TWI788075B - Method of manufacturing flexible wiring substrate group - Google Patents

Abstract

A method of manufacturing a flexible wiring substrate group includes a plurality of flexible multilayer wiring substrates. Each of the flexible multilayer wiring substrates includes two outer conductive layers, a plurality of insulating layers, and at least one wiring layer. The insulating layers are disposed between the outer conductive layers. The wiring layer is sandwiched between two adjacent insulating layers. Next, a plurality of adhesive sheets adhere to the flexible multilayer wiring substrates. Each of the adhesive sheets adheres to the outer conductive layers of adjacent two flexible multilayer wiring substrates. After the adhesive sheets adhere to the flexible multilayer wiring substrates, the flexible multilayer wiring substrates are located between the adhesive sheets and arranged in a line.

Description

Manufacturing method of flexible circuit substrate group

The invention relates to a manufacturing method of a circuit board, and in particular to a manufacturing method of a flexible circuit board group.

The current flexible circuit boards are usually formed by cutting large-sized circuit boards (panels), and in the existing flexible circuit Molecular substrates are formed through a series of processes. The circuit connecting boards are individually made from the boards one by one. With the development of electronic technology, electronic products are gradually miniaturized, the wiring density and the number of layers of circuit boards are gradually increasing, and the demand for multi-layer (≥ 2 two-layer) circuit boards and high-frequency boards (LCP, MPI, etc.) is also increasing. Increase, because the main parts and accessories of the multilayer board must use a single process, and the subsequent process cannot use the high stability and high efficiency roll-to-roll (roll to roll) continuous process, because the circuit board is thin and soft, The single-sheet process can easily lead to problems such as creases, uneven copper plating, and poor efficiency. Therefore, in the process of manufacturing the circuit board, the staff must often flatten the large-sized board, so that the board can be kept in a flat state and sent to the processing equipment for processing, so as to avoid damage caused by the board. And reduce yield. In this way, it not only increases the labor cost, but also limits the throughput.

The present application provides a method for manufacturing a flexible circuit board group, which can manufacture flexible circuit boards in a roll-to-roll manner.

The manufacturing method of the flexible circuit substrate set proposed in the present application includes providing a plurality of multilayer flexible circuit substrates, wherein each multilayer flexible circuit substrate includes two outer conductive layers, multiple insulating layers and at least one circuit layer. The insulating layer is disposed between the outer conductive layers. The circuit layer is interposed between two adjacent insulating layers. Next, attach a plurality of adhesive sheets to the multi-layer flexible circuit substrate, wherein each adhesive sheet is attached to the outer conductive layer of two adjacent multi-layer flexible circuit substrates, and after the adhesive sheet is attached to the After the multi-layer flexible circuit substrate, the multi-layer flexible circuit substrate is located between the adhesive sheets, and the multi-layer flexible circuit substrate is linearly arranged.

In one embodiment, the step of attaching the adhesive sheet to the multilayer flexible circuit substrate includes disposing each adhesive sheet on the outer conductive layer of two adjacent multilayer flexible circuit substrates, wherein each adhesive sheet Partially covering the outer conductive layer of two adjacent multi-layer flexible circuit substrates. Next, a plurality of positioning pins are respectively inserted into a plurality of positioning holes of the adhesive sheet and the multi-layer flexible circuit substrate, wherein each positioning pin passes through two of the adhesive sheets and is located between the two adhesive sheets. One of the multi-layer flexible circuit substrates. Next, the positioning pins are removed. After removing the positioning pins, pressing the adhesive sheet and the multi-layer flexible circuit substrate.

In one embodiment, each adhesive sheet includes a conductive adhesive, a metal layer and a polymer material layer. The conductive adhesive directly contacts and adheres to the outer conductive layer, and the polymer material layer is located between the conductive adhesive and the metal layer.

In one embodiment, each multi-layer flexible circuit substrate has a plurality of positioning holes and a pair of opposite edges, each positioning hole is adjacent to one of the edges, and the distance between the adjacent positioning holes and the edge is between 2 mm and 4 mm. between.

In one of the embodiments, each adhesive sheet has a plurality of positioning holes and a pair of long edges opposite to each other, and part of the positioning holes of the same adhesive sheet are arranged along the long edges, wherein adjacent to the same long edge The spacing between the positioning holes is between 80 and 150mm.

In one embodiment, after the adhesive sheet is pasted on the multilayer flexible circuit substrate, the distance between two adjacent multilayer flexible circuit substrates is between 0 mm and 2 mm.

In one embodiment, after attaching the adhesive sheet to the multilayer flexible circuit substrate, the adhesive sheet and the multilayer flexible circuit substrate are crimped.

Based on the above, the manufacturing method of the embodiment of the present invention can manufacture the flexible circuit board group suitable for the roll-to-roll process, and then can use the roll-to-roll method to manufacture the flexible circuit board. In this way, the manufacturing method of the embodiment of the present invention not only helps to increase the production capacity of the flexible circuit board, but also saves manpower for handling the multi-layer flexible circuit board, thereby helping to reduce the production cost.

In the following text, in order to clearly present the technical features of this application, the dimensions (such as length, width, thickness, and depth) of elements (such as layers, films, substrates, and regions) in the drawings will be enlarged in a non-proportional manner , and some component counts will be reduced. Therefore, the description and explanation of the following embodiments are not limited to the number of components in the drawings and the size and shape of the components, but should cover the deviations in size, shape and both caused by actual manufacturing processes and/or tolerances. For example, a planar surface shown in the drawings may have rough and/or non-linear features, while acute angles shown in the drawings may be rounded. Therefore, the components shown in the drawings of this case are mainly for illustration, and are not intended to accurately depict the actual shape of the components, nor are they used to limit the scope of the patent application of this case.

Secondly, words such as "about", "approximately" or "substantially" appearing in the content of this case not only cover the clearly stated values and numerical ranges, but also cover The allowable deviation range, wherein the deviation range can be determined by the error generated during the measurement, and the error is caused by the limitation of the measurement system or process conditions, for example. Additionally, "about" can mean within one or more standard deviations of the above numerical values, eg, within ±30%, ±20%, ±10%, or ±5%. Words such as "about", "approximately" or "substantially" appearing in this text can choose the acceptable deviation range or standard deviation according to optical properties, etching properties, mechanical properties or other properties, not a single The standard deviation is used to apply all properties such as the above optical properties, etching properties, mechanical properties and other properties.

1A and FIG. 1B are schematic diagrams of a method for manufacturing a flexible circuit substrate set according to at least one embodiment of the present invention, wherein FIG. 1A is a perspective schematic diagram, and FIG. 1B is a schematic cross-sectional diagram drawn along the line 1B-1B in FIG. 1A . Please refer to FIG. 1A and FIG. 1B. In the manufacturing method of this embodiment, firstly, a plurality of multilayer flexible circuit substrates 200 are provided, wherein each multilayer flexible circuit substrate 200 includes two outer conductive layers 211a, multilayer insulating layers 212, 213 and At least one circuit layer 211.

Taking FIG. 1A and FIG. 1B as an example, each multilayer flexible circuit substrate 200 includes two outer conductive layers 211a, two insulating layers 212, an insulating layer 213 and a wiring layer 211, wherein the insulating layers 212 and 213 are all arranged on Between the outer conductive layers 211 a , and the circuit layer 211 is sandwiched between two adjacent layers of the insulating layers 212 and 213 . Each outer conductive layer 211a completely covers its adjacent insulating layer 212 , and may be a metal foil, such as copper foil. In addition, the insulating layer 213 can be an adhesive layer.

It can be seen from this that the outer conductive layer 211a is not a patterned circuit layer, and the multi-layer flexible circuit board 200 is a semi-finished flexible circuit board that has not yet been manufactured. In addition, each multilayer flexible circuit substrate 200 can be a circuit panel or a substrate strip. Therefore, a single multi-layer flexible circuit board 200 can produce multiple flexible circuit boards.

Next, attach a plurality of adhesive sheets 100 to the multilayer flexible circuit substrate 200, wherein each adhesive sheet 100 is attached to the outer conductive layer 211a of two adjacent multilayer flexible circuit substrates 200, and each multilayer flexible circuit substrate 200 Two adhesive sheets 100 are pasted on the opposite sides of each other. Each adhesive sheet 100 includes a conductive adhesive 113 , a metal layer 111 and a polymer material layer 112 , wherein the polymer material layer 112 is located between the conductive adhesive 113 and the metal layer 111 .

The polymer material layer 112 is an insulating material, and may be made of polyimide (PI). After the adhesive sheet 100 is attached to the multilayer flexible circuit substrate 200 , the conductive adhesive 113 can directly contact and adhere to the outer conductive layer 211 a , and the multilayer flexible circuit substrate 200 will be located between the adhesive sheets 100 . Therefore, each adhesive sheet 100 can be electrically connected to the two outer conductive layers 211 a through the conductive adhesive 113 .

Each adhesive sheet 100 may have a plurality of positioning holes H1, and each multilayer flexible circuit board 200 may have a plurality of positioning holes H2. The method for attaching the adhesive sheet 100 to the multi-layer flexible circuit substrate 200 may include the following steps. Firstly, each adhesive sheet 100 is disposed on the outer conductive layers 211a of two adjacent multilayer flexible circuit substrates 200 , wherein each adhesive sheet 100 partially covers two adjacent outer conductive layers 211a. At this time, the sticky adhesive sheet 100 is not firmly combined with the multilayer flexible circuit substrate 200 , so the adhesive sheet 100 may move relative to the multilayer flexible circuit substrate 200 due to external force. In other words, at this time, the staff can move or tear off the adhesive sheet 100 by hand.

Please refer to FIG. 1B , and then, a plurality of positioning pins 12 are respectively inserted into the positioning holes H1 and H2 of both the adhesive sheet 100 and the multilayer flexible circuit board 200 . Specifically, a positioning jig may be provided, which includes the positioning pin 12 , the cover plate 11 a and the base 11 b. The positioning pin 12 is fixed on the base 11b and extends upward from the base 11b such that the positioning pin 12 protrudes from the upper surface of the base 11b. The cover plate 11 a is an independent component and can be arranged on the top end of the positioning pin 12 .

Since the adhesive sheet 100 can be moved by hand at this time, each positioning hole H1 of the adhesive sheet 100 can be aligned with the correct positioning hole H2 by moving the adhesive sheet 100 . In this way, the adhesive sheet 100 and the multi-layer flexible circuit substrate 200 can be disposed on the base 11b, and the positioning pins 12 can be respectively inserted into the positioning holes H1 and H2, so that each positioning pin 12 penetrates two of them. The two adhesive sheets 100 and one of the multi-layer flexible circuit substrates 200 between the two adhesive sheets 100 .

After the positioning pin 12 passes through the adhesive sheet 100 and the multi-layer flexible circuit substrate 200, the adhesive sheet 100 will basically be arranged in the correct position, and the cover plate 11a can be temporarily arranged on the top of the positioning pin 12, as shown in the figure 1B. Next, remove the cover plate 11a, and remove the positioned adhesive sheet 100 and the multilayer flexible circuit substrate 200 from the base 11b, so as to remove the positioning pins 12 from the positioning holes H1 and H2. .

Please refer to FIG. 1C, after removing the positioning pins 12, press the positioned adhesive sheet 100 and the multi-layer flexible circuit substrate 200, wherein a pressing machine 20 can be used to press the adhesive sheet 100 and the multi-layer flexible circuit. substrate 200 , so that the adhesive sheet 100 is bonded to the multi-layer flexible circuit substrate 200 . After pressing the adhesive sheet 100 and the multilayer flexible circuit substrate 200 , the multilayer flexible circuit substrate 200 can be arranged in a linear manner. So far, the flexible circuit board set 10 has basically been manufactured.

Afterwards, the flexible circuit substrate group 10 including the adhesive sheet 100 and the multi-layer flexible circuit substrate 200 can be curled, as shown in FIG. 1C . In this way, the flexible circuit board assembly 10 can manufacture flexible circuit boards in a roll-to-roll manner. For example, processes such as photolithography and cleaning are performed in a roll-to-roll manner, so that the outer conductive layer 211a can form multiple circuit layers. In addition, since each adhesive sheet 100 can electrically connect the two outer conductive layers 211a, the flexible circuit board set 10 can also be electroplated in a roll-to-roll manner to deposit metal on the outer conductive layer 211a.

Compared with the conventional technology, since the flexible circuit board group 10 disclosed above can manufacture flexible circuit boards in a roll-to-roll manner, the manufacturing method of this embodiment can not only increase the production capacity, but also save the handling of multi-layer flexible circuit boards 200 manpower, thereby helping to reduce production costs. In addition, when the flexible circuit board assembly 10 manufactures flexible circuit boards in a roll-to-roll manner, the multilayer flexible circuit substrate 200 will be pulled by the machine, so that the multilayer flexible circuit substrate 200 can be kept in a flat state and fed into the processing equipment. to process. In this way, the manufacturing method of this embodiment helps to reduce or avoid damage to the multilayer flexible circuit board 200 , thereby improving the yield of the flexible circuit board.

FIG. 2 is a schematic top view of the finished flexible circuit board assembly. Please refer to FIG. 2 , in the flexible circuit substrate set 10 , each multilayer flexible circuit substrate 200 also has a pair of edges 200 e opposite to each other. Each positioning hole H2 of the multilayer flexible circuit substrate 200 is adjacent to one of the edges 200e, wherein the distance S21 between the adjacent positioning holes H2 and the edge 200e is between 2 mm and 4 mm. Since the multilayer flexible circuit substrate 200 can be a circuit board or a substrate strip, the length L20 of the multilayer flexible circuit substrate 200 can be between 240 mm and 280 mm, wherein the length L20 can be equal to the length of the edge 200 e.

It should be noted that although FIG. 2 does not show the positioning holes H2 of the multilayer flexible circuit board 200, since the positioning holes H2 are respectively aligned with the multiple positioning holes H1 of the adhesive sheet 100, the positioning holes in FIG. 2 The location of H1 is equal to the location of the positioning hole H2. Therefore, the positioning hole H1 in FIG. 2 can also be regarded as the positioning hole H2 of the multilayer flexible circuit substrate 200 .

Since the distance S21 between the adjacent positioning holes H2 and the edge 200 e is between 2 mm and 4 mm, the positioning holes H2 can avoid the effective circuit area of the circuit layer 211 . In other words, the positioning hole H2 will not affect the electrical function of the circuit layer 211 . Each adhesive sheet 100 also has a pair of long edges 100a opposite to each other, and part of the positioning holes H1 of the same adhesive sheet 100 can be arranged along the long edges 100a, wherein the positioning holes H1 adjacent to the same long edge 100a The spacing S22 between the holes H1 may be between 80 and 150 mm. In addition, the distance W2 between two adjacent multilayer flexible circuit substrates 200 can be between 0 and 2 mm, so a gap G2 can be formed between two adjacent multilayer flexible circuit substrates 200, and its width is equal to the distance W2. .

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The protection scope of the invention shall be defined by the scope of the appended patent application.

10: Flexible circuit board group 11a: Cover plate 11b: base 12: Locating pin 20: Laminating machine 100: Adhesive film 100a: Long edge 111: metal layer 112: polymer material layer 113: Conductive adhesive 200: Multi-layer flexible circuit substrate 200e: edge 211: line layer 211a: outer conductive layer 212, 213: insulating layer G2: Gap H1, H2: positioning hole L20: Length S21, W2: Distance S22: Spacing

1A and 1B are schematic diagrams of a method for manufacturing a flexible circuit board set according to at least one embodiment of the present invention. FIG. 1C is a three-dimensional schematic diagram of laminating the multi-layer flexible circuit substrate and the adhesive sheet in FIG. 1A . FIG. 2 is a schematic top view of the finished flexible circuit board assembly.

10: Flexible circuit board group

20: Laminating machine

100: Adhesive film

200: Multi-layer flexible circuit substrate

Claims (6)

A method for manufacturing a flexible circuit substrate group, comprising: providing a plurality of multilayer flexible circuit substrates, wherein each of the multilayer flexible circuit substrates includes: two outer conductive layers; a multilayer insulating layer arranged between the outer conductive layers; at least one The circuit layer is sandwiched between two adjacent insulating layers; a plurality of adhesive sheets are bonded to the multi-layer flexible circuit substrate, wherein each of the adhesive sheets is bonded to the adjacent two layers of the multi-layer flexible circuit substrate. on the outer conductive layer, and after the adhesive sheets are bonded to the multi-layer flexible circuit substrate, the multi-layer flexible circuit substrate is located between the adhesive sheets, and the multi-layer flexible circuit substrates are arranged linearly; and After the adhesive sheet is attached to the multi-layer flexible circuit substrate, the adhesive sheet and the multi-layer flexible circuit substrate are crimped. The manufacturing method of the flexible circuit substrate group according to claim 1, wherein the step of attaching the adhesive sheet to the multi-layer flexible circuit substrate includes: disposing each of the adhesive sheets on two adjacent multi-layer flexible circuit substrates On the outer conductive layer, each of the adhesive sheets partially covers the outer conductive layers of the two adjacent multi-layer flexible circuit substrates; inserting a plurality of positioning pins into both the adhesive sheet and the multi-layer flexible circuit substrate In a plurality of positioning holes, each of the positioning pins passes through two of the adhesive sheets and one of the plurality of adhesive sheets is located between the two adhesive sheets. layer flexible circuit substrate; and removing the positioning pin; and after removing the positioning pin, pressing the adhesive sheet and the multi-layer flexible circuit substrate. The manufacturing method of the flexible circuit substrate group as described in Claim 1, wherein each of the adhesive sheets includes: a conductive adhesive, directly contacting and bonding to the outer conductive layer; a metal layer; and a polymer material layer located on the conductive layer. between the glue and the metal layer. The manufacturing method of the flexible circuit substrate set as claimed in item 1, wherein each of the multilayer flexible circuit substrates has a plurality of positioning holes and a pair of edges opposite to each other, each of the positioning holes is adjacent to one of the edges, and the adjacent one of the edges The distance between the positioning hole and the edge is between 2 and 4 mm. The manufacturing method of the flexible circuit substrate set as claimed in item 1, wherein each of the adhesive sheets has a plurality of positioning holes and a pair of long edges opposite to each other, and part of the positioning holes of the same adhesive sheet are along the length Edges are arranged, wherein the spacing between the positioning holes adjacent to the same long edge is between 80 and 150 mm. The manufacturing method of the flexible circuit substrate set according to claim 1, wherein after the adhesive sheet is pasted on the multi-layer flexible circuit substrate Finally, the distance between two adjacent multilayer flexible circuit substrates is between 0 and 2mm.

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