CN216673417U

CN216673417U - Plasma cleaning protection device of rigid-flex board

Info

Publication number: CN216673417U
Application number: CN202122941805.4U
Authority: CN
Inventors: 刘志勇; 杨婵; 卢起斌
Original assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd
Current assignee: Zhuhai Zhongjing Yuansheng Electronic Technology Co ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2022-06-03
Anticipated expiration: 2031-11-29

Abstract

The utility model discloses and provides a plasma cleaning protection device and a plasma cleaning protection method for a rigid-flex board. The utility model comprises two base plates, wherein the base plates are provided with through hole areas, baffle plates matched with soft plates are arranged in the through hole areas, two ends of each baffle plate are connected to the hole walls of the through hole areas, a plurality of positioning holes are arranged on the base plates and surround the through hole areas, each positioning hole on one base plate is provided with a hollow rivet, the positioning holes on the other base plate penetrate through the hollow rivets, so that the two base plates are overlapped, when in use, a soft-hard combination plate is positioned between the two base plates, the hard plate of the soft-hard combination plate is exposed outside through the through hole areas, and the soft plates of the soft-hard combination plate are completely clamped by the baffle plates on the two base plates. The utility model is applied to the technical field of PCB/FPC production technology.

Description

Plasma cleaning protection device of rigid-flex board

Technical Field

The utility model relates to the technical field of PCB/FPC production, in particular to a plasma cleaning protection device of a rigid-flex board.

Background

With the development of electronic products toward high density, miniaturization, and high reliability, Flexible Printed Circuit (FPC) having free bending, winding, and folding characteristics is gaining attention. The development of flexible circuit boards and PCB hard boards has prompted a new product of rigid-flexible circuit boards. The so-called rigid-flex board is a circuit board with FPC (flexible printed circuit) and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board through processes such as pressing and the like according to relevant process requirements. When the soft and hard combined plate is produced, a soft plate area is free of an adhesive layer, so that the back scrapping is caused due to easy foaming, a very important process is provided, namely hole wall cleaning after drilling is carried out, mechanical drilling and laser drilling are required, the process which is often used for cleaning the hole wall is plasma cleaning, and when the soft plate area is large, the plasma cleaning is used, so that series problems of bubbling, deformation, plate burning and the like of the soft plate area are caused.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides a plasma cleaning protection device for a rigid-flex board, which can well protect the rigid-flex board and prevent the rigid-flex board from being damaged during plasma cleaning.

The technical scheme adopted by the utility model is as follows: the utility model comprises two base plates, wherein the base plates are provided with through hole areas, baffle plates matched with soft plates are arranged in the through hole areas, two ends of each baffle plate are connected to the hole walls of the through hole areas, a plurality of positioning holes are arranged on the base plates and surround the through hole areas, each positioning hole on one base plate is provided with a hollow rivet, the positioning holes on the other base plate penetrate through the hollow rivets, so that the two base plates are overlapped, when in use, a soft-hard combination plate is positioned between the two base plates, the hard plate of the soft-hard combination plate is exposed outside through the through hole areas, and the soft plates of the soft-hard combination plate are completely clamped by the baffle plates on the two base plates.

Furthermore, a plurality of through hole areas are arranged on the substrate, and each through hole area is provided with the baffle matched with the soft board.

Further, the through hole area is a square hole.

Furthermore, the two ends of the baffle are connected to the hole wall of the square hole, and the square hole is divided into two small square holes with the same size by the baffle.

Further, the baffle and the substrate are integrally arranged.

Further, the baffle is rectangular shaped plate, both ends are all connected around the baffle on the pore wall in through-hole region, the left and right sides face of baffle is the inclined plane, the top on inclined plane is located the upper surface of baffle, the bottom on inclined plane is located the upper surface of baffle, the baffle left and right sides the top on inclined plane is close to each other, the baffle left and right sides the bottom on inclined plane is kept away from each other, during the use the lower surface of baffle pastes and leans on the soft board of soft and hard combined plate.

Further, the hole wall of the through hole region is formed in an inclined shape.

The utility model has the beneficial effects that: because the utility model adopts the design of partition protection, the flexible-rigid combination board is prevented from directly contacting with plasma gas when carrying out plasma cleaning, and the series problems of bubbling, deformation, board burning and the like of the flexible board area are further solved.

Drawings

FIG. 1 is a schematic view of a plasma cleaning protection device;

FIG. 2 is a schematic view of another perspective of the plasma cleaning protection device;

FIG. 3 is a schematic view of a rigid-flex board according to an embodiment;

FIG. 4 is a schematic view of drilling a base plate and a rigid-flex board together

FIG. 5 is a schematic view of processing a slot in a substrate;

FIG. 6 is a schematic view after installation of a pop rivet on a base plate;

FIG. 7 is a schematic view of the base plate and the rigid-flexible printed circuit board after being combined by a hollow rivet;

FIG. 8 is a schematic view of the base plate and the rigid-flex board after being combined and riveted by the rivet;

FIG. 9 is a schematic view of the baffle when the left and right sides are not beveled;

FIG. 10 is a schematic view of the baffle with the left and right sides thereof being beveled;

FIG. 11 is a flow chart of the overall process of the present invention.

Detailed Description

As shown in fig. 1 and 2, in this embodiment, the utility model includes the utility model comprising two substrates 1, said substrates 1 being provided with via areas 2, a baffle 3 matched with the soft board is arranged in the through hole area 2, two ends of the baffle 3 are connected on the hole wall of the through hole area 2, a plurality of positioning holes 4 are arranged on the substrate 1 and around the through hole area 2, each positioning hole 4 on one base plate 1 is provided with a hollow rivet 5, the positioning hole 4 on the other base plate 1 penetrates through the hollow rivet 5, the two base plates 1 are arranged in an overlapping mode, the rigid-flexible board 7 is located between the two base plates 1 when the flexible-rigid board is used, the rigid board 8 of the rigid-flexible board 7 is exposed outside through the through hole area 2, and the flexible board 9 of the rigid-flexible board is completely clamped by the baffle plates 3 on the two base plates 1. In this embodiment, the base plate 1 is cut to be as large as the rigid-flex board 7.

In this embodiment, four through hole regions 2 are disposed on the substrate 1, and the baffle 3 adapted to the flexible printed circuit board is disposed on each through hole region 2.

In the present embodiment, the through hole region 2 is a square hole.

In this embodiment, both ends of the baffle 3 are connected to the hole wall of the square hole, and the baffle 3 divides the square hole into two small square holes with the same size.

In this embodiment, the baffle 3 and the substrate 1 are integrally provided.

In this embodiment, as shown in fig. 10, the baffle 3 is an elongated plate, the front end and the rear end of the baffle 3 are both connected to the hole wall of the through hole region 2, the left and right sides of the baffle 3 are inclined planes 6, the top of the inclined plane 6 is located on the upper surface of the baffle 3, the bottom of the inclined plane 6 is located on the upper surface of the baffle 3, the tops of the inclined planes 6 on the left and right sides of the baffle 3 are close to each other, the bottoms of the inclined planes 6 on the left and right sides of the baffle 3 are far away from each other, the lower surface of the baffle 3 is attached to the soft plate 9 of the soft-hard combined plate 7 during use, and the hole wall of the through hole region 2 is inclined. Through the design of the inclined plane 6, the isoplast can be better ensured not to enter the clearance between the baffle 3 and the soft board 9, the phenomenon that the soft and hard combined board is damaged due to the overlarge pressing force of the two base boards 1 can be avoided, the direct contact between the soft board area and plasma gas can be avoided, and further series problems of bubbling, deformation, board burning and the like in the soft board area are solved. As shown in fig. 9, if the left and right side surfaces of the baffle plate 3 are not provided with the inclined surfaces 6, high-pressure vortex gas is formed at a right angle, and the high-pressure vortex gas more easily enters the gap between the baffle plate 3 and the flexible board 9, so that the flexible board region is in direct contact with the plasma gas, and the flexible board 9 is likely to be damaged.

As shown in fig. 3 to 8, the plasma cleaning protection method of the plasma cleaning protection device using the rigid-flex board includes the following steps:

a. installing the hollow rivet 5 in the positioning hole 4 on the first substrate 1;

b. the small positioning holes in the rigid-flexible combined plate 7 are sleeved on the hollow rivets 5, and the rigid-flexible combined plate 7 is placed on the first base plate 1 through the positioning of the hollow rivets 5;

c. the positioning hole 4 of the other substrate 1 is sleeved on the hollow rivet 5;

d. after the two base plates 1 clamp the rigid-flexible printed circuit board 7, the hollow rivet 5 is turned over and riveted tightly, the hard board 8 of the rigid-flexible printed circuit board 7 is exposed outside through the through hole area 2, and the soft board 9 of the rigid-flexible printed circuit board is completely clamped by the baffle 3 on the two base plates 1;

e. the drilling position on the hard board 8 is cleaned by plasma gas, so that the soft board 9 is prevented from being directly contacted with the plasma gas;

f. and after cleaning, removing the hollow rivet 5, removing the base plate 1, and taking out the plasma cleaned rigid-flex board 7.

In the embodiment, the closest distance between the outer edge of the baffle 3 and the outer edge of the soft plate 9 is 0.5mm-100 mm.

In this embodiment, the base plate 1 and the rigid-flex board 7 are drilled simultaneously, so that the sizes and positions of the positioning holes of the rigid-flex board 7 and the positioning holes 4 are the same, and the size of the drilled holes is 0.5mm-10 mm.

As shown in fig. 11, the size of the rigid-flexible printed circuit board is determined, the flexible printed circuit board area is defined, two substrates (the material of the substrate may be arbitrary) as large as the rigid-flexible printed circuit board are prepared, holes are drilled in the rigid-flexible printed circuit board and the substrate, the drilling positions are the same and are uniformly distributed in the flexible printed circuit board area, and then the rigid printed circuit board position corresponding to the rigid-flexible printed circuit board on the substrate is cut by laser cutting, the cut position is smaller than that of the rigid printed circuit board, and especially the position where the rigid and flexible printed circuit boards are connected needs to be as far away from the flexible printed circuit board area as possible. Then, a hollow rivet with the same size as the drilled hole is arranged on the base plate 2, the rigid-flexible combined plate is connected with the base plate 1 and the base plate 2 through the hollow rivet, and the hollow rivet is turned over and riveted tightly to be capable of being sent to plasma cleaning equipment for cleaning. When the rigid-flexible board is subjected to plasma cleaning, the flexible board area is prevented from being in direct contact with plasma gas, and the series of problems of bubbling, deformation, board burning and the like in the flexible board area are solved.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. The utility model provides a plasma of soft or hard combination board washs protection device which characterized in that: the flexible printed circuit board comprises two base boards (1), wherein a through hole area (2) is arranged on each base board (1), a baffle (3) matched with a flexible printed circuit board is arranged in the through hole area (2), two ends of each baffle (3) are connected to the hole wall of the through hole area (2), a plurality of positioning holes (4) are formed in each base board (1) and surround the through hole area (2), each positioning hole (4) in one base board (1) is provided with a hollow rivet (5), the positioning holes (4) in the other base board (1) penetrate through the hollow rivets (5), so that the two base boards (1) are arranged in an overlapped mode, a soft-hard combination board (7) is located between the two base boards (1) in use, and a hard board (8) of the soft-hard combination board (7) is exposed outside through the through hole area (2), the soft board (9) of the rigid-flex board is completely clamped by the baffle plates (3) on the two base boards (1).

2. The plasma cleaning protection device for the rigid-flex circuit board according to claim 1, wherein: the substrate (1) is provided with a plurality of through hole areas (2), and each through hole area (2) is provided with a baffle (3) matched with the soft board.

3. The plasma cleaning protection device for the rigid-flex circuit board according to claim 1, wherein: the through hole area (2) is a square hole.

4. The plasma cleaning protection device of the rigid-flex circuit board as claimed in claim 3, wherein: the two ends of the baffle (3) are connected to the hole wall of the square hole, and the baffle (3) divides the square hole into two small square holes with the same size.

5. The plasma cleaning protection device for the rigid-flex circuit board according to claim 1, wherein: the baffle (3) and the substrate (1) are integrally arranged.

6. The plasma cleaning protection device for the rigid-flex circuit board according to claim 1, wherein: baffle (3) are rectangular shaped plate, both ends are all connected around baffle (3) on the pore wall of through-hole region (2), the left and right sides face of baffle (3) is inclined plane (6), the top on inclined plane (6) is located the upper surface of baffle (3), the bottom on inclined plane (6) is located the upper surface of baffle (3), the baffle (3) left and right sides the top on inclined plane (6) is close to each other, baffle (3) left and right sides the bottom on inclined plane (6) is kept away from each other, during the use the lower surface subsides of baffle (3) lean on soft board (9) of soft and hard combination board (7).

7. The plasma cleaning protection device for the rigid-flex printed circuit board according to any one of claims 1 to 6, wherein: the hole wall of the through hole region (2) is inclined.