CN106455339B - A kind of semi-flexible printed board and preparation method thereof with function of destroying or force to yield - Google Patents
A kind of semi-flexible printed board and preparation method thereof with function of destroying or force to yield Download PDFInfo
- Publication number
- CN106455339B CN106455339B CN201611108652.2A CN201611108652A CN106455339B CN 106455339 B CN106455339 B CN 106455339B CN 201611108652 A CN201611108652 A CN 201611108652A CN 106455339 B CN106455339 B CN 106455339B
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- Prior art keywords
- force
- flexible printed
- printed board
- semi
- yield
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The present invention discloses a kind of semi-flexible printed board and preparation method thereof with function of destroying or force to yield, production method is comprising steps of A, make semi-flexible printed board to character process, semi-flexible printed board is cut by laser, the extra substrate ablation in region of destroying or force to yield is removed, realizes function of destroying or force to yield；B, after laser ablation, thickness more than region of destroying or force to yield is measured, whether detection semi-flexible printed board is qualified.The present invention can effectively save production process and time, improve efficiency, and effectively reduce cost of manufacture height, improve Performance And Reliability of destroying or force to yield, thus the problem of terminal electronic product reliability difference caused by avoiding because of performance difference of destroying or force to yield.
Description
Technical field
The present invention relates to printed board field more particularly to a kind of semi-flexible printed boards and its production side with function of destroying or force to yield
Method.
Background technique
Currently, the development trend of miniaturization of electronic products, multifunction, high reliability requires the packing forms of electronic product
It assembles and develops to 3 D stereo.The advantage of flexible printed board combination rigid plate and flex plate both can provide the branch of rigid circuit board
Support effect, and can realize local buckling, it is widely used in the three-dimensional assembling of electronic product.Semi-flexible printed circuit board, also known as
Semi-flex printed circuit board is one kind of flexible printed board, is based on rigid multi-layer plate technique, uses conventional rigid plate material
Production is without the use of expensive polyimide flexible material, can reduce material and processing cost, provides preferably heat-resisting
Performance, more stable electric property need to only lack number applied to multiple dynamic bending is not needed when installing, doing over again and repairing
Curved electronic product.But semi-flexible printed board producing efficiency is low, at high cost in the prior art, and destroys or force to yield Performance And Reliability also
It is to be improved.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the semi-flexible print with function of destroying or force to yield that the purpose of the present invention is to provide a kind of
Making sheet and preparation method thereof, it is intended to solve in the prior art semi-flexible printed board producing efficiency it is low, at high cost, and destroy or force to yield performance and
Reliability need to be improved problem.
Technical scheme is as follows:
A kind of production method of the semi-flexible printed board with function of destroying or force to yield, wherein comprising steps of
A, semi-flexible printed board is made to character process, semi-flexible printed board is cut by laser, by flexable-broken area
The extra substrate ablation in domain is removed, and realizes function of destroying or force to yield；
B, after laser ablation, thickness more than region of destroying or force to yield is measured, whether detection semi-flexible printed board is qualified.
The production method of the semi-flexible printed board that there is function of destroying or force to yield, wherein in the step A, laser ablation
When energy be 18-24mj.
The production method of the semi-flexible printed board that there is function of destroying or force to yield, wherein in the step A, laser ablation
When pulse width be 5-15 μm/s.
The production method of the semi-flexible printed board that there is function of destroying or force to yield, wherein in the step B, work as flexable-broken area
Thickness then determines that semi-flexible printed board is qualified in 0.15-0.25mm more than domain.
The production method of the semi-flexible printed board that there is function of destroying or force to yield, wherein in the step A, first half-and-half scratch
Property printed board successively sawing sheet, baking plate, drilling, heavy copper plate electric, production route, graphic plating, etching, welding resistance, finally make to
Character process.
The production method of the semi-flexible printed board that there is function of destroying or force to yield, wherein the semi-flexible printed board is double
Face or multilayer semi-flexible printed board.
The production method of the semi-flexible printed board that there is function of destroying or force to yield, wherein a length of 4-15mm in region of destroying or force to yield,
Width is 4-8mm.
The production method of the described semi-flexible printed board with function of destroying or force to yield, wherein aperture when laser ablation it is big
Small is 0.075-0.1mm.
The production method of the semi-flexible printed board that there is function of destroying or force to yield, wherein overlap distance is between Kong Yukong
0.05-0.1mm。
A kind of semi-flexible printed board with function of destroying or force to yield, wherein using such as the described in any item production of claim 1 ~ 9
Method is made.
The utility model has the advantages that the present invention can effectively save production process and time, improve efficiency, and effectively reduces cost of manufacture
Height improves Performance And Reliability of destroying or force to yield, so that terminal electronic product reliability difference caused by avoiding because of performance difference of destroying or force to yield is asked
Topic.
Detailed description of the invention
Fig. 1 is a kind of process of the production method preferred embodiment of the semi-flexible printed board with function of destroying or force to yield of the present invention
Figure.
Fig. 2 is a kind of schematic diagram of the production method of the semi-flexible printed board with function of destroying or force to yield of the present invention.
The Distribution Principle figure in aperture when Fig. 3 is laser ablation in the present invention.
Specific embodiment
The present invention provides a kind of semi-flexible printed board and preparation method thereof with function of destroying or force to yield, to make mesh of the invention
, technical solution and effect it is clearer, clear, the present invention is described in more detail below.It should be appreciated that described herein
Specific embodiment be only used to explain the present invention, be not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is that a kind of production method of the semi-flexible printed board with function of destroying or force to yield of the present invention is preferably implemented
Example flow chart, as shown, itself comprising steps of
S1, semi-flexible printed board is made to character process, semi-flexible printed board is cut by laser, by flexable-broken area
The extra substrate ablation in domain is removed, and realizes function of destroying or force to yield；
S2, after laser ablation, measurement is destroyed or force to yield thick more than region, and whether detection semi-flexible printed board qualified.
As shown in Fig. 2, laser cutting method of the present invention, is using the substrate for capableing of double of flexible printed board
(such as FR4 substrate) absorb and the laser of ablation, the unwanted substrate in region 10 that will destroy or force to yield (mark and are) ablation in Fig. 2
Fall, remain certain thickness substrate, to realize function of destroying or force to yield.That is, laser cutting parameter is applied, then making
When semi-flexible printed board, the method for being not required to by the way of pressing, and using laser realizes the windowing in region of destroying or force to yield, from
And semi-flexible printed board is made to realize function of destroying or force to yield, and which simplify production processes, improve producing efficiency, it reduces the production cost,
Product reliability is also improved simultaneously.
Production method of the invention mainly includes engineering data design, the application of technical flow design, laser cutting parameter,
With the selection of process of surface treatment.Semi-flexible printed board in the present invention, substrate are FR4 epoxy resin, and base material thickness is (in Fig. 2
Labeled as a)≤0.35mm, route can be it is two-sided be also possible to multilayer, i.e., the described semi-flexible printed board is two-sided or multilayer half
Flexible printed board.
Engineering data is designed, is designed as no copper (there is copper foil 11 in other regions) in region surface of destroying or force to yield, after guaranteeing
Substrate can be ablated off when continuous laser cutting, a length of 4-15mm, the width 4-8mm of the i.e. windowed regions in region of destroying or force to yield, such as
In one specific example, a length of 8mm in region of destroying or force to yield, width 4mm.
For technical flow design, the process design that opens a window is after route production, before surface treatment or later, to prevent route
Windowing, may result in the problems such as dry film does not press tightly film, influences the conduction of route before production.
Generally, for residual thickness (remaining thickness, label is in Fig. 2), Yu Houyue is big, and performance of destroying or force to yield is poorer, Yu Houyue
Small, performance of destroying or force to yield is more excellent, so the present invention generally guarantees remaining thickness between 0.15-0.25mm.The thickness more than region that ought destroy or force to yield exists
0.15-0.25mm then determines that semi-flexible printed board is qualified.
The wherein selection of process of surface treatment refers to that the surface treatment of semi-flexible printed board not select hot air leveling technology,
Because plate is easy to become fragile after hot air leveling, blind slot is excessively thin easily to be broken through, so the surface treatment of selection chemical classes, to guarantee half
The reliability of flexible printed board.
Specifically, in step sl, energy when laser ablation is preferably 18-24mj, such as 20 mj.Laser ablation
When pulse width be 5-15 μm/s, such as 10 μm/s.Under the above conditions, laser ablation effect is good, and can guarantee product
In the case where quality, producing efficiency is improved.
Further, in the step S1, first double of flexible printed board successively sawing sheet, baking plate, drilling, heavy copper plate electric, system
Make route, graphic plating, etching, welding resistance, finally makes to character process.That is, making according to above-mentioned technique to character
After process, then carry out lasser cutting.When laser ablation substrate, to guarantee the efficiency of laser ablation and the product of laser ablation
Matter, i.e. not eating thrown substrate are added for folded hole and carry out ablation, as shown in figure 3, aperture when laser ablation is preferably 0.075-
Between 0.1mm (label is in such as 0.18mm, Fig. 3), overlap distance is 0.05-0.1mm(such as 0.06 mm, Fig. 3 between Kong Yukong
Middle label is), after guaranteeing ablation, substrate residual thickness 0.15-0.25mm.
The semi-flexible printed board preferred embodiment with function of destroying or force to yield that the present invention also provides a kind of uses as described above
Production method is made.
Method of the invention is specifically described below by a specific embodiment.
Step 1: selecting a kind of semi-flexible printed board for having design of destroying or force to yield；
Step 2: the semi-flexible printed board being subjected to engineering data design as requested, region design of destroying or force to yield is in length
12mm, wide 6mm.
Step 3: engineering data design includes that laser ablation engineering data makes, and is folded hole machined design, laser when design
Aperture when ablation is 0.075-0.1mm(such as 0.09mm), Kong Yukong overlap distance is 0.05-0.1mm(such as 0.06mm).
Step 4: semi-flexible printed board being made according to process to character, before surface treatment, the process includes opening
Material, baking plate, drilling, heavy copper plate electric, route, graphic plating, etching, welding resistance, character.
Step 5: the semi-flexible printed board that character has made being cut by laser, by the extra substrate ablation in region of destroying or force to yield
Remove, realizes function of destroying or force to yield.Parameter when laser ablation (being cut by laser) are as follows: energy 20mj, pulse width are 10 μm/s.
Step 6: after laser ablation, slice or using depth tester, whether the remaining thickness of measurement is seen in 0.15-0.25mm range
It is interior.
Step 7: after having made and having detected qualification, shipment.
In conclusion the present invention can effectively save production process and time, improve efficiency, and effectively reduces cost of manufacture
Height improves Performance And Reliability of destroying or force to yield, so that terminal electronic product reliability difference caused by avoiding because of performance difference of destroying or force to yield is asked
Topic.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (7)
1. a kind of production method of the semi-flexible printed board with function of destroying or force to yield, which is characterized in that comprising steps of
A, semi-flexible printed board is made to character process, semi-flexible printed board is cut by laser, the region that will destroy or force to yield is more
Remaining substrate ablation is removed, and realizes function of destroying or force to yield；The substrate is FR4 epoxy resin；No copper is designed as in region surface of destroying or force to yield；
Ablation process is added using folded hole carries out ablation, the size 0.075-0.1mm in aperture when laser ablation；It is overlapped between Kong Yukong
Distance is 0.05-0.1mm；
B, after laser ablation, thickness more than region of destroying or force to yield is measured, whether detection semi-flexible printed board is qualified；Thickness exists more than the region of destroying or force to yield
0.15-0.25mm then determines that semi-flexible printed board is qualified.
2. the production method of the semi-flexible printed board with function of destroying or force to yield according to claim 1, which is characterized in that described
In step A, energy when laser ablation is 18-24mj.
3. the production method of the semi-flexible printed board with function of destroying or force to yield according to claim 1, which is characterized in that described
In step A, pulse width when laser ablation is 5-15 μm/s.
4. the production method of the semi-flexible printed board with function of destroying or force to yield according to claim 1, which is characterized in that described
In step A, first double of flexible printed board successively sawing sheet, baking plate, drilling, heavy copper plate electric, production route, graphic plating, etching,
Welding resistance finally makes to character process.
5. the production method of the semi-flexible printed board with function of destroying or force to yield according to claim 1, which is characterized in that described
Semi-flexible printed board is two-sided or multilayer semi-flexible printed board.
6. the production method of the semi-flexible printed board with function of destroying or force to yield according to claim 1, which is characterized in that destroy or force to yield
A length of 4-15mm in region, width 4-8mm.
7. a kind of semi-flexible printed board with function of destroying or force to yield, which is characterized in that using as claimed in any one of claims 1 to 6
Production method is made.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611108652.2A CN106455339B (en) | 2016-12-06 | 2016-12-06 | A kind of semi-flexible printed board and preparation method thereof with function of destroying or force to yield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611108652.2A CN106455339B (en) | 2016-12-06 | 2016-12-06 | A kind of semi-flexible printed board and preparation method thereof with function of destroying or force to yield |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106455339A CN106455339A (en) | 2017-02-22 |
| CN106455339B true CN106455339B (en) | 2019-01-11 |
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| CN201611108652.2A Active CN106455339B (en) | 2016-12-06 | 2016-12-06 | A kind of semi-flexible printed board and preparation method thereof with function of destroying or force to yield |
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| CN111615253A (en) * | 2020-05-22 | 2020-09-01 | 深圳市辉煌线路板有限公司 | Bendable rigid multilayer PCB |
Citations (5)
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|---|---|---|---|---|
| CN101365298A (en) * | 2008-08-22 | 2009-02-11 | 汕头超声印制板公司 | Manufacturing method for semi-flexible printed circuit board |
| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN104519682A (en) * | 2014-12-11 | 2015-04-15 | 广州兴森快捷电路科技有限公司 | Semi-flexible circuit board and preparation method thereof |
| CN204669718U (en) * | 2015-05-29 | 2015-09-23 | 广州杰赛科技股份有限公司 | A kind of bent printed wiring board |
| CN104968147A (en) * | 2015-05-29 | 2015-10-07 | 广州杰赛科技股份有限公司 | Bendable printed circuit board and manufacturing method thereof |
-
2016
- 2016-12-06 CN CN201611108652.2A patent/CN106455339B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365298A (en) * | 2008-08-22 | 2009-02-11 | 汕头超声印制板公司 | Manufacturing method for semi-flexible printed circuit board |
| CN102802361A (en) * | 2012-08-27 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Making method of semi-flexible printed circuit board |
| CN104519682A (en) * | 2014-12-11 | 2015-04-15 | 广州兴森快捷电路科技有限公司 | Semi-flexible circuit board and preparation method thereof |
| CN204669718U (en) * | 2015-05-29 | 2015-09-23 | 广州杰赛科技股份有限公司 | A kind of bent printed wiring board |
| CN104968147A (en) * | 2015-05-29 | 2015-10-07 | 广州杰赛科技股份有限公司 | Bendable printed circuit board and manufacturing method thereof |
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