CN209299584U - A kind of solderability pcb board - Google Patents
A kind of solderability pcb board Download PDFInfo
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- CN209299584U CN209299584U CN201821401881.8U CN201821401881U CN209299584U CN 209299584 U CN209299584 U CN 209299584U CN 201821401881 U CN201821401881 U CN 201821401881U CN 209299584 U CN209299584 U CN 209299584U
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- solderability
- pads
- pcb board
- pad
- plate ontology
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Abstract
The utility model embodiment is suitable for PCB production technical field, provides a kind of solderability pcb board.The solderability pcb board includes plate ontology, the surface of the plate ontology has several surface pads, several functional hole and location hole, the location hole is located at the surrounding of the plate ontology, every kind of functional hole corresponds to a kind of function, every kind of surface pads correspond to a kind of function, and every kind of surface pads are arranged successively.The utility model can simulate the solderability of the pad of different clients design, preferably ensure the solderability of client's piece uploading, and only needing to design a steel mesh according to the item number of the pcb board can be realized the steel mesh print tin cream operation mode for meeting various item numbers, save great amount of cost.
Description
Technical field
The utility model belongs to PCB (Printed Circuit Board printed circuit board) production technical field, especially relates to
And a kind of solderability pcb board.
Background technique
Pcb board produces plate head in kind/last part does drift tin/heavy tin confirmation in various surface treatment production processes, by taking
The mode of solderability have following defects that 1) float tin/heavy tin can not accurate simulation PCBA piece uploading process, i.e., and with client's piece uploading
Journey (SMT/DIP) has differences.2) it takes plate in kind to do drift tin/heavy tin test, causes test scrap cost to increase, i.e., can take
It scraps plate to test, and scraps plate in doing horizontal line surface treatment process, be easily mixed into on-gauge plate, leakage is caused to complain.
3) it is considered based on pcb board test scrap cost, only does first/last part solderability confirmation, process variation can not monitor.
Therefore, the SMT/DIP during PCBA piece uploading eats tin process and is typically passed through steel mesh print tin cream mode operation to expire
Sufficient customer demand.However, existing print tin cream operation mode in PCB progress solderability processing procedure by steel mesh, every money PCB item number is needed
It is corresponding to apply to purchase a steel mesh, and it is every increase a steel mesh, need to increase a large amount of cost, result in waste of resources.
Utility model content
The utility model embodiment technical problem to be solved is to provide a kind of solderability pcb board, it is intended to solve existing
There is the solderability pcb board in technology to need the problem of increasing great amount of cost in steel mesh print tin cream operation process.
The utility model embodiment, which is achieved in that, provides a kind of solderability pcb board.The solderability pcb board includes plate
The surface of ontology, the plate ontology has several surface pads, several functional hole and location hole, and the location hole is located at
The surrounding of the plate ontology, every kind of functional hole correspond to a kind of function, and every kind of surface pads correspond to a kind of function, and
Every kind of surface pads are arranged successively, and cover tin in the surface pads.
Further, the several surface pads include circular pad, ball-pads, square pads, polygon weldering
Disk, oval pads and tear-drop pattern pad.
Further, the circular pad, ball-pads, polygon pad, square pads, oval pads and tear
Formula pad is in "-" type arrangement.
Further, the ball-pads are BGA.
Further, the several functional hole includes PTH, NPTH and VIA.
Further, the ball-pads and the VIA are located at the middle part of the plate ontology, and the ball-pads and
The VIA is spaced apart from each other setting.
Further, the plate ontology with a thickness of 0.8-1.5mm.
Further, the length of the plate ontology and width are 50mm.
Compared with prior art, beneficial effect is the utility model embodiment: the utility model passes through on plate ontology
The surface pads and functional hole for designing various different function, allow solderability pcb board to simulate the pad of different clients design
Solderability preferably ensures the solderability of client's piece uploading, and only needs to design a steel mesh according to the item number of the pcb board
It realizes the steel mesh print tin cream operation mode for meeting various item numbers, saves great amount of cost.
Detailed description of the invention
Fig. 1 is solderability pcb board structural schematic diagram provided by the embodiment of the utility model；
Fig. 2 is the production process schematic diagram of solderability pcb board provided by the embodiment of the utility model.
In the accompanying drawings, each appended drawing reference indicates:
10, plate ontology；11, circular pad；12, ball-pads；13, square pads；14, polygon pad；15, oval
Pad；16, tear-drop pattern pad；20, location hole；21,PTH；22,NPTH；23,VIA.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
As shown in Figure 1, being a kind of solderability pcb board provided by the embodiment of the utility model.The solderability pcb board includes plate
Ontology, the plate ontology 10 be copper-clad base plate, copper-clad base plate with a thickness of 0.8-1.5mm, length and width is 50mm.In plate sheet
The surface of body 10 has several surface pads, several functional hole and location hole 20, and location hole 20 is located at plate ontology 10
Surrounding, every kind of functional hole correspond to a kind of function, and every kind of surface pads correspond to a kind of function, and every kind of surface pads are successively arranged
It arranges, covers tin in surface pads, so as to enable the solderability pcb board to include the surface pads of a variety of item numbers.
In above-described embodiment, several surface pads include circular pad 11, ball-pads 12, square pads 13, polygon
Shape pad 14, oval pads 15 and tear-drop pattern pad 16, circular pad 11, ball-pads 12, square pads 13, polygon
Pad 14, oval pads 15, tear-drop pattern pad 16 are arranged in "-" type.Wherein, circular pad 11 is widely used in element rule
In the single, double surface printed board then arranged, if the density of plate allows, pad be can be larger, and when welding is unlikely to fall off.Ball-pads 12
For BGA (encapsulation of BallGrid Array welded ball array), it is the bottom production array soldered ball in encapsulation structure base board as circuit
The end I/O and printed wiring board mutual connection.Square pads 13 it is big in component in printed board and less and when printed conductor is simple more adopt
With, by hand make by oneself PCB when, be easily achieved using this pad.Polygon pad 14 for distinguish that outer diameter is close and aperture not
Same pad, easy to process and assembly.Oval pads 15 have enough areas to enhance anti-stripping ability, are usually used in dual inline type
Device.Tear-drop pattern pad 16 be when pad connection cabling it is thinner when frequently with, to prevent pad peeling, cabling and pad disconnection,
This pad is commonly used in high-frequency circuit.The above-mentioned surface pads for having various functions are integrated into same plate ontology 10,
So as to enable above-mentioned solderability pcb board simulate different clients design pad solderability, preferably ensure client
The solderability of piece uploading, and only need to design a steel mesh according to the item number of the pcb board and the steel for meeting various item numbers can be realized
Wire mark tin cream operation mode saves great amount of cost, improves product benefit.
In above-described embodiment, several functional hole includes 21, NPTH PTH (Plating Through Hole sink copper hole)
(the non-heavy copper hole Non Plating Through Hole) 22 and VIA (via hole) 23.Wherein, the copper wall of PTH 21 has copper, uses
It is used to weld DIP (dual inline-pin package dual-inline package) part foot, the aperture of this some holes must be than zero
The welding foot diameter of part is greater, and part could be inserted into hole in this way.VIA 23 is for connection to and turning circuit plate
Two or more layers between copper foil circuit because PCB is to be stacked to accumulate by many copper foil layers, each layer of copper foil
Between can all repave a layer insulating, that is to say, that copper foil layer is unable to intercommunication each other, and VIA is depended in the connection of signal.?
Ball-pads and VIA 23 are located at the middle part of plate ontology 10, and ball-pads 12 and VIA 23 are spaced apart from each other setting, are used for mould
The pad of quasi- different clients design.
As shown in Fig. 2, the manufacture craft of above-mentioned solderability pcb board includes the following steps:
A, using CAM software by the layout Integration Design of several surface pads possessed by various types of PCB
In an image, it is stored as CAM data.
B, choose the copper-clad base plate that plate thickness is 0.8-1.5mm and be used as plate ontology 10, can choose dull plate, saving material at
This.
C, the substrate that one piece long and width is 50mm is cut out according to the processing procedure of engineering design using PCB guillotine.
D, bore operation is carried out to substrate using abrasive drill bit machine；In drilling can more lamination operations (at least 3PNL/ axis,
Can be with 4PNL/ axis when plate thickness≤1.2mm), to save drilling time；It bores the optional high mill time of nozzle and bores nozzle.
E, copper facing on the partial through holes hole wall by PTH plating on substrate.
F, by LDI (laser direct imaging laser direct imaging technology) by what is be designed in above-mentioned steps a
Image images on substrate.
G, by etching by the several surface pads in above-mentioned steps a etched on substrate come.
H, corresponding one of the substrate item number made according to above-mentioned steps g applies to purchase steel mesh, prints tin cream operation by steel mesh
Mode prints tin cream in several surface pads, and carries out hot setting, solderability pcb board is made.
In above-described embodiment, further includes following steps g1 between step g and step h: successively substrate being cleaned, is micro-
Steel mesh print tin cream operation is carried out after erosion, preimpregnation, shield copper, washing and drying, again to guarantee the reliability of print tin cream.
In conclusion the utility model is on plate ontology by designing the surface pads and functional hole of various different function,
So that solderability pcb board is simulated the solderability of the pad of different clients design, preferably ensures the solderability of client's piece uploading, and
And it only needs to design a steel mesh according to the item number of the pcb board and the steel mesh print tin cream operator for meeting various item numbers can be realized
Formula saves great amount of cost.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (8)
1. a kind of solderability pcb board, which is characterized in that including plate ontology, the surface of the plate ontology is welded with several surface
Disk, several functional hole and location hole, the location hole are located at the surrounding of the plate ontology, and every kind of surface pads are corresponding
A kind of function, and every kind of surface pads are arranged successively, and cover tin in the surface pads.
2. solderability pcb board as described in claim 1, which is characterized in that the several surface pads include round weldering
Disk, ball-pads, square pads, polygon pad, oval pads and tear-drop pattern pad.
3. solderability pcb board as claimed in claim 2, which is characterized in that the circular pad, ball-pads, square pads,
Polygon pad, oval pads and tear-drop pattern pad are in "-" type arrangement.
4. solderability pcb board as claimed in claim 2, which is characterized in that the ball-pads are BGA.
5. solderability pcb board as claimed in claim 2, which is characterized in that the several functional hole includes PTH, NPTH
And VIA.
6. solderability pcb board as claimed in claim 5, which is characterized in that the ball-pads and the VIA are located at the plate
The middle part of ontology, and the ball-pads and the VIA are spaced apart from each other setting.
7. solderability pcb board as described in claim 1, which is characterized in that the plate ontology with a thickness of 0.8-1.5mm.
8. solderability pcb board as claimed in claim 1 or 7, which is characterized in that the length of the plate ontology is with width
50mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821401881.8U CN209299584U (en) | 2018-08-28 | 2018-08-28 | A kind of solderability pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821401881.8U CN209299584U (en) | 2018-08-28 | 2018-08-28 | A kind of solderability pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209299584U true CN209299584U (en) | 2019-08-23 |
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ID=67652158
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821401881.8U Active CN209299584U (en) | 2018-08-28 | 2018-08-28 | A kind of solderability pcb board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990265A (en) * | 2018-08-28 | 2018-12-11 | 竞华电子(深圳)有限公司 | A kind of solderability pcb board and its manufacture craft |
-
2018
- 2018-08-28 CN CN201821401881.8U patent/CN209299584U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990265A (en) * | 2018-08-28 | 2018-12-11 | 竞华电子(深圳)有限公司 | A kind of solderability pcb board and its manufacture craft |
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