JP2006203118A - Flexible printed wiring board - Google Patents

Flexible printed wiring board Download PDF

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Publication number
JP2006203118A
JP2006203118A JP2005015389A JP2005015389A JP2006203118A JP 2006203118 A JP2006203118 A JP 2006203118A JP 2005015389 A JP2005015389 A JP 2005015389A JP 2005015389 A JP2005015389 A JP 2005015389A JP 2006203118 A JP2006203118 A JP 2006203118A
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Prior art keywords
wiring board
printed wiring
flexible printed
reinforcing plate
mounting
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Pending
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JP2005015389A
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Japanese (ja)
Inventor
Tsukasa Konno
司 今野
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Priority to JP2005015389A priority Critical patent/JP2006203118A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which reduces component mounting defects when mounting electronic components on the flexible printed wiring board. <P>SOLUTION: On the flexible printed wiring board, a reinforcing plate used as a carrier in mounting electronic components is stuck, a plurality of cross-shaped through-holes are provided on the reinforcing plate, thickness of the reinforcing plate is 0.3 to 5 mm, and further, the reinforcing plate is constituted of an epoxy resin impregnant glass fabric substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、フレキシブルプリント配線板に関する。   The present invention relates to a flexible printed wiring board.

近年の電子機器の高密度化に伴い、これに用いられるプリント配線板に搭載される電子部品の小型化が進んできており、フレキシブルプリント配線板（以下ＦＰＣともいう）においても、電子部品の小型化と共に、基板の小型化及び薄型化が進んでいる。又電子機器の多機能化に伴い機器内部の使用部品点数が増加し、それらの部品同士との接続や部品搭載が可能なＦＰＣの需要は拡大している。   With recent increases in the density of electronic devices, electronic components mounted on printed wiring boards used in the electronic devices have been miniaturized, and even in flexible printed wiring boards (hereinafter also referred to as FPCs), electronic components are becoming smaller. Along with this trend, miniaturization and thinning of the substrate are progressing. In addition, as the number of electronic devices has increased, the number of components used inside the devices has increased, and the demand for FPCs that can be connected to each other and mounted can be increased.

ＦＰＣへの部品搭載は、リフローソルダリングによる表面実装方法を用いることが多くなってきている。しかし、ＦＰＣは軽薄化であるものの部品実装時にはそれが問題となることもあった。即ち、薄い基板であるため、ＦＰＣ上に部品を搭載すると部品の重量でＦＰＣの平滑性が十分でないため、電子部品の位置ズレ等の実装不良が発生することがあった。また、部品実装も自動化が進み、連続的に部品を搭載し、リフローする方式が採られているが、ＦＰＣは、薄くて腰がないため、搬送中に脱落したり、折れシワ等が発生したりと問題があった。   For mounting components on the FPC, a surface mounting method using reflow soldering is increasingly used. However, although the FPC is thin, it sometimes becomes a problem when mounting components. That is, since a thin substrate is used, mounting a component on the FPC may cause insufficient mounting due to the weight of the component, and the smoothness of the FPC may be insufficient. In addition, automation of component mounting has progressed so that components are continuously mounted and reflowed. However, since FPC is thin and has no waist, it may fall off during transportation or bend and wrinkle. There was a problem.

そのため、電子部品を搭載する際に、ＦＰＣの腰のなさを補うためリフローソルダリング時の前記補強板をキャリアの機能を兼ね合わせることを目的とし、前記補強板の上にフレキシブルプリント配線板を貼り合わせて、実装する方法などがある（例えば特許文献１）。
しかし、ＦＰＣよりも大きな面積の補強板を使うことが多くリフローソルダリング中の熱のため、補強板が反るという問題があり、これが電子部品の実装不良の原因となることがあった。
特開平１０−０６５３２０号公報 For this reason, when mounting electronic parts, the flexible printed wiring board is pasted on the reinforcing plate for the purpose of combining the reinforcing plate at the time of reflow soldering with the function of the carrier in order to compensate for the lack of elasticity of the FPC. In addition, there is a method of mounting (for example, Patent Document 1).
However, a reinforcing plate having an area larger than that of the FPC is often used, and there is a problem that the reinforcing plate is warped due to heat during reflow soldering, which may cause a mounting failure of an electronic component.
Japanese Patent Laid-Open No. 10-065320

本発明は、上記事情に鑑みてなされたものであり、部品実装不良の少ないフレキシブルプリント配線板を提供することを目的とする。   This invention is made | formed in view of the said situation, and it aims at providing the flexible printed wiring board with few component mounting defects.

本発明によれば、電子部品を搭載する際に、キャリアとして用いる補強板が貼り合わせられたフレキシブルプリント配線板であって、前記補強板には複数の十字形状の貫通孔が設けられているフレキシブルプリント配線板が提供される。   According to the present invention, there is provided a flexible printed wiring board to which a reinforcing plate used as a carrier is bonded when mounting an electronic component, wherein the reinforcing plate is provided with a plurality of cross-shaped through holes. A printed wiring board is provided.

本発明に係るフレキシブルプリント配線板は、部品実装を行う際に用いられる回路基板である。補強板に十字形状の貫通孔が設けられているため、リフロー時の熱で補強板に反りなどが発生したとき、孔で反りの歪みを低減することができる。   The flexible printed wiring board according to the present invention is a circuit board used when component mounting is performed. Since the reinforcing plate is provided with a cross-shaped through hole, when the reinforcing plate warps due to heat during reflow, warping distortion can be reduced by the hole.

また、前記補強板の厚さは、０．３〜５ｍｍの厚さとしてもよい。さらには、前記補強板は、エポキシ樹脂含浸ガラス布基材を用いてもよい。   The thickness of the reinforcing plate may be 0.3 to 5 mm. Furthermore, an epoxy resin impregnated glass cloth base material may be used for the reinforcing plate.

本発明により、部品実装不良の少ないフレキシブルプリント配線板を提供することができる。   According to the present invention, a flexible printed wiring board with few component mounting defects can be provided.

以下、フレキシブルプリント配線板について図面をもちいて説明する。なお、すべての図面において、共通する構成要素には同一符号を付し、以下の説明において詳細な説明を適宜省略する。   Hereinafter, the flexible printed wiring board will be described with reference to the drawings. In all the drawings, common constituent elements are denoted by the same reference numerals, and detailed description will be appropriately omitted in the following description.

本実施形態に係るフレキシブルプリント配線板８００は、図１に示すように、電子部品を搭載する際に、キャリアとして用いる補強板４００が貼り合わせられたフレキシブルプリント配線板８００であって、補強板４００には複数の十字形状の貫通孔２００が設けられている。   As shown in FIG. 1, a flexible printed wiring board 800 according to the present embodiment is a flexible printed wiring board 800 to which a reinforcing plate 400 used as a carrier is attached when an electronic component is mounted. Are provided with a plurality of cross-shaped through holes 200.

補強板４００には、十字形状の貫通孔２００が複数個設けられている。十字形状の貫通孔２００の大きさは、補強板４００の大きさと、その一方の面側に貼着されている回路基板３００の大きさによって決めればよい。一方向の長さは、５ｍｍ以上が好ましい。そうすることにより、部品実装時の加熱による補強板４００の変形を十字形状の貫通孔２００で吸収することができる。   The reinforcement plate 400 is provided with a plurality of cross-shaped through holes 200. The size of the cross-shaped through hole 200 may be determined by the size of the reinforcing plate 400 and the size of the circuit board 300 attached to one surface side thereof. The length in one direction is preferably 5 mm or more. By doing so, deformation of the reinforcing plate 400 due to heating during component mounting can be absorbed by the cross-shaped through-hole 200.

十字形状の貫通孔２００の加工方法としては、金型を用いた打抜き、ＮＣルータなどが用いられる。補強板４００の厚さが、１．６mmを超えるとＮＣルータで加工する方が好ましい。また、十字形状の貫通孔２００の占める範囲は、補強板面積全体の２％以上１０％以下が好ましい。この範囲内にあると反りに対する効果が期待できる。   As a method of processing the cross-shaped through hole 200, punching using a mold, NC router, or the like is used. When the thickness of the reinforcing plate 400 exceeds 1.6 mm, it is preferable to process with a NC router. Further, the range occupied by the cross-shaped through hole 200 is preferably 2% to 10% of the entire reinforcing plate area. If it is within this range, an effect on warping can be expected.

補強板４００の材質は、耐熱性の面からエポキシ樹脂含浸ガラス布基材（以下ＥＬ板と言うことがある）を用いることが好ましい。フェノール樹脂含浸紙基材（以下ＰＬ板と言うことがある）、フェノール樹脂成形品、エポキシ樹脂成形品等の熱硬化性樹脂、ガラス板などを用いてもよい。   The material of the reinforcing plate 400 is preferably an epoxy resin-impregnated glass cloth substrate (hereinafter sometimes referred to as an EL plate) from the viewpoint of heat resistance. A thermosetting resin such as a phenol resin-impregnated paper base (hereinafter sometimes referred to as a PL plate), a phenol resin molded product, an epoxy resin molded product, or a glass plate may be used.

補強板４００の厚さは、０．３ｍｍ以上５ｍｍ以下好ましい。この範囲内にある厚さの補強板４００を用いることにより電子部品の実装を効率よく行うことができる。   The thickness of the reinforcing plate 400 is preferably 0.3 mm or more and 5 mm or less. By using the reinforcing plate 400 having a thickness within this range, electronic components can be mounted efficiently.

回路基板３００とキャリアとして用いる補強板４００の貼り付け方法は、回路基板３００と、補強板４００に予め加工された穴１００を基準として、φ１ｍｍ〜φ６ｍｍ程度のガイドピンにより位置固定することが好ましい。ガイドピン径や数の設定は、製品間隔により任意で配置してもよい。   A method of attaching the circuit board 300 and the reinforcing plate 400 used as a carrier is preferably fixed with a guide pin having a diameter of about 1 mm to 6 mm on the basis of the circuit board 300 and the hole 100 previously processed in the reinforcing board 400. The guide pin diameter and number may be arbitrarily set depending on the product interval.

フレキシブルプリント配線板８００の製造方法として、例えばポリイミドフィルム基材に接着剤を介して銅箔が積層された素材を用いて、一般的なフレキシブルプリント配線板の製造方法に沿って回路作成を行う。   As a manufacturing method of the flexible printed wiring board 800, for example, using a material in which a copper foil is laminated on a polyimide film base material with an adhesive, a circuit is created along a general manufacturing method of a flexible printed wiring board.

次に、導体回路面に表面被覆を行う。ここで用いる表面被覆は、回路作成された素材で用いられているものと同様なポリイミドフィルムの片面に、接着剤が積層されたものが好ましい。導体回路面には、部品実装するための開口部を設けておく。必要に応じて、めっきなどの表面処理を施してもよい。   Next, surface coating is performed on the conductor circuit surface. The surface coating used here is preferably one in which an adhesive is laminated on one side of a polyimide film similar to that used for a circuit-formed material. An opening for mounting components is provided on the conductor circuit surface. If necessary, surface treatment such as plating may be performed.

両面フレキシブルプリント配線板や、導体回路が２層以上ある、多層フレキシブルプリント配線板についても同様である。更に、実装するに適した方形サイズの基板に切断し、多数個整列させた製品の外形周囲にあたる位置に、貫通孔の加工をする事で、製品外形部に空隙部を有するフレキシブルプリント配線板８００を製造する。貫通孔の形成は、ＮＣルータを用いて加工してもよいし、トムソン型や金型などで抜き加工してもよい。   The same applies to a double-sided flexible printed wiring board and a multilayer flexible printed wiring board having two or more layers of conductor circuits. Furthermore, a flexible printed wiring board 800 having a gap in the outer shape of the product is formed by cutting through holes at positions corresponding to the outer periphery of the product that is cut into a square-sized substrate suitable for mounting and arranged in a large number. Manufacturing. The formation of the through hole may be processed using an NC router, or may be punched using a Thomson mold or a mold.

本実施形態によるフレキシブルプリント配線板Flexible printed wiring board according to this embodiment

符号の説明Explanation of symbols

１００ 基準穴
２００ 十字形状の貫通孔
３００ 回路基板
４００ 補強板
８００ フレキシブルプリント配線板



100 Reference hole 200 Cross-shaped through hole 300 Circuit board 400 Reinforcement plate 800 Flexible printed wiring board



Claims (3)

電子部品を搭載する際に、キャリアとして用いる補強板が貼り合わせられたフレキシブルプリント配線板であって、前記補強板には複数の十字形状の貫通孔が設けられていることを特徴とするフレキシブルプリント配線板。   A flexible printed wiring board to which a reinforcing plate used as a carrier is attached when mounting an electronic component, wherein the reinforcing plate is provided with a plurality of cross-shaped through holes. Wiring board. 前記補強板の厚さは、０．３〜５ｍｍの厚さである請求項１に記載のフレキシブルプリント配線板。   The flexible printed wiring board according to claim 1, wherein the reinforcing plate has a thickness of 0.3 to 5 mm. 前記補強板は、エポキシ樹脂含浸ガラス布基材からなる請求項１または２に記載のフレキシブルプリント配線板。

The flexible printed wiring board according to claim 1, wherein the reinforcing plate is made of an epoxy resin-impregnated glass cloth base material.

JP2005015389A 2005-01-24 2005-01-24 Flexible printed wiring board Pending JP2006203118A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107567179A (en) * 2017-08-25 2018-01-09 维沃移动通信有限公司 A kind of surface mount method, flexible circuit board member and mobile terminal
CN109051026A (en) * 2018-06-27 2018-12-21 无锡积捷光电材料有限公司 Stiffening plate precision sticking patch jig
CN109688691A (en) * 2017-11-16 2019-04-26 苏州旭创科技有限公司 Flexible circuit board, optical transceiver module and optical module
US10801090B2 (en) 2013-01-22 2020-10-13 Baoshan Iron & Steel Co., Ltd. Ultra high obdurability steel plate having low yield ratio and process of manufacturing same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054536U (en) * 1991-07-04 1993-01-22 日本メクトロン株式会社 Flexible circuit board with reinforcing plate
JPH06204654A (en) * 1993-01-06 1994-07-22 Nec Corp Densely mounted printed circuit board
JPH08222820A (en) * 1995-02-13 1996-08-30 Sony Corp Reinforcing plate of printed wiring board
JP2000151060A (en) * 1998-11-09 2000-05-30 Fujitsu Ten Ltd Mounting structure for electronic parts
JP2000228566A (en) * 1999-02-04 2000-08-15 Matsushita Electric Ind Co Ltd Aggregate printed-wiring board
JP2002232197A (en) * 2001-02-06 2002-08-16 Matsushita Electric Ind Co Ltd Electronic component mounting method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054536U (en) * 1991-07-04 1993-01-22 日本メクトロン株式会社 Flexible circuit board with reinforcing plate
JPH06204654A (en) * 1993-01-06 1994-07-22 Nec Corp Densely mounted printed circuit board
JPH08222820A (en) * 1995-02-13 1996-08-30 Sony Corp Reinforcing plate of printed wiring board
JP2000151060A (en) * 1998-11-09 2000-05-30 Fujitsu Ten Ltd Mounting structure for electronic parts
JP2000228566A (en) * 1999-02-04 2000-08-15 Matsushita Electric Ind Co Ltd Aggregate printed-wiring board
JP2002232197A (en) * 2001-02-06 2002-08-16 Matsushita Electric Ind Co Ltd Electronic component mounting method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10801090B2 (en) 2013-01-22 2020-10-13 Baoshan Iron & Steel Co., Ltd. Ultra high obdurability steel plate having low yield ratio and process of manufacturing same
CN107567179A (en) * 2017-08-25 2018-01-09 维沃移动通信有限公司 A kind of surface mount method, flexible circuit board member and mobile terminal
CN109688691A (en) * 2017-11-16 2019-04-26 苏州旭创科技有限公司 Flexible circuit board, optical transceiver module and optical module
CN109688691B (en) * 2017-11-16 2020-09-25 苏州旭创科技有限公司 Flexible circuit board, optical transceiver module and optical module
CN109051026A (en) * 2018-06-27 2018-12-21 无锡积捷光电材料有限公司 Stiffening plate precision sticking patch jig

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