JP4361325B2 - Mounting substrate manufacturing method, electronic component mounting method, mounted substrate inspection method, mounted substrate dividing method, reinforcing substrate, and multilayer substrate - Google Patents

Description

  The present invention relates to a mounting substrate manufacturing method, an electronic component mounting method, a mounted substrate inspection method, a mounted substrate dividing method, a reinforcing substrate, and a laminated substrate.

  A mounting board (printed wiring board) for mounting LSIs and other electronic components is formed by bonding a copper foil to an insulating board and pattern etching to form a conductive pattern, as described in Patent Document 1, for example. After forming the through hole, etc., it is formed by punching into a product size by press working.

  However, in the above press working, generally, the error of the press position (relative deviation from the wiring pattern of the mounting board) is as large as about 0.5 mm or less. For this reason, it is necessary to use this error dimension from the outer edge of the mounting substrate as a clearance margin as a prohibited area for forming a wiring pattern.

  In recent electronic devices, in order to reduce the size, thickness, and size of devices, it is required to reduce the size, thickness, and size of mounting boards mounted on these devices. Compression is essential.

In order to reduce the thickness of the mounting substrate and further improve the economy, an aggregate substrate is formed by integrating a plurality of mounting substrates in a plane, and a plurality of mounting substrates are taken from one integrated substrate to reduce the number of mounting substrates. There are known ways to increase it.
However, in the above method, since the strength is reduced by making the mounting substrate thinner, the mounting substrate is likely to vibrate due to an external impact or the like when a large-sized collective substrate is used. When mounting electronic components on a collective board, the mounting board easily vibrates due to vibrations and shocks from the mounting machine and transporter, and the mounted electronic components are likely to drop off and the mounting position may become misaligned. .

  Therefore, an insulating substrate (also referred to as a backing substrate, referred to as a reinforcing substrate in this specification) having a strength stronger than that of the collective substrate on the back surface of the collective substrate in which a plurality of mounting substrates are integrated in a plane. A method is known in which the entire assembly substrate is reinforced by bonding to the entire surface and punched out to a predetermined size by pressing.

However, this method can only be applied when mounted on a single-sided board, and it requires a special process such as masking of adhesive to facilitate separation from the reinforcing board when divided into individual mounting boards. Further, since punching is performed by press working, it is difficult to reduce the manufacturing cost because a clearance margin is necessary.
Furthermore, in the above manufacturing method, after the collective substrate is divided into individual mounting substrates, it is necessary to perform a process such as mounting or inspection for each individual mounting substrate, and there is a problem that handling is low. .

  Further, as described in Patent Document 2, a collective substrate is formed that is arranged by being arranged in parallel with a space between a plurality of mounting substrates, and is used for reinforcement with an adhesive in a region that is the space. A method is known in which a substrate is bonded, and a V-shaped groove is provided and divided along the V-shaped groove.

However, in this method, since a space is provided between a plurality of mounting substrates, the problem is that the economy is low and the manufacturing cost is high, and the stress applied to the substrate and the mounted electronic components during V-groove processing is reduced. There was a problem of requiring a clearance margin from the divided outer edge.
JP 2002-26518 A JP-A-6-132627

  The problem to be solved is that a conventional method of manufacturing a mounting board that divides a collective board in which a plurality of mounting boards are integrated in a plane requires a clearance margin, so that a wiring pattern or mounting is performed with respect to the board outer dimensions. The arrangement of electronic components is limited, the effective area of the substrate is reduced, the handleability is low, and the production cost is difficult to suppress.

  The mounting substrate manufacturing method of the present invention includes a step of forming a collective substrate in which a plurality of mount substrates are integrated in a planar manner through a cutting margin, a plate thickness thicker than the collective substrate, and at least the cut substrate. Forming a reinforcing substrate in which a through opening is formed so as to leave a support having a width wider than the margin at a portion corresponding to the margin; and the support of the margin of the aggregate substrate and the reinforcing substrate. A step of bonding the collective substrate and the reinforcing substrate so that the portions overlap each other, and a step of cutting the collective substrate along the cutting margin and dividing it into individual mounting substrates.

  The above-described method for manufacturing a mounting board according to the present invention forms a collective substrate in which a plurality of mounting boards are integrated in a planar manner through a cutting margin, and on the other hand, has a thicker plate thickness than the collective substrate, and at least the above-mentioned A reinforcing substrate having a through opening formed so as to leave a support portion having a width wider than the cut margin at a portion corresponding to the cut margin is formed. Next, the collective substrate and the reinforcing substrate are bonded together so that the margin of the collective substrate overlaps with the support portion of the reinforcing substrate, and the collective substrate is cut along the cut margin to be divided into individual mounting substrates.

Further, the electronic component mounting method of the present invention includes a collective substrate in which a plurality of mounting substrates are integrated in a plane via cut margins, and a thickness greater than that of the collective substrate, at least in the cut margin. A reinforcing substrate in which a through opening is formed so as to leave a support portion wider than the cut margin at a corresponding portion, so that the cut margin of the collective substrate and the support portion of the reinforcing substrate overlap. bonded together is, formed by dividing the aggregate substrate is cut into individual mounting substrate along the cutting white, for a plurality of said mounting substrate which is Awa bonded to the reinforcing substrate, the mounting substrate is the A step of mounting an electronic component on the mounting substrate in a state of being fixed to the reinforcing substrate;

The electronic component mounting method according to the present invention includes a collective substrate in which a plurality of mounting substrates are integrated in a planar manner through a margin, and a thickness greater than that of the aggregate substrate, at least corresponding to the margin. The reinforcing substrate in which the through opening is formed so as to leave a support portion wider than the margin at the part to be cut is pasted so that the cutting margin of the collective substrate and the supporting portion of the reinforcement substrate overlap. becomes divided into separate mounting substrate along collective substrate is cut to a plurality of mounting substrates that are Awa bonded to the reinforcing substrate, in a state in which the mounting board is fixed to the reinforcing substrate, the mounting substrate Mount electronic components on

Further, the mounted substrate inspection method of the present invention includes a collective substrate in which a plurality of mount substrates are integrated in a plane via cut margins, a plate thickness thicker than the collective substrate, and at least the cut margin. And a reinforcing substrate having a through opening formed so as to leave a support portion having a width wider than that of the cut margin, and the support portion of the reinforcing substrate overlap with the reinforcing substrate. are bonded together in the said collective substrate along a cutting white is divided into separate mounting board is cut, the electronic component is made by mounting on the mounting substrate, a plurality of implementations are Awa bonded to the reinforcing substrate And a step of performing a mounting inspection of the electronic component in a state where the mounted substrate is fixed to the reinforcing substrate.

The mounted substrate inspection method according to the present invention includes a collective substrate in which a plurality of mount substrates are integrated in a planar manner through a cutting margin, a plate thickness thicker than the collective substrate, and at least the cut margin. A reinforcing substrate having a through-opening formed so as to leave a support portion having a width wider than the margin at the corresponding portion is bonded so that the margin of the aggregate substrate and the supporting portion of the reinforcement substrate overlap. is divided into separate mounting board collective substrate is cut along the electronic component is made by mounting on a mounting board, for a plurality of populated substrate which is Awa bonded to the reinforcing substrate, the populated board The electronic component is mounted and inspected while being fixed to the reinforcing substrate.

Further, the mounting substrate dividing method of the present invention includes a collective substrate in which a plurality of mount substrates are integrated in a plane via cut margins, a plate thickness thicker than the collective substrate, and at least the cut margin. And a reinforcing substrate having a through opening formed so as to leave a support portion having a width wider than that of the cut margin, and the support portion of the reinforcing substrate overlap with the reinforcing substrate. are bonded together in the said collective substrate along a cutting white is divided into separate mounting board is cut, the electronic component is made by mounting on the mounting substrate, a plurality of implementations are Awa bonded to the reinforcing substrate Inserting the protruding portion of the jig having a protruding portion into the through-opening portion of the reinforcing substrate from the opposite side of the mounted substrate to push up the mounted substrate, Remove from reinforcing substrate A step of dividing into individual populated board Te.

The above-described method for dividing a mounted substrate according to the present invention includes a collective substrate in which a plurality of mount substrates are integrated in a planar manner through a margin, and a plate thickness that is thicker than the collective substrate, at least in the margin. A reinforcing substrate having a through-opening formed so as to leave a support portion having a width wider than the margin at the corresponding portion is bonded so that the margin of the aggregate substrate and the supporting portion of the reinforcement substrate overlap. in along collective substrate is divided are cut into individual mounting board, the electronic components made by mounting on a mounting board, for a plurality of populated substrate which is Awa bonded to the reinforcing substrate, the populated board The protruding portion of the jig having the protruding portion is inserted into the through-opening portion of the reinforcing substrate from the opposite side to push up the mounted substrate, and the mounting substrate is removed from the reinforcing substrate and divided into individual mounted substrates.

  Further, the reinforcing substrate of the present invention is a reinforcing substrate that is bonded to divide a collective substrate in which a plurality of mounting substrates are integrated in a planar manner through a cutting margin into individual mounting substrates, A through opening is formed so as to leave a support portion having a plate thickness thicker than that of the collective substrate and having a width wider than the cut margin at least in a portion corresponding to the cut margin.

  The above-described reinforcing substrate of the present invention is a reinforcing substrate that is bonded to divide an assembly substrate, in which a plurality of mounting substrates are integrated in a plane via a margin, into individual mounting substrates. Here, the through-opening is formed so as to leave a support portion having a plate thickness thicker than that of the collective substrate and having a width wider than the cut margin at least in a portion corresponding to the cut margin.

  In addition, the multilayer substrate of the present invention includes a collective substrate in which a plurality of mounting substrates are integrated in a planar manner through a margin, and a thickness that is thicker than the aggregate substrate, and at least a portion corresponding to the margin. And a reinforcing substrate in which a through opening is formed so as to leave a support having a width wider than the cut margin, and the cut portion of the collective substrate and the support portion of the reinforcing substrate are bonded to each other. .

  The laminated substrate of the present invention is configured by bonding a collective substrate and a reinforcing substrate. The collective substrate is a plurality of mounting substrates that are integrated in a plane via a margin, while the reinforcing substrate is thicker than the aggregate substrate, and at least a portion corresponding to the margin. A through-opening is formed so as to leave a support having a width wider than the margin. The collective substrate and the reinforcing substrate are bonded together so that the margin of the collective substrate and the support portion of the reinforcing substrate overlap.

  The mounting substrate manufacturing method of the present invention can be processed by a dicing machine (round saw blade cutting machine) processing using a collective substrate integrated through a narrower margin than before, and is necessary in conventional press processing. A large clearance margin is not required, the area of the execution area that can be used as the mounting area of the mounting board can be expanded, and the manufacturing cost can be suppressed.Also, it can be mounted on the mounting board from the reinforcing board side through the through opening, Application to a double-sided substrate is also possible. In addition, a thin aggregate substrate can be easily handled.

  In addition, the electronic component mounting method and the mounted substrate inspection method of the present invention can perform a process such as mounting or inspection by collectively mounting a plurality of mounting substrates while the mounting substrate is fixed to the reinforcing substrate. Easy to handle.

  Furthermore, according to the method for dividing a mounted substrate of the present invention, it is possible to easily remove the mounting substrate from a state in which the mounting substrate is fixed to the reinforcing substrate, and it is possible to divide while suppressing the manufacturing cost.

  Further, the reinforcing substrate and the laminated substrate of the present invention can realize the mounting substrate manufacturing method, the electronic component mounting method, the mounted substrate inspection method, and the mounted substrate dividing method of the present invention.

  Embodiments of a mounting board manufacturing method, an electronic component mounting method, a mounted board inspection method, a mounted board dividing method, a reinforcing board, and a laminated board according to the present invention will be described below with reference to the drawings. To do.

FIG. 1A is a perspective view of the collective substrate according to the present embodiment. In the collective substrate 10, a plurality of (for example, 8 × 8) mounting substrates 11 are integrated in a plane via a margin 12.
On the other hand, FIG. 1B is a perspective view of a reinforcing substrate for reinforcing the collective substrate according to the present embodiment. The reinforcing substrate 20 has a thicker thickness than the collective substrate 10, and a through opening 21 is formed so as to leave a support portion 22 wider than the cut margin 12 at least in a portion corresponding to the cut margin 12. It becomes.

2A is an enlarged plan view of an X portion of the collective substrate 10 shown in FIG. 1A, and FIGS. 2B and 2C are side views thereof.
Four mounting substrates 11 are integrated on the collective substrate 10 in the region shown in the drawing, and wiring patterns are formed on each mounting substrate 11 by bonding copper foil and pattern etching, respectively. Correspondingly, punched holes and the like are formed by press working, for example. The press working for punching holes can be performed on a plurality of collective substrates at once.
The thickness of the collective substrate 10 is, for example, about 0.3 mm, and the thickness is easy to vibrate.
Each mounting board 11 has a size of about 10 mm square, for example, and a margin 12 of about 0.1 mm width for separation by a dicing machine, which will be described later, is provided at the boundary between them. 11 are densely arranged.
Further, when the individual mounting substrate 11 is not square, it is assumed that the mounting substrate 11 has been punched into a desired shape so as not to be divided here, and after being cut by a dicing machine described later, the outline of this punched portion is The outline should be a non-square shape.

3A is an enlarged plan view of an X portion of the reinforcing substrate 20 shown in FIG. 1B, and FIGS. 3B and 3C are side views thereof.
The reinforcing substrate 20 has a plate thickness that is thicker than that of the collective substrate 10, for example, about 0.8 to 1.2 mm.
Further, the through-opening 21 is formed by, for example, pressing so as to leave the support portion 22 wider than the cut margin 12 at least in a portion corresponding to the cut margin 12 of the collective substrate 10. The press working for forming the through-opening 21 can collectively perform a plurality of reinforcing substrates.
The width of the support portion 22 depends on the accuracy of the press working for forming the through-opening 21 and the accuracy in the step of cutting with a dicing machine, which will be described later, and the thickness of the collective substrate 10 and the reinforcing substrate 20 and The width of the support 12 can be set to, for example, 1 mm, 1.5 mm or 2 mm when the width of the cutting margin 12 is about 0.1 mm as described above. Is possible.
For example, when the shape of the mounting substrate 11 is a square, the pattern of the support portion 22 of the reinforcing substrate 20 with respect to the margin 12 of the collective substrate 10 by making the shape of the through opening 21 smaller than the mounting substrate 11. It can be.
Further, the support portion 22 is formed so as to include a pattern that functions only to support the collective substrate 10 at a portion that does not become the cut margin 12 in addition to a portion corresponding to the cut margin 12 of the collective substrate 10. Also good.
When the shape of the individual mounting board 11 is not a square, for example, a square opening that is smaller than this is used as the apparent outer shape of the mounting board 11 that matches the outer shape of the individual mounting board 11. Layout. Thereby, it becomes possible to perform separation by a dicing machine described later in a straight line.

In the mounting substrate manufacturing method according to the present embodiment, the integrated substrate having the above-described configuration is divided for each mounting substrate using the reinforcing substrate formed as described above. For example, it is performed as follows.
First, the collective substrate 10 and the reinforcing substrate 20 are bonded together so that the margin 12 of the collective substrate 10 and the support portion 22 of the reinforcing substrate 20 overlap. For the bonding, for example, an epoxy resin adhesive is used, and this is applied, the aggregate substrate 10 and the reinforcing substrate 20 are overlapped, and bonded by heating and pressing. Moreover, it is possible to use an adhesive having a weaker adhesive force in consideration of ease of removal of individual mounting boards in a later process.
FIG. 4 is a perspective view of a laminated substrate in which the collective substrate 10 and the reinforcing substrate 20 are bonded together. FIG. 5A is an enlarged plan view of an X portion of the laminated substrate in which the collective substrate 10 and the reinforcing substrate 20 shown in FIG. 4 are bonded, and FIGS. It is a side view.
The drawing shows a case where the cutting margin 12 is located at the center of the support portion 22, but may be intentionally shifted from the center in consideration of ease of removal of individual mounting boards in a later process. .

Next, the collective substrate 10 is cut along the margin 12 of the collective substrate 10 and divided into individual mounting substrates 11.
FIG. 6 is a perspective view of a laminated substrate of the collective substrate 10 and the reinforcing substrate 20 obtained by cutting the collective substrate 10 along the margin 12. 7A is an enlarged plan view of the X portion of the collective substrate 10 and the reinforcing substrate 20 shown in FIG. 6, and FIGS. 7B and 7C are side views thereof.
Here, for example, by using a dicing machine (circular saw cutting machine) used for wafer processing of a semiconductor device, the cut 13 is cut from the collective substrate 10 side to a midway depth of the reinforcing substrate 20. A dicing machine used for wafer processing of a semiconductor device recognizes a pattern on a surface to be cut and specifies a cutting position, so that cutting can be performed with high accuracy of 0.1 mm or less.
As described above, since the reinforcing substrate 20 is not completely cut, at this stage, it is not divided into individual mounting substrates 11, and the next process is performed in a state where a plurality of mounting substrates 11 are fixed and integrated on the reinforcing substrate 20. Can proceed to.
Further, when forming the collective substrate 10 and the reinforcing substrate 20, the collective substrate 10 is cut along the cut margin 12 by forming the cut margin 12 and the support portion 22 in advance in a straight line. In the process, it can be cut linearly.

Next, as shown in the perspective view of FIG. 8, in a state where the individual mounting substrate 11 is fixed to the reinforcing substrate 20, an electronic component such as an LSI or a capacitive element C or a resistance element R is mounted on the mounting substrate 11. The substrate 14 is mounted by reflowing to form a mounted substrate 14.
At this time, in a state where the mounting substrate 11 is fixed to the reinforcing substrate 20 as described above, the electronic component is also formed on the surface of the reinforcing substrate 20 on the reinforcing substrate side 20 through the through opening 21 of the reinforcing substrate 20. Can be mounted, and can be applied to double-sided mounting.

Next, as shown in the perspective view of FIG. 9, for example, an electronic probe P for measuring electrical characteristics is mounted on the substrate in a state where the individual mounted substrate 14 on which electronic components are mounted is fixed to the reinforcing substrate 20. The mounting inspection of the mounted electronic component is performed by contacting.
Since the mounting substrate 11 is fixed to the reinforcing substrate 20 as described above, it is not necessary to inspect individual mounted substrates one by one, and a plurality of mounted substrates 14 can be inspected simultaneously. it can. Individual mounted boards 14 determined as NG by the inspection are marked or electronically managed, and separated from normal products after being removed in the next process.

Next, the mounted substrate 14 is detached from the reinforcing substrate 20 and divided into individual mounted substrates 14.
Here, as shown in the schematic diagram of FIG. 10 (a), formed as described above, for a plurality of populated board 14 which is Awa bonded to the reinforcing substrate 20, the opposite side of the populated board 14 The protrusion 31 of the jig 30 having the protrusion 31 is inserted into the through-opening 21 of the reinforcing substrate 20 to push up the mounted substrate 14. At this time, by forming the shape of the protrusion 31 into an anisotropic shape in which pressure is applied nonuniformly to the mounted substrate 14, the protrusion 31 is thin at the outer periphery as shown in the schematic diagram of FIG. One edge of the bonded mounted substrate 14 is peeled off and lifted, and the mounted substrates 14 divided individually can be removed one by one. In particular, in the case of double-sided mounting, it is preferable that the shape of the protruding portion 31 is such that the protruding portion 31 does not directly hit the electronic component mounted on the surface to which the protruding portion 31 hits.
After removal in this way, for example, incorporation into an electronic device or further mounting on a mounting substrate is performed.
After removing the mounted substrate as described above, the reinforcing substrate can be repeatedly used in the same process as described above through an appropriate process such as cleaning.

  In the step of removing the mounted substrate 14 from the reinforcing substrate 20, when the adhesive strength is strong and cannot be easily removed, for example, a method of reducing the adhesive strength of the adhesive that bonds the collective substrate and the reinforcing substrate. A method of facilitating the peeling of the one side edge of the mounted substrate 14 by laminating the cutting edge 12 so as to be shifted from the center of the support portion 22, or performing a concave processing on the surface of the reinforcing substrate 20. It is preferable that the adhesive area can be easily removed by reducing the adhesive strength with respect to the collective substrate 10 (mounted substrate 14).

  According to the mounting substrate manufacturing method of the present embodiment described above, it is possible to perform processing by a dicing machine (round sawtooth cutting machine) processing or the like using a collective substrate integrated through a narrower margin than in the past. This eliminates the need for the clearance margin required for press processing, increases the area of the execution area that can be used as the mounting area for the mounting board, and can reduce manufacturing costs. Therefore, it can be applied to a double-sided board. In addition, a thin aggregate substrate can be easily handled.

  Further, according to the mounting method of the electronic component on the mounting substrate of this embodiment and the inspection method of the mounted substrate on which the electronic component is mounted, a plurality of mounting substrates are gathered together with the mounting substrate fixed to the reinforcing substrate. Since the process such as mounting and inspection can be performed, the handling is high.

  Furthermore, the mounting substrate can be easily removed from the state in which the mounting substrate is fixed to the reinforcing substrate by the mounting substrate dividing method of the present embodiment, and the manufacturing cost can be reduced and divided.

  In addition, according to the reinforcing substrate and the laminated substrate of the present embodiment, the mounting substrate manufacturing method, the electronic component mounting method, the mounted substrate inspection method, and the mounted substrate dividing method can be realized.

The present invention is not limited to the above description.
For example, the type of adhesive that bonds the collective substrate and the reinforcing substrate is not limited to the epoxy resin adhesive, but the collective substrate, a mounting substrate obtained by dividing the collective substrate, and a mounted substrate on which electronic components are mounted can be used as the reinforcing substrate. Any adhesive may be used as long as the adhesive has sufficient adhesive strength.
The shape of the mounting substrate can be applied to various shapes in addition to a square shape.
As electronic components to be mounted, various electronic components can be mounted in addition to LSI, capacitive element C, resistance element R, and the like.
In addition, various modifications can be made without departing from the scope of the present invention.

The mounting board manufacturing method, electronic component mounting method, mounted board inspection method, and mounted board dividing method of the present invention manufacture a mounting board for mounting a semiconductor device that has been miniaturized and miniaturized. However, it can be applied as a method of mounting electronic parts, inspecting and mounting the mounted substrate.
Further, the reinforcing substrate and the laminated substrate of the present invention can be used in a method for manufacturing a mounting substrate for mounting a semiconductor device whose miniaturization and miniaturization have been advanced.

FIG. 1A is a perspective view of a collective substrate according to an embodiment of the present invention, and FIG. 1B is a perspective view of a reinforcing substrate for reinforcing the collective substrate according to an embodiment of the present invention. 2A is an enlarged plan view of an X portion of the collective substrate shown in FIG. 1A, and FIGS. 2B and 2C are side views thereof. 3A is an enlarged plan view of an X portion of the reinforcing substrate shown in FIG. 1B, and FIGS. 3B and 3C are side views thereof. FIG. 4 is a perspective view of a laminated substrate in which the aggregate substrate shown in FIG. 1A and the reinforcing substrate shown in FIG. FIG. 5A is an enlarged plan view of an X portion of the laminated substrate in which the collective substrate and the reinforcing substrate shown in FIG. 4 are bonded together, and FIGS. 5B and 5C are side views thereof. . FIG. 6 is a perspective view of a laminated substrate of a collective substrate and a reinforcing substrate obtained by cutting the collective substrate along a cutting margin. FIG. 7A is an enlarged plan view of the X portion of the collective substrate and the reinforcing substrate shown in FIG. 6, and FIGS. 7B and 7C are side views thereof. FIG. 8 is a perspective view showing a process of mounting electronic components on individual mounting boards fixed to the reinforcing board. FIG. 9 is a perspective view showing a process of performing mounting inspection of electronic components on individual mounted boards in a state of being fixed to the reinforcing board. FIG. 10A and FIG. 10B are schematic views showing a process of removing the mounted substrate from the reinforcing substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Assembly board | substrate, 11 ... Mounting board | substrate, 12 ... Cutting edge, 13 ... Cut | interruption, 14 ... Mounted board | substrate, 20 ... Reinforcement board | substrate, 22 ... Through-opening part, 22 ... Support part, 30 ... Jig, 31 ... Protrusion Part, LSI, C, R ... electronic component, P ... electronic probe

Claims (11)

A step of forming a collective substrate in which a plurality of mounting substrates are integrated in a plane via a cutting margin;
Forming a reinforcing substrate having a plate thickness thicker than the aggregate substrate and having a through opening formed so as to leave a support portion having a width wider than the margin at least in a portion corresponding to the margin;
Bonding the collective substrate and the reinforcing substrate so that the margin of the collective substrate overlaps the support portion of the reinforcing substrate;
Cutting the collective substrate along the cutting margin and dividing it into individual mounting substrates. The method for manufacturing a mounting substrate according to claim 1, wherein in the step of cutting the collective substrate along the cutting margin, a cut is made from the collective substrate side to a midway depth of the reinforcing substrate. The manufacturing method of the mounting substrate according to claim 1, wherein the collective substrate is cut using a circular saw-tooth cutting machine in the step of cutting the collective substrate along the cutting margin. In the step of forming the collective substrate and the step of forming the reinforcing substrate, the cutting margin and the support portion are arranged in a straight line,
The manufacturing method of the mounting board | substrate of Claim 1. It cut | disconnects linearly in the process of cut | disconnecting the said assembly board | substrate along the said cutting margin. After the step of cutting the collective substrate along the cutting margin, the mounting substrate is inserted by inserting the protruding portion of a jig having a protruding portion into the through opening of the reinforcing substrate from the opposite side of the mounting substrate. The manufacturing method of the mounting substrate according to claim 1, further comprising a step of pushing up and removing the mounting substrate from the reinforcing substrate. A collective substrate in which a plurality of mounting substrates are integrated in a plane via cut margins, and a support having a thickness greater than that of the collective substrate and having a width wider than the cut margin at least in a portion corresponding to the cut margin A reinforcing substrate having a through-opening formed so as to leave a portion, and the cutout of the collective substrate and the support portion of the reinforcing substrate are bonded to each other, and the collective substrate along the cutout There formed by dividing are cut into individual mounting substrate, wherein the relative reinforcing plurality of said mounting substrate which is Awa bonded to the substrate, in a state in which the mounting board is fixed to the reinforcing substrate, the mounting An electronic component mounting method comprising a step of mounting an electronic component on a substrate. The electronic device further includes a step of mounting an electronic component on the surface of the mounting substrate on the side of the reinforcing substrate through the through-opening portion of the reinforcing substrate in a state where the mounting substrate is fixed to the reinforcing substrate. Item 7. The electronic component mounting method according to Item 6. A collective substrate in which a plurality of mounting substrates are integrated in a plane via cut margins, and a support having a thickness greater than that of the collective substrate and having a width wider than the cut margin at least in a portion corresponding to the cut margin A reinforcing substrate having a through-opening formed so as to leave a portion, and the cutout of the collective substrate and the support portion of the reinforcing substrate are bonded to each other, and the collective substrate along the cutout There is divided into separate mounting board is cut, the electronic component is installed in said mounting board, for a plurality of populated substrate which is Awa bonded to the reinforcing substrate, the populated board the reinforcing A method for inspecting a mounted substrate, comprising: a step of inspecting the mounting of the electronic component in a state of being fixed to a substrate. A collective substrate in which a plurality of mounting substrates are integrated in a plane via cut margins, and a support having a thickness greater than that of the collective substrate and having a width wider than the cut margin at least in a portion corresponding to the cut margin A reinforcing substrate having a through-opening formed so as to leave a portion, and the cutout of the collective substrate and the support portion of the reinforcing substrate are bonded to each other, and the collective substrate along the cutout There is split is cut into individual mounting board, comprising an electronic component is mounted on the mounting board, for a plurality of populated substrate which is Awa bonded to the reinforcing substrate, the opposite side of the populated board The protrusion of a jig having a protrusion in the through-opening of the reinforcing substrate is inserted to push up the mounted substrate, and the mounted substrate is removed from the reinforcing substrate to form an individual mounted substrate. The process of dividing Division method of implementation already substrate. A reinforcing substrate to be bonded to divide a collective substrate, in which a plurality of mounting substrates are integrated in a plane via a margin, into individual mounting substrates,
Having a thicker thickness than the aggregate substrate;
A reinforcing substrate, wherein a through opening is formed so as to leave a support portion having a width wider than the cut margin at least in a portion corresponding to the cut margin. A collective substrate in which a plurality of mounting substrates are integrated in a plane via cut margins, and a support having a thickness greater than that of the collective substrate and having a width wider than the cut margin at least in a portion corresponding to the cut margin And a reinforcing substrate in which a through-opening is formed so as to leave a portion, and is laminated so that a cutting margin of the collective substrate and the supporting portion of the reinforcing substrate overlap.

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