JP5513983B2 - Assembly board - Google Patents

Description

  The present invention relates to a collective substrate.

  Conventionally, in order to efficiently perform component mounting and soldering on a plurality of circuit boards, component mounting and soldering have been collectively performed on one collective board including the plurality of circuit boards.

  As shown in FIG. 7, the collective substrate P is connected to a plurality of circuit boards 120 arranged in parallel with a gap S therebetween, and to each end of the circuit board 120 in a direction orthogonal to the parallel arrangement direction. And a pair of connection plates 130 that connect the circuit boards 120. And the dividing line Y for dividing each circuit board 120 from connection board 130 is formed in the boundary of each circuit board 120 and connection board 130, and after the above-mentioned component mounting and soldering are performed, Each circuit board 120 is individually divided by the aggregate board P being folded along the dividing line Y. Here, the dividing line Y is formed of a pair of V-shaped grooves Y1 and Y2 that are formed on one surface and the other surface of the collective substrate P and face each other in the thickness direction of the collective substrate P, as shown in FIG. .

  When the collective substrate P is folded along the dividing line Y, as shown in FIG. 9, the circuit board 120 is bent in the thickness direction, so that the circuit board 120 and the electronic component mounted on the circuit board are obtained. There is a possibility that cracks may occur in the solder (connecting portion) that connects to 121, and the circuit board 120 is bent in the thickness direction, so that bending stress is generated in the electronic component 121, and the electronic component 121 is deformed. There is also a possibility that the electronic component 121 may break down.

Therefore, as shown in FIG. 10, in the vicinity of the electronic component 121 mounted on the circuit board 120, there is provided a collective board Q provided with a notch 120a in a region including a part of the dividing line Y (for example, Patent Document 1). The aggregate substrate Q is intended to disperse bending stress generated in the vicinity of the electronic component 121 by the cutout portion 120a when being folded. The notch 120a prevents the solder at the connecting portion of the electronic component 121 from cracking, and further suppresses bending stress applied to the electronic component 121 to prevent the failure of the electronic component 121. Is.

Further, as the assembly substrate to prevent failure of the electronic components, as shown in FIG. 11, a multilayer ceramic chip capacitor (electronic component) 102, a ceramic substrate 103, a metal terminal 104, is that a circuit board 105 For example (see Patent Document 2). More specifically, a multilayer chip ceramic capacitor 102 that is easily deformed by a bending stress and is likely to fail is mounted on one surface of the ceramic substrate 103, and two U-shapes are formed between the other surface of the ceramic substrate 103 and the circuit substrate 105. The metal terminal 104 is interposed. That is, the ceramic substrate 103 on which the multilayer chip ceramic capacitor 102 is mounted is supported on the circuit substrate 105 by the two metal terminals 104. Then, two metal terminals 104, when the set board is split folding reduces the bending stress generated in the ceramic substrate 103 by deforming with the deflection of the circuit board 105, suppressing the bending of the ceramic substrate 103 To do. Thus, the bending stress applied to the multilayer chip ceramic capacitor 102 from the ceramic substrate 103 is suppressed to prevent a failure of the multilayer chip ceramic capacitor 102.

JP 2004-31777 A JP-A-9-266125

  However, in the collective substrate Q provided with the notch 120a, the structure of the punching die when forming the collective substrate Q is complicated by providing the notch 120a, and the cost for manufacturing the die increases. There was a problem such as.

Further, in the set board with two metal terminals 104, there is a problem becomes higher component height on the circuit board 105 by providing the metal terminal 104.

  The present invention has been made in view of the above-mentioned reasons, and its object is to increase the height of electronic components mounted on a circuit board without complicating the shape of a punching die when forming a collective substrate. It is an object of the present invention to provide a collective substrate capable of separating circuit boards while suppressing the increase in height and preventing the occurrence of cracks and failure of electronic components in a connection part of electronic components.

In order to solve the above problems, the collective board of the present invention is a collective board in which a plurality of circuit boards are formed so as to be individually separable along a dividing line, and the circuit board comprises a printed board and the printed board. A protected component which is mounted on the printed circuit board and forms an electric circuit together with the printed circuit board, and a protected component which is mounted on the printed circuit board and does not form the electric circuit, and the protected component and the protected component are The shortest distance from the connection portion between the protective component and the printed circuit board to the dividing line is longer than the shortest distance from the connection portion between the protective component and the printed circuit board to the dividing line, and Each of the longest distance from the connection part with the printed circuit board to the dividing line is shorter than the longest distance from the connection part between the protective component and the printed circuit board to the dividing line. It is instrumentation, the protection component, the printed harder than the substrate, and provided with a plurality of terminals, characterized by connecting the printed circuit board and the terminal part in the connection.

  In the collective substrate, it is preferable that the circuit board has the protected component mounted on one surface of the printed board and the protective component mounted on the other surface.

  Moreover, in this collective substrate, it is preferable that the said protection component opposes the said to-be-protected component through this printed circuit board in the thickness direction of the said printed circuit board.

  Further, in this collective substrate, the printed circuit board is formed with a wiring pattern constituting the electric circuit, the protected component is connected to a first land formed on the wiring pattern, and the protective component is The printed circuit board is preferably connected to a second land formed independently from the wiring pattern.

Further, the printed circuit board, the wiring pattern constituting the electrical circuit is formed, the protection component is preferably connected to a point at the same potential to each other before Symbol wiring patterns a plurality of said pin portion.

  The present invention does not complicate the shape of the punching die when forming the collective substrate, suppresses the increase in the height of the electronic component mounted on the circuit board, and prevents cracks in the connection part of the electronic component. There is an effect of providing a collective substrate capable of separating circuit boards while preventing generation and failure of electronic components.

The principal part enlarged view of the aggregate substrate in Embodiment 1 of this invention is shown. A side view of the collective substrate is shown. The schematic of the aggregate substrate of another form in the same as the above is shown. The schematic diagram of the aggregate substrate in Embodiment 2 of the present invention is shown. The schematic diagram of the aggregate substrate in Embodiment 3 of the present invention is shown. The schematic in another form of the collective board in the same as the above is shown. The schematic of the collective board in a prior art example is shown. The principal part enlarged view of the aggregate substrate in the same as the above is shown. A side view of the collective substrate is shown. The schematic of the aggregate substrate of another form in the same as the above is shown. The side view of the aggregate substrate of another form same as the above is shown.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
The collective substrate A of this embodiment will be described with reference to FIGS. In the following description, the vertical and horizontal directions in FIG. 1 are used as a reference, and the direction perpendicular to the vertical and horizontal directions is the front and rear direction.

The collective substrate A of the present embodiment is connected to a rectangular plate-like circuit board 1 arranged in parallel in the vertical direction via gaps (slits) 3 and ends in the left-right direction of the circuit boards 1. It is comprised from the connection board 2 which connects between the board | substrates 1. FIG. A linear dividing line X along the vertical direction is formed at the boundary between each circuit board 1 and the connection plate 2.

  As illustrated in FIG. 1, the circuit board 1 includes a printed board 11 having a substantially rectangular plate shape on which a wiring pattern 110 is formed, an electronic component (protected component) 12 mounted on the printed board 11, and the electronic component 12. And a dummy component (protective component) 13 mounted in the vicinity.

The printed circuit board 11 is formed in a rectangular plate shape that is long in the left-right direction from the paper base phenolic resin laminate. Then, on the front surface of the printed circuit board 11, a pair of lands 14L, 14R are arranged in the lateral direction, the pair of lands 14 L, 1 4R, the wiring pattern 110 (110L, 110R) with different potentials from each other in Each is connected. The pair of lands 14L and 14R are referred to as lands 14 when the land 14L is formed on the left side and the land 14R is formed on the right side on the printed circuit board 11 and the lands 14L and 14R are not distinguished from each other. Then, a wiring pattern 110 that lands 14L is connected to the wiring pattern 110L, a wiring pattern 110 that land 14R is connected to the wiring pattern 110R, when there is no need to distinguish between the wiring pattern 110 L, 1 10R is referred to as a wiring pattern 110.

In addition, a pair of lands 15 L and 15 R for mounting the dummy component 13 are arranged in parallel in the left-right direction above the pair of lands 14 L and 14 R to be independent (insulated) from the wiring pattern 110. Yes. The lands 15L and 15R are referred to as lands 15 when the lands 15L are formed on the left side and the lands 15R are formed on the right side, and the lands 15L and 15R are not distinguished from each other.

  Here, in the present embodiment, a pair of lands 14L and 14R are provided between a straight line L11 parallel to the dividing line X and passing through the right end of the land 15L and a straight line L21 parallel to the dividing line X and passing through the left end of the land 15R. Each is formed.

  The electronic component 12 is a rectangular chip monolithic ceramic capacitor, and terminal portions 121L and 121R are formed on the short sides along the short sides. Here, as an example of the electronic component 12, a so-called 1608 size component having a long side of 1.6 mm and a short side of 0.8 mm is used.

  The electronic component 12 is mounted on the printed circuit board 11 and constitutes an electric circuit together with the wiring pattern 110 by soldering the terminal portions 121L and 121R to the pair of lands 14L and 14R on the printed circuit board 11, respectively. . That is, the electronic component 12 is mounted on the printed circuit board 11 with its longitudinal direction being along the left-right direction. In FIG. 1, only a part of the circuit board 1 (left end side) is shown, and only a part of the electric circuit is shown. However, the electric circuit is not shown in FIG. It is also formed in the range of the substrate 1.

  The dummy component 13 is formed of a rectangular alumina-based chip jumper having a longitudinal dimension larger than that of the electronic component 12, and terminal portions 131 </ b> L and 131 </ b> R are formed on each short side along the short side. Yes. Here, as an example of the dummy component 13, a so-called 3216 size chip jumper having a long side of 3.2 mm and a short side of 1.6 mm is used.

  The dummy component 13 is mounted on the printed circuit board 11 by soldering the terminal portions 131L and 131R to the pair of lands 15L and 15R on the printed circuit board 11, respectively. That is, like the electronic component 12, the dummy component 13 is mounted on the printed circuit board 11 with its longitudinal direction aligned with the left-right direction.

  As a result, the electronic component 12 and the dummy component 13 are arranged side by side along the dividing line X (up and down) on the printed board 11. Here, since the terminal parts 131L and 131R are connected to the pair of lands 15L and 15R that are insulated and independent from the wiring pattern 110, the dummy component 13 does not constitute the electric circuit.

  The shortest distance M1 from the solder (connecting portion) 16 that connects the electronic component 12 and the printed board 11 to the dividing line X is the dividing line from the solder (connecting portion) 17 that connects the dummy component 13 and the printed board 11. It is longer than the shortest distance M2 to X (M1> M2). The shortest distances M1 and M2 represent the shortest distances from the dividing line X to the solders 16 and 17 in the direction orthogonal to the dividing line X (left-right direction).

  The longest distance M3 from the solder 16 connecting the electronic component 12 and the printed board 11 to the dividing line X is longer than the longest distance M4 from the solder 17 connecting the dummy part 13 and the printed board 11 to the dividing line X. short. The longest distances M3 and M4 indicate the longest distances from the dividing line X to the solders 16 and 17 in the direction orthogonal to the dividing line X (left and right direction).

  That is, the electronic component 12 is parallel to the dividing line X formed in a straight line along the vertical direction (along the vertical direction) and between the straight lines L1 and L2 passing through the solder 17 used when the dummy component 13 is mounted. Has been implemented.

  In the collective board A of the present embodiment having the above-described configuration, each circuit board 1 is individually separated from the connection plate 2 and separated when the collective board A is folded along the dividing line X. At that time, as shown in FIG. 2, the circuit board 1 is bent by being stressed in the thickness direction. However, since the dummy component 13 made of an alumina base is harder than the printed board 11 made of a paper base phenolic resin laminate, the printed board 11 is less bent in the vicinity of the place where the dummy part 13 is mounted. In particular, the bending of the printed circuit board 11 is suppressed between the straight lines L1 and L2, the bending stress is prevented from being applied to the electronic component 12 mounted between the straight lines L1 and L2, and the deformation of the electronic component 12 is suppressed. Thus, failure of the electronic component 12 can be prevented.

  Moreover, since the bending stress with respect to the electronic component 12 is suppressed, it is possible to prevent the solder 16 that connects the terminal portions 121L and 121R of the electronic component 12 and the lands 14L and 14R from being cracked.

Further, the collective substrate A of the present embodiment does not require the formation of the cutout portion 120a as shown in FIG. 10 with respect to the circuit board 1, so that the mold for forming the collective substrate A is complicated. It can be prevented, and the cost for manufacturing the mold can be reduced.

  Furthermore, in the collective board A of the present embodiment, it is not necessary to interpose the metal terminal 104 as shown in FIG. 11 between the printed board 11 and the electronic component 12, so that it is mounted on the printed board 11. The component height of the component can be suppressed.

  Further, as described above, the dummy component 13 is connected to the independent lands 15L and 15R by being insulated from the electric circuit composed of the printed circuit board 11 and the electronic component 12. Accordingly, when the aggregate substrate A is folded, even if the dummy component 13 is broken due to deformation or the solder 17 connecting the dummy component 13 and the land 15 is cracked, the electric circuit is affected. There is nothing.

In the above embodiment, the short sides (right and left ends) in the ends of the terminal portion 1 31L of dummy parts 13, 131R are respectively formed in the pin portion 1 31L, 131R is not connected by solder 17 to the printed circuit board 11 It was. However, as shown in FIG. 3, the end terminal part 1 31L, instead of forming 131R, the ends of the terminal portion 1 3a may be formed respectively on each long side of the dummy parts 13 (upper and lower ends). In that case, the shortest distance M1 from the solder 16 connecting the terminal portion 121L of the electronic component 12 and the printed circuit board 11 to the dividing line X is determined from the solder 17 connecting the terminal portion 13a of the dummy component 13 and the printed circuit board 11. What is necessary is just to make it larger than the shortest distance M5 to the parting line X (M1> M5).

The longest distance M3 from the solder 16 connecting the terminal part 121R of the electronic component 12 and the printed board 11 to the dividing line X is divided from the solder 17 connecting the terminal part 13a of the dummy part 13 and the printed board 11. What is necessary is just to make it smaller than the longest distance M6 to the disconnection X (M3 <M6).

  In the present embodiment, the size of the electronic component 12 is a so-called 1608 size, and the size of the dummy component 13 is a so-called 3216 size. However, the size is not limited to this.

(Embodiment 2)
The collective substrate B of this embodiment will be described with reference to FIG.

  The collective substrate B of the present embodiment is that the dummy component 13 is mounted on the wiring pattern 110L to which one terminal portion (left terminal in the present embodiment) 121L of the electronic component 12 is connected. Different from substrate A. Since other configurations are the same as those in the first embodiment, the same reference numerals are given and description thereof is omitted.

In collective substrate B of this embodiment, the wiring patterns 110L of the left ends of the terminal portion 1 21L of the electronic component 12 is connected solder is extended further toward the dummy parts 13 side (upper side) from the connection point. The wiring pattern 110L is extended and then widened in the left-right direction to form a widened portion 110a, and the dummy component 13 is mounted on the widened portion 110a.

Then, dummy parts 13, a pair of ends of the terminal portion 1 31L, 131R are connected by Handa 1 7 each widened portion 110a. That is, dummy parts 13, a pair of ends of the terminal portion 1 31L, 131R has been short-circuited are connected to portions to be Oite same potential to the wiring pattern 11 0L.

  Accordingly, when the collective board B is folded, even if cracks occur in the solder 17 connecting the respective terminal portions 131L and 131R and the printed board 11, or even if the dummy component 13 breaks down due to deformation, the electronic component 12 And the operation of the electric circuit composed of the wiring pattern 110 is not affected.

  Further, since the dummy component 13 is mounted (soldered) on the wiring pattern 110L, it is not necessary to separately provide a land for mounting the dummy component 13 on the circuit substrate 1, so that the size of the circuit substrate 1 is reduced. Can be small. For example, when a land for mounting the dummy component 13 is separately provided on the printed board 11, it is necessary to insulate the wiring pattern 110 to which the electronic component 12 is connected from the land to which the dummy component 13 is connected. For this reason, it is necessary to provide a predetermined creepage distance between the wiring pattern 110 and the land, and the size of the printed circuit board 11 is increased.

  On the other hand, in this embodiment, since the dummy component 13 is mounted on a part of the wiring pattern 110, it is not necessary to provide the creeping distance, and the distance between the electronic component 12 and the dummy component 13 is reduced. And the size of the circuit board 1 can be suppressed.

(Embodiment 3)
The collective substrate C of this embodiment will be described with reference to FIG.

As shown in FIGS. 5A and 5B, the collective substrate C of the present embodiment is mounted on the surface (rear surface) opposite to the surface (front surface) on which the dummy component 13 is mounted. point being is different from the aggregate board a of the first embodiment. Since other configurations are the same as those in the first embodiment, the same reference numerals are given and description thereof is omitted.

In the collective board C of the present embodiment, the dummy components 13 are placed at positions opposite to each other (the printed board 11) across the printed board 11 from the position where the dummy component 13 is mounted on the collective board A of the first embodiment (the front surface of the printed board 11). Is implemented on the rear side). In other words, the rear surface of the printed circuit board 11, lands 15 L, 1 5R is arranged in the lateral direction, the pair of lands 15L, the 15R, each end terminal part of the dummy parts 13 1 31 L, 1 31R solder respectively 17 is connected.

Further, on the front surface of the printed circuit board 11, a pair of lands 14L, 14L, between a straight line L11 parallel to the dividing line X and passing through the right end of the land 15L and a straight line L21 parallel to the dividing line X and passing through the left end of the land 15R 14R is formed. Then, the pair of lands 14L, the 14R, each end terminal part 1 21L of the electronic component 12, 121R are connected by respective solder 16.

  Here, as in the first embodiment, the shortest distance M1 from the solder 16 connecting the electronic component 12 and the printed board 11 to the dividing line X is the dividing line from the solder 17 connecting the dummy component 13 and the printed board 11. It becomes larger than the shortest distance M2 to X (M1> M2).

  The longest distance M3 from the solder 16 connecting the electronic component 12 and the printed board 11 to the dividing line X is longer than the longest distance M4 from the solder 17 connecting the dummy part 13 and the printed board 11 to the dividing line X. small.

  That is, the electronic component 12 is mounted between the straight lines L1 and L2 passing through the solder 17 for mounting the dummy component 13 parallel to the dividing line X (along the vertical direction).

  Therefore, the printed board 11 is less bent near the portion where the dummy component 13 is mounted. In particular, the bending of the printed circuit board 11 is suppressed between the straight lines L1 and L2, and bending stress can be suppressed from being applied to the electronic component 12 mounted between the straight lines L1 and L2, thereby suppressing deformation of the electronic component 12. Thus, failure of the electronic component 12 can be prevented.

  Moreover, since the bending stress with respect to the electronic component 12 is suppressed, it is possible to prevent the solder 16 that connects the terminal portions 121L and 121R of the electronic component 12 and the lands 14L and 14R from being cracked.

  Further, the land 14 to which the electronic component 12 is connected is formed on the front surface of the printed circuit board 11, and the land 15 to which the dummy component 13 is connected is formed on the rear surface of the printed circuit board 11, so that the land 14 and the land 15 are vertically aligned. There is no need to provide a creepage distance for insulation. Therefore, the distance between the electronic component 12 and the dummy component 13 can be reduced, and the size of the circuit board 1 in the vertical direction can be suppressed.

  Further, for example, as shown in FIG. 6, the electronic component 12 and the dummy component 13 can be mounted to face each other via the printed board 11, and the vertical direction of the circuit board 11 can be achieved by mounting as described above. The size at can be made smaller.

  Further, for example, as shown in FIG. 5C, when the circuit board 1 is stored in the housing 4, the front surface of the circuit board 1 is close to the inner wall of the housing 4, and the circuit board 1 side from the inner wall. Even if the reinforcing rib 4a protruding to the side is formed, the reinforcing rib 4a does not interfere with the dummy component 13.

1 circuit board 2 connecting plate 3 gap 11 printed circuit board
1 2 Electronic parts (protected parts)
13 Dummy parts (protective parts)
14 (14 L, 14 R) Land (first land)
15 (15 L, 15 R) Land (second land)
16 Solder (connection part)
17 Solder (connection part )
110 (110L, 110R) wiring pattern
1 31 L, 1 31R Terminal section L1 straight line (first straight line)
L2 straight line (second straight line)

Claims (5)

A plurality of circuit boards formed so as to be individually separable along a dividing line,
The circuit board includes a printed circuit board, a protected component that is mounted on the printed circuit board and forms an electric circuit together with the printed circuit board, and a protective component that is mounted on the printed circuit board and does not configure the electric circuit,
The protected part and the protective part have a shortest distance from a connection part between the protected part and the printed circuit board to the dividing line, from a connection part between the protective part and the printed circuit board to the dividing line. It is longer than the shortest distance, and further, the longest distance from the connection part between the protected component and the printed board to the dividing line is longer than the longest distance from the connection part between the protective part and the printed board to the dividing line. Each of the protective components is harder than the printed circuit board and includes a plurality of terminal portions, and the terminal portions and the printed circuit board are connected by the connection portions. A collective board characterized by   2. The collective substrate according to claim 1, wherein the circuit board has the protected component mounted on one surface of a printed circuit board and the protective component mounted on the other surface.   3. The collective substrate according to claim 2, wherein the protective component faces the protected component through the printed board in the thickness direction of the printed board. The printed circuit board is formed with a wiring pattern constituting the electric circuit,
The protected component is connected to a first land formed on the wiring pattern,
The collective substrate according to claim 1, wherein the protective component is connected to a second land formed independently of the wiring pattern on the printed circuit board. The printed circuit board is formed with a wiring pattern constituting the electric circuit,
The protection component, assembly substrate according to any one of claims 1 to 3, characterized in that connected before Symbol wiring patterns a plurality of said pin portion in place is a same potential.

Images