CN113232083A - Die cutting positioning hole rotating process - Google Patents
Die cutting positioning hole rotating process Download PDFInfo
- Publication number
- CN113232083A CN113232083A CN202110513860.5A CN202110513860A CN113232083A CN 113232083 A CN113232083 A CN 113232083A CN 202110513860 A CN202110513860 A CN 202110513860A CN 113232083 A CN113232083 A CN 113232083A
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- Prior art keywords
- release film
- punching
- adhesive
- cutting machine
- die
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004080 punching Methods 0.000 claims abstract description 84
- 239000000463 material Substances 0.000 claims abstract description 65
- 239000000853 adhesive Substances 0.000 claims abstract description 51
- 230000001070 adhesive effect Effects 0.000 claims abstract description 51
- 239000002699 waste material Substances 0.000 claims abstract description 33
- 230000001681 protective effect Effects 0.000 claims abstract description 20
- 238000005096 rolling process Methods 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010837 adhesive waste Substances 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- 239000000741 silica gel Substances 0.000 claims description 23
- 229910002027 silica gel Inorganic materials 0.000 claims description 23
- 239000002390 adhesive tape Substances 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 12
- 239000012945 sealing adhesive Substances 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 239000000499 gel Substances 0.000 claims description 2
- 239000000047 product Substances 0.000 abstract description 6
- 239000011265 semifinished product Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 3
- 210000002469 basement membrane Anatomy 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D11/00—Combinations of several similar cutting apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a die cutting positioning hole rotating process, which comprises the following steps: s1: punching the second release film by an A die cutting machine with the release surface facing upwards, pulling the self-carrying paper of the reticulated adhesive and attaching the self-carrying paper of the reticulated adhesive downwards to the upper surface of the release film in the middle, simultaneously pulling the self-carrying paper of the reticulated adhesive, attaching the fourth release film to the upper surface of the reticulated adhesive downwards in the middle, attaching the adhesion surface of the acrylic protective film to the lower surface of the second release film in the middle with the adhesion surface facing upwards, and rolling by using an adhesive core to obtain a material A; s2: and (3) punching a B die cutting machine with the fourth release film surface in the material A facing upwards, pulling four conductive adhesive waste materials and enabling each conductive adhesive weak adhesive surface to face downwards to be attached according to the reference figure 2, pulling all conductive adhesive waste materials with adhesive, attaching the third release film surface facing downwards to the upper surface of the conductive adhesive on the uppermost layer in the middle, and rolling by using the adhesive core to obtain the material B. According to the invention, the semi-finished product is prevented from being taken away by waste materials through the processes of positioning holes and hole turning, manual waste discharge is not required, and the yield of the product is ensured.
Description
Technical Field
The invention relates to the technical field of die cutting processes, in particular to a die cutting positioning hole rotating process.
Background
The traditional die cutting is a cutting process for the post processing of printed matters, and the die cutting process can manufacture printed matters or other paper products into a die cutting knife plate according to a pre-designed pattern for cutting, so that the shapes of the printed matters are not limited to straight edges and right angles any more. The traditional die cutting production is a forming process that a die cutting cutter is combined into a die cutting plate according to patterns required by product design, and a printed matter or other platy blanks are rolled and cut into required shapes or cutting marks under the action of pressure.
The following problems can occur when the copper foil adhesive tape is subjected to die cutting: the copper foil adhesive tape is easy to be processed and has the defects of folds, edge impression, surface oxidation, surface dirt, foreign matters, bending deformation and the like; the punching size tolerance is +/-0.1, normal operation is realized without adding CPK (compact peripheral component Key) control, and difficult operation is realized by adding the CPK control; the knife printing of the basement membrane is normal process operation, and the knife printing of the basement membrane is not difficult process operation.
To this end, we propose a die-cutting positioning hole-rotating process to solve the above problems.
Disclosure of Invention
The invention aims to provide a die-cutting positioning hole rotating process to solve the problems in the background art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the die cutting positioning hole rotating process comprises the following steps:
s1: punching the second release film by an A die cutting machine with the release surface facing upwards, pulling the self-carrying paper of the reticulated adhesive and attaching the self-carrying paper of the reticulated adhesive downwards to the upper surface of the release film in the middle, simultaneously pulling the self-carrying paper of the reticulated adhesive, attaching the fourth release film to the upper surface of the reticulated adhesive downwards in the middle, attaching the adhesion surface of the acrylic protective film to the lower surface of the second release film in the middle with the adhesion surface facing upwards, and rolling by using an adhesive core to obtain a material A;
s2: punching the fourth release film surface in the material A upwards by a B die cutting machine, pulling four pieces of conductive adhesive waste materials, enabling the weak adhesive surfaces of the conductive adhesives to face downwards, attaching the conductive adhesive waste materials with reference to a figure 2, pulling all the conductive adhesives from the adhesive waste materials, attaching the third release film surface downwards, centering the third release film surface to the upper surface of the conductive adhesive on the uppermost layer, and rolling by using a rubber core to obtain a material B;
s3: punching the third release film face upwards in the material B by a C die cutting machine, attaching the adhesive surface of a sealing adhesive tape to the upper surface of the third release film face downwards, pulling all the third release film, the fourth release film and the outer frame waste material, attaching the red surface of a copper foil to the middle in a downward mode, pulling a self-carrying film of a silica gel protective film to enable the adhesive surface of the self-carrying film to be attached to the middle in a downward mode, and rolling by using an adhesive core to obtain a material C;
s4: punching the acrylic protective film in the material C upwards by a D die cutting machine, pulling acrylic protective film waste, pulling a middle second release film waste, attaching a fourth release film with the release surface facing downwards in the middle, and rolling by using a rubber core to obtain a material D;
s5: punching the fourth release film surface in the material D upwards by an E die cutting machine, attaching the box sealing adhesive tape surface downwards, pulling the aluminum foil outer frame and all fourth release film waste materials, attaching the transparent silica gel adhesive tape surface upwards to a reference knife line, attaching the fourth release film downwards and centrally, and winding by using a rubber core to obtain a material E;
s6: punching the fourth release film surface in the material E by an F die-cutting machine, pulling the transparent silica gel adhesive tape intermediate waste and all fourth release film waste, centrally attaching the first release film downwards, and winding by using a rubber core to obtain a material F;
s7: and (3) punching the first release film surface in the material F upwards by a G die cutting machine, upwards pulling to obtain the waste materials of the positioning holes at two sides, downwards pulling to obtain the silica gel protective film and the waste materials of the transparent silica gel adhesive tapes at two sides, and rolling by using a gel core to obtain the material G.
Preferably, the punching layer of the die-cutting machine A is a second release film; the punching layer of the B die-cutting machine is a fourth release film and reticulate glue; the punching layer of the C die-cutting machine is a third release film and conductive adhesive; the punching level of the D die-cutting machine is an acrylic protective film and a second release film; the punching layer of the E die-cutting machine comprises a fourth release film, reticulate pattern glue, conductive glue and copper foil; the punching level of the F die-cutting machine is a fourth release film and a transparent silica gel adhesive tape; the punching level of the G die-cutting machine is a first release film and a transparent silica gel adhesive tape.
Preferably, the punching pressures of the A-G die cutting machine are 3.520 +/-0.1, 4.200 +/-0.1, 2.520 +/-0.1, 4.574 +/-0.1, -6.36 +/-0.1, 1.49 +/-0.1 and-14.58 +/-0.1 respectively, and the unit of the punching pressure is Pa; the punching speed of the A-G die cutting machine is 210 punching +/-5 punching/min, 180 punching +/-5 punching/min and 180 punching +/-5 punching/min respectively.
Preferably, the bonding processes in S1-S7 are all realized by using a bonding machine.
Preferably, the A-G die cutting machines all adopt etching knives, wherein the etching knives in the A, C, E die cutting machines are all 35 degrees of inward straight and outward inclination, and the etching knives in the D die cutting machines are 35 degrees of double peaks.
Preferably, a scraper tool is adopted in S1-S7 to strip waste materials, and a material breaking photoelectric sensor is arranged on one side of the bonding material in S1-S7.
Compared with the prior art, the invention has the beneficial effects that:
the copper foil surface of the whole process is protected by a silica gel protective film, so that the defects of scratching, oxidation, dirt, foreign matters and the like on the surface of the copper foil are avoided; the mold A adopts a release film hole digging auxiliary process, so that the thickness difference of the conductive adhesive is eliminated, and the problem of copper foil protrusion is solved; the copper foil cutting part uses an inlet cutting die, so that the problem of product edge imprinting is solved; in conclusion, the semi-finished product is prevented from being taken away by waste materials through the process of positioning holes and rotating holes, manual waste discharge is not needed, and the yield of the product is ensured.
Drawings
FIG. 1 is a schematic structural diagram of a step A of a die-cutting positioning hole-rotating process according to the present invention;
FIG. 2 is a schematic structural diagram of a step B of the die-cutting positioning hole-rotating process according to the present invention;
FIG. 3 is a schematic structural diagram of a step C of the die-cutting positioning hole-rotating process according to the present invention;
FIG. 4 is a schematic structural diagram of a die-cutting positioning hole-rotating process D provided in the present invention;
FIG. 5 is a schematic structural diagram of a die-cutting positioning hole-rotating process E according to the present invention;
FIG. 6 is a schematic structural diagram of a step F of the die-cutting positioning hole-rotating process according to the present invention;
FIG. 7 is a schematic structural diagram of a die-cutting positioning hole-rotating process G according to the present invention;
fig. 8 is a schematic view of the auxiliary reading of fig. 1-7 for the hole-cutting positioning hole-rotating process provided by the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-8, the die cutting positioning hole and hole rotating process comprises the following steps:
s1: referring to fig. 1, a second release film is punched by a die cutting machine A with the release surface facing upwards, the punching level of the die cutting machine A is the second release film, the punching knife pressure is 3.520 +/-0.1 Pa, the punching speed is 210 +/-5 punching/min, an etching knife with an inner angle, a straight angle and an outer angle of 35 degrees is adopted, reticulated glue self-carrying paper is pulled, the upper surface of the release film is attached to the center downwards, meanwhile, reticulated glue self-carrying film is pulled, the fourth release film faces downwards, the upper surface of the reticulated glue is attached to the center, the adhesion surface of an acrylic protective film is attached to the lower surface of the second release film to the center upwards, and a 6INCH glue core is used for rolling to obtain a material A;
s2: referring to fig. 2, a fourth release film in a material a is punched by a B die-cutting machine with the face upward, the punching layers of the B die-cutting machine are the fourth release film and the reticulated adhesive, the punching knife pressure is 4.200 ± 0.1Pa, the punching speed is 210 punching ± 5 punching/min, an etching knife is adopted to pull four pieces of conductive adhesive waste materials and make each conductive adhesive weak adhesive face downward, refer to fig. 2 for bonding, all conductive adhesives are pulled from adhesive waste materials, the third release film face downward is centrally bonded on the upper surface of the conductive adhesive on the uppermost layer, and a 6INCH adhesive core is used for rolling to obtain a material B;
s3: referring to fig. 3, a third release film in a material B is punched by a C die-cutting machine with the face upward, the punching layers of the C die-cutting machine are the third release film and the conductive adhesive, the punching cutter is pressed at 2.520 ± 0.1Pa, the punching speed is 210 punching ± 5 punching/minute, an etching knife with an inner straight angle and an outer oblique angle is adopted, the adhesive surface of a box sealing adhesive tape is attached to the upper surface of the third release film with the face downward, all the third release film, the fourth release film and the outer frame waste material are pulled, the red surface of a copper foil is attached to the center with the face downward, a silica gel protective film is pulled, the adhesive surface of the self-carrying film is attached to the center with the face downward, and a 6INCH rubber;
s4: referring to fig. 4, the acrylic protective film in the material C is punched upwards by a D-die cutting machine, the punching layers of the D-die cutting machine are the acrylic protective film and a second release film, the punching cutter is pressed at 4.574 +/-0.1 Pa, the punching speed is 210 punch +/-5 punch/min, a double-peak 35-degree etching knife is adopted to pull the acrylic protective film waste material, pull the middle second release film waste material, the fourth release film is downwards, attached in the middle, and the 6INCH rubber core is used for rolling to obtain the material D;
s5: referring to fig. 5, a fourth release film in a material D is punched by an E-die cutter with the face up, the punching layers of the E-die cutter are the fourth release film, the reticulated adhesive, the conductive adhesive and the copper foil, the adhesive surface of the sealing tape is attached downwards, the punching knife pressure is-6.36 ± 0.1pa, the punching speed is 180 punching ± 5 punching/min, an etching knife is adopted to draw the outer aluminum foil frame and all fourth release film waste materials, the adhesive surface of the transparent silica gel adhesive tape is attached upwards to the reference knife line, the fourth release film is attached downwards and centrally, and a 6INCH adhesive core is used for rolling to obtain a material E;
s6: referring to fig. 6, punching a fourth release film in the material E by an F die-cutting machine, wherein the punching level of the F die-cutting machine is the fourth release film and the transparent silica gel adhesive tape, the punching knife pressure is 1.49 ± 0.1Pa, the punching speed is 180 punching ± 5 punching/min, an etching knife with an inner angle of 35 degrees and an outer angle is adopted to pull the transparent silica gel adhesive tape intermediate waste and all fourth release film waste, the first release film is attached downwards and centrally, and a 6INCH rubber core is used for winding to obtain a material F;
s7: referring to fig. 7, the first release film surface in the material F is punched by a G die-cutting machine, the punching level of the G die-cutting machine is the first release film and the transparent silica gel adhesive tape, the punching knife pressure is-14.58 ± 0.1Pa, the punching speed is 180 punching ± 5 punching/minute, an etching knife is adopted to pull up the waste materials of the positioning holes at two sides, pull down the waste materials of the silica gel protective film and the transparent silica gel adhesive tapes at two sides, and the material G is obtained by rolling up the waste materials of the transparent silica gel adhesive tapes at two sides by using a 3INCH rubber core.
The invention mainly takes note that:
1. confirming whether the material and the mould are correct;
2. cleaning products and foreign matters of the machine according to an operation standard in the operation process;
3. the operation of laminating the layered structure and the required laminating surface is required to be carried out according to the materials;
4. confirming the tension of the material, the flatness of the product, the depth of knife mark, glue overflow, dirt, foreign matters, scratches, glue wrinkles, folds, cushion damage, poor size, poor release and other defects at regular intervals of 1H;
5. the cutting die is an etching knife, the service life of the ABCDFG die cutting machine is managed according to 30 ten thousand punching times, and the service life of the E die is managed according to 5 ten thousand punching times;
6. all materials and waste materials must be added with a material breaking photoelectric sensor;
7. the coil shipment was 10000 EA/coil.
In order to facilitate reading of the attached drawings, the invention numbers the materials, and specifically explains the selection type, thickness and color, and the following table is used for:
further, the bonding processes in S1-S7 are all realized by using a bonding machine, in particular to a machine for bonding two substrates.
Furthermore, a scraper jig is adopted in S1-S7 to strip the waste materials, adhesion between two adjacent layers of base materials is avoided, a material breaking photoelectric sensor is arranged on one side of the attached material in S1-S7, the material is prevented from being broken under special factors, and timely alarming is achieved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The die cutting positioning hole rotating process is characterized by comprising the following steps of:
s1: punching the second release film by an A die cutting machine with the release surface facing upwards, pulling the self-carrying paper of the reticulated adhesive and attaching the self-carrying paper of the reticulated adhesive downwards to the upper surface of the release film in the middle, simultaneously pulling the self-carrying paper of the reticulated adhesive, attaching the fourth release film to the upper surface of the reticulated adhesive downwards in the middle, attaching the adhesion surface of the acrylic protective film to the lower surface of the second release film in the middle with the adhesion surface facing upwards, and rolling by using an adhesive core to obtain a material A;
s2: punching the fourth release film surface in the material A upwards by a B die cutting machine, pulling four pieces of conductive adhesive waste materials, enabling the weak adhesive surfaces of the conductive adhesives to face downwards, attaching the conductive adhesive waste materials with reference to a figure 2, pulling all the conductive adhesives from the adhesive waste materials, attaching the third release film surface downwards, centering the third release film surface to the upper surface of the conductive adhesive on the uppermost layer, and rolling by using a rubber core to obtain a material B;
s3: punching the third release film face upwards in the material B by a C die cutting machine, attaching the adhesive surface of a sealing adhesive tape to the upper surface of the third release film face downwards, pulling all the third release film, the fourth release film and the outer frame waste material, attaching the red surface of a copper foil to the middle in a downward mode, pulling a self-carrying film of a silica gel protective film to enable the adhesive surface of the self-carrying film to be attached to the middle in a downward mode, and rolling by using an adhesive core to obtain a material C;
s4: punching the acrylic protective film in the material C upwards by a D die cutting machine, pulling acrylic protective film waste, pulling a middle second release film waste, attaching a fourth release film with the release surface facing downwards in the middle, and rolling by using a rubber core to obtain a material D;
s5: punching the fourth release film surface in the material D upwards by an E die cutting machine, attaching the box sealing adhesive tape surface downwards, pulling the aluminum foil outer frame and all fourth release film waste materials, attaching the transparent silica gel adhesive tape surface upwards to a reference knife line, attaching the fourth release film downwards and centrally, and winding by using a rubber core to obtain a material E;
s6: punching the fourth release film surface in the material E by an F die-cutting machine, pulling the transparent silica gel adhesive tape intermediate waste and all fourth release film waste, centrally attaching the first release film downwards, and winding by using a rubber core to obtain a material F;
s7: and (3) punching the first release film surface in the material F upwards by a G die cutting machine, upwards pulling to obtain the waste materials of the positioning holes at two sides, downwards pulling to obtain the silica gel protective film and the waste materials of the transparent silica gel adhesive tapes at two sides, and rolling by using a gel core to obtain the material G.
2. The die cutting positioning hole rotating hole process according to claim 1, wherein: the punching level of the die-cutting machine A is a second release film; the punching layer of the B die-cutting machine is a fourth release film and reticulate glue; the punching layer of the C die-cutting machine is a third release film and conductive adhesive; the punching level of the D die-cutting machine is an acrylic protective film and a second release film; the punching layer of the E die-cutting machine comprises a fourth release film, reticulate pattern glue, conductive glue and copper foil; the punching level of the F die-cutting machine is a fourth release film and a transparent silica gel adhesive tape; the punching level of the G die-cutting machine is a first release film and a transparent silica gel adhesive tape.
3. The die cutting positioning hole rotating hole process according to claim 1, wherein: the punching knife pressures of the A-G die-cutting machine are 3.520 +/-0.1, 4.200 +/-0.1, 2.520 +/-0.1, 4.574 +/-0.1, -6.36 +/-0.1, 1.49 +/-0.1 and-14.58 +/-0.1 respectively, and the unit of the punching knife pressure is Pa; the punching speed of the A-G die cutting machine is 210 punching +/-5 punching/min, 180 punching +/-5 punching/min and 180 punching +/-5 punching/min respectively.
4. The die cutting positioning hole rotating hole process according to claim 1, wherein: the bonding steps in S1 to S7 are all performed by using a bonding machine.
5. The die cutting positioning hole rotating hole process according to claim 1, wherein: the A-G die cutting machine adopts etching knives, wherein the etching knives in the A, C, E die cutting machine are all internally straight and externally inclined by 35 degrees, and the etching knives in the D die cutting machine are in double peaks by 35 degrees.
6. The die cutting positioning hole rotating hole process according to claim 1, wherein: and in the S1-S7, a scraper jig is adopted to strip the waste, and in the S1-S7, a material breaking photoelectric sensor is arranged on one side of the bonding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110513860.5A CN113232083A (en) | 2021-05-12 | 2021-05-12 | Die cutting positioning hole rotating process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110513860.5A CN113232083A (en) | 2021-05-12 | 2021-05-12 | Die cutting positioning hole rotating process |
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| CN113232083A true CN113232083A (en) | 2021-08-10 |
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| CN202110513860.5A Pending CN113232083A (en) | 2021-05-12 | 2021-05-12 | Die cutting positioning hole rotating process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114132045A (en) * | 2021-12-01 | 2022-03-04 | 汇精（厦门）电子科技有限公司 | Production equipment of electric appliance copper foil film |
| CN115256541A (en) * | 2022-07-18 | 2022-11-01 | 恒玮电子材料(昆山)有限公司 | Die cutting process for controlling dimension of Mylar area of easy-to-draw glue |
-
2021
- 2021-05-12 CN CN202110513860.5A patent/CN113232083A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114132045A (en) * | 2021-12-01 | 2022-03-04 | 汇精（厦门）电子科技有限公司 | Production equipment of electric appliance copper foil film |
| CN115256541A (en) * | 2022-07-18 | 2022-11-01 | 恒玮电子材料(昆山)有限公司 | Die cutting process for controlling dimension of Mylar area of easy-to-draw glue |
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Application publication date: 20210810 |