to obtain single covering films, and cutting a bearing film roll material into required sizes to obtain single bearing films;
pasting: sequentially stacking a bearing film and a covering film and then pre-attaching the bearing film and the covering film, and pre-attaching the bearing film to the PI surface of the covering film;
pre-pressing: carrying out hot pressing on the covering film pre-attached with the carrier film to ensure that the carrier film is tightly attached to the PI surface of the covering film;
tearing and separating paper: tearing off the separation paper on the covering film attached with the bearing film;
cutting: carrying out laser depth control cutting on the windowing position area of the covering film, and removing waste materials in the windowing position area to obtain the covering film to be attached;
attaching: providing an inner layer substrate, and respectively attaching two cover films to be attached to two sides of the inner layer substrate;
hot pressing: and carrying out hot-pressing treatment on the inner-layer substrate attached with the covering film, and tearing off the bearing film to obtain the inner-layer flexible printed circuit board.
2. The reverse laminating method of the inner layer soft board cover film according to claim 1, characterized in that: the cutting step further comprises: and punching a positioning hole on the covering film through laser.
3. The reverse laminating method of the inner layer soft board cover film according to claim 2, characterized in that: the attaching step further includes: punching alignment holes on the inner-layer substrate, penetrating the alignment holes and positioning holes of the to-be-bonded cover films through jig positioning pins to ensure that the to-be-bonded cover films are aligned with the inner-layer substrate, and bonding the two to-be-bonded cover films to two sides of the inner-layer substrate respectively.
4. The reverse laminating method of the inner layer soft board cover film according to claim 1, characterized in that: carry out laminating in advance after stacking carrier film, cover film in proper order and include: the carrier film and the covering film are sequentially stacked and then pass through the upper roller and the lower roller, so that the carrier film and the covering film are preliminarily attached together, and air between the carrier film and the covering film is pressed.
5. The reverse laminating method of the inner layer soft board cover film according to claim 1, characterized in that: the step of performing hot-pressing treatment on the inner-layer substrate attached with the cover film in the hot-pressing step specifically comprises the following steps: and (3) carrying out hot pressing on the covering film by using a manual hot press so as to enable the glue surface of the covering film to be adhered with the inner-layer substrate.
6. The reverse laminating method of the inner layer soft board cover film according to claim 3, characterized in that: the punching of the alignment holes on the inner layer substrate specifically comprises: and punching alignment holes on the inner layer substrate by a target punching method.
7. The reverse laminating method of the inner layer soft board cover film according to claim 1, characterized in that: the step of carrying out hot-pressing on the covering film pre-attached with the carrier film comprises the following steps: the covering film pre-attached with the bearing film is pressed between an upper heating roller and a lower heating roller in a hot pressing mode, the pressure between the two heating rollers is set to be 6-7 Kg/cm2, and the temperature is set to be 130-140 ℃.
8. The reverse laminating method of the inner layer soft board cover film according to claim 1, characterized in that: after the hot pressing step, conventional post processes are arranged, wherein the conventional post processes comprise pressing an inner-layer soft board and an outer-layer soft board together through an adhesive sheet, manufacturing an outer-layer circuit, manufacturing a solder mask and performing surface treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011594695.2A CN112770545A (en) | 2020-12-29 | 2020-12-29 | Reverse pasting method for inner layer soft board covering film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011594695.2A CN112770545A (en) | 2020-12-29 | 2020-12-29 | Reverse pasting method for inner layer soft board covering film |
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| Publication Number | Publication Date |
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| CN112770545A true CN112770545A (en) | 2021-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011594695.2A Pending CN112770545A (en) | 2020-12-29 | 2020-12-29 | Reverse pasting method for inner layer soft board covering film |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002026485A (en) * | 2000-07-12 | 2002-01-25 | Sony Chem Corp | Manufacturing method of etching liquid and flexible wiring board |
| US20020112880A1 (en) * | 2001-02-16 | 2002-08-22 | Nippon Mektron, Ltd. | Flexible printed circuit board and manufacturing method |
| CN108449880A (en) * | 2018-04-08 | 2018-08-24 | 珠海市凯诺微电子有限公司 | Flexible circuit board cover film applying method |
| CN109688704A (en) * | 2018-12-03 | 2019-04-26 | 上海展华电子有限公司 | A kind of method of Rigid Flex control excessive glue and solderability |
| CN112074087A (en) * | 2020-08-26 | 2020-12-11 | 江西一诺新材料有限公司 | Method for attaching surface covering film of wireless charging coil plate |
-
2020
- 2020-12-29 CN CN202011594695.2A patent/CN112770545A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002026485A (en) * | 2000-07-12 | 2002-01-25 | Sony Chem Corp | Manufacturing method of etching liquid and flexible wiring board |
| US20020112880A1 (en) * | 2001-02-16 | 2002-08-22 | Nippon Mektron, Ltd. | Flexible printed circuit board and manufacturing method |
| CN108449880A (en) * | 2018-04-08 | 2018-08-24 | 珠海市凯诺微电子有限公司 | Flexible circuit board cover film applying method |
| CN109688704A (en) * | 2018-12-03 | 2019-04-26 | 上海展华电子有限公司 | A kind of method of Rigid Flex control excessive glue and solderability |
| CN112074087A (en) * | 2020-08-26 | 2020-12-11 | 江西一诺新材料有限公司 | Method for attaching surface covering film of wireless charging coil plate |
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