JP2008053277A - Apparatus and method of cutting off board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method of cutting off a substrate by which a flexible printed board can be surely cut off by using a simple cutting tool without using a large-scaled facility such as a hydraulic press and so on. <P>SOLUTION: In a work 3, an FPC (flexible printed circuit board) 3e for mounting parts is separated from a peripheral auxiliary part by a groove 3f, and it is also connected with the auxiliary part by a bridge 3a. A positioning pin 1 and positioning holes 2b and 3b are used to insert the work 3 between a base board 1 and a top board 2. Then, a cutting tool such as a cutter knife or the like is inserted into a top board slit 1a, and the bridge 3a is cut to separate the FPC 3e from the work 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate separation method and a separation device, and in particular, a flexible printed circuit (FPC) for mounting an automatic component connected to a base material via a bridge-shaped joint portion from the base material. The present invention relates to a substrate separation method and a separation apparatus for separation.

  Conventionally, in the separation of flexible printed circuit (FPC) for mounting automatic parts connected to a base material via a bridge-shaped joint, a different attachment (cutting die) is created for each FPC, and hydraulic pressure etc. Separation was performed using a large press machine using

  Patent Document 1 describes an FPC processing method capable of separating an FPC without curling it. In the conventional FPC processing method described in Patent Document 1, a plurality of FPCs are arranged on a receiving member with a plurality of FPCs arranged at a predetermined interval, and one selected FPC is received by a suction conveyance device. Press up and adsorb. Then, the FPC is separated from the FPC array using a cutting device.

JP 2002-157724 A

  However, the above-described prior art has the following problems.

  In the conventional FPC cutting device, firstly, a large power facility such as a hydraulic press machine is required. Therefore, when there is no facility or when there is a shortage of facilities for increased production, the FPC cannot be cut. There was a problem. The second problem is that a simple cutting method using a cutter knife or scissors can be used as a countermeasure for the first problem. In some cases, a necessary part of the FPC is likely to be damaged. That is, in the prior art, by using these simple methods, it was not possible to reliably separate only the necessary parts for automatic component mounting from the FPC connected to the auxiliary part.

  The present invention has been made in view of such problems, and without using a large-scale facility such as a hydraulic press machine, the flexible printed circuit board can be surely separated using a simple cutting instrument. It is an object of the present invention to provide a substrate separation method and a separation device.

  The method for separating a substrate according to the present invention includes a plurality of substrate portions provided on a sheet-like base material, separated by a groove and connected to the periphery by a plurality of bridge portions crossing the groove, from the base material. In the cutting method, a step of mounting the base material on the base board provided with slits at positions corresponding to the bridge portions of the base material so that the slits and the bridge portions are aligned, and the base A step of placing a top board provided with slits at positions corresponding to the slits of the board on the base material and fixing the top board to the base board, and inserting a cutting tool from the slit of the top board or the base board And a step of cutting the bridge portion.

  Further, in the step of cutting the bridge portion, the slits of the top board and the base board may be cut in such a manner that each of the slits crosses the bridge portion in a plan view and does not overlap with the substrate portion. it can. Furthermore, it is preferable that one long edge of each slit of the top board and the base board extends on the outer edge of the substrate portion in plan view.

  Further, the cutting instrument may be a cutter knife or scissors.

  The board portion may be a flexible printed board.

  The substrate cutting device according to the present invention is provided on a sheet-like base material, separated by a groove, and connected to the surroundings by a plurality of bridge portions crossing the groove from the base material. In the separating apparatus, a base board provided with a slit at a position corresponding to each bridge portion of the base material, a top board provided with a slit at a position corresponding to each slit of the base board, the top board, A cutting tool that can be inserted into a slit of the base board, and the base board is mounted on the base board so that the slits and the bridge portions are aligned, and the top board is mounted on the base board. It arrange | positions and it fixes to the said base board, The said bridge | bridging part is cut | disconnected by the said cutting instrument inserted from the slit of the said top board or the said base board, It is characterized by the above-mentioned.

  Further, when cutting the bridge portion, the bridge portion can be cut such that each slit of the top board and the base board crosses each bridge portion in a plan view and does not overlap with the substrate portion. . Furthermore, it is preferable that one long edge of each slit of the top board and the base board extends on the outer edge of the substrate portion in plan view.

  Further, the cutting instrument may be a cutter knife or scissors.

  Moreover, the said board | substrate part can be made into a flexible printed circuit board.

  According to the present invention, in a method of separating a plurality of substrate portions provided on a sheet-like base material and separated by a groove and connected to the periphery by a plurality of bridge portions crossing the groove from the base material, such as hydraulic pressure A large-scale facility such as a press device using the above is not used, and the substrate portion can be separated by a simple cutting instrument such as a cutter knife. Furthermore, the bridge portion is cut through a slit provided in the top board or the base board, so that the slit restricts the movement range of the cutting instrument, thereby preventing the substrate portion from being accidentally cut and damaged. be able to. In addition, when a cutting tool is inserted from, for example, a slit in the top board, the slit provided in the base board prevents the cutting tool inserted for cutting on the surface of the base board, thereby ensuring a more reliable bridge. The part can be cut.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings. FIG. 1 is a perspective view showing a flexible printed circuit board cutting apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a base board in the present embodiment.

  As shown in FIGS. 1 and 2, the flexible substrate cutting apparatus according to this embodiment is based on a base board 1, a top board 2 disposed above the base board 1, and an FPC not shown. It consists of a cutting instrument for cutting from the material. A work 3 is mounted between the base board 1 and the top board 2.

  The base board 1 is made of a rectangular plate-like member, and is provided with a plurality of base board slits 1a. This base board slit 1a has a shape in which the blade of a cutting instrument can be inserted along its longitudinal direction. A plurality of positioning pins 1b are disposed on the base board 1, and the number thereof is preferably three or more. As shown in FIG. 2, in the present embodiment, positioning pins 1 b are provided at, for example, three corners of the base board 1.

  In the work 3, a plurality of (four in the illustrated example) FPCs 3e are provided on the sheet-like base material, and are separated by the groove 3f, and a plurality (eight in the illustrated example) crossing the groove 3f. It is connected to the periphery by a bridge portion 3a. That is, the FPC 3e which is a board part for mounting automatic parts is connected to an auxiliary part in the peripheral part of the FPC 3e via a bridge part 3a which is a connection part, and the auxiliary part made of the same material as the FPC 3e is FPC 3e. This is an unnecessary part that is discarded after the separation. Further, positioning holes 3b are provided at the four corners of the work 3, and three of the positioning holes 3b correspond to the positioning pins 1b and are fitted to the positioning pins 1b. Then, by fitting the positioning pins 1b and the positioning holes 3b and mounting the workpiece 3 on the base board 1, the positional relationship between the bridge portion 3a and the base board slit 1a in the workpiece 3 can be matched. . This positional relationship will be described in detail below. Note that the number of positioning holes 3b in the workpiece 3 is at least equal to the number of positioning pins 1b.

  The top board 2 is made of a rectangular plate-like member, and is provided with a top board slit 2 a having the same pattern as that provided on the base board 1. The top board slit 2a is a slit penetrating in the thickness direction of the top board 2a, and has a shape in which a blade of a cutting instrument can be inserted along the longitudinal direction thereof. Further, the same number of positioning holes 2b as the number of positioning pins 1 are provided at the corners of the top board 2 so as to be fitted with the positioning pins 1b. Then, the top board 2 is fixed to the base board 1 by aligning the positioning pins 1b and the positioning holes 2b from above the work 3, and the work 3 is fixed so as to be sandwiched between the top board 2 and the base board 1. In this way, the positional relationship among the bridge portion 3a of the workpiece 3, the base board slit 1a, and the top board slit 2a can be matched and matched.

  Next, with reference to FIG. 3, the positional relationship among the bridge portion 3a of the workpiece 3, the base board slit 1a, and the top board slit 2a will be described. FIG. 3 is a plan view showing a configuration when the slit portion is viewed from the viewpoint A shown in FIG. 1 after the work 3 and the top board 2 are sequentially attached on the base board 1.

  FIG. 3 is a plan view of the substrate cutting apparatus according to the present embodiment from above the top board. With respect to the top board, only the top board slit 2a is shown, and the other portions are omitted. The work disposed on the back side of the top board 2 is indicated by a broken line, and the necessary portion 3c of the FPC which is the substrate portion of the work is separated from the unnecessary portion 3d of the FPC with the groove 3f therebetween. The bridge portion 3a crossing 3f is connected to an unnecessary portion 3d of the FPC. Here, the necessary portion 3c of the FPC is equivalent to the FPC 3e in FIG. Although not shown, the baseboard slit at the corresponding position coincides with the topboard slit 2a in plan view.

  As shown in FIG. 3, a part of the bridge portion 3a that is an FPC connection portion can be visually recognized by the top board slit 2a. The length of the top board slit 2a in the longitudinal direction is larger than the width of the bridge portion 3a. Moreover, the top board slit 2a is located on the groove 3f, and in particular, it does not overlap with the necessary portion 2a of the FPC in a plan view. Further, of the long edges of the top board slit 2, the long edge on the FPC necessary part 3c side extends on the outer edge of the FPC necessary part 3c, that is, on the boundary between the FPC necessary part 3c and the groove 3f. . The arrangement relationship as shown in FIG. 3 is similarly established for the other slit portions.

  As a cutting tool for the bridge portion 3a, for example, a simple tool such as a cutter knife or scissors can be used. At this time, the blade part of the cutting tool can be inserted into the top board slit 2a, and it is sufficient that the bridge part 3a can be cut at the time of insertion.

  Next, the operation of the present embodiment configured as described above will be described with reference to FIGS. As shown in FIG. 1, the operator aligns the workpiece 3 with respect to the base board 1 by aligning the positioning pins 1b of the base board 1 with the positioning holes 3b of the workpiece 3 before cutting. The work 3 is mounted on. Similarly, the top board 2 is positioned with respect to the base board 1 by aligning the positioning pins 1b of the base board 1 and the positioning holes 2b of the top board 2, and the top board 2 is mounted on the work 3. 1 and the top board 2 are fixed so as to sandwich the work 3.

  In this way, the positional relationship among the bridge portion 3a, the baseboard slit 1a, and the topboard slit 2a is determined, and as shown in FIG. 3, the bridge portion 3a can be clearly seen through the topboard slit 2a. Become. And an operator inserts cutting tools, such as a cutter knife, from the top board slit 2a, and cut | disconnects the bridge part 3a. At that time, the top board slit 2a or the base board slit 1a limits the moving direction of the cutting instrument. At the same time, the size of burrs generated when cutting the bridge portion 3a can be suppressed. Moreover, the baseboard slit 1a does not stop the cutting instrument inserted for cutting on the surface of the baseboard. The base board slit 1a does not need to penetrate the base board 1a in the thickness direction like the top board slit 2a, and may have a groove shape having an appropriate depth in the thickness direction. Moreover, the operator can also cut | disconnect the bridge | bridging part 3a by inserting cutting tools, such as a cutter knife, from the baseboard slit 1a.

  The operator cuts all the bridge portions 3a of the workpiece 3 that can be judged from the top board slit 2a, removes the top board 2, cuts off the necessary portion 3c of the FPC as the substrate portion, and removes the unnecessary portion 3d of the FPC. Can be separated from

  According to the present embodiment, the FPC 3e can be separated from the work 3 by using a simple cutting instrument such as a general-purpose cutter knife without using a press device using hydraulic pressure or the like. Further, since the movement range of the cutting tool such as a cutter knife is limited by the top board slit 2a or the base board slit 1a, the necessary part 3c of the FPC is not damaged by not slitting the necessary part 3c of the FPC. Can be securely separated. Moreover, since the baseboard slit 1a does not stop the cutting tool inserted for cutting on the surface of the baseboard, the cutting work of the bridge portion 3a can be performed more reliably.

  In this way, in the separation of the flexible printed board corresponding to automatic component mounting, the necessary mounting portion and the discarding portion can be divided after mounting the components.

  In the present embodiment, the FPC detaching apparatus has been described. However, as long as it has the same form as that of the work 3, it can also be applied to detaching substrates other than the FPC.

1 is a perspective view showing a flexible printed circuit board separating apparatus according to an embodiment of the present invention. It is a perspective view which shows the base board in this embodiment. It is a top view which shows a structure when a slit part is seen from the viewpoint A shown in FIG. 1, after a workpiece | work and a top board are attached sequentially on a base board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Base board 1a; Base board slit 1b; Positioning pin 2; Top board 2a; Top board slit 2b, 3b; Positioning hole 3; Work piece 3a;

Claims (10)

In a method of separating a plurality of substrate portions provided on a sheet-like base material and separated by a groove and connected to the periphery by a plurality of bridge portions crossing the groove, each bridge of the base material A step of mounting the base material so that each slit and each bridge portion are aligned on a base board provided with a slit at a position corresponding to each portion, and a slit at a position corresponding to each slit of the base board A step of disposing a top board provided on the base material and fixing the top board to the base board; and a step of cutting the bridge portion by inserting a cutting tool from the slit of the top board or the base board. A method for separating a substrate characterized by the above. 2. The substrate separation according to claim 1, wherein in the step of cutting the bridge portion, the slits of the top board and the base board cross each bridge portion in a plan view and do not overlap with the substrate portion. Method. 3. The method for separating a substrate according to claim 2, wherein one long edge of each slit of the top board and the base board extends on an outer edge of the substrate part in a plan view. The substrate cutting method according to claim 1, wherein the cutting instrument is a cutter knife or scissors. The method for separating a substrate according to any one of claims 1 to 4, wherein the substrate unit is a flexible printed circuit board. In an apparatus for separating a plurality of substrate portions provided on a sheet-like base material and separated by a groove and connected to the periphery by a plurality of bridge portions crossing the groove, each bridge of the base material A base board provided with a slit at a position corresponding to each part, a top board provided with a slit at a position corresponding to each slit of the base board, and a cutting that can be inserted into the slit of the top board and the base board And mounting the base material so that each slit and each bridge portion are aligned on the base board, and placing the top board on the base board and fixing the base board to the base board, The board | substrate cutting apparatus characterized by cutting the said bridge part with the said cutting instrument inserted from the slit of the said top board or the said base board. 7. The substrate separating apparatus according to claim 6, wherein when the bridge portion is cut, each slit of the top board and the base board crosses each bridge portion in a plan view and does not overlap with the substrate portion. . 8. The substrate separating apparatus according to claim 7, wherein one long edge of each slit of the top board and the base board extends on an outer edge of the substrate part in a plan view. The substrate cutting apparatus according to claim 6 or 7, wherein the cutting instrument is a cutter knife or scissors. The substrate separating apparatus according to claim 6, wherein the substrate unit is a flexible printed circuit board.

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