JP2007281133A - Original board, electronic component mounting board, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an original board in which burrs are restrained from being left on product boards when the product boards are cut out from the original board by breaking perforate cutting lines between a waste board and the product boards. <P>SOLUTION: The original board 5 has a configuration in which the product boards 3 cut out from the original board 5 by breaking perforate cutting lines 17 are connected to the waste board 7, through the intermediary of the perforate cutting lines 17. Interconnections 11 which interconnect the product boards 3 and the waste board 7 together are each formed into a curvature 13 which spreads wide from the perforate cutting line 17 toward the waste board 7 side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an original substrate, an electronic component mounting substrate, and an electronic device that are connected to a discarded substrate through a perforated cutting line portion that allows a plurality of product substrates to be broken and cut.

  Patent Document 1 describes an original substrate having a structure in which a plurality of product substrates are connected to a discarded substrate through a perforated cutting line portion that can be cut and cut. The product substrate is separated from the original substrate. It is disclosed that an operator obtains a product substrate by separating it by hand.

  FIG. 5 is a plan view of a main part for explaining the problems of the conventional base substrate, and FIG. 6 is a plan view showing a specific example of the conventional base substrate. That is, as shown in FIG. 6, when separating the product substrate 103 from the original substrate 101 from the discarded substrate on the original substrate side, the operator connects the connecting portions 107, 109, and 111 connected to the discarded substrate at the perforation 105. It must be divisible by hand.

  However, for example, when the connecting portion 111 is divided, as shown in FIG. 5A, a crack 119 is formed between the corner portion 115 located on the side of the discarded substrate 113 and the small hole portion 117, so that FIG. As shown in FIG. 3, the burr 121 may remain on the product substrate 103 side. When the product substrate 103 is assembled to the housing, the burr 121 may interfere with the housing to cause a malfunction that cannot be assembled.

JP-A-6-342963

  An object of the present invention is to provide an original substrate, an electronic component mounting substrate, and an electronic apparatus that prevent a burr from being left on the product substrate side when the product substrate is discarded and cut from the substrate.

  In order to achieve the above object, the original substrate according to the first aspect of the present invention is connected to the discarded substrate through a perforated cutting line portion that can be cut and cut by a plurality of product substrates. The connecting portion that connects the product substrate and the discarded substrate is an original substrate, and is formed in a curved shape that widens toward the discarded substrate side from the perforated cutting line portion. It is a feature.

  According to the first aspect of the present invention, the connecting portion that connects the product substrate and the discarded substrate is formed in a curved shape that spreads from the perforated cutting line portion toward the discarded substrate side, and is cracked. The perforation is the intended cutting position of the connecting part located between the product substrate and the discarded substrate when the product substrate is cut from the discarded substrate and cut. It becomes easy to cut | disconnect in a shaped cutting line part. Therefore, the problem that burrs remain on the product substrate side can be solved.

The base substrate according to the second aspect of the present invention is characterized in that, in the first aspect, small cut portions are formed at both side positions of the cutting line portion.
According to the second aspect of the present invention, when the product substrate is thrown away from the substrate and cut, the breakage is likely to start from the small notch portion, so that the breakage starts from an unintended position and the product substrate side The risk of burrs remaining on the surface can be reduced.

  Moreover, the original substrate according to the third aspect of the present invention is an original substrate that is connected to a discarded substrate through a perforated cutting line portion that can be cut and cut by a plurality of product substrates. The connecting portion that connects the product substrate and the discarded substrate is formed in a curved shape that widens toward the discarded substrate side from the perforated cutting line portion, and at both side positions of the cutting line portion. The corner portion is formed.

  According to the third aspect of the present invention, when the product substrate is thrown away from the substrate and cut, the corner portion that is likely to break first is positively formed at the position of the cutting line portion on the product substrate side. Breaking can be easily started from the corner, thereby preventing the start of breaking from other portions and reducing the possibility of burrs remaining on the product substrate side.

Further, the base substrate according to the fourth aspect of the present invention is the above-mentioned third aspect, wherein instead of the curvilinear shape spreading toward the end from the corner portion toward the discarded substrate side, the base substrate has a linear shape spreading toward the end. It is characterized by being formed.
According to the fourth aspect of the present invention, it becomes easier to start the break from the corner portion, and the same effect as the curved shape can be obtained even in the linear shape.

According to a fifth aspect of the present invention, there is provided an electronic component mounting substrate in which an electronic component is mounted on a substrate, wherein the substrate is the original substrate according to any one of the first to fourth aspects. The perforated cut line portion is divided and cut.
According to the fifth aspect of the present invention, it is possible to obtain an electronic component mounting board that solves the problem that the burr remains.

According to a fifth aspect of the present invention, there is provided an electronic apparatus having an electronic component mounting board mounted thereon, wherein the electronic component mounting board is the electronic component mounting board according to the fifth aspect. To do.
According to the sixth aspect of the present invention, when the electronic component mounting board is assembled to the housing, there is no problem that the burr cannot be assembled due to interference with the housing.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an original substrate according to an embodiment to which the present invention is applied, and FIGS. 2A and 2B are main part plan views showing different examples of connecting portions of the original substrate according to the embodiment. FIG. 3 is a plan view showing a main part of a modification of the embodiment shown in FIG. 2A, and FIG. 4 is a plan view showing a main part of still another embodiment.

[Example 1]
As shown in FIG. 1, when the product substrate 3 is created, first, for example, eight product substrates 3 (3a to 3h) are discarded by the molding die and connected to the substrate 7 by the connecting portion 11 and laid out. 5 is created. Then, the operator separates the product substrates 3 a to 3 h from the discarded substrate 7 of the original substrate 5 by cutting them by hand.

  The original substrate 5 includes a product substrate 3 to be used and a discarded substrate 7 that becomes unnecessary after the product substrate 3 is separated. Further, most of the portion between the product substrate 3 and the discarded substrate 7 is separated in advance by the separation slot 9. And the product board | substrate 3 and the discard board | substrate 7 are locally connected by the connection part 11 in the several places.

  The connecting portion 11 is formed in a curved shape 13 that widens from the position of the perforated cutting line portion 17 toward the discarded substrate 7 side. That is, the left and right side surfaces 15 of the connecting portion 11 are formed in a smooth curved surface shape like the base of Mt. Fuji.

  As described above, the curved shape 13 is widened so that the corner portion does not exist from the product substrate 3 side to the discarded substrate 7 side. Thereby, when the product substrate 3 is cut from the discarded substrate 7 and cut, there is no corner that is likely to be a starting point of cracking, so that the intended cutting position is located between the product substrate 3 and the discarded substrate 7. It becomes easy to cut | disconnect in the perforated cutting line part 17 which is.

  On the perforated cutting line portion 17, as shown in FIG. 2A, two small holes 19 are arranged to constitute a perforation. This small hole 19 is a path when the worker discards the product substrate 3 along the separation long hole 9 and cuts the product substrate 3 from the substrate 7 and breaks it from one side to the other side of the cutting line portion 17. It becomes. Therefore, the break line is less likely to deviate from the originally intended position. Note that there may be one such small hole 19 as shown in FIG. 2B, or three or more.

  Further, as shown in FIGS. 2 (a) and 2 (b), small cutouts having substantially the same diameter as the small holes 19 are provided at both side positions of the cutting line portion 17, that is, at the start position where the connecting portion 11 extends toward the discarded substrate 7 side. You may make it have the part 21, respectively. Such a small cut-out portion 21 is not intended because the breakage of the connecting portion 11 is likely to start from the respective small cut-out portions 21 on both sides when the product substrate 3 is discarded from the substrate 7 and cut. It is possible to prevent breakage from starting.

  In order to obtain the same effect, as shown in FIG. 3, the distance from both sides of the connecting portion 11 to the product substrate 3 side of the connecting portion 11 is reduced along the cutting line portion 17 from both sides of the connecting portion 11. You may make it have the small notch part 23 in the shape extended toward mutually.

Next, the operation will be described.
According to the above-described embodiment, the connecting portion 11 that connects the product substrate 3 and the discarded substrate 7 is formed in the curved shape 13 that spreads from the perforated cutting line portion 17 toward the discarded substrate side 7. Therefore, when the product substrate 3 is cut from the discarded substrate 7 and cut, the intention of the connecting portion 11 located between the product substrate 3 and the discarded substrate 7 is designed. It becomes easy to cut | disconnect in the perforated cutting line part 17 which is a cutting position to perform. Accordingly, no burrs are left on the product substrate 3 side.

[Example 2]
Next, another embodiment of the present invention will be described with reference to FIG. In the embodiment shown in FIG. 4, the connecting portion 11 that connects the product substrate 3 and the discarded substrate 7 is formed in a linear shape 18 that widens from the perforated cutting line portion 17 toward the discarded substrate 7 side. In addition, corner portions 25 are formed at both side positions of the cutting line portion 17.

  By providing the corner portion 25, when the product substrate 3 is thrown away from the substrate 7 and cut, the breaking force concentrates on the corner portion 25, so that the bottom serves as a starting point for crack initiation. It becomes easier to start fracture from the point. Furthermore, even if the connecting portion 11 has a linear shape that widens toward the end, the same effects as the curved shape can be obtained, and burrs can be prevented from remaining on the product substrate 3 side.

  In FIG. 4, the connecting portion 11 is formed in a linear shape 18 that widens toward the end, but it may be replaced with a curved shape 13 that widens toward the end. In this case as well, it is possible to prevent cracks from starting from the corner 25 and leaving burrs on the product substrate 3 side.

  The connecting portion 11 has been described as described above. However, the connecting portion 11 may have a structure in which it breaks along the perforated cutting line portion 17 provided there and no burrs remain on the product substrate 3 side. Various modifications are possible.

[Example 3]
A third embodiment of the present invention is an electronic component mounting board in which an electronic component is mounted on the product substrate 3. That is, the product substrate 3 is obtained by dividing the original substrate 5 of Example 1 or Example 2 from the perforated cutting line portion 17 and cutting the product substrate 3 into various types such as chip-type electronic components. Electronic components are mounted. Here, the electronic component may be mounted in a state of the original substrate 5 or may be mounted in a state where the original substrate 5 is divided into individual product substrates 3. According to this embodiment, the problem that the burr remains as an electronic component mounting board does not occur.

[Example 4]
The fourth embodiment of the present invention is an electronic device on which an electronic component mounting board is mounted. Here, the electronic component mounting substrate of Example 3 is used as the electronic component mounting substrate. Examples of the electronic device include, but are not limited to, an ink jet printer, a copying machine, a facsimile machine, and a scanner. According to the fourth embodiment, when the electronic component mounting board is assembled to the casing of the electronic device, there is no problem that the burr cannot be assembled due to interference with the casing.

The top view of the former substrate concerning one embodiment to which the present invention is applied. (A) (b) is a principal part top view which shows the Example from which the connection part of the original board which concerns on the embodiment differs. The principal part top view which shows the modification of the Example of Fig.2 (a). The principal part top view showing other embodiments. The principal part top view for demonstrating the problem of the conventional original board | substrate. The top view which shows a specific example of the conventional original board | substrate.

Explanation of symbols

  3, 3a-3h Substrate, 5 original substrate, 7 Discarded substrate, 9 Separation long hole, 11 Connection part, 13 Curved shape of the end, 15 Both sides of connection part, 17 Cutting line part, 19 Small hole, 21 Small cut part , 23 Small cutout, 25 corner

Claims (6)

A plurality of product substrates is an original substrate connected to a discarded substrate through a perforated cutting line portion that can be cut and cut,
The connection part which connects the said product board | substrate and the said discard board | substrate is formed in the curve shape which spreads toward the said discard board | substrate side from the said perforated cutting line part, The original board | substrate characterized by the above-mentioned.   2. The original substrate according to claim 1, wherein small notches are formed at both side positions of the cutting line portion. A plurality of product substrates is an original substrate connected to a discarded substrate through a perforated cutting line portion that can be cut and cut,
The connecting portion that connects the product substrate and the discarded substrate is formed in a curved shape that extends from the perforated cutting line portion toward the discarded substrate side, and has corners on both sides of the cutting line portion. The original board | substrate characterized by forming the part.   4. The original substrate according to claim 3, wherein the original substrate is formed in a linear shape that is widened toward the end of the discarded substrate, instead of the curved shape that is widened toward the end.   An electronic component mounting board formed by mounting an electronic component on a board, wherein the board is obtained by cutting the original board according to any one of claims 1 to 4 from the perforated cutting line portion. An electronic component mounting board characterized by being.   An electronic device comprising an electronic component mounting board mounted thereon, wherein the electronic component mounting board is the electronic component mounting board according to claim 5.

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