CN102497732A - PCB (printed circuit board) spliced plate - Google Patents
PCB (printed circuit board) spliced plate Download PDFInfo
- Publication number
- CN102497732A CN102497732A CN2011103902738A CN201110390273A CN102497732A CN 102497732 A CN102497732 A CN 102497732A CN 2011103902738 A CN2011103902738 A CN 2011103902738A CN 201110390273 A CN201110390273 A CN 201110390273A CN 102497732 A CN102497732 A CN 102497732A
- Authority
- CN
- China
- Prior art keywords
- pcb
- circuit board
- plate
- printed circuit
- spliced plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a PCB (printed circuit board) spliced plate which is composed of a plurality of independent PCB boards, and the plurality of independent PCB boards are mutually connected by parting lines. According to the invention, because of the existence of stamp holes, a plurality of function blocks can be gathered and printed together, and the separated application of the function blocks is also extremely simple; and because of the adoption of the stamp holes serving as parting holes, the PCB spliced plate is convenient to process and high in production efficiency.
Description
Technical field
The present invention relates to a kind of PCB splice plate.
Background technology
Pcb board is exactly a printed circuit board (PCB), almost can appear in the middle of each electronic equipment.And electronic component just is set on the pcb board of different sizes.Along with electronic equipment becomes increasingly complex, the part that needs is more and more, and circuit and part on the pcb board are also more and more intensive.This plate is heat insulation by insulation, also unbending material constitutes substrate; The tiny line material that can see on the surface is a Copper Foil; Originally Copper Foil is to cover on the whole plank, and part is etched and disposes in manufacture process, and the part that stays has just become netted tiny circuit.These circuits are known as lead or claim wiring, and are used to provide the circuit connection of part on the pcb board.
Existing many layouts pcb board profile all need be carried out the V-CUT operation, and this operation is left cutting exactly between a plurality of functional areas of layout, separates in the future with convenient.This procedure has increased human and material resources accordingly, causes the increase of production cost and the reduction of production efficiency; More likely cause operating personnel's misoperation when V-CUT operates, make sheet material V-CUT processing off normal and even sheet material and scrap.
Summary of the invention
The technical problem that the present invention will solve is: a kind of PCB splice plate is provided.
The technical solution adopted for the present invention to solve the technical problems is: a kind of PCB splice plate, described splice plate is made up of a plurality of independently pcb boards, is connected through cut-off rule between the plate of described a plurality of independently pcb boards and the plate.Described cut-off rule is that stamp is poroid.
The invention has the beneficial effects as follows, solved the defective that exists in the background technology, because the existence of stamp hole, a plurality of function plates can be gathered printing together, and separate when using also very simple; And the hole of cutting apart of adopting stamp hole, processing is convenient, and production efficiency is high.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 is the structural representation of the preferred embodiments of the present invention;
Fig. 2 is the enlarged diagram at Figure 1A place.
Embodiment
Combine accompanying drawing and preferred embodiment that the present invention is done further detailed explanation now.These accompanying drawings are the sketch map of simplification, basic structure of the present invention only is described in a schematic way, so it only show the formation relevant with the present invention.
A kind of PCB splice plate as shown in Figure 1, described splice plate is made up of a plurality of independently pcb boards, is connected through cut-off rule between the plate of described a plurality of independently pcb boards and the plate.Described cut-off rule is stamp hole 1 shape.
What describe in the above specification is embodiment of the present invention; Various not illustrating constitutes restriction to flesh and blood of the present invention; Under the those of ordinary skill of technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from essence of an invention and scope.
Claims (2)
1. PCB splice plate, it is characterized in that: described splice plate is made up of a plurality of independently pcb boards, is connected through cut-off rule between the plate of described a plurality of independently pcb boards and the plate.
2. a kind of PCB splice plate as claimed in claim 1 is characterized in that: described cut-off rule is that stamp is poroid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103902738A CN102497732A (en) | 2011-11-30 | 2011-11-30 | PCB (printed circuit board) spliced plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103902738A CN102497732A (en) | 2011-11-30 | 2011-11-30 | PCB (printed circuit board) spliced plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102497732A true CN102497732A (en) | 2012-06-13 |
Family
ID=46189507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103902738A Pending CN102497732A (en) | 2011-11-30 | 2011-11-30 | PCB (printed circuit board) spliced plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102497732A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103747612A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Champagne metal reinforcement sheet and preparation method thereof |
| CN104518975A (en) * | 2013-09-27 | 2015-04-15 | 方正宽带网络服务股份有限公司 | Routing device |
| CN105592994A (en) * | 2013-08-07 | 2016-05-18 | 通快激光与系统工程有限公司 | Method for processing plate-like workpiece having transparent, glass, glass-like, ceramic, and/or crystalline layer, severing device for such workpiece, and product from such workpiece |
-
2011
- 2011-11-30 CN CN2011103902738A patent/CN102497732A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105592994A (en) * | 2013-08-07 | 2016-05-18 | 通快激光与系统工程有限公司 | Method for processing plate-like workpiece having transparent, glass, glass-like, ceramic, and/or crystalline layer, severing device for such workpiece, and product from such workpiece |
| US10941069B2 (en) | 2013-08-07 | 2021-03-09 | Trumpf Laser- Und Systemtechnik Gmbh | Processing a plate-like workpiece having a transparent, glass, glass-like, ceramic and/or crystalline layer |
| CN104518975A (en) * | 2013-09-27 | 2015-04-15 | 方正宽带网络服务股份有限公司 | Routing device |
| CN103747612A (en) * | 2013-12-31 | 2014-04-23 | 苏州米达思精密电子有限公司 | Champagne metal reinforcement sheet and preparation method thereof |
| CN103747612B (en) * | 2013-12-31 | 2018-12-25 | 苏州中拓专利运营管理有限公司 | A kind of Champagne metal reinforcement sheet and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102548225B (en) | Manufacturing method for printed circuit board (PCB) | |
| CN103220889B (en) | Layer manufacturing method thereof in a kind of oversize PCB backboard | |
| US20150034364A1 (en) | Flexible printed circuit board and method for making same | |
| US10321560B2 (en) | Dummy core plus plating resist restrict resin process and structure | |
| US10886670B2 (en) | PCB-based connector device | |
| CN103298252B (en) | Printed circuit board and method for manufacturing the printed circuit board | |
| CN202174609U (en) | Die for punching positioning holes and shapes of flexible circuits | |
| CN102497732A (en) | PCB (printed circuit board) spliced plate | |
| CN201797644U (en) | Printed circuit board (PCB) with impedance module | |
| CN109379519A (en) | A kind of camera module wiring board layout, camera module | |
| CN103491708A (en) | High-density inter connector printed circuit board and manufacturing method thereof | |
| CN101472399B (en) | Inner buried type circuit board and method for producing the same | |
| CN101257767B (en) | Printed circuit board and manufacturing method thereof | |
| KR100972431B1 (en) | Embedded printed circuit board and manufacturing method thereof | |
| CN107729277B (en) | Multifunctional multiplexing high-speed signal co-lay wiring structure and wiring method | |
| KR20130055990A (en) | Rigid-flexible printed circuit board and method for manufacturing the same | |
| CN201418206Y (en) | PCB jointed board with stamp hole | |
| CN101137271A (en) | Printed circuit boards | |
| CN201805631U (en) | Inverted-fastening assembling structure for printed circuit boards (PCB) | |
| CN107896419A (en) | A kind of PCB structure and its manufacture craft | |
| KR101555531B1 (en) | Electronic package assembly, electronic package and method of making the same | |
| CN210042351U (en) | PCB single board and PCB makeup | |
| CN101090600A (en) | Printed circuit board, printed circuit subboard and manufacturing process of printed circuit board | |
| CN105828532B (en) | A kind of scoreboard method of multiple-printed-panel for circuit board | |
| CN103917058A (en) | Method for manufacturing pluggable finger type flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120613 |