CN113380529A - Processing technology of single-layer wireless charging coil carrier plate - Google Patents
Processing technology of single-layer wireless charging coil carrier plate Download PDFInfo
- Publication number
- CN113380529A CN113380529A CN202110523427.XA CN202110523427A CN113380529A CN 113380529 A CN113380529 A CN 113380529A CN 202110523427 A CN202110523427 A CN 202110523427A CN 113380529 A CN113380529 A CN 113380529A
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- Prior art keywords
- carrier
- copper
- wireless charging
- carrier plate
- charging coil
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- 238000005516 engineering process Methods 0.000 title claims abstract description 29
- 238000012545 processing Methods 0.000 title claims abstract description 27
- 239000002356 single layer Substances 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 114
- 239000011889 copper foil Substances 0.000 claims abstract description 67
- 239000010410 layer Substances 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- 239000010949 copper Substances 0.000 claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000007639 printing Methods 0.000 claims abstract description 5
- 238000011161 development Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
Abstract
The invention discloses a processing technology of a single-layer wireless charging coil carrier plate, which comprises the following steps: preparing a carrier plate having an auxiliary substrate and two ultra-thin carrier copper foils laminated on front and back surfaces of the auxiliary substrate, respectively, the two ultra-thin carrier copper foils each having a carrier copper foil and an ultra-thin copper foil detachably provided on one surface of the carrier copper foil; adhering dry films to the two ultrathin copper foils, and forming a circuit pattern after exposure and development; plating circuit copper layers on the two ultrathin copper foils according to the circuit pattern, removing the dry film, and printing resin layers on the two circuit copper layers to obtain a second intermediate plate; detaching the second intermediate plate along the joint of the two ultrathin copper foils and the two carrier copper foils to obtain two third intermediate plates; and etching off the ultrathin copper foil on the third middle plate to obtain the effective plate of the single-layer wireless charging coil carrier plate. The processing technology is novel, the production efficiency is high, the thickness of the manufactured single-layer wireless charging coil carrier plate is thin, the reliability is good, and the shape and the wiring of a coil graph are not limited.
Description
Technical Field
The invention relates to the technical field of manufacturing of wireless charging coils, and particularly provides a processing technology of a single-layer wireless charging coil carrier plate.
Background
With the continuous progress of science and technology and the continuous upgrade of human needs, electronic products such as mobile phones, tablet computers and the like are continuously updated and upgraded, and wireless charging becomes a trend more and more, and more market demands are caused.
At present, a single-layer wireless charging coil on the market is mostly manufactured by winding or FPC (flexible printed circuit) process on a conducting wire wrapped by an insulating layer; in addition, the existing PCB technology is not applied to the wireless charging coil carrier plate for implementation.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
In order to overcome the defects, the invention provides a processing technology of a single-layer wireless charging coil carrier plate, which has the advantages of novel and reasonable design, easiness in implementation, high production efficiency and high yield, and the single-layer wireless charging coil carrier plate prepared by the processing technology has the advantages of thin thickness, good reliability, unlimited coil pattern shape/pattern wiring and the like, so that a new PCB technology market is well developed.
The technical scheme adopted by the invention for solving the technical problem is as follows: a processing technology of a single-layer wireless charging coil carrier plate comprises the following steps:
s1), preparing a carrier plate, wherein the carrier plate is provided with an auxiliary substrate and two ultrathin carrier copper foils, each of the two ultrathin carrier copper foils is provided with a layer of carrier copper foil and an ultrathin copper foil detachably arranged on one surface of the carrier copper foil, and the two ultrathin carrier copper foils are correspondingly pressed on the front surface and the back surface of the auxiliary substrate through the carrier copper foils on the two ultrathin carrier copper foils respectively;
s2), respectively pasting dry films on the two ultrathin copper foils, and forming a circuit pattern after exposure and development;
s3), respectively electroplating line copper layers on the two ultrathin copper foils according to the line patterns, and removing the dry film to obtain a first intermediate plate;
s4), respectively printing a resin layer on the two circuit copper layers of the first intermediate board to obtain a second intermediate board;
s5), splitting the second intermediate board along the joint of the two ultrathin copper foils and the two carrier copper foils respectively to obtain two third intermediate boards containing the circuit copper layers;
s6), etching the ultra-thin copper foil on the third middle plate by using a flash etching operation method to obtain the effective plate of the single-layer wireless charging coil carrier plate.
As a further improvement of the invention, the auxiliary substrate is an FR4 board or a BT board, and the thickness of the auxiliary substrate is 50-500 μm;
the thickness of the carrier copper foil is 12-18 mu m; the thickness of the ultrathin copper foil is 2-5 mu m.
As a further improvement of the present invention, there is S11) between the above S1) and S2), and S11) is: and cutting the carrier plate into the size required by production.
As a further improvement of the present invention, in the step S3), the copper thickness of the circuit copper layer is 35 to 80 μm, the line width is 35 to 80 μm, and the line pitch is 35 to 80 μm.
As a further improvement of the present invention, in S4), the specific process for manufacturing the second intermediate plate includes: the method comprises the steps of firstly, printing the resin layers with the thickness higher than that of the circuit copper layers on the two circuit copper layers respectively, and then, baking the resin layers for 30-120 min at the temperature of 120-150 ℃ to obtain the second intermediate plate.
As a further improvement of the invention, the difference of the thicknesses of the resin layer and the circuit copper layer is 30-100 μm.
As a further improvement of the present invention, S7) is further included: and carrying out surface treatment and finished product detection processes on the effective plate to complete the subsequent required processing and manufacturing of the single-layer wireless charging coil support plate.
The invention has the beneficial effects that: 1) according to the invention, through innovation, a brand-new processing technology with high reliability, high efficiency and high application applicability for the single-layer wireless charging coil carrier plate is provided for the wireless charging module, on one hand, the processing technology develops the application of the PCB technology in the field of wireless charging coils, and opens up a new market for the PCB industry; on the other hand, the processing technology is easy to implement and compatible to production, and the production range is expanded; in addition, the processing technology can also be applied to coil shapes such as round shapes or square shapes and to single-strand or multi-strand coil structures, namely the coil pattern shapes and the coil pattern wiring are not limited. 2) The invention adopts the double-sided ultra-thin carrier-coated copper foil substrate as the carrier plate, and has the following advantages: based on the carrier plate, the double-sided carrier plate can be processed simultaneously, so that the production efficiency is doubled, the plate loss in the production process is effectively reduced, and the production yield is improved; secondly, based on the carrier plate, the production of a thick copper precision circuit with the copper thickness of 50um, the line width of 50um and the line distance of 50um can be realized; and thirdly, based on the carrier plate, after the plates are separated, the ultrathin copper foil can be etched by using a flash etching operation method, so that the corrosion to the circuit can be reduced, and the high reliability of the coil circuit is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a carrier plate according to the present invention;
FIG. 2 is a schematic cross-sectional view of a carrier plate according to the present invention after a circuit pattern is formed thereon;
FIG. 3 is a schematic cross-sectional view of a carrier plate according to the present invention after plating a circuit copper layer thereon;
FIG. 4 is a schematic cross-sectional view of a first intermediate plate according to the present invention;
FIG. 5 is a schematic cross-sectional view of a second intermediate plate according to the present invention;
FIG. 6 is a schematic sectional view of the second intermediate plate after being disassembled according to the present invention;
fig. 7 is a schematic cross-sectional view of an effective plate according to the present invention.
The following description is made with reference to the accompanying drawings:
b0 — carrier plate; b1 — first intermediate plate; b2 — second intermediate plate; b3 — third intermediate plate; b4 — active plate; 10 — an auxiliary substrate; 11-ultra-thin carrier copper foil; 110-carrier copper foil; 111-ultra-thin copper foil; 2-a line copper layer; and 3, resin layer.
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions of the present invention, so that the present invention has no technical significance. The terms "first", "second" and "third" used herein are for convenience of description and are not intended to limit the scope of the present invention.
Example (b):
the processing technology of the single-layer wireless charging coil carrier plate comprises the following steps:
s1), referring to fig. 1, a carrier board B0 is prepared, where the carrier board B0 has an auxiliary substrate 10 and two ultra-thin carrier copper foils 11, each of the two ultra-thin carrier copper foils 11 has a carrier copper foil 110 and an ultra-thin copper foil 111 detachably disposed on one surface of the carrier copper foil 110, and the two ultra-thin carrier copper foils 11 are respectively pressed on the front and back surfaces of the auxiliary substrate 10 through the carrier copper foils 110 thereon;
s2), respectively attaching a dry film to the two ultra-thin copper foils 111, exposing and developing to form a circuit pattern, which can be specifically shown in fig. 2; in addition, the thickness of the dry film is slightly larger than that of a circuit copper layer 2 to be manufactured subsequently;
s3), respectively electroplating a circuit copper layer 2 on the two ultra-thin copper foils 111 according to the circuit pattern, as shown in fig. 3; removing the dry film to obtain a first intermediate plate B1, as shown in FIG. 4;
s4), printing a resin layer 3 on each of the two wiring copper layers 2 of the first intermediate board B1 to obtain a second intermediate board B2, as shown in fig. 5;
s5), splitting the second intermediate board B2 along the joint of the two ultra-thin copper foils 111 and the two carrier copper foils 110, respectively, to obtain two third intermediate boards B3 containing the circuit copper layer 2, which can be specifically referred to as shown in fig. 6;
s6), etching off the ultra-thin copper foil 111 on the third middle plate B3 by a flash etching method to obtain an effective plate B4 of the single-layer wireless charging coil carrier, as shown in fig. 7;
s7), carrying out OSP surface treatment, finished product detection and other processes on the effective plate B4, and finishing the subsequent processing and manufacturing of the required single-layer wireless charging coil carrier plate.
In this embodiment, it is preferable that the auxiliary substrate 10 is an FR4 board or a BT board, and the thickness of the auxiliary substrate 10 is 50 to 500 μm; the thickness of the carrier copper foil 110 is 12-18 μm; the thickness of the ultra-thin copper foil 111 is 2 to 5 μm, and more preferably 3 μm or 5 μm.
In this embodiment, the manufacturing method of the ultra-thin carrier copper foil 11 adopts a conventional method, that is: the carrier copper foil 110 is treated with liquid medicine, and then the ultra-thin copper foil 111 is deposited on the carrier copper foil 110 by means of electrodeposition. When subsequently detaching, the ultra-thin copper foil 111 may be detached from the carrier copper foil 110 by using a mechanical method.
The invention adopts the double-sided ultra-thin carrier-coated copper foil substrate as the carrier plate, and has the following advantages: based on the carrier plate, the double-sided carrier plate can be processed simultaneously, so that the production efficiency is doubled, the plate loss in the production process is effectively reduced, and the production yield is improved; secondly, based on the carrier plate, the production of a thick copper precision circuit with the copper thickness of 50um, the line width of 50um and the line distance of 50um can be realized; and thirdly, based on the carrier plate, after the plates are separated, the ultrathin copper foil can be etched by using a flash etching operation method, so that the corrosion to the circuit can be reduced, and the high reliability of the coil circuit is improved.
In the present embodiment, it is preferable that there is also S11) between the above S1) and S2), and S11) is: the carrier plate B0 is subjected to a cutting operation and cut to the size required for production.
In this embodiment, in the step S3), the copper thickness of the circuit copper layer 2 is preferably 35 to 80 μm, the line width is preferably 35 to 80 μm, and the line pitch is preferably 35 to 80 μm. And further preferably, the copper thickness of the wiring copper layer 2 is 50 μm, the line width is 50 μm, and the line pitch is 50 μm.
In this embodiment, in S4), the specific process of manufacturing the second intermediate plate B2 preferably includes: firstly, the resin layers 3 which are made of epoxy resin and have the thickness higher than that of the circuit copper layers 2 are printed on the two circuit copper layers 2 respectively, and then the resin layers 3 are baked for 30-120 min at the temperature of 120-150 ℃, so that the second intermediate plate B2 is obtained. Description of the drawings: in practical production, when different resin materials are used, the baking temperature and baking time are changed accordingly.
Further preferably, the thickness difference between the resin layer 3 and the circuit copper layer 2 is 30-100 μm, so that the resin layer 3 can cover, protect and support the circuit copper layer 2.
In conclusion, the invention provides a brand-new processing technology of a single-layer wireless charging coil carrier plate with high reliability, high efficiency and high application applicability for the wireless charging module through innovation, on one hand, the processing technology develops the application of the PCB technology in the field of wireless charging coils, and opens up a new market for the PCB industry; on the other hand, the processing technology is easy to implement and compatible to production, and the production range is expanded; in addition, the processing technology can also be applied to coil shapes such as round shapes or square shapes and to single-strand or multi-strand coil structures, namely the coil pattern shapes and the coil pattern wiring are not limited.
The above embodiments are merely illustrative of the efficacy of the present invention and not intended to limit the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be construed as being within the scope of the present invention.
Claims (7)
1. The processing technology of the single-layer wireless charging coil carrier plate is characterized in that: the method comprises the following steps:
s1), preparing a carrier plate (B0), wherein the carrier plate (B0) is provided with an auxiliary substrate (10) and two ultrathin carrier copper foils (11), each of the two ultrathin carrier copper foils (11) is provided with a layer of carrier copper foil (110) and an ultrathin copper foil (111) which is detachably arranged on one surface of the carrier copper foil (110), and the two ultrathin carrier copper foils (11) are correspondingly laminated on the front surface and the back surface of the auxiliary substrate (10) through the carrier copper foils (110) on the two ultrathin carrier copper foils respectively;
s2), respectively attaching dry films to the two ultrathin copper foils (111), and forming a circuit pattern after exposure and development;
s3), respectively electroplating circuit copper layers (2) on the two ultrathin copper foils (111) according to the circuit patterns, and then removing the dry film to obtain a first intermediate plate (B1);
s4), respectively printing a resin layer (3) on the two circuit copper layers (2) of the first intermediate board (B1) to obtain a second intermediate board (B2);
s5), splitting the second intermediate board (B2) along the joint of the two ultrathin copper foils (111) and the two carrier copper foils (110) respectively to obtain two third intermediate boards (B3) containing the circuit copper layers (2);
s6), etching the ultra-thin copper foil (111) on the third middle plate (B3) by a flash etching operation method to obtain an effective plate (B4) of the single-layer wireless charging coil carrier plate.
2. The processing technology of the single-layer wireless charging coil carrier plate according to claim 1, characterized in that: the auxiliary substrate (10) is an FR4 board or a BT board, and the thickness of the auxiliary substrate (10) is 50-500 mu m;
the thickness of the carrier copper foil (110) is 12-18 mu m; the thickness of the ultrathin copper foil (111) is 2-5 mu m.
3. The processing technology of the single-layer wireless charging coil carrier plate according to claim 1, characterized in that: s11) between S1) and S2), the S11) being: -cutting the carrier plate (B0) to size for production.
4. The processing technology of the single-layer wireless charging coil carrier plate according to claim 1, characterized in that: s3), the copper thickness of the circuit copper layer (2) is 35 to 80 μm, the line width is 35 to 80 μm, and the line distance is 35 to 80 μm.
5. The processing technology of the single-layer wireless charging coil carrier plate according to claim 1, characterized in that: the above S4), the specific process for manufacturing the second intermediate plate (B2) is: firstly, the resin layers (3) with the thickness higher than that of the circuit copper layers (2) are printed on the two circuit copper layers (2), and then the resin layers (3) are baked for 30-120 min at the temperature of 120-150 ℃, so that the second intermediate plate (B2) is obtained.
6. The processing technology of a single-layer wireless charging coil carrier plate according to claim 5, characterized in that: the thickness difference between the resin layer (3) and the circuit copper layer (2) is 30-100 mu m.
7. The processing technology of the single-layer wireless charging coil carrier plate according to claim 1, characterized in that: also included is S7): and carrying out surface treatment and finished product detection processes on the effective plate (B4) to finish the subsequent processing and manufacturing of the required single-layer wireless charging coil carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110523427.XA CN113380529A (en) | 2021-05-13 | 2021-05-13 | Processing technology of single-layer wireless charging coil carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110523427.XA CN113380529A (en) | 2021-05-13 | 2021-05-13 | Processing technology of single-layer wireless charging coil carrier plate |
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| Publication Number | Publication Date |
|---|---|
| CN113380529A true CN113380529A (en) | 2021-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110523427.XA Pending CN113380529A (en) | 2021-05-13 | 2021-05-13 | Processing technology of single-layer wireless charging coil carrier plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116744585A (en) * | 2023-08-15 | 2023-09-12 | 江苏普诺威电子股份有限公司 | Ultrathin medium-thickness substrate, manufacturing method thereof and voice coil motor |
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| KR20180036871A (en) * | 2016-09-30 | 2018-04-10 | 주식회사 심텍 | method of fabricating printed circuit board including solder resist patterns with uniform thickness |
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| CN111356309A (en) * | 2020-04-15 | 2020-06-30 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer circuit board with high line alignment precision |
| CN112135431A (en) * | 2020-10-08 | 2020-12-25 | 广州添利电子科技有限公司 | Edge sealing process for manufacturing buried circuit board |
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2021
- 2021-05-13 CN CN202110523427.XA patent/CN113380529A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105746003A (en) * | 2013-11-22 | 2016-07-06 | 三井金属矿业株式会社 | Manufacturing method for printed wiring board provided with buried circuit, and printed wiring board obtained by the manufacturing method |
| KR20180036871A (en) * | 2016-09-30 | 2018-04-10 | 주식회사 심텍 | method of fabricating printed circuit board including solder resist patterns with uniform thickness |
| CN107995792A (en) * | 2017-11-27 | 2018-05-04 | 深圳光韵达激光应用技术有限公司 | A kind of FPC flexibilities wireless charging transmission coil module manufacture craft |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116744585A (en) * | 2023-08-15 | 2023-09-12 | 江苏普诺威电子股份有限公司 | Ultrathin medium-thickness substrate, manufacturing method thereof and voice coil motor |
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