KR101129539B1 - Bonding method between pad for touch panel and circuit board and assembly prepared thereby - Google Patents

Abstract

The present invention relates to a method of bonding a pad for a touch panel and a substrate, and an assembly manufactured by the touch panel. An insulator is formed on a top surface of which a touch pattern and a lead wire are formed, and one end of the lead wire extends to an edge to form a connection electrode having an upper metal layer. In the bonding method of coupling the touch panel pad and the printed circuit board electrically connected to each other, the touch panel pad and the printed circuit board for coupling the coupling electrode facing each other in response to the connection electrode, the touch panel Preparing a laminated assembly by laminating at least an adhesive layer for opening the connection electrode portion on the top surface of the pad and a bonding layer bonded to the top surface of the adhesive layer; Applying an anisotropic conductive adhesive to the open upper metal layer including the connection electrode in the laminated assembly including the pad for the touch panel; And arranging the coupling electrodes with the anisotropic conductive adhesive interposed therebetween so as to face the connection electrodes to which the anisotropic conductive adhesive is applied, and stacking and bonding the printed circuit boards. The present invention relates to a method for bonding a pad and a substrate for use and a combination produced by the same.
Through this, the opening of the connection electrode forming portion of the touch panel pad may be hermetically coated as a bonding member in the process of bonding the touch panel pad and the substrate, and thus the connection electrode forming portion remaining after the pad and the printed circuit board are combined. It can improve the durability of the touch panel by solving the corrosion problem on the part, and can simultaneously perform the airtightness and bonding of the open part, thereby reducing the manufacturing time of the assembly of the touch panel and circuit boards such as FPCB, This has the effect of improving productivity.

Description

Bonding method of pad and substrate for touch panel and bonded body manufactured by the same {BONDING METHOD BETWEEN PAD FOR TOUCH PANEL AND CIRCUIT BOARD AND ASSEMBLY PREPARED THEREBY}

The present invention relates to a method of joining a pad for a touch panel and a substrate, and an assembly manufactured by the method. It is possible to improve the durability of the touch panel by solving the corrosion problem with respect to the opening of the connection electrode formation site remaining after the pad and the printed circuit board bonding, and can be performed simultaneously with the airtight sealing and sealing of the opening The present invention relates to a method for joining a pad for a touch panel and a substrate, which can improve productivity by reducing a manufacturing time of a combination of a panel and a circuit board such as an FPCB coupled thereto, and a combination manufactured by the same.

As a raw material pad in the pre-processing state used in manufacturing a conventional touch panel, a laminated pad coated with an insulating layer such as glass or an insulating resin is used, and an ITO pattern layer formed by etching the ITO layer and the outside is used. Silver paste is generally used for electrical connection. However, in the case of conducting wire formation using silver paste, there is a limitation in applying silver paste thinly, so the thickness of the conducting wire becomes thick, and a step difference occurs in the vertical direction, and the width of the conducting wire in the planar direction becomes wide. Thus, efforts have been made to improve this.

Therefore, in recent years, a method of applying a lamination pad having an ITO coated on an insulating layer and a copper layer formed thereon has been applied to the lamination pad. An embodiment of the manufacturing process of the touch panel pad with the pattern formed thereon is applied. As shown in FIG. That is, by attaching the first mask to the portion where copper and ITO should be removed at the same time, copper and ITO are simultaneously removed for all portions except for the portion (combination) corresponding to any one of the pattern portion of the lead wire portion and the touch portion. Remove the first mask. Next, since the copper layer of the portion corresponding to the window portion of the pad must be removed, the display which is subsequently coupled to the touch panel is visible even when coupled to the lower portion of the touch panel. For this purpose, the copper layer to be removed remaining in the window portion is removed. A second mask is attached to the remaining portion, and only the exposed copper layer is etched, and then the second mask is removed to manufacture a pad stacked on the touch panel.

However, when the pattern is formed through the above process, the coupling between the pad on which the pattern is formed and the FPCB (flexible printed circuit board) connected thereto is performed as shown in FIG. 2, and as shown in FIG. After preparing the formed pad and attaching the printed circuit board to the printed circuit board as shown in FIG. 2 (b), the heated tips are pressed on the contact surface and then bonded to each other. In this process, the copper layer is exposed. In this way, the copper layer exposed as described above has a problem in that corrosion occurs in the copper layer in the reliability test such as a salt spray test, thereby deteriorating durability.

Therefore, the development of a manufacturing method that can solve these problems and simplify the manufacturing process is urgently needed.

In order to solve the above problems, the present invention can be air-tightly applied to the coupling member in the bonding process of the touch panel pad and the substrate, the opening of the connection electrode forming portion of the touch panel pad, even after the pad and the printed circuit board bonding The durability of the touch panel can be improved by solving the corrosion problem of the remaining opening of the connection electrode formation site, and since the airtightness and bonding of the opening can be performed at the same time, An object of the present invention is to provide a method for bonding a pad for a touch panel and a substrate that can reduce productivity of a binder manufacturing process and to improve productivity, and a binder manufactured thereby.

In order to achieve the above object, the present invention

A touch pattern and a lead wire are formed on the upper surface, and one end of the lead wire extends to an edge to form a touch panel pad made of an insulator layer forming a connection electrode having an upper metal layer and a coupling electrode facing the coupling electrode in response to the connection electrode. In the coupling method for coupling the printed circuit board and the pad for the touch panel for electrically connecting the circuit board to each other,

Preparing a laminated assembly by laminating an adhesive layer for opening at least the connection electrode portion and a bonding layer bonded to the upper surface of the adhesive layer on an upper surface of the touch panel pad;

Applying an anisotropic conductive adhesive to the open upper metal layer including the connection electrode in the laminated assembly including the pad for the touch panel; And,

And laminating and bonding the printed circuit board by arranging the coupling electrode with the anisotropic conductive adhesive therebetween to face the connection electrode to which the anisotropic conductive adhesive is applied. Provides a method of bonding the substrate.

Also,

A touch panel pad having a touch pattern and a lead wire formed on an upper surface thereof, wherein one end of the lead wire extends to an edge to form a connection electrode having an upper metal layer; And,

A printed circuit board coupled to the coupling electrode so as to face the connection electrode;

The touch panel pad may include the insulator layer, a transparent conductive coating layer pattern laminated on a part of the upper surface of the insulator layer, a metal coating layer laminated on a part of the upper surface of the transparent conductive coating layer, an adhesive layer laminated on a part of the upper surface of the metal coating layer, and the At least a bonding layer bonded to the upper surface of the adhesive layer, wherein the connection electrode portion is formed with the upper surface of the metal coating layer is open,

The printed circuit board is laminated and bonded by arranging the coupling electrode with an anisotropic conductive adhesive therebetween facing the connection electrode of the pad for the touch panel.

The open surface of the remaining metal coating layer of the connection electrode portion is provided with a pad for a touch panel and a printed circuit board, characterized in that the coating is applied to the solidified body of the anisotropic conductive adhesive layer.

According to the method for bonding the pad for the touch panel and the substrate of the present invention and the assembly manufactured thereby, the opening of the connection electrode forming portion of the pad for the touch panel is hermetically applied to the bonding member in the process of bonding the pad for the touch panel and the substrate. It is possible to improve the durability of the touch panel by solving the corrosion problem with respect to the opening of the connection electrode formation site remaining after the pad and the printed circuit board bonding, it is possible to perform the airtight and bonding of the opening at the same time, ACF Since the welding process applied in the application of (anisotropic conductive (adhesive) film) is omitted, it is possible to reduce the manufacturing time of the assembly of the touch panel and the circuit boards such as FPCB (flexible printed circuit board) bonded thereto, thereby improving productivity. You can get the effect.

In addition, there is an effect that can reduce the manufacturing cost according to the process simplification and the use of an anisotropic conductive adhesive (ACA), which is inexpensive compared to the ACF.

1 is a view schematically showing an embodiment of a conventional method for manufacturing a pad for a touch panel based on a cross-sectional structure.
FIG. 2 is a view schematically showing an embodiment of a bonding method between a pad for a conventional touch panel and a printed circuit board sequentially based on a cross-sectional structure.
3 is photographic data showing that corrosion of a metal layer occurs after a reliability test in a bonded body manufactured by a bonding method between a pad for a touch panel and a printed circuit board.
4 is a diagram schematically showing an embodiment of a method for bonding a pad for a touch panel and a substrate of the present invention based on a cross-sectional structure.
5 is a view schematically showing another embodiment of a method for bonding a pad for a touch panel and a substrate according to the cross-sectional structure of the present invention.
FIG. 6 is a diagram illustrating one embodiment of an actual photograph and an enlarged photograph thereof of a combination of a touch panel pad and a printed circuit board manufactured by a method of joining a pad for a touch panel and a substrate of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to a method of joining a pad for a touch panel and a substrate, wherein a touch pattern and a lead wire are formed on an upper surface thereof, and one end of the lead wire extends to an edge to form a touch panel pad including an insulator layer forming a connection electrode having an upper metal layer. And a coupling method for coupling the touch panel pad and the printed circuit board electrically connected to each other, the printed circuit board coupling the coupling electrode to face the connection electrode, wherein at least the upper surface of the pad for the touch panel is formed. Preparing a laminated binder by laminating an adhesive layer which opens a connection electrode part and a bonding layer bonded to an upper surface of the adhesive layer; Applying an anisotropic conductive adhesive to the open upper metal layer including the connection electrode in the laminated assembly including the pad for the touch panel; And stacking and coupling the printed circuit board by arranging the coupling electrode with the anisotropic conductive adhesive therebetween to face the connection electrode to which the anisotropic conductive adhesive is applied.

A specific embodiment thereof is as shown in FIGS. 4 to 5, and a real picture thereof is as shown in FIG. 6 (which proceeds in the form of FIG. 5).

That is, as shown in Figures 2 to 3, in order to solve the problem that the surface exposure of the metal layer affects the durability, instead of the conventional coupling method using the ACF with the coupling portion where the pad and the circuit board substantially contact. ACA is applied to all the metal exposed surfaces, including the remaining metal exposed surfaces, by printing or the like, and then the pads and the circuit board are bonded to each other. In addition, the remaining metal exposed part is covered with ACA and separated from the outside so that corrosion does not occur.

To this end, a touch pattern and a lead wire are formed on an upper surface thereof, and one end of the lead wire extends to an edge so as to face a touch electrode pad formed of an insulator layer forming a connection electrode having an upper metal layer and a coupling electrode corresponding to the connection electrode. In the bonding method for coupling the touch panel pad and the printed circuit board electrically connecting the printed circuit board to be bonded to each other, the adhesive layer and the adhesive layer for opening at least the connection electrode portion on the upper surface of the touch panel pad. The step of preparing a laminated binder by laminating a bonding layer bonded to the upper surface of the.

The pad for the touch panel is a pad manufactured by a manufacturing method as shown in FIG. 1, and the like, which may have a laminated structure as shown in FIGS. 2 and 4 to 5. Membrane pads or capacitive pads may correspond to each other, and preferably capacitive pads may correspond thereto. The laminated assembly may have various types of laminated layer configurations according to the configuration of the touch pad, which is merely one embodiment thereof.

An anisotropic conductive adhesive is applied to the pad thus prepared, as shown in FIGS. 4 to 5. That is, the step of applying an anisotropic conductive adhesive (ACA) to the open upper metal layer including the connection electrode in the laminated assembly including the pad for the touch panel. Through this, the ACA serves as an adhesive to the contact portion, and serves to prevent exposure of the open metal layer to the outside in the remaining portion. The application of the ACA can be carried out through a conventional coating method including a printing technique, and the like, the ACA applied to all of the conventional anisotropic conductive adhesive can be applied thereto, preferably applying a high corrosion resistance adhesive It is good. The coating area of the ACA may be coated only on the open top surface as shown in FIG. 4, and preferably, the ACA may be covered together with the side open metal part in addition to the open upper metal layer including the connection electrode. Good to do. Through this, the contact force of the ACA layer can be increased, and the end peeling of the laminated layer can be prevented by preventing corrosion of the side exposed metal.

Next, in order to form a bond between the pad and the circuit board, as shown in FIGS. 4 to 5, the coupling is provided with the anisotropic conductive adhesive therebetween facing the connection electrode to which the anisotropic conductive adhesive is applied. Laminating and bonding the printed circuit board by placing electrodes. This may include a solidification process of the applied ACA, which may be applied to a common drying or solidification process, and of course, a method such as heating and pressurization may be added to shorten the solidification time.

Preferably, as described above, the pad for the touch panel may be a pad having a specific example shown in FIG. 1. That is, the pad may include the insulator layer, a transparent conductive coating layer pattern laminated on a part of the upper surface of the insulator layer, a metal coating layer laminated on a part of the upper surface of the transparent conductive coating layer, an adhesive layer laminated on a part of the upper surface of the metal coating layer, and the adhesive. At least a bonding layer bonded to the upper surface of the layer, wherein the connection electrode portion is formed with the upper surface of the metal coating layer open, and the bonding of the printed circuit board by laminating the touch panel is illustrated in FIG. 2. By applying a bonding tip for manufacturing, it is possible to secure a uniform bonding layer thickness and bonding strength by pressing the upper portion of the coupling laminated portion of the connection electrode and the coupling electrode with the coupling tip to bond the pad for the touch panel and the printed circuit board. good.

In another aspect, the present invention provides a bonding body produced through the bonding method, which is a touch pattern and a lead wire is formed on the upper surface and one end of the lead wire extends to the edge to form a touch formed of an insulator layer forming a connection electrode having an upper metal layer Panel pads; And a printed circuit board for coupling the coupling electrode to face the connection electrode, wherein the pad for the touch panel includes a transparent conductive coating layer pattern laminated on a part of an upper surface of the insulator layer and the insulator layer, and the transparent conductive coating layer. At least a metal coating layer laminated on a part of the upper surface, an adhesive layer (OCA layer) laminated on a portion of the upper surface of the metal coating layer and a bonding layer (which may have a configuration as shown) bonded to the upper surface of the adhesive layer. The connection electrode portion may be formed with the upper surface of the metal coating layer open, and the coupling electrode may be disposed with an anisotropic conductive adhesive therebetween to face the connection electrode of the pad for the touch panel. The substrate is laminated and bonded, and the open side of the remaining metal coating layer of the connection electrode part is the anisotropic conductive It has applied configuration body solidification of the adhesive layer.

Specific examples of this are illustrated in the lowermost part of FIGS. 4 to 5 (the capacitive stacking structure is shown as an example) and FIG. 6 (that is, the one produced by the method of FIG. 5). As shown. That is, according to the application of the ACA, the metal openings are not present, all are coated by the ACA, and the bond between the pad and the circuit board may also be provided with a binder having a structure made of ACA. This ensures excellent durability in reliability tests such as salt spray tests. Here, the application of the ACA may be applied only to the upper surface of the connection electrode, as shown in FIGS. 5 to 6 may be applied in the form extending to the side surface of the layer and the upper surface of the end of the touch pattern region connected thereto. Of course.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various modifications and changes made by those skilled in the art without departing from the spirit and scope of the present invention described in the claims below. Changes are also included within the scope of the invention.

10: transparent insulator layer 20: transparent conductive material coating layer
30: metal coating layer

Claims (4)

A touch pattern and a lead wire are formed on the upper surface, and one end of the lead wire extends to an edge to form a touch panel pad made of an insulator layer forming a connection electrode having an upper metal layer and a coupling electrode facing the coupling electrode in response to the connection electrode. In the coupling method for coupling the printed circuit board and the pad for the touch panel for electrically connecting the circuit board to each other,
Preparing a laminated assembly by laminating an adhesive layer for opening at least the connection electrode portion and a bonding layer bonded to the upper surface of the adhesive layer on an upper surface of the touch panel pad;
Applying an anisotropic conductive adhesive to the open upper metal layer including the connection electrode in order to disconnect the upper surface of the upper metal layer exposed in the bonding process with the printed circuit board of the connection electrode in the laminated assembly including the pad for the touch panel from the outside. Making; And
And laminating and bonding the printed circuit board by arranging the coupling electrode with the anisotropic conductive adhesive therebetween to face the connection electrode to which the anisotropic conductive adhesive is applied. And substrate bonding method. The method of claim 1,
The touch panel pad may include the insulator layer, a transparent conductive coating layer pattern laminated on a part of the upper surface of the insulator layer, a metal coating layer laminated on a part of the upper surface of the transparent conductive coating layer, an adhesive layer laminated on a part of the upper surface of the metal coating layer, and the At least a bonding layer bonded to the top surface of the adhesive layer, wherein the connection electrode portion is formed with the top surface of the metal coating layer open;
The stacking and bonding of the printed circuit board may include pressing the upper portion of the coupling stack of the connection electrode and the coupling electrode with a bonding tip for manufacturing a touch panel, thereby combining the touch panel pad and the printed circuit board. And substrate bonding method. The method of claim 1,
The applying of the anisotropic conductive adhesive is a method of joining the pad for the touch panel and the substrate, characterized in that to apply a side open metal part in addition to the open upper metal layer including the connection electrode. A touch panel pad having a touch pattern and a lead wire formed on an upper surface thereof, wherein one end of the lead wire extends to an edge to form a connection electrode having an upper metal layer; And,
A printed circuit board coupled to the coupling electrode so as to face the connection electrode;
The touch panel pad may include the insulator layer, a transparent conductive coating layer pattern laminated on a part of the upper surface of the insulator layer, a metal coating layer laminated on a part of the upper surface of the transparent conductive coating layer, an adhesive layer laminated on a part of the upper surface of the metal coating layer, and the At least a bonding layer bonded to the upper surface of the adhesive layer, wherein the connection electrode portion is formed with the upper surface of the metal coating layer is open,
An anisotropic conductive adhesive layer is formed on the open upper metal layer including the connection electrode to disconnect the upper surface of the upper metal layer exposed in the bonding process with the printed circuit board of the connection electrode part from the outside. The printed circuit board is laminated and bonded by disposing the anisotropic conductive adhesive between the connection electrode and the coupling electrode.
And the open surface of the remaining metal coating layer of the connection electrode portion is coated with a solidified body of the anisotropic conductive adhesive layer.

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