CN106211541B - A kind of positioning datum point and method improving circuit board cutting accuracy - Google Patents
A kind of positioning datum point and method improving circuit board cutting accuracy Download PDFInfo
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- CN106211541B CN106211541B CN201510209450.6A CN201510209450A CN106211541B CN 106211541 B CN106211541 B CN 106211541B CN 201510209450 A CN201510209450 A CN 201510209450A CN 106211541 B CN106211541 B CN 106211541B
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Abstract
A kind of positioning datum point and method improving circuit board cutting accuracy, wherein the positioning datum point is set on a printed circuit board (PCB), wherein the positioning datum point is hollow out point, it is made of process identical with the cutting position of the pcb board, each hollow out point is completed by one-off hole-piercing, and be set at the pcb board technique edges, as cutting reference point, it is improved Precision of Laser Cutting.
Description
Technical field
The present invention relates to the electronics industry having higher requirements to PCB segmentation manufacture more particularly to cell-phone camera PCB segmentation systems
The positioning datum point and method for improving circuit board cutting accuracy in industry are made, is solved by the design higher positioning coordinate of precision
It is certainly not accurate to influence cutting precision problem because positioning coordinate caused by PCB deformation, harmomegathus etc. in PCB segmentation.
Background technique
As electronic product gradually develops to thin, small, light, micro- direction, " outer dimension " has become the weight of end product
One of attraction is wanted, the proposition of high-quality, the utilization of high-tech similarly bring a series of new challenges to manufacturing process.
It is quite stringent to the requirement of PCB division size currently as the SMT making technology of mobile phone camera module front end manufacture,
But cell-phone camera PCB before Ban Chang, SMT etc. in processing procedure process due to high temperature, stress, operation etc. cause PCB deformation, rise
Contracting leads to be cut by laser that Mark positioning coordinate is not accurate to occur cutting the bad problems such as offset, burr be more, this is mainly
Since current PCB cutting is to choose brass Mark as benchmarking, it is highly unstable to cut effect, often will appear hair
Thorn, lousiness cut out the bad phenomenons such as bad, and rear processing procedure examines post that need to place under repair to burr, lousiness badness, for cutting out bad product
It opens and scraps single processing, not only increase and examine post workload but also reduce product qualification rate, processing procedure after SMT is caused very big
Influence.
Use brass positioning Mark as benchmark, but the position cut is the edge contour of monolithic, from wiring board
From the point of view of process, the two is produced under identical conditions, and it is (real inherently to there is at least error of 0.1mm or more
Border measurement error reaches 0.5mm), thus the unstability being formed in production process cut offset it is bad.
The PCB that high-pixel mobile phone mould group uses similarly is this manufacturing process, due to the continuous pressure of mobile phone volume
Contracting, after camera module enters high pixel, micro volume, the volume of each component, thickness constantly reduce, especially PCB, from before
0.7mm, 0.8mm or so be compressed to current 0.3mm or even 0.25mm.Ultra-thin PCB is by the production of plate factory, SMT processing
Since high temperature, stress, operation etc. are made, PCB deformation is bad, and PCB material itself can not overcome, so as to cause list in the process
Piece mould group causes the cuttings such as mould group burr, sanction evil idea bad in rear processing procedure laser cutting process.This problem occurs in mould group laser
During cutting processing procedure, the unconfined quality for improving other accessories, stringent control PCB production, SMT processing, COB can only be passed through
Processing is to promote qualification rate.Although having accomplished quite strictly to the control process of processing procedure, and put into a large amount of human and material resources moneys
Source, but still can not solve not occur precisely cutting out bad scrap products due to PCB deformation and Mark positioning coordinate identification, because
This, is badly in need of studying a kind of more accurately positioning method to improve the precision of PCB laser cutting.
Summary of the invention
It is an object of the present invention to provide a kind of positioning datum points and method for improving circuit board cutting accuracy, pass through
Reference point is set on pcb board as positioning datum point, is solved in PCB segmentation because PCB deformation, harmomegathus cause to position coordinate not
Precisely to influence cutting precision problem, to guarantee the precision cut.
Another object of the present invention is to provide a kind of positioning datum points and method for improving circuit board cutting accuracy, wherein
The positioning datum point is made of process identical with position is cut, and guarantees and cut the consistency of position, is effectively solved
The bad problem of offset is cut, the qualification rate of product is improved.
Another object of the present invention is to provide a kind of positioning datum points and method for improving circuit board cutting accuracy, wherein
The positioning datum point can be hollow out Mark, and the hollow out Mark is circle, diamond shape, triangle or cross, with diagonal line
Mode be set to pcb board technique edges on.
Another object of the present invention is to provide a kind of positioning datum points and method for improving circuit board cutting accuracy, wherein
It is completed including at least a pair of hollow out Mark, each hollow out Mark by one-off hole-piercing, the relative accuracy between all holes
It is higher, it can effectively solve the problems, such as that the cuttings such as PCB burr, the sanction evil idea that pcb board occurs in rear processing procedure laser cutting process are bad.
Another object of the present invention is to provide a kind of positioning datum points and method for improving circuit board cutting accuracy, with list
Piece PCB shape selects identical position to make the reference point, and completes the process in identical process, is not related to additional
Other investments and variation do not need to increase cost.
Another object of the present invention is to provide a kind of positioning datum points and method for improving circuit board cutting accuracy, pass through
Generate hollow out point in real time when cutting, using with the reference point that cuts location consistency, production difficulty is low, and the processing is simple, operation
It is convenient.
Another object of the present invention is to provide a kind of positioning datum points and method for improving circuit board cutting accuracy, reduce
The bad problems such as bad, burr is exceeded of cutting out are brought since PCB deformation Mark positioning coordinate is not accurate, reduce plate factory, Mo Zu factory is
The a large amount of human and material resources resources for improving PCB deformation and putting into.
Another object of the present invention is to provide it is a kind of improve circuit board cutting accuracy positioning datum point and method, due to
It is less that this scheme divides burr, lousiness that PCB is generated, it is possible to reduce processing procedure examines the work of post repairing burr, lousiness class after PCB
It measures, reduces human cost.
Another object of the present invention is to provide a kind of positioning datum points and method for improving circuit board cutting accuracy, are passing
On the basis of PCB substrate is made in controlling, hollow out point is formed when cutting, is cut, can be effectively prevent in this, as positioning datum point
It cuts bad, avoids shift phenomenon.
To meet object above and other objects of the present invention and advantage of the invention, the present invention provides a kind of raising electricity
The positioning datum point of road plate cutting accuracy, wherein positioning datum point is set on a printed circuit board (PCB), wherein described fixed
Position datum mark is used to be made with the identical process in position that cuts of the pcb board.
Preferably, the positioning datum point is hollow out point.
Preferably, the hollow out point is circle, diamond shape, triangle or cross.
Further, including at least a pair of hollow out point, wherein hollow out point be set in a manner of cornerwise it is described
On the technique edges at pcb board edge, size, the shape set on each hollow out point with a piece of pcb board are consistent.
Preferably, the hollow out point is set between the 2 brass points for being used as attachment positioning.
A kind of localization method improving circuit board cutting accuracy, comprising the following steps: (1) cut position phase using with PCB
Same process makes positioning datum point；(2) the positioning datum point is selected to be cut by laser for cutting reference point.
Preferably, the positioning datum point is at least a pair of of hollow out point, wherein each hollow out point is complete by one-off hole-piercing
At.
Preferably, each hollow out point is equal using size, the identical workpiece of shape is punched out.
Preferably, the hollow out point is in a manner of cornerwise on the technique edges at the pcb board edge.
Preferably, the hollow out point is circle, diamond shape, triangle or cross.
A kind of PCB processing method, comprising the following steps:
(A) an at least PCB substrate is selected, with brass point；
(C) point on the basis of the brass point mounts component；With
(C) multiple hollow out points are generated when cutting, and are cut using the hollow out point as positioning datum point is cut.
Further, the hollow out point is made of process identical with position is cut.
Preferably, the hollow out point is equal using size, the identical workpiece of shape is punched out.
Preferably, the hollow out point is circle, diamond shape, triangle or cross.
Detailed description of the invention
Fig. 1 is the laser cutting schematic diagram for the brass Mark positioning taken according to traditional PCB cutting.
Fig. 2 is to cut result schematic diagram according to what traditional above-mentioned brass Mark positioning laser cutting PCB occurred.
Fig. 3 is the hollow out Mark schematic diagram taken according to a preferred embodiment of the present invention.
Fig. 4 is that above preferred embodiment according to the present invention using hollow out Mark as reference point cuts result schematic diagram.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description
Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
As shown in Figure 1, a printed circuit board or printed wiring board (Printed Circuit Board, abbreviation PCB) 10
Four corners position, which is set, respectively has a tool locating part 11, can be positioning column or location hole, when for printed circuit and other operations
Positioning, wherein the tool locating part be set to a PCB substrate 12 on, preferably four corners position is set, and the PCB substrate is able to
Printed circuit and various components are mounted, in order to enable printing and mounting more accurate, at least two in PCB substrate 12 are opposite
At least a pair of of brass point is arranged on technique edges 13, and (i.e. brass Mark is known as by brass Mark below in the preferred embodiment
Brass point) 20 conduct attachment datum marks, traditional brass point 20 is provided jointly as all steps in surface mount process
Measurement point, laser cutting is also using brass point 20 as datum mark, and the Huang copper Mark 20 is convex in the form of pad
For the surface of the PCB substrate 12, and require have one between the brass point 20 and the host material of printed circuit board 10
It just can reach optimal recognition performance when fixed high contrast, convenient for carrying out Machine Vision Recognition when patch, but due to rear
The factors such as phase high temperature, stress, operation cause the brass point 20 to deviate on the surface of the PCB substrate 12, the brass
Point the location of 20 is no longer original position, if during laser cutting, still according to this on the basis of point, then cut
Position also will appear offset, and then cut out bad product, and will appear the bad phenomenons such as many burrs, lousiness.
Due to being using brass point as positioning datum, but the position 14 cut is but in traditional PCB cutting industry
It is the edge contour of monolithic PCB, from the point of view of the process of wiring board, the two is produced under identical conditions, this
Body there is at least error of 0.1mm or more, and plus in the later period, PCB leads to PCB due to factors such as high temperature, pressure, operations
Deformation, and also will appear sporadic offset etc., PCB substrate and as between the brass point of datum mark as the brass of datum mark point
Substantial measurement errors be even up to 0.5mm, actual measured results are as shown in table 1, so being formed in production process not
It is bad that stability cuts offset, for example, cause product to be cut out when deviation angle θ bad, it is as shown in Figure 2 to cut result.
As shown in Figure 3 and Figure 4, the present invention provides a kind of new positioning method, designs a kind of new cutting positioning datum point,
It is bad that offset is cut with the unstability solved the problems, such as in production process.The present invention selects and cuts position 14A same processes system
The positioning datum point (Mark) of work, it is ensured that and the consistency for cutting position 14A, to guarantee the precision cut, in other words,
Positioning datum point provided by the invention is different to be cut on traditional the brass point 20, with PCB that protrude from 12 surface of PCB substrate
It cuts position 14A to be made of same processes, durings PCB later period high temperature, stress, operation etc., is not in offset, locates always
In the position of PCB substrate 12 initially set up, according to this as cutting datum mark, it is ensured that the precision of positioning coordinate identification,
It can guarantee the precision cut.
In the preferred embodiment, cutting positioning datum point provided by the invention is through-hole, in the preferred embodiment, institute
Stating positioning datum point is hollow out point (i.e. hollow out Mark is known as hollow out point below in the preferred embodiment by hollow out Mark)
30, wherein hollow out point 30 be through-hole, further, in the present invention, as attachment positioning datum point brass point 20 according to
So to be traditionally used for the datum mark as Surface Mount Component, and the hollow out point 30 of the invention is newly-designed is used for
It is cut by laser the datum mark of positioning, wherein brass point 20 and hollow out point 30 occur in pairs, on PCB at least
At two opposite technique edges 13, be respectively used to SMT (Surface Mounting Technology) and laser cutting in positioning
Datum mark, to guarantee the precision of attachment component and laser cutting.
The present invention redesigns laser cutting positioning datum point, i.e., the hollow out point 30 in this preferred embodiment is set to institute
It states on the technique edges 13 of PCB, will not be deviated because of the deformation of PCB, specifically with the position 14A that cuts using phase
Make with process, and completed by one-off hole-piercing, in the PCB substrate 12, therefore will not with PCB because of high temperature, answer
Deformation that the factors such as power, operation occur and deviate, during PCB cutting, with the hollow out point 30 for reference point, made
To cut positioning datum point, since the hollow out point 30 is not in offset, cutting positioning coordinate is more accurate, Neng Goubao
Demonstrate,prove the precision of cutting.
Specifically, according to traditional technique, at least a piece of PCB substrate 12 is selected, makes institute by modes such as scolding tin
Brass point 20 is stated, point is on the basis of the brass point 20 to mount required component, after the completion of the attachment of each component, by
In mount component and it is subsequent cut during, the later period will receive the factors such as high temperature, stress, operation, the PCB substrate 12
It deforms, the brass point 20 is caused to shift, at this time if cut again using the brass point 20 as anchor point,
It will appear phenomena such as cutting offset, cause burr occur, cut out evil idea etc. to cut bad problem.Therefore, in the present embodiment, in order to keep away
The generation for exempting from such case after having mounted all components, then is remake and cuts positioning datum point, by using with cut
Position same processes make the hollow out point 30, i.e., when cutting, the hollow out point 30 are generated in real time, then directly with described
Point is cut on the basis of hollow out point 30, size required for cutting into or shape, to meet actual needs.
It is noted that the hollow out point 30 is that just occur after the completion of all components mount, but must infuse
Meaning be the hollow out point 30 is formation in a flash before being cut, and when cutting generates the hollow out point 30 in real time, then directly
It connects and is cut as datum mark, can effectively prevent deviating, also it is possible to prevente effectively from there is situations such as cutting out bad product, raising is cut
Cut precision and product yield.
The present invention provides a kind of PCB processing technology, comprising the following steps:
(A) at least a piece of PCB substrate 12 is selected, is formed with the brass point 20 in the PCB substrate 12；
(B) point on the basis of the brass point 20 mounts component；With
(C) multiple hollow out points 30 are generated when cutting, using the hollow out point 30 as positioning datum point is cut, according to reality
Border is cut.
Further, those skilled in the art is it is envisioned that according to the actual needs cut, using corresponding work
Tool is to make the hollow out point 30, and the size and shape to guarantee all hollow out points 30 is consistent, it is ensured that the precision cut.
It is noted that being set to size, the shape of each hollow out point 30 with a piece of PCB must be consistent, just
In positional dissection.In the preferred embodiment, all hollow out points 30 be all made of the workpiece with same size dimension into
Row punching, one-off hole-piercing are completed, and ensure that the consistency of all hollow out points 30, opposite between each hollow out point 30
Precision is higher, and hollow out point 30 will not deviate, and can efficiently solve laser cutting cuts the bad problem of offset.
It is noted that at least a pair of hollow out point 30 is arranged in PCB edge, and catercorner mode is set
It sets, in order to position.In the preferred embodiment, two pairs of hollow out points 30 are set in the technique edges 13 of the opposite PCB,
That is four hollow out points 30, are set at intervals respectively on the technique edges 13 of the opposite PCB, can with for mounting
Positioning the brass point 20 be arranged at intervals, also can be set in the same side technique edges 13 two brass points 20 it
Between.
Further, when printed on both sides pcb board, tow sides have for cutting and mounted Mark point is as benchmark
Point, if be cut by laser using the brass point 20 of traditional easy offset as cutting datum mark, since two sides will appear
Different degrees of offset, the datum mark of tow sides are difficult to accomplish unanimously, to cause degrees of offset more serious, therefore be easy to cause
Product cut out it is bad, and use the present invention in hollow out point as datum mark when, then be not easy occur sanction bad product the case where, this be by
It is duplicate, the i.e. datum mark of tow sides in the position of PCB tow sides in the hollow out point 30 provided by the invention
Position is the same, therefore no matter is put and cut on the basis of the hollow out point 30 in which face, and obtained positioning result is all
Be it is the same, in other words, when the two-sided all printed circuits of PCB, the hollow out point 30 made through the invention be can be used as
The reference point of the pcb board laser cutting of printed on both sides, cutting accuracy are higher.
It is noted that the hollow out point 30 of the invention is generated in real time when cutting or cutting, that is, use with
The hollow out point 30 of cut point same processes production, one-off hole-piercing are completed, in this case, when the position cut is a line
When, that is, cut position by it is multiple cut form when, the point on the basis of the fixed hollow out point 30 not deviated can be with
Guarantee respectively cuts the consistency a little cut, it is ensured that the precision cut, and can also avoid causing to position because of PCB deformation, harmomegathus
It not enough precisely causes laser separation burr, cut out the problems such as bad bad, in other words, using this scheme, can effectively solve monolithic
Mould group causes mould group burr in rear processing procedure laser cutting process, cuts out the bad problem of cutting such as bad.
Further, as shown in figure 3, the shape of hollow out point 30 can be circle, diamond shape, triangle, cross etc.
Other various figures, can unrestricted choice according to the actual situation.In the preferred embodiment, the hollow out point 30 and the brass
Point 20 is selected as circle, wherein hollow out point 30 occurs in pairs on same diagonal line, shown brass point 20 is also same
Occur in pairs on diagonal line.
Preferably, PCB edge needs the technique edges 13 of reserved at least 5mm, the hollow out point 30 can be set to
On the technique edges 13, as the datum mark of laser cutting, wherein the smallest diameter of hollow out point 30 is 1mm, maximum gauge
For 3mm, on same plate PCB all hollow out points 30 can, shape identical workpiece equal by size once rush
Hole is completed, and therefore, size, the shape of all hollow out points 30 are consistent, and positional accuracy is higher when as datum mark, can be with
Guarantee the precision of laser cutting.
Therefore, when carrying out cutting positioning, following steps are needed to be implemented: (1) identical using position 14A is cut with PCB
Process makes the positioning datum point；(2) the positioning datum point is selected to be cut for cutting reference point, wherein described fixed
Position datum mark may be embodied as the hollow out point 30.
It is noted that either PCB jigsaw or monolithic pcb board, should all using the pairs of hollow out point 30, with
Catercorner mode is set on the technique edges 13 of the PCB.
It is noted that the circular through hole coordinate of the hollow out point 30 and the PCB shape of monolithic select identical position
The hollow out point 30 is made, and is completed the process in identical process, without reference to other additional investments and changes, does not need
Increase cost.After 30 circular through hole of hollow out point is completed, the foreign matter in cleaning hole, hole inner wall smooth is finally made
No apparent foreign matter residual, and the solder mask of bore edges must not serious chipping missing.
It is noted that the hollow out point 30 mentioned above using with cut position be by identical process
Production, and generated in real time when cutting, cutting precision, and simple process can be effectively improved, cost is relatively low.
Tradition is as shown in table 1 with the measurement data of brass positional dissection result, and error is larger.New work provided by the invention
The PCB that jigsaw occurs in rear processing procedure laser cutting process can be effectively solved to be cut by laser the hollow out point 30 of datum mark
Burr cuts out the bad problem of cutting such as bad, and creation data compares as shown in table 2, by 2 data pair of table before and after actual production exception machine
After it is found that being used as laser cutting datum mark using the hollow out point 30 provided by the invention, cutting accuracy is significantly improved.
The measurement data of the traditional brass positional dissection result of table 1
Production front and back data comparison before and after 2 actual production exception machine of table
It is noted that according to the present invention, it may occur to persons skilled in the art that other use same processes with PCB
The anchor point of production, anchor point can also use non-hollow out point 30A, i.e., corresponding groove conduct are arranged on the technique edges of PCB
Anchor point, such as the blind hole of blind round hole 30A shown in Fig. 3 and other shapes, these groove anchor points are also and cleavage
Same processes production is set, will not shift because of factors such as high temperature, stress, operations, can equally guarantee in laser cutting
The precision cut, what reduction laser cutting PCB occurred cuts burr, cuts out the bad problem such as bad.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention exists
It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (13)
1. a kind of positioning datum point for improving circuit board cutting accuracy, which is characterized in that the positioning datum point is set to a printing
On circuit board PCB, wherein the edge contour based on the pcb board, the positioning datum point and the formation pcb board cut position
Set and be prepared in the same process, with based on it is described cut position the pcb board cut when, generate in real time described in
Positioning datum point.
2. improving the positioning datum point of circuit board cutting accuracy as described in claim 1, the positioning datum point is hollow out point.
3. as claimed in claim 2 improve circuit board cutting accuracy positioning datum point, the hollow out point be circle, diamond shape,
Triangle or cross.
4. the positioning datum point of the raising circuit board cutting accuracy as described in claim 2-3 is any, including at least described in a pair
Hollow out point is set to wherein hollow out point is set on the technique edges at the pcb board edge in a manner of cornerwise with a piece of described
Size, the shape of each hollow out point of pcb board are consistent.
5. improving the positioning datum point of circuit board cutting accuracy as claimed in claim 4, the hollow out point, which is set to, is used as attachment
Between 2 brass points of positioning.
6. a kind of localization method for improving circuit board cutting accuracy, which comprises the following steps: (1) be based on pcb board
When cutting position and being cut to the pcb board, generate positioning datum point in real time, wherein the pcb board cuts position base
It is generated in the edge contour of the pcb board；(2) the positioning datum point is selected to be cut by laser for cutting reference point.
7. improving the localization method of circuit board cutting accuracy as claimed in claim 6, the positioning datum point is at least a pair of
Hollow out point, wherein each hollow out point is completed by one-off hole-piercing.
8. improving the localization method of circuit board cutting accuracy as claimed in claim 7, each hollow out point uses size
Equal, the identical workpiece of shape is punched out.
9. improving the localization method of circuit board cutting accuracy as claimed in claim 8, the hollow out point is in a manner of cornerwise
On the technique edges at the pcb board edge.
10. the localization method of the raising circuit board cutting accuracy as described in claim 7-9 is any, the hollow out point be it is round,
Diamond shape, triangle or cross.
11. a kind of PCB processing method, which comprises the following steps:
(A) an at least PCB substrate is selected, with brass point；
(B) point on the basis of the brass point mounts component；With
(C) multiple hollow out points when cutting position and cutting to the pcb board, are being generated, in real time with institute based on the pcb board
Hollow out point is stated as cutting positioning datum point to be cut, wherein the pcb board cuts side of the position based on the pcb board
Edge shape generates.
12. PCB processing method as claimed in claim 11, each hollow out point is equal using size, shape is identical
Workpiece is punched out.
13. the PCB processing method as described in claim 11-12 is any, the hollow out point is circle, diamond shape, triangle or ten
Font.
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| CN102711389A (en) * | 2012-05-31 | 2012-10-03 | 昆山市线路板厂 | Component mounting device and method for flexible circuit board |
| CN103008711A (en) * | 2012-12-21 | 2013-04-03 | 东莞生益电子有限公司 | Drilled hole aligning method of circuit board |
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