CN107745033A - A kind of production technology that can reduce edges of boards burr - Google Patents
A kind of production technology that can reduce edges of boards burr Download PDFInfo
- Publication number
- CN107745033A CN107745033A CN201711213071.XA CN201711213071A CN107745033A CN 107745033 A CN107745033 A CN 107745033A CN 201711213071 A CN201711213071 A CN 201711213071A CN 107745033 A CN107745033 A CN 107745033A
- Authority
- CN
- China
- Prior art keywords
- aperture
- circuit board
- edges
- printed circuit
- knives
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/16—Shoulder or burr prevention, e.g. fine-blanking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
- B21D28/26—Perforating, i.e. punching holes in sheets or flat parts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to printed circuit board production technical field, and in particular to a kind of production technology that can reduce edges of boards burr.The production technology that edges of boards burr can be reduced comprises the following steps：Step 1, substrate rail flanges open aperture：Need in printed circuit board to be punched an aperture in the substrate rail flanges for the position that V knives pass through using the mould with red needle；Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board, and then the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in the edges of boards of printed circuit board.Therefore, the production technology that can reduce edges of boards burr has production efficiency height, loss small and can reduce the burr of printed circuit board after cutting.It is simple with technique and this can reduce the production technology of edges of boards burr, and the characteristics of industrialization mass produces can be applied to.
Description
Technical field
The present invention relates to printed circuit board production technical field, and in particular to a kind of production work that can reduce edges of boards burr
Skill.
Background technology
At present, it is necessary to be cut to printed circuit board in the production process of printed circuit board.In the prior art, it is right
The technique that printed circuit board is cut, usually cut using V knives, at present after the completion of the cutting of V knives, position appearance of returning sword
Easy jagged residual, and then need manually to place under repair to the printed circuit board after cutting, and then not only labor intensive cost, and
And reduce production efficiency.
The content of the invention
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to a kind of production technology that can reduce edges of boards burr is provided,
The production technology that edges of boards burr can be reduced has production efficiency height, loss small and can reduce the hair of printed circuit board after cutting
Thorn.
To achieve these goals, the present invention adopts the following technical scheme that：
A kind of production technology that can reduce edges of boards burr is provided, it comprises the following steps：
Step 1, substrate rail flanges open aperture：Using the mould with red needle the position that V knives pass through is needed in printed circuit board
Substrate rail flanges on be punched an aperture；
Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board,
And then the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in printed circuit board
Edges of boards.
In above-mentioned technical proposal, in the step 1, the mould is arranged to punching die.
In above-mentioned technical proposal, in the step 1, the aperture for the aperture being punched is arranged to 1mm~4mm.
In above-mentioned technical proposal, it is preferred that in the step 1, the aperture for the aperture being punched is arranged to 2mm.
In above-mentioned technical proposal, it is preferred that in the step 1, the aperture for the aperture being punched is arranged to 3mm.
In above-mentioned technical proposal, in the step 2, the V knives are arranged to single V knives.
In above-mentioned technical proposal, in the step 2, the V knives are driven by cutting machine and cut.
Compared with prior art, beneficial effect is the present invention：
(1) a kind of production technology that can reduce edges of boards burr provided by the invention, including：Step 1, substrate rail flanges
Open aperture；Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board,
And then the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in printed circuit board
Edges of boards.Therefore, the production technology that can reduce edges of boards burr has production efficiency height, loss small and printed after reducing cutting
The burr of circuit board processed.
(2) a kind of production technology that can reduce edges of boards burr provided by the invention, it is simple with technique, and can be applied to
The characteristics of industrialization large-scale production.
Embodiment
In order that technical problem solved by the invention, technical scheme and beneficial effect are more clearly understood, below in conjunction with
Embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only explaining
The present invention, it is not intended to limit the present invention.
Embodiment 1.
A kind of production technology that can reduce edges of boards burr, it comprises the following steps：
Step 1, substrate rail flanges open aperture：Using the mould with red needle the position that V knives pass through is needed in printed circuit board
Substrate rail flanges on be punched an aperture；In the present embodiment, mould is arranged to punching die；In the present embodiment, it is punched
The aperture of aperture be arranged to 2mm；
Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board,
And then the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in printed circuit board
Edges of boards.In the present embodiment, V knives are arranged to single V knives；Wherein, V knives are driven by cutting machine and cut.
Embodiment 2.
A kind of production technology that can reduce edges of boards burr, it comprises the following steps：
Step 1, substrate rail flanges open aperture：Using the mould with red needle the position that V knives pass through is needed in printed circuit board
Substrate rail flanges on be punched an aperture；In the present embodiment, mould is arranged to punching die；In the present embodiment, it is punched
The aperture of aperture be arranged to 3mm；
Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board,
And then the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in printed circuit board
Edges of boards.In the present embodiment, V knives are arranged to single V knives；Wherein, V knives are driven by cutting machine and cut.
Embodiment 3.
A kind of production technology that can reduce edges of boards burr, it comprises the following steps：
Step 1, substrate rail flanges open aperture：Using the mould with red needle the position that V knives pass through is needed in printed circuit board
Substrate rail flanges on be punched an aperture；In the present embodiment, mould is arranged to punching die；In the present embodiment, it is punched
The aperture of aperture be arranged to 1mm；
Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board,
And then the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in printed circuit board
Edges of boards.In the present embodiment, V knives are arranged to single V knives；Wherein, V knives are driven by cutting machine and cut.
Embodiment 4.
A kind of production technology that can reduce edges of boards burr, it comprises the following steps：
Step 1, substrate rail flanges open aperture：Using the mould with red needle the position that V knives pass through is needed in printed circuit board
Substrate rail flanges on be punched an aperture；In the present embodiment, mould is arranged to punching die；In the present embodiment, it is punched
The aperture of aperture be arranged to 4mm；
Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board,
And then the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in printed circuit board
Edges of boards.In the present embodiment, V knives are arranged to single V knives；Wherein, V knives are driven by cutting machine and cut.
Embodiment 5.
A kind of production technology that can reduce edges of boards burr, it comprises the following steps：
Step 1, substrate rail flanges open aperture：Using the mould with red needle the position that V knives pass through is needed in printed circuit board
Substrate rail flanges on be punched an aperture；In the present embodiment, mould is arranged to punching die；In the present embodiment, it is punched
The aperture of aperture be arranged to 2.5mm；
Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board,
And then the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in printed circuit board
Edges of boards.In the present embodiment, V knives are arranged to single V knives；Wherein, V knives are driven by cutting machine and cut.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than the present invention is protected
The limitation of scope is protected, although being explained with reference to preferred embodiment to the present invention, one of ordinary skill in the art should
Work as understanding, technical scheme can be modified or equivalent substitution, without departing from the reality of technical solution of the present invention
Matter and scope.
Claims (7)
- A kind of 1. production technology that can reduce edges of boards burr, it is characterised in that：It comprises the following steps：Step 1, substrate rail flanges open aperture：The base for the position that V knives pass through is needed in printed circuit board using the mould with red needle An aperture is punched in plate rail flanges；Step 2, V knives are cut through small holes：By the aperture of step 1 when being cut using V knives to printed circuit board, and then So that the edges of boards burr of printed circuit board is broken when passing through the aperture, and then burr will not remain in the plate of printed circuit board Side.
- A kind of 2. production technology that can reduce edges of boards burr according to claim 1, it is characterised in that：The step 1 In, the mould is arranged to punching die.
- A kind of 3. production technology that can reduce edges of boards burr according to claim 1, it is characterised in that：The step 1 In, the aperture for the aperture being punched is arranged to 1mm~4mm.
- A kind of 4. production technology that can reduce edges of boards burr according to claim 3, it is characterised in that：The step 1 In, the aperture for the aperture being punched is arranged to 2mm.
- A kind of 5. production technology that can reduce edges of boards burr according to claim 3, it is characterised in that：The step 1 In, the aperture for the aperture being punched is arranged to 3mm.
- A kind of 6. production technology that can reduce edges of boards burr according to claim 1, it is characterised in that：The step 2 In, the V knives are arranged to single V knives.
- A kind of 7. production technology that can reduce edges of boards burr according to claim 1, it is characterised in that：The step 2 In, the V knives are driven by cutting machine and cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711213071.XA CN107745033A (en) | 2017-11-28 | 2017-11-28 | A kind of production technology that can reduce edges of boards burr |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711213071.XA CN107745033A (en) | 2017-11-28 | 2017-11-28 | A kind of production technology that can reduce edges of boards burr |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107745033A true CN107745033A (en) | 2018-03-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711213071.XA Pending CN107745033A (en) | 2017-11-28 | 2017-11-28 | A kind of production technology that can reduce edges of boards burr |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1190899A (en) * | 1997-09-25 | 1999-04-06 | Furukawa Electric Co Ltd:The | Punching device for thin-walled sheet material |
| CN202262033U (en) * | 2011-09-01 | 2012-05-30 | 青岛海信电器股份有限公司 | Printed circuit board with stamp hole structure and electronic terminal |
| CN102573300A (en) * | 2010-12-29 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Board splitting method of circuit board |
| CN103298252A (en) * | 2012-03-02 | 2013-09-11 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing the same |
| CN104377116A (en) * | 2013-08-16 | 2015-02-25 | 普因特工程有限公司 | Base Substrate Which Prevents Burrs Generated During the Cutting Process and Method for Manufacturing the Same |
| CN106211541A (en) * | 2015-04-29 | 2016-12-07 | 宁波舜宇光电信息有限公司 | A kind of positioning datum point improving circuit board cutting accuracy and method |
| CN106341947A (en) * | 2016-03-31 | 2017-01-18 | 东莞生益电子有限公司 | Circuit board manufacturing method |
-
2017
- 2017-11-28 CN CN201711213071.XA patent/CN107745033A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1190899A (en) * | 1997-09-25 | 1999-04-06 | Furukawa Electric Co Ltd:The | Punching device for thin-walled sheet material |
| CN102573300A (en) * | 2010-12-29 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | Board splitting method of circuit board |
| CN202262033U (en) * | 2011-09-01 | 2012-05-30 | 青岛海信电器股份有限公司 | Printed circuit board with stamp hole structure and electronic terminal |
| CN103298252A (en) * | 2012-03-02 | 2013-09-11 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing the same |
| CN104377116A (en) * | 2013-08-16 | 2015-02-25 | 普因特工程有限公司 | Base Substrate Which Prevents Burrs Generated During the Cutting Process and Method for Manufacturing the Same |
| CN106211541A (en) * | 2015-04-29 | 2016-12-07 | 宁波舜宇光电信息有限公司 | A kind of positioning datum point improving circuit board cutting accuracy and method |
| CN106341947A (en) * | 2016-03-31 | 2017-01-18 | 东莞生益电子有限公司 | Circuit board manufacturing method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180302 |
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| RJ01 | Rejection of invention patent application after publication |