JP2000228566A - Aggregate printed-wiring board - Google Patents
Aggregate printed-wiring boardInfo
- Publication number
- JP2000228566A JP2000228566A JP2756299A JP2756299A JP2000228566A JP 2000228566 A JP2000228566 A JP 2000228566A JP 2756299 A JP2756299 A JP 2756299A JP 2756299 A JP2756299 A JP 2756299A JP 2000228566 A JP2000228566 A JP 2000228566A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- individual
- collective
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、複数の個別プリン
ト配線板を有する集合プリント配線板に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collective printed wiring board having a plurality of individual printed wiring boards.
【０００２】[0002]
【従来の技術】近年の半導体技術分野における急速な発
展により、プリント配線基板の高密度実装が進んでお
り、また半導体部品等の実装効率を高めるため、複数の
個別プリント配線板を有する集合プリント配線板が一般
的になってきた。また耐熱性や高周波特性及びスルーホ
ールの小径化へのレーザー加工対応に適していることか
ら、従来のガラスエポキシ基材に代わってアラミド不織
布基材を用いたプリント配線板の採用も年々増加してき
た。2. Description of the Related Art Due to rapid development in the field of semiconductor technology in recent years, high-density mounting of printed wiring boards has been promoted, and collective printed wiring having a plurality of individual printed wiring boards in order to improve the mounting efficiency of semiconductor components and the like. Boards are becoming more common. In addition, the use of printed wiring boards using aramid nonwoven substrates instead of the conventional glass epoxy substrates has been increasing year by year because they are suitable for laser processing for heat resistance, high frequency characteristics and through-hole diameter reduction. .
【０００３】さらに、ボールグリッドアレイ（以下ＢＧ
Ａと称す）やチップスケールパッケージ（以下ＣＳＰと
称す）等の半導体部品の実装も増加しており、それらに
用いられるプリント配線板も高密度、高精度および高耐
熱性を要求されるようになってきた。したがって部品実
装工程におけるプリント配線板の反りやねじれに対する
許容値も低く設定されるようになってきた。Further, a ball grid array (hereinafter referred to as BG)
A) and the mounting of semiconductor components such as chip-scale packages (hereinafter referred to as CSP) are increasing, and printed wiring boards used for them are also required to have high density, high precision and high heat resistance. Have been. Therefore, the tolerance for the warpage or twist of the printed wiring board in the component mounting process has been set low.
【０００４】以下に従来のプリント配線板について説明
する。[0004] A conventional printed wiring board will be described below.
【０００５】図４は、従来の集合プリント配線板を示す
簡略図である。図４において、１１は集合プリント配線
板、１２は回路パターン及び導通孔としてのビアホール
が形成された半導体部品実装部として個別プリント配線
板、１３は外枠部、１４は外枠部の両面に形成された補
強用ダミーパターンであり、個別プリント配線板１２の
回路パターンと同時に、エッチングにより形成する。従
来は集合プリント配線板１１の個別プリント配線板１２
に半導体部品を実装したのち、個片の個別プリント配線
板に金型等の手段を用いて分離していた。従来は上記の
補強用ダミーパターン１４により、プリント配線基板の
剛性を保持し、反りやねじれの軽減を図っていた。FIG. 4 is a simplified diagram showing a conventional collective printed wiring board. In FIG. 4, 11 is a collective printed wiring board, 12 is an individual printed wiring board as a semiconductor component mounting portion having a circuit pattern and a via hole as a conductive hole, 13 is an outer frame portion, and 14 is formed on both sides of the outer frame portion. The reinforcing dummy pattern is formed by etching simultaneously with the circuit pattern of the individual printed wiring board 12. Conventionally, individual printed wiring boards 12 of collective printed wiring boards 11
After mounting the semiconductor components on the individual printed wiring boards, the individual printed wiring boards are separated from each other by means such as a mold. Conventionally, the rigidity of the printed wiring board is maintained by the above-described reinforcing dummy pattern 14 to reduce warpage and twist.
【０００６】[0006]
【発明が解決しようとする課題】上記プリント配線板の
補強用ダミーパターンにおいては、回路パターンの表裏
面のパターン幅や厚みによる剛性及び回路パターンやソ
ルダレジスト総面積の相違と、基材自体の残留応力並び
に基材とパターンの伸縮差から、部品実装時に熱により
プリント配線板の表と裏において伸縮差が発生する。そ
の結果プリント配線板の反り、ねじれの発生が避けられ
ず、ＢＧＡやＣＳＰの実装において不具合が生じる可能
性があり、さらに反り、ねじれの発生を低減させる必要
があった。In the above-mentioned reinforcing dummy pattern for a printed wiring board, differences in rigidity and the total area of the circuit pattern and solder resist due to the pattern width and thickness of the front and back surfaces of the circuit pattern, and the residual of the base material itself. Due to the stress and the difference in expansion and contraction between the substrate and the pattern, a difference in expansion and contraction occurs between the front and back of the printed wiring board due to heat during component mounting. As a result, the occurrence of warpage and twist of the printed wiring board is inevitable, and there is a possibility that a failure may occur in mounting the BGA or CSP, and it is necessary to further reduce the occurrence of warpage or twist.
【０００７】本発明は上記従来の課題を解決するもの
で、反りやねじれをより低減し、安定した実装工程を実
現できる集合プリント配線板を提供することを目的とす
るものである。An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a collective printed wiring board which can further reduce warpage and twist and realize a stable mounting process.
【０００８】[0008]
【発明が解決するための手段】上記課題を解決するため
に本発明は、複数の個別プリント配線板と外枠を有する
集合プリント配線板において、前記個別プリント配線板
の外周形状に沿ったスリットを形成した集合プリント配
線板を提供し、これにより反りやねじれを低減し安定し
た実装工程を実現できるものである。According to the present invention, there is provided a collective printed wiring board having a plurality of individual printed wiring boards and an outer frame, wherein a slit is formed along an outer peripheral shape of the individual printed wiring boards. It is intended to provide a formed collective printed wiring board, which can reduce warpage and twist and realize a stable mounting process.
【０００９】[0009]
【発明の実施の形態】本発明の請求項１に記載の発明
は、複数の個別プリント配線板と外枠を有する集合プリ
ント配線板において、前記個別プリント配線板の外周形
状に沿ったスリットを形成した集合プリント配線板とし
たものであり、個別プリント配線板の外周形状に沿って
形成されたスリットにより集合プリント配線板の残留応
力を分断することにより反りやねじれを低減するという
作用を有するものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, in a collective printed wiring board having a plurality of individual printed wiring boards and an outer frame, a slit is formed along the outer peripheral shape of the individual printed wiring boards. It has a function of reducing warping and twisting by dividing the residual stress of the collective printed wiring board by slits formed along the outer peripheral shape of the individual printed wiring board. is there.
【００１０】本発明の請求項２に記載の発明は、個別プ
リント配線板の外周に形成したスリットの総長を前記個
別プリント配線板の外周総長の９０〜９５％とした請求
項１に記載の集合プリント配線板としたものであり、個
別プリント配線板の外周総長の９０〜９５％のスリット
により集合プリント配線板の残留応力を効率的に分断す
ることにより反りやねじれを低減するという作用を有す
るものである。The invention according to claim 2 of the present invention is the assembly according to claim 1, wherein the total length of the slits formed on the outer periphery of the individual printed wiring board is 90 to 95% of the total outer length of the individual printed wiring board. A printed wiring board which has an effect of reducing warping and twisting by efficiently dividing residual stress of a collective printed wiring board by slits of 90 to 95% of the total outer length of an individual printed wiring board. It is.
【００１１】本発明の請求項３に記載の発明は、個別プ
リント配線板の外周に少なくとも４点の支持部を設けた
請求項１に記載の集合プリント配線板としたものであ
り、複数の個別プリント配線板と外枠を連結し、スリッ
トを効率的に形成することができるという作用を有す
る。According to a third aspect of the present invention, there is provided a collective printed wiring board according to the first aspect, wherein at least four support portions are provided on the outer periphery of the individual printed wiring board. It has an effect that the printed wiring board and the outer frame are connected, and the slit can be efficiently formed.
【００１２】本発明の請求項４に記載の発明は、個別プ
リント配線板外周の角部に支持部を設けた請求項３に記
載の集合プリント配線板としたものであり、集合プリン
ト配線板の残留応力を効率的に分断し、かつ個別プリン
ト配線板が外枠及び他の個別プリント配線板の反りやね
じれ影響を受けにくいという作用を有するものである
る。According to a fourth aspect of the present invention, there is provided the collective printed wiring board according to the third aspect, wherein a support portion is provided at a corner of the outer periphery of the individual printed wiring board. This has the effect of efficiently dividing the residual stress and making the individual printed wiring board less susceptible to warping and twisting of the outer frame and other individual printed wiring boards.
【００１３】本発明の請求項５に記載の発明は、プリン
ト配線板がビアホールを有する可撓性基材で構成されて
いる請求項１に記載の集合プリント配線板としたもので
あり、実装時の熱による反りやねじれが著しいフレキシ
ブルプリント配線板のようなビアホールを有する可撓性
基材で構成された集合プリント配線板の反りやねじれに
有効であるという作用を有する。According to a fifth aspect of the present invention, there is provided the collective printed wiring board according to the first aspect, wherein the printed wiring board is formed of a flexible base material having via holes. Is effective for warping and twisting of a collective printed wiring board composed of a flexible base material having a via hole such as a flexible printed wiring board in which warping and twisting due to heat are remarkable.
【００１４】本発明の請求項６に記載の発明は、プリン
ト配線板がアラミド不織布に樹脂を含浸した基材で構成
されている請求項１に記載の集合プリント配線板とした
ものであり、高耐熱かつレーザー加工性に優れるアラミ
ド不織布基材を用いたプリント配線板の反りやねじれの
低減に有効であるという作用を有する。According to a sixth aspect of the present invention, there is provided a collective printed wiring board according to the first aspect, wherein the printed wiring board is formed of a base material in which aramid nonwoven fabric is impregnated with a resin. It has an effect that it is effective in reducing warpage and twist of a printed wiring board using an aramid nonwoven fabric base material having excellent heat resistance and laser workability.
【００１５】本発明の請求項７に記載の発明は、支持部
の少なくとも片面に個別プリント配線板の領域に侵入し
ない範囲で導体が形成された請求項３に記載の集合プリ
ント配線板としたものであり、基材厚みが薄いプリント
配線板において個別プリント配線板と外枠及び他のプリ
ント配線板との連結において一定の強度を保ち、プリン
ト配線板の製造工程や部品実装工程途中における個別プ
リント配線板の分離を防止するという作用を有する。According to a seventh aspect of the present invention, there is provided the collective printed wiring board according to the third aspect, wherein a conductor is formed on at least one surface of the support portion so as not to enter the area of the individual printed wiring board. In a printed wiring board with a thin base material, a certain strength is maintained in the connection between the individual printed wiring board and the outer frame or another printed wiring board, and the individual printed wiring is performed during the manufacturing process of the printed wiring board and the component mounting process. It has the effect of preventing separation of the plates.
【００１６】（実施の形態１）以下、本発明の実施形態
におけるプリント配線板について、図面を参照しながら
説明する。(Embodiment 1) Hereinafter, a printed wiring board according to an embodiment of the present invention will be described with reference to the drawings.
【００１７】図１は本発明の集合プリント配線板を示す
図、図２は本発明の個別プリント配線板の断面図、図３
は本発明の集合プリント配線板を示す要部拡大図であ
る。図１〜図３において、１は集合プリント配線板、２
はＣＳＰ基板としての個別プリント配線板、３は外枠、
４はスリット、５は支持部、５ａは角部、６は支持部上
の導体、７は回路パターン、８はソルダレジスト、９は
ビアホール、１０は基材である。FIG. 1 is a view showing a collective printed wiring board of the present invention, FIG. 2 is a sectional view of an individual printed wiring board of the present invention, and FIG.
FIG. 2 is an enlarged view of a main part showing the collective printed wiring board of the present invention. 1 to 3, reference numeral 1 denotes a collective printed wiring board;
Is an individual printed wiring board as a CSP board, 3 is an outer frame,
4 is a slit, 5 is a support, 5a is a corner, 6 is a conductor on the support, 7 is a circuit pattern, 8 is a solder resist, 9 is a via hole, and 10 is a base material.
【００１８】図１において、集合プリント配線板１はＣ
ＳＰ基板としての個別プリント配線板２が複数と外枠
３、スリット４、並びに支持部５で構成されている。In FIG. 1, the collective printed wiring board 1 is C
An individual printed wiring board 2 as an SP substrate includes a plurality, an outer frame 3, a slit 4, and a support 5.
【００１９】スリット４は金型による打ち抜きやルータ
加工等の手段により個別プリント配線板２の外周に形成
されており、その総長は個別プリント配線板２の外周総
長の９０〜９５％であることが望ましい。９０％以下の
場合は反りやねじれの低減効果が低く、９５％以上のス
リットを形成すると個別プリント配線板２と外枠３及び
他の個別プリント配線板との連結の強度が弱くなり、プ
リント配線板の製造工程や部品実装工程中に個別プリン
ト配線板が分離、脱落する可能性がある。The slit 4 is formed on the outer periphery of the individual printed wiring board 2 by means such as punching with a mold or router processing, and the total length thereof is 90 to 95% of the total outer length of the individual printed wiring board 2. desirable. If it is 90% or less, the effect of reducing warpage and twist is low. If a slit of 95% or more is formed, the strength of connection between the individual printed wiring board 2 and the outer frame 3 and other individual printed wiring boards is reduced, and printed wiring is reduced. There is a possibility that the individual printed wiring boards will be separated and fall off during the board manufacturing process and the component mounting process.
【００２０】本発明は、図２の断面に示すようにアラミ
ド不織布にエポキシ樹脂を含浸した可撓性を有する厚み
０．１〜０．２ｍｍの薄手の基材１０にレーザー加工等
より貫通孔を施した後導電ペーストを充填し、ビアホー
ル８を形成した個別プリント配線板の反りやねじれの低
減に有効である。According to the present invention, as shown in the cross section of FIG. 2, a through hole is formed in a thin 0.1 to 0.2 mm thick thin base material 10 having an aramid nonwoven fabric impregnated with an epoxy resin by laser processing or the like. After the application, the conductive paste is filled, which is effective for reducing the warpage and twist of the individual printed wiring board in which the via hole 8 is formed.
【００２１】また上記の薄手かつ可撓性を有する基材を
用いた場合、支持部５は個別プリント配線板２の角部５
ａに形成することが望ましく、さらに他の個別プリント
配線板や外枠３との連結の強度を図るため、図３に示す
ような支持部５の表裏に導体６を個別プリント配線板２
の領域に侵入しない範囲で形成することが可能である。When the above-mentioned thin and flexible base material is used, the support portion 5 is provided at the corner portion 5 of the individual printed wiring board 2.
It is desirable to form the conductor 6 on the front and back of the support portion 5 as shown in FIG. 3 in order to increase the strength of connection with another individual printed wiring board or the outer frame 3.
Can be formed in a range that does not enter the region.
【００２２】本発明の集合プリント配線板の部品実装面
にＢＧＡやＣＳＰ等の半導体部品をはんだ付けした結
果、反りやねじれによる不具合を解消することができ
た。As a result of soldering a semiconductor component such as a BGA or a CSP to the component mounting surface of the collective printed wiring board of the present invention, it was possible to eliminate the problem caused by the warpage and the twist.
【００２３】[0023]
【発明の効果】以上のように本発明は、従来の集合プリ
ント配線板の反りやねじれを低減し、ＢＧＡやＣＳＰに
対して安定した実装工程を実現できる効果を奏するもの
であるる。As described above, the present invention has the effect of reducing the warpage and twist of the conventional collective printed wiring board and realizing a stable mounting process for BGA and CSP.
【図１】本発明の集合プリント配線板を示す図FIG. 1 shows a collective printed wiring board of the present invention.
【図２】本発明の個別プリント配線板の断面図FIG. 2 is a sectional view of an individual printed wiring board of the present invention.
【図３】本発明の集合プリント配線板を示す要部拡大図FIG. 3 is an enlarged view of a main part showing the collective printed wiring board of the present invention.
【図４】従来の集合プリント配線板の簡略図FIG. 4 is a simplified diagram of a conventional collective printed wiring board.
１ 集合プリント配線板 ２ 個別プリント配線板 ３ 外枠 ４ スリット ５ 支持部 ５ａ 角部 ６ 支持部上の導体 ７ 回路パターン ８ ソルダレジスト ９ ビアホール １０ 基材 DESCRIPTION OF SYMBOLS 1 Collective printed wiring board 2 Individual printed wiring board 3 Outer frame 4 Slit 5 Support part 5a Corner part 6 Conductor on a support part 7 Circuit pattern 8 Solder resist 9 Via hole 10 Base material
Claims (7)
る集合プリント配線板において、前記個別プリント配線
板の外周形状に沿ったスリットを形成した集合プリント
配線板。1. A collective printed wiring board having a plurality of individual printed wiring boards and an outer frame, wherein a slit is formed along an outer peripheral shape of the individual printed wiring board.
リットの総長を前記個別プリント配線板の外周総長の９
０〜９５％とした請求項１に記載の集合プリント配線
板。2. The total length of the slit formed on the outer periphery of the individual printed wiring board is set to 9 times the total outer length of the individual printed wiring board.
The collective printed wiring board according to claim 1, wherein the content is 0 to 95%.
けた請求項１に記載の集合プリント配線板。3. The collective printed wiring board according to claim 1, wherein a support portion is provided on an outer periphery of the individual printed wiring board.
を設けた請求項３に記載の集合プリント配線板。4. The collective printed wiring board according to claim 3, wherein a support portion is provided at a corner on the outer periphery of the individual printed wiring board.
撓性基材で構成されている請求項１に記載の集合プリン
ト配線板。5. The collective printed wiring board according to claim 1, wherein the printed wiring board is formed of a flexible base material having a via hole.
を含浸した基材で構成されている請求項１に記載の集合
プリント配線板。6. The collective printed wiring board according to claim 1, wherein the printed wiring board is formed of a base material in which aramid nonwoven fabric is impregnated with a resin.
配線板の領域に侵入しない範囲で導体が形成された請求
項３に記載の集合プリント配線板。7. The collective printed wiring board according to claim 3, wherein a conductor is formed on at least one surface of the support portion so as not to enter the area of the individual printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2756299A JP2000228566A (en) | 1999-02-04 | 1999-02-04 | Aggregate printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2756299A JP2000228566A (en) | 1999-02-04 | 1999-02-04 | Aggregate printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000228566A true JP2000228566A (en) | 2000-08-15 |
Family
ID=12224487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2756299A Pending JP2000228566A (en) | 1999-02-04 | 1999-02-04 | Aggregate printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000228566A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076530A (en) * | 2000-09-05 | 2002-03-15 | Matsushita Electric Ind Co Ltd | Printed circuit board and its manufacturing method |
| JP2002190488A (en) * | 2000-12-20 | 2002-07-05 | Hitachi Ltd | Method for manufacturing semiconductor device and the semiconductor device |
| JP2006203118A (en) * | 2005-01-24 | 2006-08-03 | Sumitomo Bakelite Co Ltd | Flexible printed wiring board |
| JP2007266113A (en) * | 2006-03-27 | 2007-10-11 | Kyocera Corp | Manufacturing method for electronic-component mounting substrate |
| JP2009289848A (en) * | 2008-05-28 | 2009-12-10 | Ngk Spark Plug Co Ltd | Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board |
| JP2010021564A (en) * | 2009-09-18 | 2010-01-28 | Tdk Corp | Collective substrate and manufacturing method therefor |
| JP2010177592A (en) * | 2009-01-30 | 2010-08-12 | Tdk Corp | Electronic component built-in substrate, manufacturing method thereof, and inspection method therefor |
| US8002542B2 (en) | 2006-07-14 | 2011-08-23 | Renesas Electronics Corporation | Heat treatment jig and heat treatment jig set |
| US8024857B2 (en) | 2008-11-07 | 2011-09-27 | Hynix Semiconductor Inc. | Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same |
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