JP5067062B2 - Printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board in which the problem of the deterioration of connection reliability in electrical connection can be resolved by reducing a generation amount of resin powder. <P>SOLUTION: In the printed wiring board which has a printed contact pattern for inserting a connector, a chamfered portion is formed at the resin edge of the printed wiring board, and a part of the pattern is patterned on the chamfered portion, and the chamfered portion of the pattern and the chamfered portion of the resin edge form a continuous surface. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a printed wiring board.

When the printed contact portion of the printed wiring board is connected to the connector, the connector comes into contact with the end portion of the substrate on which the printed contact portion is formed, and resin powder that is a base material of the printed wiring board is generated. In addition, when the printed contact portion of the printed wiring board is inserted into the connector, a concentrated load is applied to the end portion of the printed contact, and resin powder that is a base material of the printed wiring board is generated from the printed contact end portion. The generated resin powder adheres to the printed contact and may cause non-contact in the electrical connection between the printed contact and the connector.
As a prior art aiming at preventing a decrease in connection reliability between a printed contact and a connector, for example, there is an invention of Patent Document 1. As shown in FIG. 1, the method described in Patent Document 1 leaves a marginal margin 11 in the vicinity of the marginal portion 12 of the printed contact portion 15 of the printed wiring board 4 between the end surface and the marginal margin portion. The insertion guide part 1 which chamfered on the front and back both surfaces which go to the said end surface is arrange | positioned via. Therefore, the printed contact can be smoothly inserted into the connector, and the generation of resin powder from the resin end 30 is suppressed.

JP 2003-347698 A

  However, in the method described in Patent Document 1, since the chamfered portion 13 is formed only of a base material, the chamfered portion 13 and the printed contact of the resin end portion 30 are not inserted when the printed contact shown in FIG. There is a problem that resin powder is generated at the corner portion 10 ′ formed by the surface to be arranged. In particular, when the first contact portion with the connector is the base portion of the printed wiring board, the amount of resin powder generated is large. The resin powder adheres to the printed contact, leading to a decrease in connection reliability between the printed contact and the connector. This invention makes it a subject to provide the printed wiring board which reduces the generation amount of resin powder and solves the problem of the connection reliability fall at the time of electrical connection.

The present invention relates to the following.
1. In the printed wiring board having the connector contact printed contact pattern, the resin end portion of the printed wiring board has a chamfered portion, and a part of the pattern has a chamfered portion, and the chamfered portion of the pattern and the resin end portion A printed wiring board that forms a continuous surface with the chamfered part of the printed circuit board.
2. Item 2. The printed wiring board according to Item 1, wherein a part or all of the pattern having the chamfered portion is a printed contact pattern.
3. Item 3. The printed wiring board according to Item 1 or 2, wherein a part or all of the pattern having a chamfered portion is a dummy pattern.
4). Item 4. The printed wiring board according to Item 3, wherein the dummy pattern is a dummy pattern formed between the printed contact pattern and the resin end portion and continuously formed in a direction perpendicular to the connector insertion portion.

  According to the present invention, the connector is chamfered so that the printed contact portion can be smoothly inserted, and the generation amount of the resin powder is reduced by having a chamfered pattern, thereby reducing connection reliability at the time of electrical connection. A printed wiring board that solves the problem and a method for manufacturing the same were obtained. Furthermore, by forming a dummy pattern between the printed contact pattern and the resin end portion in a direction perpendicular to the connector insertion portion, metal burrs generated during chamfering of the dummy pattern can be reduced.

  First, the printed wiring board of the present invention can be produced by a normal method except that special chamfering is performed. For example, wiring and footprints are formed on a double-sided copper-clad laminate to produce an inner layer wiring board. Depending on the required number of layers, a prepreg is placed between the inner layer wiring boards and between the outer layer wiring forming copper foil and the inner layer wiring board, and heated and pressed to form. Next, through holes are provided in the multilayer wiring board formed as described above, and through hole copper plating is formed. Thereafter, wiring and footprints are formed. Next, using a method of selectively removing the solder resist, etc., an insulating coating of the wiring is performed. Thereafter, symbol marks representing the type and orientation of the mounted component are formed around the land and footprint. Further, the periphery of the wiring board is cut by router processing to form the outer shape.

The printed wiring board of the present invention is further chamfered on the resin edge and the pattern. The chamfering process is performed simultaneously on the resin end portion and the pattern. That is, the chamfering process is performed so that the chamfered portion of the resin end and the chamfered portion of the pattern are continuous, that is, the same surface is formed. Such a pattern may be partly or entirely a printed contact pattern or a dummy pattern, and is preferably a dummy pattern. In the case of the dummy pattern, it may be a continuous pattern (reference numeral 19 in FIG. 3 ) or a discontinuous pattern composed of a plurality of conductor portions (print contacts) (reference numeral 14 in FIG. 2 ). In the case of discontinuous patterns, there is a possibility that metal burrs may occur at the end of the chamfering direction of each conductor part during chamfering (the same number of metal burrs as the number of conductor parts). Since the portions are continuous, the occurrence of metal burrs is at most one, and therefore a continuous pattern is preferred. The surface formed by the chamfering process may be a flat surface or a curved surface. The chamfering process may be performed on a surface on which a pattern is not formed in addition to the pattern formation surface of the printed wiring board. As shown in FIG. 2, the chamfer angle α is an angle formed by the chamfered portions 10 and 13 and the upper side of the printed wiring board 4, and is preferably 15 to 30 ° C. Further, the chamfer width d is the width of the chamfered portion 10 as viewed from the upper surface, and is preferably 1 to 2 mm.

Example 1
A printed wiring board was manufactured as follows.
As shown in FIG. 4, by selectively removing the inner layer copper foil 18 of the double-sided copper clad laminate composed of the inner layer copper foil 18 and the insulating base material 7 by a subtractive method or the like, and forming a wiring or a footprint, Inner layer wiring board (I) was manufactured. Next, a plurality of inner layer wiring boards (II) and (III) were produced in the same manner as the inner layer wiring board (I). Furthermore, according to the required number of layers, the prepreg 17 is disposed between the inner layer wiring boards (I) to (III) and between the outer layer wiring forming copper foil and the inner layer wiring board, and is heated and pressed to be molded. . Next, the multilayer wiring board formed as described above is shown in FIG. 5 (I), and a through hole 3 including a heat radiating through hole shown in FIG. 5 (II) is provided. Thereafter, a copper plating portion shown in FIG. 5 (III) is provided. 6 was formed. Thereafter, the conductor composed of the copper foil 5 and the plated copper 6 was selectively removed by a subtractive method or the like, and the wiring 40 and the footprint 2 were formed as shown in FIG.

  Next, with respect to the wiring 40 shown in FIG. 5 (IV), a solder resist 8 is formed by screen printing of the solder resist 8 for the purpose of insulating coating, etc. The wiring 40 is covered with an insulating film by using a method of selectively removing the wiring (FIG. 5 (V)). Thereafter, the solder resist 8 is cured by ultraviolet irradiation or heating, and then the symbol mark 20 indicating the type and orientation of the mounted component shown in FIG. 5 (VI) is printed on the screen and directly drawn with ink by the ink jet method. Formed around the print. Further, the periphery of the wiring board was cut by router processing to form an outer shape, and a printed wiring board was obtained in which the printed contact pattern was positioned leaving a blank at the resin edge. Next, using a chamfering machine (Shoda Techtron Co., Ltd., ACM-650), chamfering was performed on the resin end portion (base material portion) 30 of the cut wiring board. The printed contact pattern (copper foil surface) 14 is also chamfered simultaneously. As shown in FIG. 2, the chamfered portion 13 of the resin end 30 and the chamfered portion 10 of the printed contact pattern 14 are chamfered at a chamfering angle of 20 ° and chamfered. A chamfered portion was continuously formed at 1.5 mm.

(Example 2)
As shown in FIG. 3, the printed wiring board 4 is produced and cut in the same manner as in Example 1 except that the dummy pattern 19 is formed between the printed contact pattern 14 and the resin end portion 30 with a blank at the resin end portion. did. Next, using a chamfering machine (Shoda Techtron Co., Ltd., ACM-650), chamfering is performed on the resin end portion (base material portion) 30 of the cut wiring board, and the chamfered portion 13 of the resin end portion 30 is formed. And the chamfered portion 10 of the dummy pattern 19 were continuously chamfered so as to form a chamfered portion at a chamfering angle of 20 ° and a chamfering width of 1.5 mm.

(Comparative Example 1)
As shown in FIG. 1, the printed wiring board 4 was produced and cut in the same manner as in Example 1 except that the printed contact pattern 14 was disposed at a position away from the resin end 30. Next, using a chamfering machine (Shoda Techtron Co., Ltd., ACM-650), the chamfering angle is 20 ° and the chamfering width is 1.5 mm only on the resin end portion (base material portion) 30 of the cut wiring board. And chamfered.

(Evaluation 1)
Resin powder and metal burrs in 86 printed contacts when the printed contact portion of the printed wiring board produced using the patterns shown in Examples 1 and 2 and Comparative Example 1 (FIGS. 1 to 3) is inserted into and removed from the connector 10 times. The occurrence location was confirmed. As a result, in Example 1, generation | occurrence | production of the resin powder was not confirmed as shown in Table 1 (0 places).

  In Example 2, there was no generation of resin powder (0 locations), and the generation of metal burrs was significantly reduced (1 location). On the other hand, in Comparative Example 1, the base material dropped off (resin powder) at the apex between the chamfered surface and the print contact surface when the print contact was inserted, and generation of resin powder was observed at 80 locations.

(Evaluation 2)
Confirmation of electrical connection in 1660 printed contacts when the printed wiring board printed contact portion created using the patterns shown in Examples 1 and 2 and Comparative Example 1 (FIGS. 1 to 3) is inserted into and removed from the connector 10 times. It was. As a result, as shown in Table 1, in Examples 1 and 2, no electrical connection failure was confirmed (both locations were 0). On the other hand, in Comparative Example 1, three insulation failures due to the resin powder were confirmed.

It is a schematic diagram which shows the printed contact part of a prior art (comparative example 1), (a) is a top view, (b) is a partial cross-sectional schematic diagram. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows Example 1 of this invention, (a) is a top view, (b) is a partial cross section schematic diagram. It is a schematic diagram which shows Example 2 of this invention, (a) is a top view, (b) is a partial cross section schematic diagram. It is a cross-sectional schematic diagram (1) which shows the manufacturing method of a printed wiring board. It is a cross-sectional schematic diagram (2) which shows the manufacturing method of a printed wiring board.

Explanation of symbols

1: Insertion guide part 2: Footprint 3: Through hole 4: Printed wiring board 5: Copper foil 6: Copper plating part (plated copper)
7: Insulating base material 8: Solder resist 9: Through-hole land 10: Pattern chamfered portion 10 ': Corner portion 11: Peripheral portion 12: Perimeter margin portion 13: Chamfered portion of resin end portion 14: Print contact pattern 15: Print Contact 16: Insertion surface to connector 17: Pre-preg 18: Inner layer copper foil 19: Dummy pattern 20: Symbol mark 21: Inner layer substrate 30: Resin end 40: Wiring

Claims (4)

In the printed wiring board having a connector contact printed contact pattern, the resin end of the printed wiring board has a chamfered portion, and a part of the pattern has a chamfered portion, and the chamfered portion of the pattern and the resin end portion A chamfered portion is a printed wiring board that forms a continuous surface ,
All of the pattern having the chamfered portion is a dummy pattern,
The dummy pattern is located between a plurality of printed contact patterns formed discontinuously in the vertical direction with respect to the connector insertion portion and the resin end portion, and is formed integrally and continuously in the vertical direction with respect to the connector insertion portion. Printed wiring board. The printed wiring board of Claim 1 whose chamfering angle formed by the said chamfering part and the upper surface of the said printed wiring board is 15-30 degrees. The printed wiring board according to claim 1 or 2, wherein a width of the chamfered portion as viewed from the upper surface of the printed wiring board is 1 to 2 mm. A method for producing a printed wiring board according to claim 1,
  A plurality of printed contact patterns are formed discontinuously in the direction perpendicular to the connector insertion part,
  Between the printed contact pattern and the resin end portion, leaving a blank at the resin end portion, forming an integrated dummy pattern that is continuous in the vertical direction with respect to the connector insertion portion,
  The printed wiring board manufacturing method, wherein the chamfered portion of the resin end portion and the chamfered portion of the dummy pattern are chamfered so as to continuously form a chamfered portion.

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