CN110996530B - Manufacturing method of PCB - Google Patents
Manufacturing method of PCB Download PDFInfo
- Publication number
- CN110996530B CN110996530B CN201911422755.XA CN201911422755A CN110996530B CN 110996530 B CN110996530 B CN 110996530B CN 201911422755 A CN201911422755 A CN 201911422755A CN 110996530 B CN110996530 B CN 110996530B
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- Prior art keywords
- copper foil
- groove
- copper
- cover plate
- thickness
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Abstract
The invention discloses a manufacturing method of a PCB, and relates to the technical field of printed circuit boards. The manufacturing method comprises the following steps: preparing a clamp, wherein the clamp comprises a bottom plate, and the preparing of the bottom plate specifically comprises the following steps: milling a second groove on the substrate, wherein a plurality of columns for fixing the copper foil are reserved at the bottom of the second groove, and the columns are arranged corresponding to the tool holes of the copper foil; fixing the copper foil provided with the tool hole on the bottom plate; and in a local area of the surface of the copper foil, the thickness of the copper foil is increased by electroplating or adhering a copper block. According to the invention, the carrier is provided for the copper foil by manufacturing the clamp, so that a single copper foil can be processed, the copper foil is kept flat, and the copper foil is prevented from being damaged; and moreover, copper blocks can be adhered to the copper foil to obtain the effect of different thicknesses of local areas, and the copper foil can be used for the subsequent product manufacturing process, so that the outer copper foil of the PCB product is provided with a step part protruding towards the inner layer.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a PCB.
Background
Along with the rapid development of the PCB industry, the product structure is gradually upgraded, diversification and complication are realized, the manufacturing difficulty is greatly improved, and the energy type thick copper PCB product is provided at present, the design of the energy type thick copper PCB product requires that the golden fingers and other parts are plated with thick copper towards the inner side of the PCB, and aims to realize the efficient transmission of current and simultaneously realize the smooth surface of the outer layer so as to meet the requirements of inserting and pulling of the golden fingers of finished products and welding of devices. The structure is special and novel, and is a trend of energy PCB products towards small volume and large density. But also due to the particularity, the manufacturing process has great difficulty: the copper foil is very thin and soft, and the position of the copper foil is difficult to fix, so that the processing of a single copper foil cannot be realized, and upgrading and improvement on the traditional process manufacturing method are needed.
Disclosure of Invention
The invention aims to provide a manufacturing method of a PCB (printed circuit board), which can manufacture copper foils with different thicknesses in local areas.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of fabricating a PCB, comprising:
preparing a clamp, wherein the clamp comprises a bottom plate, and the preparing of the bottom plate specifically comprises the following steps: milling a second groove on the substrate, wherein a plurality of columns for fixing the copper foil are reserved at the bottom of the second groove, and the columns are arranged corresponding to the tool holes of the copper foil;
fixing the copper foil provided with the tool hole on the bottom plate;
and in a local area of the surface of the copper foil, the thickness of the copper foil is increased by electroplating or adhering a copper block.
Wherein, preparing the base plate further comprises:
milling a plurality of first grooves on the periphery of the second groove, wherein the first grooves are communicated with the second groove and correspond to the cylinders one to one;
providing clamping pieces corresponding to the number of the first grooves;
in each first groove, one end of each clamping piece is riveted to one end of the corresponding first groove, and each clamping piece can rotate along the bottom plane of the corresponding first groove and extends out of the corresponding second groove to clamp the copper foil;
the depth of the first groove is equal to the thickness of the clamping piece.
Wherein the clamp further comprises a first cover plate;
preparing the first cover plate specifically comprises: windowing an area, corresponding to the thickness of the copper foil, of the first cover plate;
accordingly, the method can be used for solving the problems that,
after the copper foil is fixed on the bottom plate, the method further comprises the following steps: covering the first cover plate on the copper foil; the clamping piece is used for clamping the first cover plate;
in the local region on the surface of copper foil, increase the thickness of copper foil through electroplating or pasting the copper billet, specifically include: coating conductive adhesive on the surface of the copper foil and in the window correspondingly, putting a copper block into the copper foil, and pressing the copper foil;
the distance from the groove bottom of the second groove to the groove bottom of the first groove is equal to the sum of the thickness of the first cover plate and the thickness of the copper foil.
Wherein, preparing the first cover plate further comprises:
and the first cover plate is provided with a fixing hole corresponding to the cylinder.
The clamping piece is arranged on the cylinder, the other end of the clamping piece is provided with a through hole, and the clamping piece rotates to enable the through hole to extend to the position above the second groove and to be sleeved on the cylinder.
Further, before the pressing, the method further comprises:
providing a second cover plate;
the second cover plate is arranged close to the first cover plate and used for covering the window.
Further, before putting into the copper billet, still include:
and performing brown oxidation treatment on one surface of the copper block bonded with the conductive adhesive.
Or the distance from the groove bottom of the second groove to the groove bottom of the first groove is equal to the thickness of the copper foil.
Correspondingly, the thickness of the copper foil is increased by electroplating or pasting the copper block, and the method comprises the following steps:
coating, silk-screening or spray-printing plating-resistant ink on the surface of the copper foil, wherein the windowing area of the plating-resistant ink after exposure and development corresponds to the area of the copper foil needing to be increased in thickness, and the areas are the same in size;
the thickness of the copper foil in the windowed area is increased by electroplating.
Further, after the thickness of the copper foil is increased by electroplating or pasting the copper block, the method further comprises the following steps:
opening the clamp to take out the copper foil;
overlapping the copper foil with a prepreg and a daughter board, wherein the flat surface of the copper foil is used as the outer surface of the PCB;
and pressing to obtain the mother board.
The invention has the beneficial effects that:
the carrier is provided for the copper foil by manufacturing the clamp, so that a single copper foil can be processed, the copper foil is kept flat, and the copper foil is prevented from being damaged; the reserved cylinder of the clamp is fixed with the tool hole of the copper foil, and the copper foil does not need to be additionally reserved with a fixed area, so that materials are saved; moreover, the effect of different thicknesses of local areas can be obtained on the copper foil, and the method can be used for subsequent product manufacturing processes, so that the outer copper foil of a PCB product is provided with a step part protruding towards the inner layer.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a PCB according to an embodiment of the present invention;
FIG. 2 is a top view of the base and clip of the clip according to one embodiment of the present invention;
FIG. 3 is a cross-sectional view of a fixture according to one embodiment of the present invention;
FIG. 4 is a cross-sectional view of a PCB product in accordance with one embodiment of the present invention;
FIG. 5 is a flowchart of a method for manufacturing a PCB according to a second embodiment of the present invention;
fig. 6 is a sectional view of a jig according to a second embodiment of the present invention.
In the figure:
1-a bottom plate; 11-a first groove; 12-a second groove;
21-a first cover plate; 22-a second cover plate; 23-a clip; 231-a through hole; 232-rivet;
3-copper foil; 4-column; 5-conductive adhesive; 6-copper block; 7-a prepreg; 8-daughter boards; 9-plating resistant ink.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
Example one
The embodiment provides a manufacturing method of a PCB, which is suitable for manufacturing a PCB product with a surface copper layer partially protruding inwards to form a step.
As shown in fig. 1, the manufacturing method includes the following steps:
s11, preparing a clamp.
As shown in fig. 2 and 3, the jig includes a base plate 1 and a first cover plate 21.
S111, preparing the base plate 1, specifically including:
a second groove 12 is milled on the substrate, a plurality of columns 4 used for fixing the copper foil 3 are reserved at the bottom of the second groove 12, and the columns 4 are arranged corresponding to tool holes of the copper foil 3. The tool holes of the copper foil 3 are used for laminating and pressing the PCB products in the subsequent step. The substrate can be a high-temperature-resistant cured resin plate, a metal plate or a copper-clad plate.
A plurality of first grooves 11 are milled on the periphery of the second groove 12, and the first grooves 11 are communicated with the second groove 12 and are in one-to-one correspondence with the cylinders 4.
Providing a number of clips 23 corresponding to the number of the first grooves 11; in each first groove 11, one end of the clamping piece 23 is riveted to one end of the first groove 11, and the clamping piece 23 uses the rivet 232 as a rotating shaft, can rotate along the bottom plane of the first groove 11 and extends to the upper part of the second groove 12. Further, the other end of the clamping piece 23 is provided with a through hole 231, and the clamping piece 23 rotates to enable the through hole 231 to extend to the position above the second groove 12 and to be sleeved on the cylinder 4 for clamping the copper foil 3.
Wherein the depth of the first groove 11 is equal to the thickness of the clamping piece 23.
S112, preparing the first cover plate 21, specifically including:
and windowing is performed on the first cover plate 21 corresponding to the area needing to increase the thickness of the copper foil 3, and fixing holes are formed in the first cover plate 21 corresponding to the cylinders 4.
The distance from the groove bottom of the second groove 12 to the groove bottom of the first groove 11 is equal to the sum of the thickness of the first cover plate 21 and the thickness of the copper foil 3.
And S12, fixing the copper foil with the tool holes on the bottom plate.
Placing the copper foil 3 in the second groove 12, and sleeving a tool hole on the cylinder 4; further, the copper foil 3 is covered with the first cover plate 21, the clamping piece 23 rotates to extend to the position above the second groove 12, and the through hole 231 thereof is sleeved on the cylinder 4 and can clamp the first cover plate 21.
And S13, adhering copper blocks on the partial area of the surface of the copper foil to increase the thickness of the copper foil.
Coating conductive adhesive 5 on the surface of the copper foil 3 corresponding to the window, and putting a copper block 6; and (3) putting the copper foil 3 clamped by the clamp into a press, and pressing the copper block 6 and the copper foil 3 through the conductive adhesive 5 at high temperature and high pressure.
The thickness of the first cover plate 21 is less than or equal to the sum of the thicknesses of the copper block 6 and the conductive adhesive 5.
Further, the jig further includes a second cover plate 22.
After putting into copper billet 6, before the pressfitting, still include: the second cover plate 22 is disposed closely to the first cover plate 21, and covers the window. The second cover plate 22 is used for applying uniform pressure to each copper block 6 during pressing, and facilitates stacking of the copper foils 3 held by the plurality of clamps together in a press while pressing.
Further, before putting into the copper billet, still include: and performing brown oxidation treatment on one surface of the copper block 6 bonded with the conductive adhesive 5.
And S14, opening the clamp to take out the copper foil.
After the copper foil 3 is taken out, the copper foil 3 needs to be browned, so that the roughness of the surface of the copper foil 3 is increased, and the binding force is enhanced. Since the copper foil 3 is thin and has a locally raised thick copper, a supporting plate needs to be attached to the flat surface of the copper foil 3 before passing through the brown oxidation process line to prevent the copper foil 3 from wrinkling or curling.
And S15, overlapping the copper foil with the prepreg and the daughter board, and pressing to obtain the mother board.
The daughter board 8 includes a single or multiple core boards.
As shown in fig. 4, the flat surface of the copper foil 3 is used as the outer surface of the PCB, i.e. the surface of the copper foil 3 with the stepped protrusion faces inwards, and is laminated with the prepreg 7 and the daughter board 8, and then the mother board is obtained by pressing.
In the embodiment, the carrier is provided for the copper foil by manufacturing the clamp, so that a single copper foil can be processed, the copper foil is kept flat, and the copper foil is prevented from being damaged; the reserved cylinder of the clamp is fixed with the tool hole of the copper foil, and the copper foil does not need to be additionally reserved with a fixed area, so that materials are saved; and moreover, the copper block is pasted and pressed on the copper foil through the conductive adhesive, and the window of the clamp cover plate is used for assisting in positioning the area where the copper block is pasted, so that the effect that the local area thickness on the copper foil is different is obtained, the clamp cover plate can be used for a subsequent product manufacturing process, and the outer-layer copper foil of a PCB product is provided with a step part protruding towards the inner layer.
Example two
The embodiment is another embodiment, belongs to the same inventive concept as the above embodiment, and can solve the same technical problems and achieve the same technical effects.
As shown in fig. 5, the manufacturing method includes the following steps:
s21, preparing a clamp.
The clamp has the same base plate 1 and clamping pieces 23 as the above described embodiment (fig. 2).
The preparation of the base plate 1 specifically comprises:
a second groove 12 is milled on the substrate, a plurality of columns 4 used for fixing the copper foil 3 are reserved at the bottom of the second groove 12, and the columns 4 are arranged corresponding to tool holes of the copper foil 3. The tool holes of the copper foil 3 are used for laminating and pressing the PCB products in the subsequent step. The substrate can be a high-temperature-resistant cured resin plate.
A plurality of first grooves 11 are milled on the periphery of the second groove 12, and the first grooves 11 are communicated with the second groove 12 and are in one-to-one correspondence with the cylinders 4.
Providing a number of clips 23 corresponding to the number of the first grooves 11; in each first groove 11, one end of the clamping piece 23 is riveted to one end of the first groove 11, and the clamping piece 23 uses the rivet 232 as a rotating shaft, can rotate along the bottom plane of the first groove 11 and extends to the upper part of the second groove 12. Further, the other end of the clamping piece 23 is provided with a through hole 231, and the clamping piece 23 rotates to enable the through hole 231 to extend to the position above the second groove 12 and to be sleeved on the cylinder 4 for clamping the copper foil 3.
Wherein the depth of the first groove 11 is equal to the thickness of the clamping piece 23; the distance from the groove bottom of the second groove 12 to the groove bottom of the first groove 11 is equal to the thickness of the copper foil 3.
And S22, fixing the copper foil with the tool holes on the bottom plate.
As shown in fig. 6, the copper foil 3 is placed in the second groove 12, and the tool hole is sleeved on the cylinder 4; the clamping piece 23 rotates and extends to the position above the second groove 12, and the through hole 231 of the clamping piece is sleeved on the cylinder 4 and can clamp the copper foil 3.
And S23, increasing the thickness of the copper foil by electroplating in the local area of the surface of the copper foil.
The surface of the copper foil 3 is coated, silk-screened or jet-printed with plating-resistant ink 9, and the windowing area of the plating-resistant ink 9 after exposure and development corresponds to the area of the copper foil 3, which needs to be increased in thickness, and has the same size.
The thickness of the copper foil 3 is selected according to the minimum thickness of the copper layer on the PCB, and the thickness of the copper foil 3 in the windowing region is increased by electroplating to form a stepped bump on the copper foil 3.
The plating resist ink 9 is removed.
And S24, opening the clamp to take out the copper foil.
And S25, overlapping the copper foil with the prepreg and the daughter board, and pressing to obtain the mother board.
In the embodiment, the carrier is provided for the copper foil by manufacturing the clamp, so that a single copper foil can be processed, the copper foil is kept flat, and the copper foil is prevented from being damaged; the reserved cylinder of the clamp is fixed with the tool hole of the copper foil, and the copper foil does not need to be additionally reserved with a fixed area, so that materials are saved; and the effect of different local area thicknesses is obtained on the copper foil through electroplating, and the method can be used for the subsequent product manufacturing process, so that the outer copper foil of the PCB product is provided with a step part protruding towards the inner layer.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (9)
1. A method for manufacturing a PCB is characterized by comprising the following steps:
preparing a clamp, wherein the clamp comprises a bottom plate, and the preparing of the bottom plate specifically comprises the following steps: milling a second groove on the substrate, wherein a plurality of columns for fixing the copper foil are reserved at the bottom of the second groove, and the columns are arranged corresponding to the tool holes of the copper foil;
fixing the copper foil provided with the tool hole on the bottom plate;
in the local area of the surface of the copper foil, the thickness of the copper foil is increased by electroplating or sticking a copper block;
opening the clamp to take out the copper foil;
overlapping the copper foil with a prepreg and a daughter board, wherein the flat surface of the copper foil is used as the outer surface of the PCB, namely the surface of the copper foil with the stepped bulges faces inwards;
and pressing to obtain the mother board.
2. The method of manufacturing according to claim 1, wherein preparing the base plate further comprises:
milling a plurality of first grooves on the periphery of the second groove, wherein the first grooves are communicated with the second groove and correspond to the cylinders one to one;
providing clamping pieces corresponding to the number of the first grooves;
in each first groove, one end of each clamping piece is riveted to one end of the corresponding first groove, and each clamping piece can rotate along the bottom plane of the corresponding first groove and extends out of the corresponding second groove to clamp the copper foil;
the depth of the first groove is equal to the thickness of the clamping piece.
3. The method of manufacturing of claim 2, wherein the fixture further comprises a first cover plate;
preparing the first cover plate specifically comprises: windowing an area, corresponding to the thickness of the copper foil, of the first cover plate;
accordingly, the method can be used for solving the problems that,
after the copper foil is fixed on the bottom plate, the method further comprises the following steps: covering the first cover plate on the copper foil; the clamping piece is used for clamping the first cover plate;
in the local region on the surface of copper foil, increase the thickness of copper foil through electroplating or pasting the copper billet, specifically include: coating conductive adhesive on the surface of the copper foil and in the window correspondingly, putting a copper block into the copper foil, and pressing the copper foil;
the distance from the groove bottom of the second groove to the groove bottom of the first groove is equal to the sum of the thickness of the first cover plate and the thickness of the copper foil.
4. The method of manufacturing according to claim 3, wherein preparing the first cover plate further comprises:
and the first cover plate is provided with a fixing hole corresponding to the cylinder.
5. The method of manufacturing according to claim 2, wherein:
the other end of the clamping piece is provided with a through hole, and the clamping piece rotates to enable the through hole to extend to the upper part of the second groove and be sleeved on the cylinder.
6. The method of claim 3, further comprising, prior to the pressing:
providing a second cover plate;
the second cover plate is arranged close to the first cover plate and used for covering the window.
7. The method of claim 3, wherein before placing the copper block, further comprising:
and performing brown oxidation treatment on one surface of the copper block bonded with the conductive adhesive.
8. The method of claim 2, wherein a distance from the bottom of the second recess to the bottom of the first recess is equal to a thickness of the copper foil.
9. The method of claim 8, wherein increasing the thickness of the copper foil by plating or pasting the copper block comprises:
coating, silk-screening or spray-printing plating-resistant ink on the surface of the copper foil, wherein the windowing area of the plating-resistant ink after exposure and development corresponds to the area of the copper foil needing to be increased in thickness, and the areas are the same in size;
the thickness of the copper foil in the windowed area is increased by electroplating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911422755.XA CN110996530B (en) | 2019-12-31 | 2019-12-31 | Manufacturing method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911422755.XA CN110996530B (en) | 2019-12-31 | 2019-12-31 | Manufacturing method of PCB |
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| Publication Number | Publication Date |
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| CN110996530A CN110996530A (en) | 2020-04-10 |
| CN110996530B true CN110996530B (en) | 2022-02-08 |
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| CN201911422755.XA Active CN110996530B (en) | 2019-12-31 | 2019-12-31 | Manufacturing method of PCB |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201115149Y (en) * | 2007-10-15 | 2008-09-10 | 英业达股份有限公司 | Fixing device for circuit board |
| CN203420000U (en) * | 2013-09-10 | 2014-02-05 | 惠州市金百泽电路科技有限公司 | Auxiliary clamp for circuit board thin plate operation |
| CN207783321U (en) * | 2018-01-08 | 2018-08-28 | 昆山纬亚电子科技有限公司 | A kind of tin stove welding fixture |
| CN208094895U (en) * | 2018-05-10 | 2018-11-13 | 甲东电子股份有限公司 | A kind of copper floating foundation harden structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167734B (en) * | 2011-12-09 | 2016-02-24 | 景硕科技股份有限公司 | Thin plate support jig |
| CN207969236U (en) * | 2018-04-08 | 2018-10-12 | 惠州市盛合顺电子有限公司 | A kind of pcb board fixing device |
| CN209151432U (en) * | 2018-10-09 | 2019-07-23 | 珠海杰赛科技有限公司 | Jig is used in a kind of PCB production |
-
2019
- 2019-12-31 CN CN201911422755.XA patent/CN110996530B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201115149Y (en) * | 2007-10-15 | 2008-09-10 | 英业达股份有限公司 | Fixing device for circuit board |
| CN203420000U (en) * | 2013-09-10 | 2014-02-05 | 惠州市金百泽电路科技有限公司 | Auxiliary clamp for circuit board thin plate operation |
| CN207783321U (en) * | 2018-01-08 | 2018-08-28 | 昆山纬亚电子科技有限公司 | A kind of tin stove welding fixture |
| CN208094895U (en) * | 2018-05-10 | 2018-11-13 | 甲东电子股份有限公司 | A kind of copper floating foundation harden structure |
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| Publication number | Publication date |
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| CN110996530A (en) | 2020-04-10 |
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