CN113764564B - Substrate preparation method and diaphragm structure - Google Patents
Substrate preparation method and diaphragm structure Download PDFInfo
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- CN113764564B CN113764564B CN202111008621.0A CN202111008621A CN113764564B CN 113764564 B CN113764564 B CN 113764564B CN 202111008621 A CN202111008621 A CN 202111008621A CN 113764564 B CN113764564 B CN 113764564B
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- 239000000758 substrate Substances 0.000 title claims abstract description 253
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000012528 membrane Substances 0.000 claims abstract description 179
- 238000003825 pressing Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims 2
- 239000010408 film Substances 0.000 description 77
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000010147 laser engraving Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136222—Colour filters incorporated in the active matrix substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The embodiment of the application discloses a substrate preparation method and a membrane structure, wherein the substrate preparation method comprises the following steps: providing a substrate; covering a membrane structure on a side surface of the substrate and at least a part of side surfaces adjacent to the side surface, wherein the membrane structure comprises a first membrane and a second membrane which are connected with each other, the first membrane covers the side surface, the second membrane covers at least a part of side surfaces, a plurality of slits are formed in the membrane structure and are crossed with the boundary line of the first membrane and the second membrane, and the slits are sequentially distributed along the length direction of the boundary line; forming a conductive layer on the surface of one side of the membrane structure, which is away from the substrate; the membrane structure is peeled off from the substrate to form a wire at a position of the substrate corresponding to the slit. According to the embodiment of the application, the conducting layer is formed on the diaphragm structure with the slit, then the diaphragm structure is peeled off from the substrate, so that the conducting wire can be formed on the substrate, the operation is simple, the operation time is short, and the preparation efficiency of the substrate can be improved.
Description
Technical Field
The application relates to the field of display, in particular to a substrate preparation method and a membrane structure.
Background
Currently, in the manufacturing process of an array substrate of a Micro light emitting diode (Micro Light Emitting Diode, micro LED) display panel, silver paste is generally coated on a side surface of the array substrate and a side edge adjacent to the side surface, then the silver paste is cured by laser, finally laser engraving is performed, and finally a wire electrically connected with a circuit structure on the side surface of the array substrate is formed on the side surface of the array substrate.
However, the conventional method for performing laser engraving on the cured silver paste on the array substrate is complex, and the operation time is long, so that the production efficiency of the array substrate is low.
Disclosure of Invention
The embodiment of the application provides a display panel and a display device, which can solve the problems that the existing mode of carrying out laser engraving on the solidified silver paste on a substrate is complex, the operation time is long, and the preparation efficiency of the substrate is low.
The embodiment of the application provides a substrate preparation method, which comprises the following steps:
providing a substrate;
covering a membrane structure on a side surface of the substrate and at least part of a side surface adjacent to the side surface, wherein the membrane structure comprises a first membrane and a second membrane which are connected with each other, the first membrane covers the side surface, the second membrane covers at least part of the side surface, a plurality of slits are formed in the membrane structure, the slits are arranged to intersect with the boundary line between the first membrane and the second membrane, and the slits are sequentially distributed along the length direction of the boundary line;
forming a conductive layer on the surface of one side of the membrane structure, which is away from the substrate;
and stripping the membrane structure from the substrate to form a wire at a position of the substrate corresponding to the slit.
Optionally, the first membrane and the second membrane are arranged at an included angle; the covering the membrane structure on the side surface of the substrate and at least part of the side surface adjacent to the side surface comprises the following steps:
placing the second membrane and the side face of the substrate in a lamination manner, and placing the first membrane and the side face of the substrate in a lamination manner;
pressing the second membrane onto the side surface of the substrate to cover the membrane structure on at least part of the side surface of the substrate;
and pressing the first membrane on the side surface of the substrate to cover the membrane structure on the side surface of the substrate.
Optionally, the pressing the second film on the side surface of the substrate includes:
and rolling and pressing the second membrane on one side of the substrate, which is away from the second membrane, through two rollers which are arranged in parallel respectively, so as to press the second membrane on the side surface of the substrate.
Optionally, a light release film is attached to one side of the substrate away from the second membrane; the pressing the second membrane on the side surface of the substrate comprises the following steps:
stripping the light release film on the substrate;
a bottom plate is arranged on one side of the substrate, which is away from the second membrane;
and rolling and pressing the second membrane on one side, which is away from the substrate, of the bottom plate through two rollers which are arranged in parallel respectively, so that the second membrane is pressed on the side surface of the substrate, and the substrate is pressed on the bottom plate.
Optionally, the pressing the first film on the side surface of the substrate includes:
and stamping one side of the first membrane, which is away from the substrate, through a pressing rod so as to press the first membrane on the side surface of the substrate.
Optionally, the forming a conductive layer on a surface of the membrane structure on a side facing away from the substrate includes:
and depositing conductive materials on the surfaces of the first membrane and the second membrane, which are away from one side of the substrate, so as to form the conductive layer.
Optionally, the second membrane overlaps the side face.
The embodiment of the application also provides a membrane structure, which comprises a first membrane and a second membrane which are connected with each other, wherein a plurality of slits are formed in the membrane structure, the slits are arranged in a crossing manner with the boundary line between the first membrane and the second membrane, and the slits are sequentially distributed along the length direction of the boundary line;
the first membrane and the second membrane are arranged at an included angle, or the membrane structure is made of flexible materials.
Optionally, the width of the slit is greater than or equal to 50 μm and less than or equal to 150 μm.
Optionally, an included angle is formed between an extending direction of the slit on the first membrane and a length direction of the first membrane.
Optionally, the first membrane and the second membrane are integrally formed.
According to the embodiment of the application, the membrane structure with the slit is covered on the substrate in the preparation process of the substrate, the slit on the membrane structure is overlapped with the side face and the side face of the substrate, then the conductive layer is arranged on the surface of one side, away from the substrate, of the membrane structure, and after the membrane structure is peeled off from the substrate, the overlapped part of the conductive layer and the slit can be left on the side face and the side face of the substrate, so that a wire consistent with the shape of the slit is formed on the substrate. Compared with the existing mode of curing silver paste through the side face of the substrate and then carrying out laser engraving on the silver paste to form a wire, the mode of forming the wire on the side face and the side face of the substrate in the embodiment of the application is simple in operation, short in operation time and capable of improving the preparation efficiency of the substrate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of one embodiment of a substrate preparation method provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a substrate provided in an embodiment of the present application after a wire is prepared;
FIG. 3 is an enlarged view at A in FIG. 2;
FIG. 4 is a schematic diagram of one embodiment of a diaphragm structure provided in an embodiment of the present application;
fig. 5 is an enlarged view at B in fig. 4;
FIG. 6 is a schematic diagram of a membrane structure according to an embodiment of the present disclosure after the membrane structure is covered on a substrate;
FIG. 7 is a schematic diagram of a structure after forming a conductive layer on a membrane structure in an embodiment of the present application;
fig. 8 is a schematic structural diagram of the film structure pressed on the substrate by the roller according to the embodiment of the present application.
Reference numerals illustrate:
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
The embodiment of the application provides a substrate preparation method and a membrane structure. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments.
First, the embodiment of the application provides a substrate preparation method.
Fig. 1 is a flowchart illustrating an embodiment of a substrate preparation method according to an embodiment of the present application. As shown in fig. 1, the substrate preparation method in the embodiment of the present application includes steps 100 to 130, specifically as follows:
100. a substrate is provided.
The substrate 100 may specifically depend on the type of display panel to which the substrate 100 is applied. The substrate 100 may include an array substrate, or the substrate 100 includes a color film substrate and an array substrate arranged to a cartridge. Specific examples are: when the substrate 100 is used in a Micro Light-Emitting Diode (Micro Light Emitting Diode, micro LED) display panel or an Organic Light-Emitting Diode (OLED) display panel, the substrate 100 is an array substrate; when the substrate 100 is used in a liquid crystal display (Liquid Crystal Display, LCD) panel, the substrate 100 is a color film substrate and an array substrate arranged in a pair of cells.
During the manufacturing process of the substrate 100, as shown in fig. 2 and 3, it is necessary to make a wire 310 on the side 110 of the substrate 100 to be electrically connected to the circuit structure on the side 120 of the substrate 100, and the wire 310 may be used for binding (Bonding) of a printed circuit board (Printed Circuit Board, PCB).
The circuit structure on the substrate 100 may include a signal line, a driving line, etc. electrically connected to the thin film transistor, which is not limited herein.
In addition, a printed circuit board may be disposed on a side surface of the substrate 100 and electrically connected with the conductive lines 310 on the side surface 110 of the substrate 100 to achieve Bonding (Bonding) of the printed circuit board (Printed Circuit Board, PCB). Alternatively, the printed circuit board may be disposed on the other side 120 of the substrate 100 and electrically connected with the conductive lines 310 on the side 110 of the substrate 100 to achieve the binding of the printed circuit board.
Of course, the bonding of the printed circuit board by the wires 310 on the side 110 of the substrate 100 is only one embodiment, and the wires 310 may be used for electrical connection with other circuit structures or electronic components other than the printed circuit board, which is not limited herein. Specific examples are: when the substrate 100 includes a color film substrate and an array substrate arranged in a pair of boxes, the conductive lines 310 on the side surface 110 of the substrate 100 may be used to electrically connect the circuit structures on the array substrate with the circuit structures on the color film substrate.
110. The method comprises the steps that a membrane structure is covered on a side face of a substrate and at least a part of side faces adjacent to the side face, the membrane structure comprises a first membrane and a second membrane which are connected with each other, the first membrane covers the side face, the second membrane covers at least a part of side faces, a plurality of slits are formed in the membrane structure, the slits are arranged in a crossing mode with the boundary line of the first membrane and the second membrane, and the slits are sequentially distributed along the length direction of the boundary line.
As shown in fig. 4, 5 and 6, the second film 220 of the film structure 200 may be covered on the side 120 of the substrate 100 on which the circuit structure is disposed, and the first film 210 of the film structure 200 may be covered on the side 110 of the substrate 100. Alternatively, the second film 220 of the film structure 200 may be first covered on the side 120 of the substrate 100, and the first film 210 of the film structure 200 may be covered on the side 110 of the substrate 100, after the steps 120 and 130 are completed, a circuit structure may be formed on the side 120 of the substrate 100 covered by the second film 220, so that the circuit structure on the side 120 of the substrate 100 is electrically connected to the conductive lines 310 formed on the substrate 100.
It will be appreciated that since the plurality of slits 213 in the diaphragm structure 200 are disposed across the boundary 212 between the first diaphragm 210 and the second diaphragm 220, the slits 213 in the diaphragm structure 200 overlap the side surfaces 110 and 120 of the substrate 100 when the diaphragm structure 200 is covered on the substrate 100.
Alternatively, as shown in fig. 6, the second membrane 220 of the membrane structure 200 overlaps the side 120 of the substrate 100. Thus, the second film 220 can protect the side 120 of the substrate 100 to prevent the circuit structure on the side 120 of the substrate 100 from being scratched. Alternatively, damage to the circuit structures on the side 120 of the substrate 100 during step 120 is avoided.
Optionally, the first diaphragm 210 and the second diaphragm 220 of the diaphragm structure 200 are integrally formed, so as to improve the connection stability of the first diaphragm 210 and the second diaphragm 220.
In other embodiments, the first membrane 210 and the second membrane 220 may be attached together by gluing, welding, or the like.
Optionally, as shown in fig. 4 and 5, the first membrane 210 and the second membrane 220 of the membrane structure 200 are disposed at an angle, so that the first membrane 210 and the second membrane 220 cover the side surface 110 and the side surface 120 of the substrate 100, respectively. The included angle formed by the first film 210 and the second film 220 may be specifically determined according to the included angle between the side surface 110 and the side surface 120 of the substrate 100, and when the included angle between the side surface 110 and the side surface 120 of the substrate 100 is 90 °, the included angle between the first film 210 and the second film 220 is also 90 °.
In other embodiments, the membrane structure 200 is made of a flexible material. Thus, the second film 220 may be first coated on the side 120 of the substrate 100, and then the first film 210 may be bent such that the first film 210 is coated on the side 110 of the substrate 100. Alternatively, the first film 210 may be first covered on the side surface 110 of the substrate 100, and then the film structure 200 may be bent, so that the second film 220 covers the side surface 120 of the substrate 100.
120. And forming a conductive layer on the surface of one side of the membrane structure, which is away from the substrate.
It will be appreciated that, because the slit 213 on the diaphragm structure 200 overlaps the side surface 110 and the side surface 120 of the substrate 100, after the conductive layer 300 is formed on the surface of the diaphragm structure 200 facing away from the substrate 100, the overlapping portion of the conductive layer 300 and the slit 213 contacts the side surface 120 and the side surface 110 of the substrate 100, and other portions of the conductive layer 300 are separated from the side surface 120 and the side surface 110 of the substrate 100 by the diaphragm structure 200.
Alternatively, as shown in fig. 7, a conductive material is deposited on the surfaces of the first and second diaphragms 210 and 220 on the side facing away from the substrate 100 to form a conductive layer 300. By depositing a conductive material on the surfaces of the first and second films 210 and 220 facing away from the substrate 100 to form the conductive layer 300, the connection between the portion of the conductive layer 300 overlapping the slit 213 and the side 120 and the side 110 of the substrate 100 can be more firmly established.
The deposition of the conductive material may be performed by physical vapor deposition (Physical Vapor Deposition, PVD), vacuum deposition, sputtering, ion plating, etc., which is not limited herein, and the conductive material may be deposited on the surfaces of the first and second films 210 and 220 facing away from the substrate 100 to form the conductive layer 300.
In other embodiments, an electrical material may be coated or sprayed on the surfaces of the first and second films 210 and 220 facing away from the substrate 100, and the conductive material may be cured to form the conductive layer 300.
In the embodiment of the present application, the conductive material of the conductive layer 300 includes conductive metal, conductive metal oxide, conductive nonmetal, and the like, which are not limited herein.
130. The membrane structure is peeled off from the substrate to form a wire at a position of the substrate corresponding to the slit.
It will be appreciated that when the membrane structure 200 is peeled off the substrate 100, the portion of the conductive layer 300 overlapping the membrane structure 200 is peeled off along with the membrane structure 200, and the portion of the conductive layer 300 overlapping the slit 213 remains on the side 120 and the side 110 of the substrate 100 to form the conductive line 310 conforming to the shape of the slit 213 on the substrate 100.
Compared with the prior art of curing silver paste through the side 110 of the substrate 100 and then performing laser engraving on the silver paste to form the conductive lines 310, in the embodiment of the present application, during the preparation of the substrate 100, the film structure 200 with the slit 213 is covered on the substrate 100, and the slit 213 on the film structure 200 overlaps the side 110 and the side 120 of the substrate 100, then the conductive layer 300 is disposed on the surface of the side of the film structure 200 facing away from the substrate 100, and after the film structure 200 is peeled off from the substrate 100, the overlapping portion of the conductive layer 300 and the slit 213 remains on the side 120 and the side 110 of the substrate 100 to form the conductive lines 310 corresponding to the shape of the slit 213 on the substrate 100. In the embodiment of the application, the mode of forming the wires 310 on the side surface 110 and the side surface 120 of the substrate 100 is simple to operate, the operation time is short, and the production efficiency of the substrate 100 can be improved.
Optionally, the first membrane 210 and the second membrane 220 are disposed at an angle. The included angle formed by the first membrane 210 and the second membrane 220 may be specifically determined according to the included angle between the side surface 110 and the side surface 120 of the substrate 100, and when the included angle between the side surface 110 and the side surface 120 of the substrate 100 is 90 °, the included angle between the first membrane 210 and the second membrane 220 is also 90 °.
The above-mentioned manner of covering the membrane structure 200 on the side surface 110 of the substrate 100 and at least a portion of the side surface 120 adjacent to the side surface 110 may include steps 111 to 113, which are specifically described as follows:
111. the second membrane is laminated to the side of the substrate, and the first membrane is laminated to the side of the substrate.
When the circuit structure is disposed on the side 120 of the substrate 100, the slit 213 of the second film 220 may be at least partially overlapped with the connection end 130 of the circuit structure on the side 120 of the substrate 100, so that after the film structure 200 is peeled off, the conductive wire 310 formed at the position corresponding to the slit 213 of the substrate 100 can be electrically connected with the circuit structure on the side 120 of the substrate 100. When no circuit structure is provided on the side 120 of the substrate 100, the slit 213 of the second film 220 may at least partially overlap with the area of the connection end 130 on the side 120 of the substrate 100 for forming the circuit structure, so that after the film structure 200 is peeled off, the conductive line 310 formed at the position corresponding to the slit 213 of the substrate 100 can be electrically connected with the circuit structure formed at the later stage of the side 120 of the substrate 100.
Optionally, the second film 220 is aligned with the side 120 of the substrate 100 by using a CCD (charge coupled device, charge-coupled device) alignment technique, so that the second film 220 is stacked with the side 120 of the substrate 100 more precisely. Specifically, a cross Mark alignment structure is designed on the side 120 of the substrate 100, and a CCD alignment technology may be used to align the edge of the second film 220 of the film structure 200 as Mark.
Because the first membrane 210 and the second membrane 220 are disposed at an angle, when the second membrane 220 is accurately stacked on the side 120 of the substrate 100, the first membrane 210 is also stacked on the side 110 of the substrate 100.
112. The second membrane is pressed onto the side of the substrate to cover the membrane structure on at least part of the side of the substrate.
In this embodiment, by pressing the second film 220 on the side 120 of the substrate 100, the second film 220 of the film structure 200 can be covered on at least part of the side 120 of the substrate 100 more stably.
Wherein, paste light release film in the base plate one side that deviates from the second diaphragm. The light release film can protect one side of the substrate away from the second membrane. The light release film is a release film, and is not described in detail herein.
As shown in fig. 8, the second film 220 may be pressed onto the side 120 of the substrate 100 by two rollers 500 arranged in parallel, which includes the following steps:
1121. and stripping the light release film on the substrate.
1122. A bottom plate is arranged on one side of the substrate, which is away from the second membrane.
1123. The two rollers arranged in parallel respectively roll and press the side, away from the substrate, of the second membrane and the side, away from the substrate, of the bottom plate so as to press the second membrane on the side surface of the substrate and press the substrate on the bottom plate.
According to the embodiment of the application, the second film 220 is pressed on the side face 120 of the substrate 100 by the two rollers 500, so that the risk of generating bubbles between the second film 220 and the side face 120 of the substrate 100 in the process of pressing the second film 220 on the side face 120 of the substrate 100 can be reduced.
Moreover, by providing the bottom plate 400 at a side of the bottom plate 400 facing away from the second film 220, when the second film 220 is pressed onto the side 120 of the substrate 100 by the two rollers 500, not only the risk of air bubbles being generated between the second film 220 and the side 120 of the substrate 100 during the pressing of the second film 220 onto the side 120 of the substrate 100 can be reduced. In addition, the substrate 100 can be pressed on the bottom plate 400, so that the substrate 100 is prevented from being crushed due to the rolling contact between the roller 500 and the substrate 100, and the subsequent preparation process of the substrate 100 is more convenient.
The two rollers 500 disposed in parallel may be used to roll and press the second film 220 on the side of the substrate 100 away from the side surface 110, and the bottom plate 400 on the side of the substrate 100 away from the side surface 110, so as to reduce the influence on the alignment accuracy of the first film 210 caused by the pressing of the second film 220 by the rollers 500.
Of course, the two rollers 500 may be rolled along the direction of the substrate 100 approaching the side surface 110, or the two rollers 500 may be rolled along the length direction of the side surface 110 relative to the substrate 100 without affecting the alignment accuracy requirement of the first film 210.
In other embodiments, the manner of pressing the second film onto the side surface of the substrate may include the following steps:
and rolling and pressing the side, away from the substrate, of the second membrane and the side, away from the second membrane, of the substrate respectively through two rollers arranged in parallel so as to press the second membrane on the side surface of the substrate.
In this embodiment, the two rollers 500 disposed in parallel respectively roll and press the second film 220 away from the side of the substrate 100 along the direction of the substrate 100 away from the side surface 110, and the side of the substrate 100 away from the second film 220, so as to reduce the alignment accuracy of the first film 210 affected by the process of pressing the second sub-grinding sheet by the rollers 500.
Of course, the two rollers 500 may be rolled along the direction of the substrate 100 approaching the side surface 110, or the two rollers 500 may be rolled along the length direction of the side surface 110 relative to the substrate 100 without affecting the alignment accuracy requirement of the first film 210.
113. The first membrane is pressed on the side surface of the substrate to cover the membrane structure on the side surface of the substrate.
In this embodiment, the first film 210 of the film structure 200 can be more stably covered on the side surface 110 of the substrate 100 by pressing the first film 210 on the side surface 110 of the substrate 100.
The step of pressing the first film 210 on the side surface 110 of the substrate 100 includes: and stamping one side of the first membrane, which is away from the substrate, through the pressing rod so as to press the first membrane on the side surface of the substrate.
It can be appreciated that the width of the side surface 110 of the substrate 100 is smaller, the length is longer, and the pressing of the first film 210 on the side surface 110 of the substrate 100 by the pressing rod can be more convenient.
The embodiment of the application also provides a substrate, which is prepared by adopting the substrate preparation method.
In addition, the present disclosure also proposes a membrane structure 200, where the membrane structure 200 includes a first membrane 210 and a second membrane 220 that are connected to each other, and a plurality of slits 213 are formed in the membrane structure 200, the plurality of slits 213 are disposed to intersect with an intersection line 212 of the first membrane 210 and the second membrane 220, and the plurality of slits 213 are sequentially distributed along a length direction of the intersection line 212.
In preparing the substrate 100 by the membrane structure 200, the membrane structure 200 may be covered on the side face 110 of the substrate 100 and at least a portion of the side face 120 adjacent to the side face 110, wherein the first membrane 210 of the membrane structure 200 covers the side face 110 of the substrate 100 and the second membrane 220 covers at least a portion of the side face 120 of the substrate 100. Then, the conductive layer 300 is formed on the side 120 of the membrane facing away from the substrate 100, and the membrane structure 200 is peeled off the substrate 100 to form the conductive lines 310 on the substrate 100.
The first membrane 210 and the second membrane 220 are disposed at an angle, or the membrane structure 200 is made of a flexible material, so that the first membrane 210 of the membrane structure 200 covers the side surface 110 of the substrate 100, and the second membrane 220 covers at least part of the side surface 120 of the substrate 100.
The specific method for preparing the substrate 100 by the membrane structure 200 may refer to the embodiments of the basic preparation method described above, and will not be described herein.
Optionally, the width of the slit 213 on the membrane structure 200 is greater than or equal to 50 μm and less than or equal to 150 μm, so that a wire 310 of suitable width is formed on the substrate 100.
Optionally, the extending direction of the slit 213 of the film structure 200 on the first film 210 forms an angle with the length direction of the first film 210, so that a larger number of wires 310 can be formed per unit length of the side surface 110 of the substrate 100. In addition, after the conductive lines 310 are formed on the substrate 100 through the membrane structure 200, the conductive lines 310 on the side surface 110 of the substrate 100 can extend toward the substrate 100 in a direction away from the second membrane 220, so as to be electrically connected with a circuit or an electronic component disposed on a side of the substrate 100 away from the second membrane 220.
Wherein the slit 213 on the first diaphragm 210 may be extended to an edge of the first diaphragm 210 away from the second diaphragm 220. The width of the first membrane 210 is greater than or equal to the thickness of the substrate 100 so that the wires 310 on the base side 110 can extend to the edge of the side 110 away from the side 120.
Optionally, the first diaphragm 210 and the second diaphragm 220 of the diaphragm structure 200 are integrally formed, so as to improve the connection stability of the first diaphragm 210 and the second diaphragm 220.
It should be noted that, the membrane structure 200 provided in the embodiment of the present application may be used in the above-mentioned method for preparing the substrate 100, and the specific structure of the membrane structure 200 may refer to the membrane structure 200 in the above-mentioned method for preparing the substrate 100, which is not described herein again.
The above description is made in detail on a substrate preparation method and a membrane structure provided in the embodiments of the present application, and specific examples are applied herein to illustrate the principles and embodiments of the present application, where the above description of the examples is only for helping to understand the method and core ideas of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (8)
1. A method of preparing a substrate, the method comprising:
providing a substrate;
laminating a first membrane of a membrane structure with the side surface of the substrate, and laminating a second membrane of the membrane structure with the side surface of the substrate; the side surface of the substrate is adjacent to the side surface, and a light release film is attached to one side of the substrate, which is away from the second membrane; the first membrane and the second membrane are connected with each other and are arranged at an included angle; the first membrane covers the side surface, the second membrane covers at least part of the side surface, a plurality of slits are formed in the membrane structure, the slits are arranged in a crossing manner with the boundary line between the first membrane and the second membrane, and the slits are sequentially distributed along the length direction of the boundary line;
stripping the light release film on the substrate;
a bottom plate is arranged on one side of the substrate, which is away from the second membrane;
respectively carrying out rolling press fit on one side of the second membrane, which is far away from the substrate, and one side of the bottom plate, which is far away from the substrate, along the direction, which is far away from the side surface, of the substrate by two rollers which are arranged in parallel, so as to press fit the second membrane on the side surface of the substrate, and press fit the substrate on the bottom plate;
pressing the first membrane on the side surface of the substrate;
forming a conductive layer on the surface of one side of the membrane structure, which is away from the substrate;
and stripping the membrane structure from the substrate to form a wire at a position of the substrate corresponding to the slit.
2. The method of manufacturing a substrate according to claim 1, wherein the pressing the first film on the side surface of the substrate includes:
and stamping one side of the first membrane, which is away from the substrate, through a pressing rod so as to press the first membrane on the side surface of the substrate.
3. The method for preparing a substrate according to claim 1 or 2, wherein forming a conductive layer on a surface of a side of the membrane structure facing away from the substrate comprises:
and depositing conductive materials on the surfaces of the first membrane and the second membrane, which are away from one side of the substrate, so as to form the conductive layer.
4. The substrate preparation method according to claim 1 or 2, wherein the second film overlaps the side surface.
5. A membrane structure for the substrate preparation method of any one of claims 1 to 4, the membrane structure comprising a first membrane and a second membrane connected to each other, the membrane structure being provided with a plurality of slits, the slits intersecting with the boundary line between the first membrane and the second membrane, the slits being sequentially distributed along the length direction of the boundary line;
the first diaphragm and the second diaphragm are arranged at an included angle.
6. The membrane structure of claim 5, wherein the slit has a width greater than or equal to 50 μm and less than or equal to 150 μm.
7. The diaphragm structure of claim 5, wherein said slit extends in a direction of said first diaphragm at an angle to a length direction of said first diaphragm.
8. The diaphragm structure of claim 5, wherein said first diaphragm and said second diaphragm are integrally formed.
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| CN104838342A (en) * | 2012-12-07 | 2015-08-12 | 3M创新有限公司 | Method of making transparent conductors on substrate |
| CN109963409A (en) * | 2019-04-10 | 2019-07-02 | 京东方科技集团股份有限公司 | The manufacturing method and board structure of substrate side surfaces conducting wire |
| KR20200100539A (en) * | 2020-02-11 | 2020-08-26 | 이엘케이 주식회사 | Display panel and method of manufacturing the same |
| CN112014987A (en) * | 2020-09-03 | 2020-12-01 | Tcl华星光电技术有限公司 | Array substrate, preparation method thereof, display panel and spliced display |
| CN113299603A (en) * | 2021-04-21 | 2021-08-24 | 上海步哒科技合伙企业(有限合伙) | Manufacturing method of backboard structure, display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111223411B (en) * | 2019-12-11 | 2022-04-05 | 京东方科技集团股份有限公司 | Substrate for micro LED display panel and manufacturing method thereof |
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| CN104838342A (en) * | 2012-12-07 | 2015-08-12 | 3M创新有限公司 | Method of making transparent conductors on substrate |
| CN109963409A (en) * | 2019-04-10 | 2019-07-02 | 京东方科技集团股份有限公司 | The manufacturing method and board structure of substrate side surfaces conducting wire |
| KR20200100539A (en) * | 2020-02-11 | 2020-08-26 | 이엘케이 주식회사 | Display panel and method of manufacturing the same |
| CN112014987A (en) * | 2020-09-03 | 2020-12-01 | Tcl华星光电技术有限公司 | Array substrate, preparation method thereof, display panel and spliced display |
| CN113299603A (en) * | 2021-04-21 | 2021-08-24 | 上海步哒科技合伙企业(有限合伙) | Manufacturing method of backboard structure, display panel and display device |
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