CN112822854A - Manufacturing method of thin single-sided flexible circuit board - Google Patents
Manufacturing method of thin single-sided flexible circuit board Download PDFInfo
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- CN112822854A CN112822854A CN202011605516.0A CN202011605516A CN112822854A CN 112822854 A CN112822854 A CN 112822854A CN 202011605516 A CN202011605516 A CN 202011605516A CN 112822854 A CN112822854 A CN 112822854A
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- Prior art keywords
- layer
- dry film
- sided
- copper foil
- foil substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for manufacturing a thin single-sided flexible circuit board, which comprises the following steps of A, preparing a single-sided copper foil substrate; b, drilling a positioning hole; c, sticking a dry film; step D, local exposure; step E, developing; step F, etching copper; step G, demoulding; step H, dry film pretreatment; step J, pasting a dry film; step K, exposing the circuit; and step L, DES. The invention adopts the single-sided copper foil substrate, the thickness of the substrate layer of the single-sided copper foil substrate is the same as that of the substrate layer required by the product, the thickness of the copper layer of the single-sided copper foil substrate is thicker than that of the circuit layer of the product, the product area is developed by adopting the local exposure developing process of the product area, and the copper layer of the product area is independently etched and thinned to the thickness of the circuit layer required by the product by adopting the copper etching process, so that the single-sided copper foil substrate with different required thicknesses is obtained, and.
Description
Technical Field
The invention relates to the technical field of manufacturing of flexible circuit boards, in particular to a manufacturing method of a thin single-sided flexible circuit board.
Background
With the development of ultra-thin portable electronic products, the flexible circuit boards used by the portable electronic products are thinner and thinner, the thin flexible circuit boards are easy to cause poor wrinkling in the manufacturing process, and in order to improve the poor wrinkling of the products, as shown in fig. 1, the conventional thin single-sided flexible circuit boards adopt single-sided copper foil substrates meeting product specifications, a carrier film is prepared on the surface of a base material, the carrier film is peeled off after the circuit is manufactured, the wrinkling of the products in the processes before the circuit is improved, but the carrier film and the single-sided copper foil substrates have different expansion and shrinkage performances, after the carrier film is peeled off, the substrates are curled, bent and deformed, the subsequent processes are difficult to process, after the carrier film is peeled off, the substrates are very thin, and are easy to wrinkle in the subsequent processes, so that the product reject ratio is high, and no method capable of effectively improving the poor wrinkling of the products.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method for manufacturing a thin single-sided flexible circuit board, which can effectively improve the wrinkles of products.
In order to achieve the above purpose, the solution of the invention is:
a manufacturing method of a thin single-sided flexible circuit board comprises the following steps:
step A, preparing a single-sided copper foil substrate: preparing a single-sided copper foil substrate, wherein the thickness of a base material layer is the same as that of a base material layer required by a product, and the thickness of a copper layer is thicker than that of a circuit layer of the product;
step B, drilling a positioning hole: drilling a positioning hole required by exposure alignment on the single-sided copper foil substrate;
step C, pasting a dry film: thermally bonding the dry film on the surface of the copper layer of the single-sided copper foil substrate;
step D, local exposure: and exposing and transferring the etched copper pattern onto the dry film layer, wherein the etched copper pattern is as follows: exposing the non-product area corresponding to the dry film, not exposing the product area corresponding to the dry film, and integrally extending a preset value of the non-exposed product area on the basis of the product shape;
step E, developing: developing the dry film layer on the single-sided copper foil substrate subjected to exposure treatment to develop the dry film layer with the copper-reduced pattern;
step F, etching copper: e, carrying out copper etching treatment on the single-sided copper foil substrate obtained in the step E, and etching and thinning the thickness of the copper layer corresponding to the product area to the thickness of the circuit layer required by the product to obtain copper layers with different required thicknesses;
step G, demoulding: removing the dry film layer by demoulding treatment to obtain a single-sided copper foil substrate with the thickness of the copper layer corresponding to the non-product area and the thickness of the copper layer corresponding to the product area 300;
step H, dry film pretreatment: carrying out microetching treatment on the single-sided copper foil substrate obtained in the step G, and roughening and cleaning the surface of the copper layer;
step J, pasting a dry film: thermally bonding the dry film on the surface of the copper layer of the single-sided copper foil substrate;
step K, line exposure: exposing and transferring the circuit pattern layer to a dry film of a single-sided copper foil substrate;
step L, DES: and D, developing, etching and stripping the single-sided copper foil substrate obtained in the step K to manufacture the circuit pattern layer.
Further, in the step A, in the preparation of the single-sided copper foil substrate, the thickness of the copper layer of the single-sided copper foil substrate is 3-12 microns thicker than the thickness of the circuit layer of the product by a certain preset value.
Further, in the step A, the thickness of the copper layer of the single-sided copper foil substrate is 3 μm, 6 μm, 9 μm or 12 μm thicker than the thickness of the circuit layer of the product.
Further, in the step D, in the local exposure, the preset value is more than or equal to 0.3 mm.
Further, in the local exposure of the step D, the preset value is 0.5-1.5 mm.
Further, in the step J of pasting the dry film, the dry film is pasted by adopting a vacuum dry film pasting method.
Further, the method also comprises a step M of dry film pretreatment: and D, performing dry film pretreatment in the step M before the dry film is attached in the step C, and performing micro-etching treatment on the surface of the copper layer of the single-sided copper foil substrate to improve the binding force of the dry film.
Further, in the steps A to L, corresponding roll-to-roll production processes are adopted in all the steps, wherein the roll-to-roll laser drilling process is adopted for drilling the alignment holes in the step B, so that the production efficiency is improved, the product wrinkles are reduced, and the product quality is improved.
After the scheme is adopted, the single-sided copper foil substrate is adopted, the thickness of the substrate layer of the single-sided copper foil substrate is the same as that of the substrate layer required by a product, the thickness of the copper layer of the single-sided copper foil substrate is thicker than that of the circuit layer of the product, the product area is developed by adopting a local exposure developing process of the product area, and the copper layer of the product area is independently etched and thinned to the thickness of the circuit layer required by the product by adopting a thinning copper process to obtain the single-sided copper foil substrate with different required thicknesses, so that the product area meets the product manufacturing requirements, the non-product area is relatively thick, and in each process of product circuit manufacturing and subsequent whole board manufacturing, the; the prior thin single-sided flexible circuit board adopts a carrier film to prepare on the base material surface of a single-sided copper foil base plate, and the base plate is curled and bent after being peeled off because the expansion and contraction properties of the two materials are different; the invention can improve the buckling and bending failure and improve the product yield.
Drawings
Fig. 1 is a flow chart of a method for manufacturing a conventional thin single-sided flexible circuit board.
Fig. 2 is a flow chart of a method for manufacturing a thin single-sided flexible circuit board according to the present invention.
Fig. 3 is a schematic cross-sectional view of the flow structure of the manufacturing method of the thin single-sided flexible circuit board of the invention.
Fig. 4 is a corresponding perspective view at d in fig. 3.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.
As shown in fig. 2, the present invention is a method for manufacturing a thin single-sided flexible circuit board, which comprises the following steps:
step A, preparing a single-sided copper foil substrate: preparing a single-sided copper foil substrate 100, wherein the thickness of a substrate layer 10 is the same as that of a substrate layer required by a product, the thickness of a copper layer 20 is thicker than that of a circuit layer of the product, and a part a in fig. 3 is a structural diagram of the single-sided copper foil substrate;
step B, drilling a positioning hole: drilling a positioning hole required by exposure alignment on the single-sided copper foil substrate 100;
step C, pasting a dry film: thermally bonding the dry film on the surface of the copper layer 20 of the single-sided copper foil substrate 100;
step D, local exposure: and exposing and transferring the etched copper pattern onto the dry film layer, wherein the etched copper pattern is as follows: the non-product area 400 is exposed corresponding to the dry film, the product area 300 is not exposed corresponding to the dry film, and the non-exposed product area 300 is integrally extended by a preset value on the basis of the product shape;
step E, developing: developing the dry film layer on the single-sided copper foil substrate 100 subjected to the exposure treatment to develop the dry film layer 200 with the copper-reduced pattern, wherein the cross-sectional view is shown as b in fig. 3;
step F, etching copper: performing copper etching treatment on the single-sided copper foil substrate 100 obtained in the step E, and etching and thinning the thickness of the copper layer corresponding to the product area 300 to the thickness of the circuit layer required by the product to obtain copper layers 21 with different required thicknesses, as shown in a position c of fig. 3;
step G, demoulding: removing the dry film layer 200 by stripping treatment to obtain a single-sided copper foil substrate 101 with a copper layer thickness corresponding to the non-product area 400 and a copper layer thickness corresponding to the product area 300, wherein the cross-sectional view is shown at d of FIG. 3 and FIG. 4;
step H, dry film pretreatment: carrying out microetching treatment on the single-sided copper foil substrate 101 obtained in the step G, and roughening and cleaning the surface of the copper layer;
step J, pasting a dry film: thermally bonding the dry film on the surface of the copper layer 21 of the single-sided copper foil substrate 101;
step K, line exposure: exposing and transferring the circuit pattern layer to a dry film of a single-sided copper foil substrate 101;
step L, DES: and D, developing, etching and stripping the single-sided copper foil substrate 101 obtained in the step K to manufacture a circuit pattern layer.
Further, in the step a, in the preparation of the single-sided copper clad laminate, the thickness of the copper layer 20 of the single-sided copper clad laminate 100 is 3 to 12 μm, preferably 3 μm, 6 μm, 9 μm or 12 μm, larger than the thickness of the circuit layer of the product.
Further, in the step D, in the local exposure, the preset value is more than or equal to 0.3 mm.
Further, in the local exposure of the step D, the preset value is 0.5-1.5 mm.
Further, in the step J of pasting the dry film, the dry film is pasted by adopting a vacuum dry film pasting method.
Further, the method also comprises a step M of dry film pretreatment: and D, performing dry film pretreatment in the step M before the dry film is attached in the step C, and performing micro-etching treatment on the surface of the copper layer 20 of the single-sided copper foil substrate 100 to improve the bonding force of the dry film.
Further, in the steps A to L, corresponding roll-to-roll production processes are adopted in all the steps, wherein the roll-to-roll laser drilling process is adopted for drilling the alignment holes in the step B, so that the production efficiency is improved, the product wrinkles are reduced, and the product quality is improved.
After the scheme is adopted, the single-sided copper foil substrate is adopted, the thickness of the substrate layer of the single-sided copper foil substrate is the same as that of the substrate layer required by a product, the thickness of the copper layer of the single-sided copper foil substrate is thicker than that of the circuit layer of the product, the product area is developed by adopting a local exposure developing process of the product area, and the copper layer of the product area is independently etched and thinned to the thickness of the circuit layer required by the product by adopting a thinning copper process to obtain the single-sided copper foil substrate with different required thicknesses, so that the product area meets the product manufacturing requirements, the non-product area is relatively thick, and in each process of product circuit manufacturing and subsequent whole board manufacturing, the; the thin single-sided flexible circuit board adopts a carrier film to prepare on the base material surface of a single-sided copper foil base plate, and the base plate is curled and bent after being stripped because the expansion and contraction properties of the two materials are different; the invention can improve the buckling and bending failure and improve the product yield.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications thereof by those skilled in the art should be considered as not departing from the scope of the present invention.
Claims (8)
1. A manufacturing method of a thin single-sided flexible circuit board is characterized by comprising the following steps:
step A, preparing a single-sided copper foil substrate: preparing a single-sided copper foil substrate, wherein the thickness of a base material layer is the same as that of a base material layer required by a product, and the thickness of a copper layer is thicker than that of a circuit layer of the product;
step B, drilling a positioning hole: drilling a positioning hole required by exposure alignment on the single-sided copper foil substrate;
step C, pasting a dry film: thermally bonding the dry film on the surface of the copper layer of the single-sided copper foil substrate;
step D, local exposure: and exposing and transferring the etched copper pattern onto the dry film layer, wherein the etched copper pattern is as follows: exposing the non-product area corresponding to the dry film, not exposing the product area corresponding to the dry film, and integrally extending a preset value of the non-exposed product area on the basis of the product shape;
step E, developing: developing the dry film layer on the single-sided copper foil substrate subjected to exposure treatment to develop the dry film layer with the copper-reduced pattern;
step F, etching copper: e, carrying out copper etching treatment on the single-sided copper foil substrate obtained in the step E, and etching and thinning the thickness of the copper layer corresponding to the product area to the thickness of the circuit layer required by the product to obtain copper layers with different required thicknesses;
step G, demoulding: removing the dry film layer by demoulding treatment to obtain a single-sided copper foil substrate with the thickness of the copper layer corresponding to the non-product area and the thickness of the copper layer corresponding to the product area 300;
step H, dry film pretreatment: carrying out microetching treatment on the single-sided copper foil substrate obtained in the step G, and roughening and cleaning the surface of the copper layer;
step J, pasting a dry film: thermally bonding the dry film on the surface of the copper layer of the single-sided copper foil substrate;
step K, line exposure: exposing and transferring the circuit pattern layer to a dry film of a single-sided copper foil substrate;
step L, DES: and D, developing, etching and stripping the single-sided copper foil substrate obtained in the step K to manufacture the circuit pattern layer.
2. The method of manufacturing a thin single-sided flexible circuit board according to claim 1, wherein: in the step A, in the preparation of the single-sided copper foil substrate, the thickness of a copper layer of the single-sided copper foil substrate is 3-12 microns thicker than the thickness of a circuit layer of a product by a certain preset value.
3. The method of manufacturing a thin single-sided flexible circuit board according to claim 2, wherein: in the step A, the thickness of the copper layer of the single-sided copper foil substrate is 3 microns, 6 microns, 9 microns or 12 microns thicker than the thickness of the circuit layer of the product.
4. The method of manufacturing a thin single-sided flexible circuit board according to claim 1, wherein: and D, in the local exposure, the preset value is more than or equal to 0.3 mm.
5. The method of manufacturing a thin single-sided flexible circuit board according to claim 4, wherein: and D, in the local exposure, the preset value is 0.5-1.5 mm.
6. The method for manufacturing a thin single-sided flexible circuit board as claimed in any one of claims 1 to 5, wherein: and step J, in the step of pasting the dry film, pasting the dry film by adopting a vacuum dry film pasting method.
7. The method of manufacturing a thin single-sided flexible circuit board according to claim 1, wherein: further comprises a step M of dry film pretreatment: and D, performing dry film pretreatment in the step M before the dry film is pasted in the step C, and performing micro-etching treatment on the surface of the copper layer of the single-sided copper foil substrate.
8. The method of manufacturing a thin single-sided flexible circuit board according to claim 1, wherein: and in the steps A to L, adopting a corresponding roll-to-roll production process in each step, wherein the step B adopts a roll-to-roll laser drilling process for drilling the alignment hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011605516.0A CN112822854A (en) | 2020-12-30 | 2020-12-30 | Manufacturing method of thin single-sided flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011605516.0A CN112822854A (en) | 2020-12-30 | 2020-12-30 | Manufacturing method of thin single-sided flexible circuit board |
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| Publication Number | Publication Date |
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| CN112822854A true CN112822854A (en) | 2021-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011605516.0A Withdrawn CN112822854A (en) | 2020-12-30 | 2020-12-30 | Manufacturing method of thin single-sided flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115988735A (en) * | 2023-03-09 | 2023-04-18 | 荣耀终端有限公司 | Circuit board and processing method thereof, battery protection board, battery and electronic equipment |
| CN116583024A (en) * | 2023-05-26 | 2023-08-11 | 珠海超群电子科技有限公司 | Manufacturing method of loudspeaker flexible circuit board and loudspeaker flexible circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102316677A (en) * | 2010-06-30 | 2012-01-11 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN108696999A (en) * | 2018-04-24 | 2018-10-23 | 珠海元盛电子科技股份有限公司 | A kind of subtractive process technology of manufacture FPC |
| CN208424918U (en) * | 2018-07-31 | 2019-01-22 | 大连吉星电子股份有限公司 | A kind of substrate that ultrathin flexible wiring board uses |
-
2020
- 2020-12-30 CN CN202011605516.0A patent/CN112822854A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102316677A (en) * | 2010-06-30 | 2012-01-11 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN108696999A (en) * | 2018-04-24 | 2018-10-23 | 珠海元盛电子科技股份有限公司 | A kind of subtractive process technology of manufacture FPC |
| CN208424918U (en) * | 2018-07-31 | 2019-01-22 | 大连吉星电子股份有限公司 | A kind of substrate that ultrathin flexible wiring board uses |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115988735A (en) * | 2023-03-09 | 2023-04-18 | 荣耀终端有限公司 | Circuit board and processing method thereof, battery protection board, battery and electronic equipment |
| CN115988735B (en) * | 2023-03-09 | 2023-08-22 | 荣耀终端有限公司 | Circuit board and processing method thereof, battery protection board, battery and electronic equipment |
| CN116583024A (en) * | 2023-05-26 | 2023-08-11 | 珠海超群电子科技有限公司 | Manufacturing method of loudspeaker flexible circuit board and loudspeaker flexible circuit board |
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Application publication date: 20210518 |