JP2000127093A - Punching die for split through hole printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a punching die for a split through hole printed wiring board and a manufacturing method therefor, which can obtain a split (half) through hole with high reliability by preventing separation and crack of a through hole. SOLUTION: Guide pins 2g, 2f which can be inserted in a through hole are arranged in contact in a punch 2a or a blank die 2b. Thus, when the punch 2a or the blank die 2b cuts a through hole part of a printed wiring board 1, the guide pins 2g, 2f are inserted in the through hole parts to keep the inner wall plating of the through hole part from being separated by pressing, whereby a split (half) through hole, separation and crack of which are prevented can be obtained. The split part of the through hole can be worked simultaneously with blanking for general round holes, square holes and outline other than the split part of the through hole.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die for punching an external shape of a printed wiring board, which is widely used in various types of electric equipment. The present invention relates to a die for punching a hole printed wiring board.

[0002]

2. Description of the Related Art In recent years, strict requirements have been placed on printed wiring boards, such as high density and high precision, with the miniaturization and multifunctionality of electronic devices, the automatic insertion of electronic components, and the surface mounting. In particular, as electronic devices become smaller, the demand for higher density of printed wiring boards also increases, and through-holes for conduction purposes are arranged on the outer end surface of the printed wiring board and used as soldering parts for further high-density wiring. Various studies have been made on the processing method, the punching die, and the like by a printed wiring board processing maker.

A method of punching a printed wiring board using a conventional die for punching a printed wiring board will be described below.

FIGS. 5 to 8 show a method of processing a divided through-hole wiring board using a conventional die for punching a printed wiring board. 5 to 8, 11 is a printed wiring board, 11a is an insulating substrate, 11b is a conductor pattern, 11c
Is a divided through hole, 11d is a punched end face by a rectangular punch, 11e is an outer punched end face, 11f is a through hole, 11g is a soldering land, 12 is an upper die, 13
Is a lower die, 12a is a punch for a rectangular hole, 12b is an outer die, 12c is an upper punch plate, 12d is an upper stripper plate, 12e is an upper backing plate, 13a is a lower die, and 13b is a lower die. The stripper plate 13c is a lower die holder.

A method of punching a printed wiring board having the above-described configuration using a die for punching will be described below.

First, a copper-clad laminate (not shown) in which a copper foil is laminated on both sides of a glass cloth or a glass cloth woven fabric base epoxy resin laminate serving as an insulating substrate 11a is cut into a predetermined size, and a plurality of sheets are laminated. At the same time, set the backup board and entry board in place. The set copper-clad laminate, backup board or entry board has a reference hole at the origin of the processing position, inserts a stack pin into the reference hole, sets it on the NC drilling machine, drills holes using a carbide drill, etc. 11f through hole in laminated board
Is formed, and the printed wiring board 11 is obtained.

Next, an electroless or electrolytic copper plating layer is formed on the surface of the copper-clad laminate including the through hole 11f on the printed wiring board 11 having the through hole 11f formed therein.
Next, an etching resist is formed on the surface of the copper plating layer by a screen printing method, a photo development method, or the like. On the printed wiring board 11 on which the etching resist is formed, the exposed copper plating layer and copper foil are etched using a solution such as cupric chloride, and after the etching resist is peeled off, as shown in FIG. The conductor pattern 11b is formed.

Next, on the printed wiring board 11, a solder resist serving as a solder resist and a road map that clearly indicates the insertion and mounting positions of the electronic components are printed on the insulating substrate 11a or the conductor pattern 11b by a method such as screen printing. A positioning hole (not shown) which is formed and serves as a guide for punching is processed. Next, the printed wiring board 11 with the guide holes is inserted into the positioning pins (not shown) of the lower mold 13 of the mold as shown in FIG. 7 set in a pressing device (not shown). Then, with the vertical movement of the upper die of the mold, the through hole 11 shown in FIG. 6 is vertically divided by the punch 12a for a rectangular hole or the die 12b for punching the outer shape of the printed wiring board 11, and the like.
After the c and the outer shape 11e are processed, the conductor pattern 11
The continuity check and surface treatment of b are performed.

[0009]

However, according to the above-mentioned conventional method, the inner wall plating portion of the divided through-hole portion 1c is peeled, cracked or broken inward as shown in FIG. 8 during punching. This broken inner wall plating not only impairs the electrical conduction reliability of the copper foil pattern on the front and back when mounting the printed wiring board on the equipment, but also prevents the solder from being absorbed and the mounting There was a problem that became a fatal defect.

In order to solve this problem, a V-shaped saw-toothed single blade is used to cut the through-hole by a push-cut method, thereby taking measures against peeling of the inner wall and cracking. However, in this case, there is a problem that it is difficult to simultaneously form other holes in the printed wiring board, and the number of steps is increased to increase the number of steps.

[0011]

In order to achieve this object, the present invention relates to a punching die for a printed wiring board, in which a punching punch or an external die is provided with a contact pin and a guide pin which can be inserted into a through hole. Have.

Thus, when the rectangular punch or the outer die punches the through hole of the printed wiring board, the guide pin is inserted into the through hole and the inner wall plating of the through hole tends to peel inward. By pressing down, a highly reliable divided through hole in which peeling or cracking of the through hole is prevented can be obtained. Since this is incorporated into a punching die for a normal printed wiring board, the processing can be completed simultaneously with the punching of a general round hole, square hole, or outer shape other than the divided portion of the through hole.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention comprises at least a punch, an outer die, and an upper die stripper plate, and substantially the center of a through hole in a printed wiring board is formed by the punch. In a punching die for a divided through-hole printed wiring board formed by punching and cutting, a die for punching a split through-hole printed wiring board in which a guide pin that can be inserted into the through-hole is placed in contact with a punch or an external die. It is punched out while protecting the conductor plating on the inner wall of the through-hole by the guide pin inserted in the through-hole, so that the through-hole does not occur in the inner wall without peeling, cracking or tearing. Is divided in the vertical direction.

According to a second aspect of the present invention, the guide pin has a semicircular or arcuate cross section.
The cross-sectional shape of the guide pin to be inserted into the through-hole is processed into the above semicircle or arc shape, and the rectangular punch or the straight line of the external die is formed. Since it has a structure in which it is arranged in contact with the part, it has an effect that the manufacture of the mold is easy.

According to a third aspect of the present invention, there is provided a die for punching a divided through-hole printed wiring board according to the first aspect, wherein the punch or the outer die and the guide pin are slidable with each other. In addition, the slidability allows the guide pin to be easily exchanged and the relative length between the punch or the outer die and the guide pin to be easily changed.

According to a fourth aspect of the present invention, there is provided the die for punching a divided through-hole printed wiring board according to the first aspect, wherein the tip of the guide pin has a smooth shell shape. It has the effect that even if there is a slight deviation between the position of the corresponding through-hole on the printed wiring board and the relative position between the guide pin and the guide hole, the contact pin does not cause a contact flaw on the inner wall of the through-hole. .

According to a fifth aspect of the present invention, there is provided a die for punching a divided through-hole printed wiring board according to the first aspect, wherein the length of the guide pin is longer than the length of the punch or the die. By increasing the length of the guide pin, the punch or punch has the effect of protecting the conductor plating on the inner wall of the through hole a moment before the punching of the printed wiring board begins.

According to a sixth aspect of the present invention, there is provided a die for punching a divided through-hole printed wiring board according to the first aspect, wherein a holding groove for a guide pin is provided on a side surface of a punch or an outer die. By forming the holding groove and mounting the guide pin in the groove, the processing of the shape of the guide pin is facilitated.

According to a seventh aspect of the present invention, there is provided a die for punching a divided through-hole printed wiring board according to the sixth aspect, wherein the guide pin has a circular cross section. By mounting a circular guide pin in the holding groove according to claim 6, there is an effect that the processing of the guide pin shape is facilitated.

According to an eighth aspect of the present invention, the radius of the circle or arc of the guide pin is set to be 0.01 to 0.03 mm smaller than the corresponding through hole diameter of the printed wiring board. It is a die for punching a divided through hole printed wiring board as described, and even if there is a slight misalignment between the position of the corresponding through hole in the printed wiring board and the relative position with the guide pin, it will guide the inner wall of the through hole. This has the effect of preventing contact scratches due to pins.

According to a ninth aspect of the present invention, the length of the guide pin is set to -1 to +1 m from the upper stripper plate.
6. The die for punching a divided through-hole printed wiring board according to claim 5, wherein the length of the stripper plate is generally 1.5 mm to 2. Since it is 0 mm long, it has the effect of smoothly removing the product after punching.

According to a tenth aspect of the present invention, there is provided a die for punching a lower die in a die for punching a divided through-hole printed wiring board formed by punching and cutting substantially the center of a through-hole of the printed wiring board. 2. A die for punching a divided through-hole printed wiring board in which a guide pin insertable into the through-hole is arranged in contact with a lower die outer shape part, and the invention according to claim 1 guides the upper die to a guide. The guide pins are placed in contact with the lower mold while the pins are placed in contact.When the printed wiring board is set in the mold, the guide pins are securely inserted into the through-holes in a stationary state. It is punched while protecting the conductor plating on the inner wall of the through-hole, so the through-hole can be formed vertically without peeling, cracking or tearing of the inner wall. It has the effect of dividing countercurrent.

According to an eleventh aspect of the present invention, there is provided a die for punching a divided through-hole printed wiring board according to the tenth aspect, wherein the cross-sectional shape of the guide pin is semicircular or arcuate. The invention according to claim 2 has a configuration in which the semi-circular or arc-shaped guide pin is arranged in contact with the upper mold, but is arranged in contact with the lower mold. Thus, the guide pin can be reliably inserted into the through-hole portion.

According to a twelfth aspect of the present invention, the tip of the guide pin has a smooth shell shape.
It is a die for punching a divided through hole printed wiring board described in, and even if there is a slight misalignment between the position of the corresponding through hole in the printed wiring board and the relative position with the guide pin, it penetrates in a stationary state The guide pin can be securely inserted into the through-hole, and the contact pin does not damage the inner wall of the through-hole.

According to a thirteenth aspect of the present invention, there is provided a die for punching a divided through-hole printed wiring board according to the tenth aspect, wherein a holding groove for a guide pin is provided in a punching die hole or a lower die outer side surface. It has a function of completely holding the guide pin with respect to the lower die.

According to a fourteenth aspect of the present invention, there is provided a die for punching a divided through-hole printed wiring board according to the tenth aspect, wherein the sectional shape of the guide pin is circular. Attaching the circular guide pin has an effect that the processing of the guide pin shape is facilitated.

According to a fifteenth aspect of the present invention, the radius of the guide pin is 0.01 to 0.03 mm smaller than the corresponding through-hole diameter of the printed wiring board. It is a die for punching a divided through hole printed wiring board as described, and even if there is a slight misalignment between the position of the corresponding through hole in the printed wiring board and the relative position with the guide pin, it will guide the inner wall of the through hole. This has the effect of preventing contact scratches due to pins.

According to the invention of claim 16 of the present invention, the length of the guide pin is 1 to 4 mm from the surface of the punched lower die hole.
11. A die for punching a divided through-hole printed wiring board according to claim 10 which is set to be long, and it is easy to set (position) the printed wiring board in the punching die, and the inner wall of the through-hole is also formed. It has the effect that it can be completely protected.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of an upper and lower mold for explaining a method of processing a divided through-hole wiring board using a punching die for a printed wiring board according to an embodiment of the present invention, and FIG. FIG. 3 is a cross-sectional view and a plan view of the mold, and FIG. 3 is a plan view and a cross-sectional view of the lower mold. 1 to 3, reference numeral 2 denotes an upper mold,
3 is a lower die, 2a is a punch for a rectangular hole, 2b is an outer die, 2c is an upper punch plate, 2d is an upper stripper plate, 2e is an upper backing plate,
2f is a guide pin having a circular cross section, 2g is a guide pin having a semicircular or arc cross section, 3a is a lower die,
3b is a lower die stripper plate, and 3c is a lower die holder.

First, as shown in FIGS. 1 and 2, a semicircular or arcuate guide pin 2g and an outer shape punching die 2b are installed so as to be in contact with the side surface of a punch 2a for a rectangular hole. The tip of the circular guide pin 2f thus incorporated is smoothly sharpened into a shell shape, and the length is longer by 2 mm than the outer die 2b (equivalent to the upper stripper plate 2d). This is important to protect the conductor plating on the inner wall of the through hole a moment before the punching of the printed wiring board begins.

The position where the guide pin is processed in the mold is the same coordinate as the position of the corresponding through hole in the printed wiring board.
The radius of the circular or arc-shaped guide pin is set to be 0.025 mm smaller than the radius of the corresponding through-hole. This is important so that even if there is a slight misalignment between the position of the corresponding through hole in the printed wiring board and the relative position of the guide pin, no contact flaw is generated on the inner wall of the through hole by the guide pin. The radius of the radius of the guide pins 2g and 2f to be processed on each plate of the mold is set to be 0.01 mm larger than the radius of the guide pins.

Further, when a divided through hole is formed by the punch 2a for a rectangular hole, an arc-shaped guide pin is used. The processing method of the arc-shaped guide pin is to finish the circular guide pin by polishing from one direction. In this case, as a method of assembling the arc-shaped guide pin 2g, the punch 2 is used to contact the punch 2a for a rectangular hole.
Delete the stepped portion of a. When the divided through hole is processed by the outer shape punching die 2b, a circular guide pin 2f is used. When the guide pins are arranged in contact with the outer shape punching die 2b, a method of assembling the guide pins by performing round hole processing on the punch plate 2c and fixing the guide pins is adopted.

In the above embodiment, the structure of the lower mold is as shown in FIG. 3, but as another embodiment, as shown in FIG. 4, the guide pins 2f, 2
It is also possible to arrange g.

[0035]

As described above, the present invention can provide a mold for a divided through-hole wiring board which obtains a highly reliable divided through-hole in which separation and cracking of the through-hole are prevented.
Since this is incorporated into a punching die for a normal printed wiring board, the processing can be completed simultaneously with the punching of a general round hole, square hole, or outer shape other than the divided portion of the through hole.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an assembling structure of a die for punching a divided through-hole wiring board according to an embodiment of the present invention.

FIG. 2 is an upper sectional view and a plan view of a die for punching a divided through-hole wiring board according to an embodiment of the present invention.

FIG. 3 is a plan view and a cross-sectional view of a lower die for punching a divided through-hole wiring board according to an embodiment of the present invention.

FIG. 4 is a sectional view of a lower die and an upper die of a punching die for a divided through-hole wiring board according to another embodiment of the present invention.

FIG. 5 is a perspective view of the printed wiring board, showing the printed wiring board in a pre-process in which divided through-hole processing is performed by a punching die;

FIG. 6 is a perspective view of a divided through-hole wiring board;

FIG. 7 is a sectional view of a punching die for a printed wiring board.

FIG. 8 is a perspective view of a divided through-hole wiring board when processed by a punching die for a divided through-hole wiring board according to a conventional method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 1a Insulating substrate 1b Conductor pattern 1c Divided through hole 1d Punched end face by rectangular punch 1e External punched end face 1f Through hole 1g Solder land 2 Upper die 2a Punch punch for rectangular hole 2b External punch die 2c Upper punch Plate 2d Upper stripper plate 2e Upper backing plate 2f Guide pin having a circular cross section 2g Guide pin having a semicircular or circular cross section 3 Lower die 3a Lower die 3b Lower stripper plate 3c Lower die holder

 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Masaru Sumikawa 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F term (reference) 3C060 BA01 BB12 BB14 BB19 BC02 BG02 5E317 AA24 AA26 BB02 BB12 CD31 CD32 GG09 GG16

Claims (16)

[Claims] 1. A divided through-hole printed wiring board comprising at least a punch, an outer die, and an upper die stripper plate, wherein substantially the center of a through-hole of the printed wiring board is formed by punching and cutting with the punch. In a punching die, a die for punching a divided through-hole printed wiring board, in which a guide pin insertable into said through-hole is placed in contact with a punch or an external die. 2. The die for punching a divided through-hole printed wiring board according to claim 1, wherein the sectional shape of the guide pin is a semicircle or an arc. 3. The die for punching a divided through-hole printed wiring board according to claim 1, wherein the punch or the outer die and the guide pin are slidable with respect to each other. 4. The die for punching a divided through-hole printed wiring board according to claim 1, wherein the tip of the guide pin has a smooth shell shape. 5. The die for punching a divided through-hole printed wiring board according to claim 1, wherein the length of the guide pin is longer than the length of the punch or punch. 6. The die for punching a divided through-hole printed wiring board according to claim 1, wherein a groove for holding a guide pin is provided on a side surface of the punch or punch. 7. The die for punching a divided through-hole printed wiring board according to claim 6, wherein the cross-sectional shape of the guide pin is circular. 8. A circle or an arc-shaped radius of the guide pin is set to 0.01 to more than a corresponding through-hole diameter of the printed wiring board.
2. The die for punching a divided through-hole printed wiring board according to claim 1, wherein the die is 0.03 mm smaller. 9. The die for punching a divided through-hole printed wiring board according to claim 5, wherein the length of the guide pin is longer by -1 to +1 mm than that of the upper die stripper plate. 10. A divided through-hole formed by punching and cutting substantially the center of a through-hole of a printed wiring board. A die for punching a divided through-hole printed wiring board in which guide pins that can be inserted into the board are placed in contact. 11. The die for punching a divided through-hole printed wiring board according to claim 10, wherein the cross-sectional shape of the guide pin is semicircular or arcuate. 12. The die for punching a divided through-hole printed wiring board according to claim 10, wherein the tip of the guide pin has a smooth shell shape. 13. The die for punching a divided through-hole printed wiring board according to claim 10, wherein a holding groove for a guide pin is provided in a punching die hole or an outer side surface of a lower die. 14. The die for punching a divided through-hole printed wiring board according to claim 10, wherein the cross-sectional shape of the guide pin is circular. 15. The circle or arc-shaped radius of the guide pin is set to be 0.01 to 0.01 mm larger than the diameter of the corresponding through hole of the printed wiring board.
The die for punching a divided through-hole printed wiring board according to claim 10, which is reduced by 0.03 mm. 16. The die for punching a divided through-hole printed wiring board according to claim 10, wherein the length of the guide pin is set to be 1 to 4 mm longer than the surface of the lower die die hole.