CN103025062B - A kind of circuit board wedge angle region forming method - Google Patents
A kind of circuit board wedge angle region forming method Download PDFInfo
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- CN103025062B CN103025062B CN201210492100.1A CN201210492100A CN103025062B CN 103025062 B CN103025062 B CN 103025062B CN 201210492100 A CN201210492100 A CN 201210492100A CN 103025062 B CN103025062 B CN 103025062B
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Abstract
The present invention discloses a kind of circuit board wedge angle region forming method, comprise: step 1, before CNC is shaping, at the point of every sheet circuit board wedge angle region to be processed, a through hole is set, or arrange multiple through hole at the point of every sheet circuit board wedge angle region to be processed, and multiple through hole linearly arranges along the directions of rays on point summit; Step 2, gets multi-disc wiring board phase to be processed poststack and is fixed on the working position of CNC former; Step 3, when arranging a through hole at the point of every sheet circuit board wedge angle region to be processed, when CNC is shaping, adopt the milling cutter identical with through-hole diameter, and get the lower cutter point of the through hole center of circle as milling cutter, when arranging multiple through hole at the point of every sheet circuit board wedge angle region to be processed, adopt the milling cutter identical with the through-hole diameter closest to point summit, and the center of circle of getting closest to the through hole on point summit is as the lower cutter point of milling cutter.The present invention is conducive to promoting circuit sheet metal forming efficiency and quality, can stop the phenomenon of circuit board wedge angle region base material projection in the course of processing.
Description
Technical field
The present invention relates to printed substrate field shaping technique, be specifically related to a kind of circuit board wedge angle region forming method.
Background technology
CNC is shaping be wiring board produce in critical processes, wiring board produce often cause manufacturing schedule to be obstructed because CNC former mobility is low, restriction production capacity promote, affect product friendship the phase.For enhancing productivity, PCB manufacturing enterprise adopts the mode increasing wiring board to be processed superposition quantity when shaping, promotes shaping efficiency.But wiring board superposition quantity increases and will the integral thickness of wiring board to be processed be made to increase, the edge of milling cutter length for processing and forming is caused to need synchronous increasing, in production practices, wiring board superposition quantity is improved by increasing edge of milling cutter length, be only applicable to the wiring board with major diameter milling cutter, for inapplicable with the wiring board of small diameter milling knife, this is because edge length increases will make the corresponding increase of breaking probability of small diameter milling knife, not only cannot raise the efficiency, also increase breaking risk.When especially processing and forming being carried out to the wedge angle region on wiring board, normal use diameter is the small dimension milling cutter of 0.6 to 0.8mm, this improves institute by being more not suitable for process the superposition quantity of wiring board by lengthening edge length, therefore greatly limit the shaping efficiency lifting of the wiring board being provided with wedge angle region.Certainly, for promoting the shaping efficiency being provided with the wiring board of wedge angle region, once attempted small diameter milling knife to change to major diameter milling cutter in industry, to promote processing and forming lamination quantity.But which cannot ensure shaping quality, and because of wedge angle region long and narrow space structural limitations, adopt major diameter milling cutter to carry out adding and easily occur the anomalies such as base material is protruding man-hour, affect circuit sheet metal forming quality.
Summary of the invention
The object of the invention is to overcome weak point of the prior art, a kind of circuit board wedge angle region forming method being conducive to promoting circuit sheet metal forming efficiency and quality is provided, utilize the method to carry out shaping to circuit board wedge angle region, the phenomenon of circuit board wedge angle region base material projection in the course of processing can be stopped.
The object of the invention is to be achieved through the following technical solutions:
A kind of circuit board wedge angle region forming method, the method comprises the steps:
Step 1, before CNC is shaping, arranges a through hole at the point of every sheet circuit board wedge angle region to be processed, or arranges multiple through hole at the point of every sheet circuit board wedge angle region to be processed, and multiple through hole linearly arranges along the directions of rays on point summit;
Step 2, gets multi-disc wiring board phase to be processed poststack and is fixed on the working position of CNC former;
Step 3, when arranging a through hole at the point of every sheet circuit board wedge angle region to be processed, when CNC is shaping, adopt the milling cutter identical with through-hole diameter, and get the lower cutter point of the through hole center of circle as milling cutter, when arranging multiple through hole at the point of every sheet circuit board wedge angle region to be processed, adopt the milling cutter identical with the through-hole diameter closest to point summit, and the center of circle of getting closest to the through hole on point summit is as the lower cutter point of milling cutter.
The present invention is before CNC is shaping, at the point of every sheet circuit board wedge angle region to be processed, through hole is set, therefore without the need to shaping to the point of wedge angle region when CNC is shaping, but directly substitute milling cutter processing via regions by arranging through hole, do not produce base material projection, be conducive to improving shaping quality, simultaneously using through hole as wedge angle region is carried out CNC shaping time milling cutter lower cutter point, contact the resistance produced with wiring board during cutter under reduction milling cutter, improve solid capacity and heat dispersion, reduction breaking risk.In addition, use forming method of the present invention first shaping to circuit board wedge angle region when CNC is shaping after, replaceable major diameter milling cutter carries out shaping to the region beyond wedge angle region again, and make major diameter milling cutter not by wedge angle region point long and narrow space structural limitations, being convenient to major diameter milling cutter carries out shaping to point with exterior domain, one-time formed lamination quantity can be increased considerably, be conducive to promoting shaping efficiency.Meanwhile, carrying out the shaping front shaping wedge angle region of CNC to wedge angle region with exterior domain, then when shaping, wedge angle region board substrate is removed, and under major diameter milling cutter, during cutter, point of a knife does not extrude by base material, effectively can prevent the generation of the protruding phenomenon of base material in forming process.
During concrete enforcement, above-mentioned through hole can be arranged in drilling operating, in the drilling program of PCB drilling operating, only increase the processing formula to through hole, without the need to extra installation location, can arrange by the through hole that completes that is simple, efficient, that save manpower.
Preferably, the diameter of described through hole or the described through hole closest to point summit is more than or equal to 0.6mm.More be preferably 0.6mm.This be milling cutter diameter owing to using in current industry minimum be 0.6mm, when the diameter of through hole is more than or equal to 0.6mm, the base material of cutter point under milling cutter could be removed, contact the resistance produced with wiring board during cutter under reduction milling cutter, improve solid capacity and heat dispersion, reduction breaking risk.Certainly, when the milling cutter that diameter need be used little compared with 0.6mm, also may correspond to the through hole that more minor diameter is set, such as 0.3,0.4mm.Simultaneously, through-hole diameter is arranged also to be needed to consider the point of wedge angle region fully to be dragged for sky, such as, when the point width of wedge angle region is 0.6mm, arranging diameter is that point fully can be dragged for sky by the through hole of 0.6mm, and when the point width of wedge angle region is 0.8mm, then can consider to arrange through hole that diameter is 0.8mm point is fully dragged for sky.
When arranging multiple through hole in the wedge angle region of every sheet wiring board to be processed, multiple through hole intersects, and gradually large along the directions of rays on wedge angle region summit.More specifically, described multiple through hole is preferably three through holes, and the diameter of three through holes is followed successively by 0.6mm, 0.7mm, 0.8mm.
Preferably, when arranging multiple through hole in the wedge angle region of every sheet wiring board to be processed, multiple through hole linearly arranges along wedge angle region center line.When multiple through hole linearly arranges along wedge angle region center line, be convenient to the lower cutter point of the center of circle of the through hole closest to point summit as milling cutter, and using time cutter point of the center of circle of the through hole farthest away from point summit as milling cutter, make milling cutter pull required figure out according to CNC processing and forming formula setting track.
Adopt forming method of the present invention complete circuit board wedge angle region shaping after, namely replaceable major diameter milling cutter continues to carry out shaping to the region beyond wedge angle region, because the breaking risk of major diameter milling cutter reduces greatly, the superposition quantity that institute processes wiring board is improved by lengthening edge of milling cutter length, thus lifting shaping efficiency.Certainly, when the milling cutter diameter used is larger, also can not changes milling cutter and continue to carry out shaping to the region beyond wedge angle region when circuit board wedge angle region is shaping.
The present invention has the following advantages and beneficial effect compared to existing technology:
The present invention is before CNC is shaping, at the point of every sheet circuit board wedge angle region to be processed, through hole is set, therefore without the need to shaping to the point of wedge angle region when CNC is shaping, but directly substitute milling cutter processing via regions by arranging through hole, do not produce base material projection, be conducive to improving shaping quality, simultaneously using through hole as wedge angle region is carried out CNC shaping time milling cutter lower cutter point, contact the resistance produced with wiring board during cutter under reduction milling cutter, improve solid capacity and heat dispersion, reduction breaking risk.In addition, use forming method of the present invention first shaping to circuit board wedge angle region when CNC is shaping after, replaceable major diameter milling cutter carries out shaping to the region beyond wedge angle region again, and make major diameter milling cutter not by wedge angle region point long and narrow space structural limitations, being convenient to major diameter milling cutter carries out shaping to point with exterior domain, significantly can increase one-time formed lamination quantity, be conducive to promoting shaping efficiency.Meanwhile, carrying out the shaping front shaping wedge angle region of CNC to wedge angle region with exterior domain, then when shaping, wedge angle region board substrate is removed, and under major diameter milling cutter, during cutter, point of a knife does not extrude by base material, effectively can prevent the generation of the protruding phenomenon of base material in forming process.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail, but the execution mode of the invention is not limited thereto.
Embodiment 1
Adopt the point width of this circuit board wedge angle region forming method to wedge angle region to be that the wiring board of 0.6mm carries out shaping, comprise the steps:
Step 1, in drilling operating before the forming, arranging a diameter at the point of every sheet circuit board wedge angle region to be processed is 0.6mm through hole;
Step 2, gets three wiring board phase poststacks to be processed and is fixed on the working position of CNC former;
Step 3, when CNC is shaping, adopts diameter to be the milling cutter of 0.6mm, and gets the lower cutter point of the through hole center of circle as milling cutter.
Complete circuit board wedge angle region shaping after, change major diameter milling cutter, and lengthen the length of major diameter milling cutter, carry out shaping to the region beyond wedge angle region, because the breaking risk of major diameter milling cutter reduces greatly, the superposition quantity that institute processes wiring board is improved by lengthening edge of milling cutter length, thus lifting shaping efficiency.
Embodiment 2
Adopt the point width of this circuit board wedge angle region forming method to wedge angle region to be that the wiring board of 0.7mm carries out shaping, comprise the steps:
Step 1, in drilling operating before the forming, at the point of every sheet circuit board wedge angle region to be processed, three through holes are set, and three through holes linearly arrange along the directions of rays on point summit, three through holes intersect, and gradually large along the directions of rays on wedge angle region summit, and the diameter of three through holes is followed successively by 0.6mm, 0.7mm, 0.8mm;
Step 2, gets four wiring board phase poststacks to be processed and is fixed on the working position of CNC former;
Step 3, adopt the milling cutter identical with the through-hole diameter closest to point summit, namely adopt diameter to be the milling cutter of 0.6mm, and the center of circle of getting closest to the through hole on point summit is as the lower cutter point of milling cutter, gets the center of circle farthest away from the through hole on point summit and return cutter point as milling cutter.
Complete circuit board wedge angle region shaping after, change major diameter milling cutter, and lengthen the length of major diameter milling cutter, carry out shaping to the region beyond wedge angle region, because the breaking risk of major diameter milling cutter reduces greatly, the superposition quantity that institute processes wiring board is improved by lengthening edge of milling cutter length, thus lifting shaping efficiency.
In the present embodiment, changing diameter is the milling cutter of 1.0mm, and long for the sword of milling cutter adding, is grown to 8mm, owing to having changed major diameter and the longer milling cutter of length, can ensure that multi-disc PCB superposes milling cutter processing simultaneously and still has enough length and intensity and not easily breaking, therefore improve institute and process the superposition quantity of wiring board, thus lifting shaping efficiency.
Embodiment 3
Adopt the point width of this circuit board wedge angle region forming method to wedge angle region to be that the wiring board of 1mm carries out shaping, comprise the steps:
Step 1, in drilling operating before the forming, at the point of every sheet circuit board wedge angle region to be processed, four through holes are set, and four through holes linearly arrange along wedge angle region center line, four through holes intersect, and gradually large along the directions of rays on wedge angle region summit, the diameter of four through holes is followed successively by 1mm, 1.2mm, 1.4mm, 1.6mm;
Step 2, gets five wiring board phase poststacks to be processed and is fixed on the working position of CNC former;
Step 3, adopt the milling cutter identical with the through-hole diameter closest to point summit, namely adopt diameter to be the milling cutter of 1mm, and the center of circle of getting closest to the through hole on point summit is as the lower cutter point of milling cutter, gets the center of circle away from the through hole on point summit and return cutter point as milling cutter.
Complete circuit board wedge angle region shaping after, do not change milling cutter, the region of continuing beyond to wedge angle region is carried out shaping, because the breaking risk of major diameter milling cutter reduces greatly, the superposition quantity that institute processes wiring board is improved by lengthening edge of milling cutter length, thus lifting shaping efficiency.
The above embodiment only have expressed working of an invention mode, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (5)
1. a circuit board wedge angle region forming method, the method comprises the steps:
Step 1, before CNC is shaping, arrange multiple through hole, and multiple through hole linearly arranges at the point of every sheet circuit board wedge angle region to be processed along wedge angle region center line;
Step 2, gets multi-disc wiring board phase to be processed poststack and is fixed on the working position of CNC former;
Step 3, adopts the milling cutter identical with the through-hole diameter closest to point summit, and the center of circle of getting closest to the through hole on point summit is as the lower cutter point of milling cutter.
2. circuit board wedge angle region forming method according to claim 1, is characterized in that: the diameter of the described through hole closest to point summit is more than or equal to 0.6mm.
3. circuit board wedge angle region forming method according to claim 2, is characterized in that: the diameter of the described through hole closest to point summit is 0.6mm.
4. circuit board wedge angle region forming method according to claim 1, is characterized in that: multiple through hole intersects, and linearly arranges along wedge angle region center line.
5. circuit board wedge angle region forming method according to claim 4, is characterized in that: described multiple through hole is preferably three through holes, and the diameter of three through holes is followed successively by 0.6mm, 0.7mm, 0.8mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210492100.1A CN103025062B (en) | 2012-11-28 | 2012-11-28 | A kind of circuit board wedge angle region forming method |
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| CN201210492100.1A CN103025062B (en) | 2012-11-28 | 2012-11-28 | A kind of circuit board wedge angle region forming method |
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| CN104427769B (en) * | 2013-08-30 | 2017-12-29 | 北大方正集团有限公司 | A kind of CNC scoreboard methods of no hole circuit board |
| CN113110289B (en) * | 2021-04-25 | 2022-12-02 | 南通大学 | Optimization method for tool return pre-judgment point in continuous cutting of circular cutter |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101945532A (en) * | 2010-08-30 | 2011-01-12 | 昆山元茂电子科技有限公司 | Contour machining hole for printed circuit board |
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| JPH0471286A (en) * | 1990-07-12 | 1992-03-05 | Konica Corp | Board aggregate |
| JPH05327141A (en) * | 1992-05-25 | 1993-12-10 | Murata Mfg Co Ltd | Dielectric board and its manufacture |
| JP2943901B2 (en) * | 1994-07-19 | 1999-08-30 | 松下電工株式会社 | Substrate for push back |
| JP2008159968A (en) * | 2006-12-26 | 2008-07-10 | Fuji Electric Fa Components & Systems Co Ltd | Multiple printed board |
| JP2009152331A (en) * | 2007-12-20 | 2009-07-09 | Panasonic Corp | Processing method for wiring board, and semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101945532A (en) * | 2010-08-30 | 2011-01-12 | 昆山元茂电子科技有限公司 | Contour machining hole for printed circuit board |
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