JP2005223266A - Manufacturing method of through-hole in end face of board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of through holes at the end face of a board by preventing production of cutting residue of a metallic plating layer at the inside of the through holes of the end face so as to avoid the production efficiency from being deteriorated. <P>SOLUTION: The printed circuit board 11 is cut by pressing a blade edge of a metallic die (not shown) along a cutting line A deviated from the center 12a of each through-hole 12 toward the center of the printed circuit board 11 by 0.1 to 0.2 mm to form each end face through-hole 15 to the end face of the printed circuit board 11. Since the blade edge of the metallic die crosses an inner circumferential face of each through-hole 12 at an obtuse angle α in this cutting, and the cutting stress in this case acts on each through-hole 12 in an outward direction resulting in that the metallic plating layer 13 sneaks away to the outside of each through-hole 12; no cutting residue of the metallic plating layer 13 is caused to the inside of each end face through-hole 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an end face through hole of a substrate for forming a semicircular end face through hole at an end of a printed wiring board or the like.

  Conventionally, for example, as shown in FIG. 2A, each through-hole 102 is formed in the substrate 101, and the metal plating layer 103 and each land pattern 104 on the inner peripheral surface of each through-through hole 102 are formed. The substrate 101 is cut by pressing a cutting edge (not shown) of a mold along a cutting line B that crosses the center 102a of each through-hole 102, and as shown in FIG. Each circular end face through-hole 105 was formed.

  However, since the die blade edge is pressed along the cutting line B crossing the center of the through-through hole 102, the inner peripheral surface of the through-through hole 102 and the blade edge of the die intersect at a right angle, and the metal is cut by the cutting stress at this time. The plating layer 103 escapes to the inside of the through through hole 102, and the uncut portion 103a of the metal plating layer 103 is generated inside the end face through hole 105.

  For this reason, a technique is proposed in which the through-hole 102 is filled with a resin to prevent the metal plating layer 103 from escaping inward, and then the substrate 101 is cut.

Further, a technique has been proposed in which the metal plating layer 103 on the inner peripheral surface of the through-hole 102 is cut in advance on the cutting line B of the substrate 101 and then the substrate 101 is cut. (See Patent Document 1).
Japanese Patent Laid-Open No. 10-12624

  However, when the through-hole 102 is filled with a resin as described above, an operation for removing the filled resin later must be performed, resulting in a decrease in production efficiency. In addition, when the metal plating layer 103 is cut in advance, the number of steps for the cutting increases, so that the production efficiency is also lowered.

  Accordingly, the present invention has been made in view of the above-described conventional problems, and the end face through hole of the substrate does not cause a metal plating layer not to be left inside the end face through hole and does not cause a reduction in production efficiency. An object is to provide a manufacturing method.

  In order to solve the above problems, the present invention forms a through-hole in a substrate, forms a metal plating layer on the inner peripheral surface of the through-through hole, and cuts the substrate along a cutting line crossing the through-through hole. In the method for manufacturing an end face through hole of a substrate in which a semicircular end face through hole is formed on the end face of the substrate, a cutting line crossing the through through hole passes through a position that is biased toward the center side of the substrate from the center of the through through hole. .

  According to the present invention, the through-through hole is cut along a cutting line that passes through a position that is biased toward the center of the substrate with respect to the center of the through-through hole. For this reason, the cutting edge of the mold used for this cutting and the inner peripheral surface of the through-through hole intersect at an obtuse angle, and the cutting stress at this time acts in the direction of the outside of the through-through hole, and the metal plating layer penetrates. Since it escapes to the outside of the through hole, the metal plating layer is not left uncut inside the end surface through hole.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  Fig.1 (a) is a top view which shows the board | substrate processed by Example 1 of the end surface through-hole manufacturing method of this invention. FIG. 1B is a plan view showing the processed substrate.

  In the manufacturing method of this embodiment, first, as shown in FIG. 1A, each through-hole 12 having a diameter of about 0.5 mm is formed on a printed wiring board 11 which is a copper-clad laminate, and each through-hole is formed. No electric field and chemical copper plating are applied to the entire surface of the printed wiring board 11 including the 12 inner peripheral surface. Thereby, the metal plating layer 13 is formed on the inner peripheral surface of each through-hole 12.

  Then, an etching resist for the circuit pattern is formed on the printed wiring board 11 by a tenting method, and the copper foil that is not protected by the etching resist is removed by etching to form land patterns 11a and the like on the surface of the printed wiring board 11. Further, a chemical resistant solder resist is printed, a symbol is printed, and the exposed surface of the copper foil is plated.

  Thereafter, a die cutting edge (not shown) is pressed along a cutting line A that is offset to the center side of the printed wiring board 11 by 0.1 to 0.2 mm from the center 12 a of each through-hole 12. The wiring board 11 is cut and each semicircular end face through hole 15 is formed on the end face of the printed wiring board 11 as shown in FIG.

  At the time of cutting, the cutting edge of the mold and the inner peripheral surface of each through-hole 12 intersect at an obtuse angle α, and the cutting stress at this time acts in the direction of the outside of each through-hole 12, and the metal plating layer Since 13 escapes to the outside of each through-hole 12, the metal plating layer 13 is not left behind inside each end face through-hole 15.

  In addition, this invention is not limited to the said Example, It can deform | transform variously. For example, although 0.5 mm is illustrated as the diameter of the through through hole, the diameter of the through through hole may be larger or smaller. Further, the deviation of the cutting line may be increased or decreased depending on the diameter of the through-through hole.

  Furthermore, the present invention can be applied to a through hole such as a single layer substrate, and the present invention is not limited by the material of the substrate or the metal plating layer.

(A) is a top view which shows the board | substrate processed by the end surface through-hole manufacturing method of an Example, (b) is a top view which shows the processed board | substrate. It is a top view which shows the board | substrate processed by the conventional manufacturing method, (b) is a top view which shows the processed board | substrate.

Explanation of symbols

11 Printed wiring board 12 Through-through hole 13 Metal plating layer 15 End face through-hole

Claims (1)

A through-hole is formed in the substrate, a metal plating layer is formed on the inner peripheral surface of the through-through hole, the substrate is cut along a cutting line crossing the through-through hole, and a semicircular end surface through-hole is formed on the substrate end surface. In the method of manufacturing the end face through hole of the substrate to be formed,
A method of manufacturing an end face through-hole of a substrate, wherein a cutting line crossing the through-through hole passes through a position deviating toward the center of the substrate from the center of the through-through hole.

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