CN108901148A - The production technology of the wiring board of pressing production core plate containing buried capacitor back-to-back - Google Patents
The production technology of the wiring board of pressing production core plate containing buried capacitor back-to-back Download PDFInfo
- Publication number
- CN108901148A CN108901148A CN201810876885.XA CN201810876885A CN108901148A CN 108901148 A CN108901148 A CN 108901148A CN 201810876885 A CN201810876885 A CN 201810876885A CN 108901148 A CN108901148 A CN 108901148A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- buried capacitor
- plate
- core plate
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of production technologies of the wiring board of the production of pressing back-to-back core plate containing buried capacitor, include the following steps:The buried capacitor core plate opened greatly is cut to form several buried capacitor core plates for needing size；It is pressed together according to the sequence of buried capacitor core plate, the second copper foil, the first PP piece, the second copper foil and buried capacitor core plate, forms six layer structure plate；Line pattern will be etched respectively on first copper foil layer in two outside of six layer structure plate；Two outsides that two sides etch the six layer structure plate of line pattern are pressed into the 2nd PP piece and third copper foil again respectively, obtain eight layers of structure plate；Eight layers of structure plate are milled into side, and are separated at the first copper foil layer and the second copper foil layer, the slashing for obtaining the wiring board of two core plates containing buried capacitor and being formed by the first PP piece and two the second copper foil layers.Two buried capacitor core plates are combined together by the present invention using back-to-back process for pressing, then carry out two-sided etching+two-sided pressing mode, solve the problems, such as that individual total plate thickness of buried capacitor core plate is thin, easily-deformable.
Description
Technical field
The present invention relates to a kind of production technologies of the wiring board of core plate containing buried capacitor, more particularly to a kind of pressing production back-to-back
The production technology of the wiring board of the core plate containing buried capacitor.
Background technique
Single side etching+single side process for pressing is used for individual buried capacitor core plate after buried capacitor core plate sawing sheet.Because buried capacitor core plate is total
Thinner thickness (0.038-0.090mm) uses tradition " single side etching+single side presses " technique, the etching of individual buried capacitor core plate single side
Afterwards, the copper sheet support of only other one side, plate are influenced in carrying, production process by external force, cause plate damage, plate folding serious,
And some non-uniform external force also result in the irregular deformation of plate, bury many hidden danger for subsequent handling production.
Summary of the invention
In order to overcome drawbacks described above, the present invention provides a kind of lifes of the wiring board of the production of pressing back-to-back core plate containing buried capacitor
Production. art overcomes the problems, such as that the sheet panel top damage of prior art production, plate folding cause largely to scrap.
The present invention is to solve technical solution used by its technical problem：
A kind of production technology of the wiring board of back-to-back pressing production core plate containing buried capacitor, includes the following steps：
Step 1, sawing sheet：The buried capacitor core plate opened greatly is cut to form several buried capacitor core plates for needing size, the buried capacitor core plate
The first copper foil by being located in the middle buried capacitor layer and positioned at two sides forms；
Step 2, one step press：Prepare two buried capacitor core plates, a first PP piece and two the second copper foils, and according to buried capacitor
Core plate, the second copper foil, the first PP piece, the second copper foil and buried capacitor core plate sequence press together, form six layer structure plate；
Step 3, a route：Line map will be etched respectively on first copper foil layer in two outside of six layer structure plate
Shape；
Step 4, second pressing：Two outsides that two sides etch the six layer structure plate of line pattern are pressed the again respectively
Two PP pieces and third copper foil obtain eight layers of structure plate；
Step 5, side and scoreboard are milled：Eight layers of structure plate is milled into side, and at the first copper foil layer and the second copper foil layer
Separation, the slashing for obtaining the wiring board of two core plates containing buried capacitor and being formed by the first PP piece and two the second copper foil layers.
As a further improvement of the present invention, in the step 2, the ruler of the size of second copper foil less than the first copper foil
Very little, the edge of the first PP piece is pressed into the periphery of first copper foil and the first copper foil knot with the buried capacitor core plate after pressing
It is integrated.
As a further improvement of the present invention, in the step 5, by eight layers of structure plate according to the ruler of the second copper foil
Little progress row mills side, and the first PP piece edge for being pressed into the periphery of first copper foil is milled.
The beneficial effects of the invention are as follows：Two buried capacitor core plates are incorporated in one using back-to-back process for pressing by the present invention
It rises, then carries out two-sided etching+two-sided pressing mode and substitute individual traditional buried capacitor core plate single side etching+single side pressing production
Mode solves the problems, such as that individual total plate thickness of buried capacitor core plate is thin, easily-deformable, solves the problems, such as the thin caused plate damage of plate, plate folding, solution
Buried capacitor of having determined core plate can not be aiming at the problem that plate thickness be adjusted flexibly in production equipment after selecting material.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of step 1 of the present invention；
Fig. 2 is the structural schematic diagram of step 2 of the present invention；
Fig. 3 is the structural schematic diagram of step 3 of the present invention；
Fig. 4 is the structural schematic diagram of step 4 of the present invention；
Fig. 5 is the structural schematic diagram of step 5 of the present invention.
In conjunction with attached drawing, make the following instructions：
1 --- buried capacitor core plate；10 --- buried capacitor layer；
11 --- the first copper foil；12 --- line pattern；
2 --- the first PP piece；3 --- the second copper foil；
4 --- the 2nd PP piece；5 --- third copper foil；
6 --- the wiring board of the core plate containing buried capacitor；7 --- slashing.
Specific embodiment
Below in conjunction with attached drawing, elaborate to a preferred embodiment of the invention.But protection scope of the present invention is not
Be limited to following embodiments, i.e., in every case with simple equivalence changes made by scope of the present invention patent and description with repair
Decorations, all still belong within the invention patent covering scope.
It refering to fig. 1-5, is a kind of production work of the wiring board of the production of pressing back-to-back core plate containing buried capacitor of the present invention
Skill includes the following steps：
Step 1, sawing sheet：The buried capacitor core plate opened greatly is cut to form several buried capacitor core plates 1 for needing size, the buried capacitor core plate
1 the first copper foil 11 by being located in the middle buried capacitor layer 10 and positioned at two sides forms, refering to fig. 1；
Step 2, one step press：Prepare two buried capacitor core plates, 1, the first PP piece 2 and two the second copper foils 3, and according to
Buried capacitor core plate, the second copper foil, the first PP piece, the second copper foil and buried capacitor core plate sequence press together, form six layer structure plate
Part, wherein the size of second copper foil less than the first copper foil size, after pressing the first PP piece edge indentation described in
The periphery of first copper foil is simultaneously combined as a whole with the first copper foil of the buried capacitor core plate 1, refering to Fig. 2；
Step 3, a route：Line map will be etched respectively on first copper foil layer in two outside of six layer structure plate
Shape 12, refering to Fig. 3；
Step 4, second pressing：Two outsides that two sides etch the six layer structure plate of line pattern are pressed the again respectively
Two PP pieces 4 and third copper foil 5 obtain eight layers of structure plate, refering to Fig. 4；
Step 5, side and scoreboard are milled：Eight layers of structure plate is milled into side, carries out milling side according to the size of the second copper foil, is pressed
The first PP piece edge for entering the periphery of first copper foil is milled, and is punished in the first copper foil layer and the second copper foil layer
From, the slashing 7 for obtaining the wiring board 6 of two core plates containing buried capacitor and being formed by the first PP piece and two the second copper foil layers, ginseng
Read Fig. 5.
Two buried capacitor core plates are incorporated in by the present invention using back-to-back process for pressing it can be seen from above-mentioned production technology
Together, then the life that two-sided etching+two-sided pressing mode substitutes individual traditional buried capacitor core plate single side etching+single side pressing is carried out
Production mode solves the problems, such as that individual total plate thickness of buried capacitor core plate is thin, easily-deformable, solves the problems, such as the thin caused plate damage of plate, plate folding,
It solves the problems, such as plate thickness can not be adjusted flexibly for production equipment after buried capacitor core plate selectes material.
Claims (3)
1. a kind of production technology of the wiring board of the production of pressing back-to-back core plate containing buried capacitor, which is characterized in that include the following steps：
Step 1, sawing sheet：The buried capacitor core plate opened greatly is cut to form several buried capacitor core plates (1) for needing size, the buried capacitor core plate
(1) the first copper foil (11) by being located in the middle buried capacitor layer (10) and positioned at two sides forms；
Step 2, one step press：Prepare two buried capacitor core plates (1), a first PP piece (2) and two the second copper foils (3), and presses
It is pressed together according to the sequence of buried capacitor core plate, the second copper foil, the first PP piece, the second copper foil and buried capacitor core plate, forms six layer structure
Plate；
Step 3, a route：Line pattern will be etched respectively on first copper foil layer in two outside of six layer structure plate；
Step 4, second pressing：Two outsides that two sides etch the six layer structure plate of line pattern are pressed into the 2nd PP again respectively
Piece (4) and third copper foil (5), obtain eight layers of structure plate；
Step 5, side and scoreboard are milled：Eight layers of structure plate is milled into side, and is separated at the first copper foil layer and the second copper foil layer,
The slashing (7) for obtaining the wiring board (6) of two core plates containing buried capacitor and being formed by the first PP piece and two the second copper foil layers.
2. the production technology of the wiring board of back-to-back pressing production core plate containing buried capacitor according to claim 1, feature exist
In：In the step 2, size of the size less than the first copper foil of second copper foil, the edge of the first PP piece after pressing
It is pressed into the periphery of first copper foil and is combined as a whole with the first copper foil of the buried capacitor core plate (1).
3. the production technology of the wiring board of back-to-back pressing production core plate containing buried capacitor according to claim 2, feature exist
In：In the step 5, eight layers of structure plate is subjected to milling side according to the size of the second copper foil, is pressed into first copper foil
Periphery the first PP piece edge milled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810876885.XA CN108901148A (en) | 2018-08-03 | 2018-08-03 | The production technology of the wiring board of pressing production core plate containing buried capacitor back-to-back |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810876885.XA CN108901148A (en) | 2018-08-03 | 2018-08-03 | The production technology of the wiring board of pressing production core plate containing buried capacitor back-to-back |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108901148A true CN108901148A (en) | 2018-11-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810876885.XA Pending CN108901148A (en) | 2018-08-03 | 2018-08-03 | The production technology of the wiring board of pressing production core plate containing buried capacitor back-to-back |
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| CN (1) | CN108901148A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111770649A (en) * | 2020-06-29 | 2020-10-13 | 肇庆昌隆电子有限公司 | Multilayer circuit board containing aluminum core and manufacturing method thereof |
| CN117881096A (en) * | 2024-03-13 | 2024-04-12 | 江苏普诺威电子股份有限公司 | Heat dissipation packaging substrate and processing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359601A (en) * | 2008-09-19 | 2009-02-04 | 上海美维科技有限公司 | Two-board-in-one processing method for substrate manufacture of printed circuit board or integrated circuit package |
| CN101541145A (en) * | 2009-03-17 | 2009-09-23 | 上海美维科技有限公司 | Processing method of ultra-thin core board in manufacturing of printed circuit board or integrated circuit package substrate |
| CN103857204A (en) * | 2012-11-28 | 2014-06-11 | 宏启胜精密电子(秦皇岛)有限公司 | Bearing plate and manufacture method for the same |
-
2018
- 2018-08-03 CN CN201810876885.XA patent/CN108901148A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359601A (en) * | 2008-09-19 | 2009-02-04 | 上海美维科技有限公司 | Two-board-in-one processing method for substrate manufacture of printed circuit board or integrated circuit package |
| CN101541145A (en) * | 2009-03-17 | 2009-09-23 | 上海美维科技有限公司 | Processing method of ultra-thin core board in manufacturing of printed circuit board or integrated circuit package substrate |
| CN103857204A (en) * | 2012-11-28 | 2014-06-11 | 宏启胜精密电子(秦皇岛)有限公司 | Bearing plate and manufacture method for the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111770649A (en) * | 2020-06-29 | 2020-10-13 | 肇庆昌隆电子有限公司 | Multilayer circuit board containing aluminum core and manufacturing method thereof |
| CN117881096A (en) * | 2024-03-13 | 2024-04-12 | 江苏普诺威电子股份有限公司 | Heat dissipation packaging substrate and processing method thereof |
| CN117881096B (en) * | 2024-03-13 | 2024-05-24 | 江苏普诺威电子股份有限公司 | Heat dissipation packaging substrate and processing method thereof |
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Application publication date: 20181127 |
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