CN105828532A - Board separating method for jointed board for circuit boards - Google Patents
Board separating method for jointed board for circuit boards Download PDFInfo
- Publication number
- CN105828532A CN105828532A CN201610380392.8A CN201610380392A CN105828532A CN 105828532 A CN105828532 A CN 105828532A CN 201610380392 A CN201610380392 A CN 201610380392A CN 105828532 A CN105828532 A CN 105828532A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- thickness
- dowel
- circuit boards
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
The invention discloses a board separating method for a jointed board for circuit boards .The method comprises the steps that a base plate is provided; the base plate is cut to obtain the jointed board for the circuit boards, wherein the jointed board for the circuit boards comprises the multiple circuit boards, and every two adjacent circuit boards are jointed through connecting ribs; a part with a preset thickness of each connecting rib is cut off according to the thickness of the base plate; a surface mounting process is conducted on the circuit boards; all the connecting ribs with the parts with the preset thicknesses cut off are completely cut, and board separating is conducted on the circuit boards on which the surface mounting process is conducted .According to the board separating method for the jointed board for the circuit boards, by cutting off a part of each connecting rib with the large thickness to reduce the thickness of the connecting rib, when the jointed board for the circuit boards is subjected to follow-up board separating, the rest of the connecting ribs is small in thickness, a tool is used for conducting cutting, and the board separating efficiency of the jointed board for the circuit boards is improved.
Description
Technical field
The present invention relates to field of circuit boards, particularly relate to a kind of point plate method of multiple-printed-panel for circuit board.
Background technology
Fast development along with electronic product, the fuselage of product increasingly trend towards thin, lightly change, the space layout of interiors of products also can be more and more compacter, increasing circuit board is made to use multiple-printed-panel for circuit board technique to be processed manufacturing, it is easy to processing and fabricating, and forming difficulty for 2 millimeters and with the PCB of the thickness of slab of more than 2 millimeters is bigger in multiple-printed-panel for circuit board technique, during the biggest processing and forming of thickness of slab the biggest to the damage of cutter, thickness of slab is the biggest simultaneously, machine-shaping speed is the lowest, so can affect point plate speed and the efficiency of circuit board.
Summary of the invention
It is an object of the invention to provide a kind of point plate method of multiple-printed-panel for circuit board, it is possible to increase point plate efficiency of multiple-printed-panel for circuit board.
In order to solve above-mentioned technical problem, embodiments provide a kind of point plate method of multiple-printed-panel for circuit board, including:
Substrate is provided；
Described substrate is carried out cutting processing, and to obtain multiple-printed-panel for circuit board, described multiple-printed-panel for circuit board includes multiple circuit board, and two adjacent described circuit boards are spliced by dowel；
Thickness according to described substrate cuts away preset thickness to dowel each described；
Circuit board each described is carried out surface mount process；
Each the described dowel cutting away preset thickness is excised completely, carries out a point plate each having been carried out the described circuit board of surface mount process.
Wherein, after the described thickness according to described substrate cuts away the step of preset thickness to dowel each described, including:
Clean the surface of each described circuit board.
Wherein, the thickness of slab of described substrate is more than or equal to 2mm.
Wherein, the thickness of the described dowel getting rid of described preset thickness is 1～1.2mm.
Wherein, in the described step that described substrate is carried out cutting processing, including:
Full-automatic cutting equipment is provided；
Cutting process is inputted in full-automatic cutting equipment；
According to described cutting process, described substrate is carried out full-automatic cutting processing.
Wherein, the cutter cutting described dowel is gong cutter.
Wherein, the structure of each described circuit board is identical.
Wherein, each described circuit board is rigid circuit board.
Wherein, described dowel is rectangle, circle or half elliptic.
Point plate method of the multiple-printed-panel for circuit board that the embodiment of the present invention provides by first cutting away a part to reduce the thickness of dowel by dowel thicker for thickness, make when multiple-printed-panel for circuit board carries out follow-up point of plate, remaining dowel thickness is less, it is beneficial to cutter and carries out cutting processing, improve point plate efficiency of multiple-printed-panel for circuit board.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in describing below is some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic flow sheet of point plate method of a kind of multiple-printed-panel for circuit board that the embodiment of the present invention provides；
Fig. 2 is the schematic flow sheet of point plate method of the another kind of multiple-printed-panel for circuit board that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not paying creative work premise, broadly fall into the scope of protection of the invention.
Below in conjunction with accompanying drawing 1-accompanying drawing 2, a point plate method for the multiple-printed-panel for circuit board that the embodiment of the present invention provides is described in detail.
Refer to Fig. 1, be the schematic flow sheet of point plate method of a kind of multiple-printed-panel for circuit board that the embodiment of the present invention provides.As it is shown in figure 1, the method for the embodiment of the present invention may comprise steps of S101-step S109.
S101: substrate is provided；
Concrete, substrate is the stock manufacturing PCB, and generally, substrate is exactly copper-clad laminate, and circuit board carries out the processing such as hole machined, electroless copper, electro-coppering, etching exactly on substrate selectively, obtains required circuitous pattern.It should be understood that processability in the performance of circuit board, quality, manufacture, manufacturing cost, manufacture level etc., depend greatly on baseplate material.This substrate is larger-size substrate, it is possible to form polylith circuit board, such as the multiple-printed-panel for circuit board of 2 × 2,3 × 3 equal-specifications.
It should be understood that the thickness of substrate is more than or equal to 2mm.
S103: described substrate is carried out cutting processing, to obtain multiple-printed-panel for circuit board, described multiple-printed-panel for circuit board includes multiple circuit board, and two adjacent described circuit boards are spliced by dowel；
Concrete, in order to improve cutting efficiency, by full-automatic cutting equipment, substrate is carried out cutting processing, wherein, concretely comprise the following steps: full-automatic cutting equipment is provided；Cutting process is inputted in full-automatic cutting equipment；According to described cutting process, described substrate is carried out full-automatic cutting processing.Cut out the circuit board of required specification by full-automatic cutting equipment, and line pattern unit is set on circuit boards, to electrically connect follow-up electronic component.
It should be understood that in order to improve working (machining) efficiency, it is to avoid making up more cutting process, the structure of each described circuit board is identical.
It should be understood that each circuit board is rigid circuit board.
It should be understood that dowel is rectangle, circle or half elliptic.
S105: dowel each described is cut away preset thickness according to the thickness of described substrate；
Concrete, the thickness of substrate is more than 2mm.In order to the thickness preventing dowel is thicker, it is unfavorable for follow-up point plate, dowel is cut away preset thickness.Preferably, the thickness of the dowel getting rid of preset thickness is 1～1.2mm.Make dowel while ensureing the bonding strength of itself, the efficiency of point plate is not impacted.Concrete, by gong cutter, the thickness of dowel is excised.
S107: circuit board each described is carried out surface mount process；
Concrete, circuit board is carried out SMT technique, the most on circuit boards upper electronic device of attachment.
S109: excise each the described dowel cutting away preset thickness completely, carries out a point plate so that each to have carried out the described circuit board of surface mount process；
Concrete, dowel is excised completely so that each circuit board no longer links together, i.e. each circuit board is carried out a point plate.Wherein, it is 1～1.2mm due to the thickness of dowel, it is possible to use common cutter excises, and does not interferes with a point plate efficiency.
Point plate method of the multiple-printed-panel for circuit board that the embodiment of the present invention provides by first cutting away a part to reduce the thickness of dowel by dowel thicker for thickness, make when multiple-printed-panel for circuit board carries out follow-up point of plate, remaining dowel thickness is less, it is beneficial to cutter and carries out cutting processing, improve point plate efficiency of multiple-printed-panel for circuit board.
Refer to Fig. 2, be the schematic flow sheet of point plate method of the another kind of multiple-printed-panel for circuit board that the embodiment of the present invention provides.As in figure 2 it is shown, the method for the embodiment of the present invention may comprise steps of S201-step S211.
S201: substrate is provided；
Concrete, substrate is the stock manufacturing PCB, and generally, substrate is exactly copper-clad laminate, and circuit board carries out the processing such as hole machined, electroless copper, electro-coppering, etching exactly on substrate selectively, obtains required circuitous pattern.It should be understood that processability in the performance of circuit board, quality, manufacture, manufacturing cost, manufacture level etc., depend greatly on baseplate material.This substrate is larger-size substrate, it is possible to form polylith circuit board, such as the multiple-printed-panel for circuit board of 2 × 2,3 × 3 equal-specifications.
It should be understood that the thickness of substrate is more than or equal to 2mm.
S203: described substrate is carried out cutting processing, to obtain multiple-printed-panel for circuit board, described multiple-printed-panel for circuit board includes multiple circuit board, and two adjacent described circuit boards are spliced by dowel；
Concrete, in order to improve cutting efficiency, by full-automatic cutting equipment, substrate is carried out cutting processing, wherein, concretely comprise the following steps: full-automatic cutting equipment is provided；Cutting process is inputted in full-automatic cutting equipment；According to described cutting process, described substrate is carried out full-automatic cutting processing.Cut out the circuit board of required specification by full-automatic cutting equipment, and line pattern unit is set on circuit boards, to electrically connect follow-up electronic component.
It should be understood that in order to improve working (machining) efficiency, it is to avoid making up more cutting process, the structure of each described circuit board is identical.
It should be understood that each circuit board is rigid circuit board.
It should be understood that dowel is rectangle, circle or half elliptic.
S205: dowel each described is cut away preset thickness according to the thickness of described substrate；
Concrete, the thickness of substrate is more than 2mm.In order to the thickness preventing dowel is thicker, it is unfavorable for follow-up point plate, dowel is cut away preset thickness.Preferably, the thickness of the dowel getting rid of preset thickness is 1～1.2mm.Make dowel while ensureing the bonding strength of itself, the efficiency of point plate is not impacted.Concrete, by gong cutter, the thickness of dowel is excised.
S207: clean the surface of each described circuit board；
Concrete, in order to prevent that the placement accuracy of follow-up surface mount process is impacted, the surface of each circuit board is carried out, to remove the plate bits caused on each circuit board because of cutting.
S209: circuit board each described is carried out surface mount process；
Concrete, circuit board is carried out SMT technique, the most on circuit boards upper electronic device of attachment.
S211: excise each the described dowel cutting away preset thickness completely, carries out a point plate so that each to have carried out the described circuit board of surface mount process；
Concrete, dowel is excised completely so that each circuit board no longer links together, i.e. each circuit board is carried out a point plate.Wherein, it is 1～1.2mm due to the thickness of dowel, it is possible to use common cutter excises, and does not interferes with a point plate efficiency.
Point plate method of the multiple-printed-panel for circuit board that the embodiment of the present invention provides by first cutting away a part to reduce the thickness of dowel by dowel thicker for thickness, make when multiple-printed-panel for circuit board carries out follow-up point of plate, remaining dowel thickness is less, it is beneficial to cutter and carries out cutting processing, improve point plate efficiency of multiple-printed-panel for circuit board.
A point plate method for the multiple-printed-panel for circuit board that the embodiment of the present invention provides is carried out also by each circuit board, to remove the plate bits caused on each circuit board because of cutting, prevent from the placement accuracy of follow-up surface mount process is impacted, improve the performance of circuit board further.
The module of the embodiment of the present invention or unit can combine according to the actual requirements or split.
It is above the embodiment of the embodiment of the present invention; it should be pointed out that, for those skilled in the art, on the premise of without departing from embodiment of the present invention principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (9)
1. point plate method of a multiple-printed-panel for circuit board, it is characterised in that including:
Substrate is provided；
Described substrate is carried out cutting processing, and to obtain multiple-printed-panel for circuit board, described multiple-printed-panel for circuit board includes multiple circuit board, and two adjacent described circuit boards are spliced by dowel；
Thickness according to described substrate cuts away preset thickness to dowel each described；
Circuit board each described is carried out surface mount process；
Each the described dowel cutting away preset thickness is excised completely, carries out a point plate each having been carried out the described circuit board of surface mount process.
Method the most according to claim 1, it is characterised in that after the described thickness according to described substrate cuts away the step of preset thickness to dowel each described, including:
Clean the surface of each described circuit board.
Method the most according to claim 1 and 2, it is characterised in that the thickness of slab of described substrate is more than or equal to 2mm.
Method the most according to claim 3, it is characterised in that the thickness of the described dowel getting rid of described preset thickness is 1～1.2mm.
Method the most according to claim 1 and 2, it is characterised in that in the described step that described substrate is carried out cutting processing, including:
Full-automatic cutting equipment is provided；
Cutting process is inputted in full-automatic cutting equipment；
According to described cutting process, described substrate is carried out full-automatic cutting processing.
Method the most according to claim 1 and 2, it is characterised in that the cutter cutting described dowel is gong cutter.
Method the most according to claim 1, it is characterised in that the structure of each described circuit board is identical.
Method the most according to claim 1, it is characterised in that each described circuit board is rigid circuit board.
Method the most according to claim 1, it is characterised in that described dowel is rectangle, circle or half elliptic.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711336426.4A CN108012427A (en) | 2016-05-31 | 2016-05-31 | A kind of scoreboard method of multiple-printed-panel for circuit board |
| CN201610380392.8A CN105828532B (en) | 2016-05-31 | 2016-05-31 | A kind of scoreboard method of multiple-printed-panel for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610380392.8A CN105828532B (en) | 2016-05-31 | 2016-05-31 | A kind of scoreboard method of multiple-printed-panel for circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711336426.4A Division CN108012427A (en) | 2016-05-31 | 2016-05-31 | A kind of scoreboard method of multiple-printed-panel for circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105828532A true CN105828532A (en) | 2016-08-03 |
| CN105828532B CN105828532B (en) | 2018-01-23 |
Family
ID=56532636
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711336426.4A Pending CN108012427A (en) | 2016-05-31 | 2016-05-31 | A kind of scoreboard method of multiple-printed-panel for circuit board |
| CN201610380392.8A Expired - Fee Related CN105828532B (en) | 2016-05-31 | 2016-05-31 | A kind of scoreboard method of multiple-printed-panel for circuit board |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711336426.4A Pending CN108012427A (en) | 2016-05-31 | 2016-05-31 | A kind of scoreboard method of multiple-printed-panel for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108012427A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107027242A (en) * | 2017-05-26 | 2017-08-08 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board contour processing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000225597A (en) * | 1999-02-08 | 2000-08-15 | Cmk Corp | Cutting tool for printed wiring board |
| CN104144564A (en) * | 2014-07-25 | 2014-11-12 | 江苏联康电子有限公司 | PCB jointed board |
| CN104394650A (en) * | 2014-08-13 | 2015-03-04 | 中国船舶重工集团公司第七0九研究所 | Board splitting method for combined printed circuit board finishing component surface mounting |
| CN105101630A (en) * | 2015-06-26 | 2015-11-25 | 努比亚技术有限公司 | Printed circuit board panel and manufacturing method thereof |
| CN205160901U (en) * | 2015-11-16 | 2016-04-13 | 磊鑫达电子(深圳)有限公司 | PCB makeup V groove structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8307547B1 (en) * | 2012-01-16 | 2012-11-13 | Indak Manufacturing Corp. | Method of manufacturing a circuit board with light emitting diodes |
| CN203523148U (en) * | 2013-10-18 | 2014-04-02 | 北大方正集团有限公司 | PCB (printed circuit board) jointed plate |
-
2016
- 2016-05-31 CN CN201711336426.4A patent/CN108012427A/en active Pending
- 2016-05-31 CN CN201610380392.8A patent/CN105828532B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000225597A (en) * | 1999-02-08 | 2000-08-15 | Cmk Corp | Cutting tool for printed wiring board |
| CN104144564A (en) * | 2014-07-25 | 2014-11-12 | 江苏联康电子有限公司 | PCB jointed board |
| CN104394650A (en) * | 2014-08-13 | 2015-03-04 | 中国船舶重工集团公司第七0九研究所 | Board splitting method for combined printed circuit board finishing component surface mounting |
| CN105101630A (en) * | 2015-06-26 | 2015-11-25 | 努比亚技术有限公司 | Printed circuit board panel and manufacturing method thereof |
| CN205160901U (en) * | 2015-11-16 | 2016-04-13 | 磊鑫达电子(深圳)有限公司 | PCB makeup V groove structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107027242A (en) * | 2017-05-26 | 2017-08-08 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board contour processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105828532B (en) | 2018-01-23 |
| CN108012427A (en) | 2018-05-08 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180123 |