JP2008159968A - Multiple printed board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple printed board in which a base board is simply and correctly positioned and set on a trimming die of a puncher and individual single substrates are punched out and separated when the single substrates attached on the base board are separated into the individual single substrates by using the puncher. <P>SOLUTION: In the multiple printed board, a plurality of single substrate 2 having almost rectangular shape is arranged in a grid pattern on a standard size base board 1. Slit openings 4 are drilled along a contour of the simple board, while bridge portions 3 are left at four corners of the simple substrate attached on the base board. Guide holes 5 for positioning the base board to be fitted to a trimming die in a step of separating the single substrates into individual single substrates are drilled, and the positioning is carried out by engaging guide pins of the trimming die with the guide holes 5 in the separation step of the single substrates. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a structure of a multi-sided printed board that is manufactured by imposing a plurality of single boards on a fixed-size board board for a small-sized circuit board mounted on an earth leakage breaker or the like.

The multi-sided printed board mentioned above is arranged on a fixed-size board (copper-clad laminate) with a plurality of single-sided boards arranged in a grid pattern and impositioned on the outline of the single-sided board. The external parts are processed along the board board, and after the circuit components are mounted on each single board area impressed on the board, the individual boards are separated from the board.
In addition, V-cut, router processing, die processing, perforation processing, and the like are known as external processing methods for a substrate board on which a single substrate is imposed.

By the way, in recent years, the thickness of the substrate has been reduced, and if a V-shaped cut (for example, refer to Patent Document 1) is performed on the outer shape of a thin substrate (plate thickness of 0.4 mm or less), the substrate warps. If this occurs, or if heat treatment is performed in the circuit component mounting process, there is a problem that the substrate is unexpectedly cracked along the V-shaped groove. Therefore, for thin substrates, slit holes are drilled (router processing or die processing) along the contour of the single board leaving bridges at the four corners of the single board facing the board. In many cases, a method (for example, see Patent Document 2) in which the bridge part is cut and divided into individual pieces after mounting circuit components on a circuit pattern formed on the board is used.
Japanese Patent Laid-Open No. 5-299789 Japanese Utility Model Laid-Open No. 5-25759 (FIG. 1)

  By the way, regarding the multi-chamfered printed board disclosed in the above-mentioned Patent Document 2, when the single board is divided from the board, when the bridge portions formed at the four corners of the single board are cut by router processing, the cutting residue is surrounded. Since it may scatter and adhere to open-type components (for example, a switch) mounted on the substrate, it may cause a contact failure of the switch contact. Therefore, equipment such as a dust collector is required in the work process. In this respect, if the bridge portion of the substrate board is punched (punched) using a punching tool instead of the router processing, the above-mentioned cutting waste is not generated and the dust collector is not required.

  In this case, if a single board is mass-produced, it is possible to divide the single board on the board using a large press facility, but it is possible to divide the board separately from the board. It is not preferable from the viewpoint of quality control to store the products in bulk. Therefore, when producing many types of products (for example, earth leakage circuit breakers) in small quantities, only the required number of single boards are taken out from the board, and the remaining single boards are stored in trays without being separated from the board. And keep it.

  By the way, in order to divide a single board from a board board one by one using a small puncher, a bridge formed on the board board corresponding to the outline of the single board is removed from the puncher (upper mold ( It is necessary to align correctly with the punch) and the lower die (die). In this respect, if the position of punching out the bridge portion with the puncher is slightly shifted, the circuit pattern or the mounted component formed on the single substrate may be damaged.

However, with the conventional structure of the board, it is difficult to manually align and set the bridge part of the board board to the puncher die, and skill is required. Has been.
The present invention has been made in view of the above points. The object of the present invention is to solve the problems described above, and to divide a single board imposing on a board board into individual pieces using a puncher. It is an object of the present invention to provide an improved multi-sided printed board so that the bridge portion of the board board can be easily and correctly positioned and set in the puncher die.

In order to achieve the above-mentioned object, according to the present invention, in a multi-surface printed board in which a plurality of single substrates that are substantially square-shaped are arranged in a grid pattern and are imposed on a fixed-size substrate board,
The bridge portion is left at the four corners of the single board faced to the fixed board, and slit holes are formed along the outline of the single board. In the step of dividing, a guide hole for positioning the substrate board according to the punching die is drilled (claim 1).

  Here, a pair of positioning guide pins is provided in the punching die used for punching the bridge portion, and the bridge portions formed on the board corresponding to the guide pins are aligned at two locations. A guide hole is drilled (Claim 2).

  According to the multi-sided printed board with the above configuration, the single board mounted on the board board is punched and divided one by one, and the board can be easily pulled out by using the guide holes drilled in the bridge part of the board board. With a simple operation, the positioning and setting can be performed correctly. This can improve the efficiency of the substrate dividing operation and ensure a high yield rate. In addition, the guide hole is punched in the range of the bridge portion to be punched later, so that it does not have any influence on the imposition of the single substrate.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on the examples shown in FIGS. 1A is a developed plan view of the board, FIG. 1B is an enlarged view of a portion P shown in FIG. 1A, and FIG. 1C is a plan view of a single board divided from the board. FIGS. 2A and 2B are plan views showing a set state in which the substrate board is aligned with a puncher punching die, and FIGS. 3A and 3B are structural sectional views of the punching die.

  First, in FIG. 1A, a fixed-size substrate board 1 has a plurality of single substrates 2 arranged and imposed in a grid pattern. Here, the board board 1 has a slit hole 4 along the outer contour of the single board, leaving the bridge portions 3 at the four corners of each single board 2, and the above-mentioned punched parts are described for each bridge section 3. Guide holes 5 corresponding to the positioning guide pins provided in the mold are perforated in two positions.

  When the single board 2 is divided into individual pieces from the board board 1, as shown in FIG. 2, the bridge portions 3 formed at the four corners of the single board 2 are used as punching die 6. Then, the puncher is operated in this positioning set state, and the two bridge portions 3 are punched out of the four corners. Subsequently, the remaining two bridge portions 3 are punched by matching with the punching die 6 in the same procedure as described above, and the individual pieces of the single substrate 2 shown in FIG.

  Next, the detailed structure of the punching die 6 used in the punching process of the bridge portion 3 is shown in FIGS. That is, the punching die 6 mounted on the puncher is a combination of an upper die (punch) 6a and a lower die (die) 6b, and corresponds to a pair of guide holes 5 drilled in the bridge portion 3 in the cavity of the lower die 6b. The positioning guide pin 7 is planted so as to stand upright. The upper die 6a is provided with relief holes 6a-1 corresponding to the guide pins 7.

  In order to punch out the bridge portion 3 of the board board 1 using this punching die 6, the board board 1 is inserted from the side between the upper die 6a and the lower die 6b as shown in the figure, and the board bridge portion is inserted. The guide hole 5 drilled in 3 is fitted to the guide pin 7 implanted in the lower mold 6b and positioned. Subsequently, the puncher is operated, and the upper die 6a is pressed onto the lower die 6b to apply the pressing force F. As a result, the bridge portion 3 of the board 1 is punched (punched).

  As described above, by punching the guide hole 5 in the bridge portion 3 of the substrate board 1 corresponding to the positioning guide pin provided in the punching die 6, special skill is required in the punching and dividing process of the single substrate 2. Therefore, it is possible to divide the single board by simply setting the board 1 to the die 6 at the correct position and to improve the workability and the yield rate.

1A is a development plan view of a board, FIG. 2B is an enlarged view of a portion P shown in FIG. 1A, and FIG. Individual plan view of a single board divided from the board Plan view of the set state in which the board of FIG. 1 is aligned with the puncher die FIG. 3 is a structural diagram of the punching die in FIG. 2, where (a) is a cross-sectional view along the longitudinal direction, and (b) is a cross-sectional view taken along line AA in (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate board 2 Single substrate 3 Bridge part 4 Slit hole 5 Guide hole 6 Die die 6a Upper die 6b Lower die 7 Guide pin

Claims (2)

In a multi-sided printed board in which a plurality of single boards that are approximately square shaped are arranged in a grid pattern on a fixed board,
A slit hole is made along the outline of the single board leaving bridge portions at the four corners of the single board facing the fixed board, and the single board is divided into single pieces from the board board to the bridge section. A multi-sided printed board comprising a guide hole for positioning the board in accordance with the punching die in the step of performing. The multi-sided printed board according to claim 1, wherein the punching die is provided with a pair of positioning guide pins, and corresponding to the guide pins, the bridge portion of the board is aligned in two directions and the guide holes are perforated. A multi-sided printed board characterized by that.

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