CN206005005U - The multilamellar soft or hard that light-sensitive surface thickens combines printed substrate - Google Patents
The multilamellar soft or hard that light-sensitive surface thickens combines printed substrate Download PDFInfo
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- CN206005005U CN206005005U CN201620900027.0U CN201620900027U CN206005005U CN 206005005 U CN206005005 U CN 206005005U CN 201620900027 U CN201620900027 U CN 201620900027U CN 206005005 U CN206005005 U CN 206005005U
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Abstract
This utility model is related to the multilamellar soft or hard that a kind of light-sensitive surface thickens and combines printed substrate, and it includes the first soft board, the second soft board, the first light-sensitive surface, the second light-sensitive surface, adhesive glue, the first hardboard, the second hardboard, prepreg, the 5th copper foil layer and the 6th copper foil layer；First soft board includes the first soft board layer, copper foil layer on first, first time copper foil layer, coverlay and first time coverlay on first；It is provided with copper foil layer on five pieces about spaced first in the upper surface of the first soft board layer, being provided with five pieces in the lower surface of the first soft board layer is in the spaced first time copper foil layer in left and right, it is wrapped with coverlay on first in copper foil layer on the first of middle part, be wrapped with first time coverlay in first time copper foil layer positioned at middle part；This utility model structure is simple, be easy to production, and this utility model decreases production procedure and production cycle, reduces production cost.
Description
Technical field
This utility model is related to a kind of printed substrate, and this utility model especially relates to the multilamellar that a kind of light-sensitive surface thickens
Soft or hard combines printed substrate.
Background technology
As consumption electronic product is lightening, integrated, multifunction development trend, it combines to printed wire soft or hard
The processing technology of plate requires more and more higher.Comply with this trend, the printed wire Rigid Flex of multilamellar soft board can be increasingly becoming
The pith of printed circuit board (PCB), the advantage of this product shows as saving more design spaces, reduces assembling, signal biography
Defeated faster with more stable etc..
The Rigid Flex of multilamellar soft board has two kinds of folded structures, and one kind simply has coverlay to protect for soft board bending part,
And do not press together between multiple soft boards, referred to as Ari-gap（Air layer）, another kind of do not only have for soft board bending part
Coverlay protects, and presses together between multiple soft boards, referred to as non-Ari-gap.
The multilamellar soft board printed wire Rigid Flex of non-Ari-gap design, general pressing is all by multilamellar soft board first first
Pressed, soft board bending part also presses together simultaneously, then finally pressed with other hardboard layers again, such technique
The defect existing is to need least twice to press, and the figure between every layer easily offsets, and increased flow process, production cycle and becomes
This.
Content of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides that a kind of structure is simple, is easy to produce
The multilamellar soft or hard that thickens of light-sensitive surface combine printed substrate.
The technical scheme providing according to this utility model, the multilamellar soft or hard that described light-sensitive surface thickens combines printed substrate,
It includes the first soft board, the second soft board, the first light-sensitive surface, the second light-sensitive surface, adhesive glue, the first hardboard, the second hardboard, semi-solid preparation
Piece, the 5th copper foil layer and the 6th copper foil layer；
First soft board include the first soft board layer, copper foil layer on first, first time copper foil layer, under coverlay and first on first
Coverlay；It is provided with copper foil layer on five pieces about spaced first in the upper surface of the first soft board layer, in the first soft board layer
It is in the spaced first time copper foil layer in left and right that lower surface is provided with five pieces, is wrapped with the in copper foil layer on the first of middle part
Coverlay on one, is wrapped with first time coverlay in first time copper foil layer positioned at middle part；
Second soft board include the second soft board layer, copper foil layer on second, second time copper foil layer, under coverlay and second on second
Coverlay；Being provided with five pieces in the upper surface of the second soft board layer is in copper foil layer on left and right spaced second, in the second soft board layer
Lower surface be provided with five pieces be in the spaced second time copper foil layer in left and right, be wrapped with copper foil layer on the second of middle part
Coverlay on second, is wrapped with second time coverlay in second time copper foil layer positioned at middle part；
First hardboard includes the first hardboard layer, copper foil layer and the three times copper foil layers on the 3rd；Upper table in the first hardboard layer
Face is arranged at intervals with copper foil layer on four piece the 3rd in left and right, is arranged at intervals with four piece in left and right in the lower surface of the first hardboard layer
Three times copper foil layers；
Second hardboard includes the second hardboard layer, copper foil layer and the four times copper foil layers on the 4th；Upper table in the second hardboard layer
Face is arranged at intervals with copper foil layer on four piece the 4th in left and right, is arranged at intervals with four piece in left and right in the lower surface of the second hardboard layer
Four times copper foil layers；
5th copper foil layer is connected with the first hardboard by prepreg, and the first hardboard passes through prepreg and the first soft board phase
Even, the first soft board is connected with the second soft board by prepreg, and the second soft board is connected with the second hardboard by prepreg, and second
Hardboard is connected with the 6th copper foil layer by prepreg；
On first, the upper surface of coverlay is provided with the first light-sensitive surface, is provided with the second sense in the lower surface of second time coverlay
Light film, is provided with adhesive glue between the upper surface of coverlay on the lower surface and second of first time coverlay.
The thickness of described first soft board layer is 0.04 ~ 0.06mm.
The thickness of described second soft board layer is 0.04 ~ 0.06mm.
The thickness of described first light-sensitive surface is 0.04 ~ 0.06mm.
The thickness of described second light-sensitive surface is 0.04 ~ 0.06mm.
The thickness of described adhesive glue is 0.01 ~ 0.03mm.
The thickness of described first hardboard layer is 0.12 ~ 0.13mm.
The thickness of described second hardboard layer is 0.12 ~ 0.13mm.
The thickness of described prepreg is 0.06 ~ 0.10mm.
This utility model structure is simple, be easy to production, and this utility model decreases production procedure and production cycle, reduces
Production cost.
Brief description
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of the first soft board in this utility model step a.
Fig. 3 is the structural representation of the second soft board in this utility model step b.
Fig. 4 is the structural representation of the first soft board after pressing upper first light-sensitive surface.
Fig. 5 is the structural representation of the second soft board after pressing upper second light-sensitive surface.
Fig. 6 is the structural representation of the photosensitive soft board of first obtaining in this utility model step e.
Fig. 7 is the structural representation of the photosensitive soft board of first obtaining in this utility model step f.
Fig. 8 is the structural representation of the first photosensitive soft board after pressing upper adhesive glue.
Fig. 9 is the structural representation of the first hardboard in this utility model step h.
Figure 10 is the structural representation of the second hardboard in this utility model step i.
Figure 11 is the structural representation of prepreg in this utility model.
Figure 12 is the structural representation of the 5th copper foil layer in this utility model.
Figure 13 is the structural representation of the 6th copper foil layer in this utility model.
Specific embodiment
With reference to specific embodiment, the utility model is described in further detail.
The multilamellar soft or hard that this light-sensitive surface thickens combines printed substrate, and it includes the first soft board 1, the second soft board 2, first is felt
Light film 3, the second light-sensitive surface 4, adhesive glue 5, the first hardboard 6, the second hardboard 7, prepreg 8, the 5th copper foil layer 9 and the 6th Copper Foil
Layer 10；
First soft board 1 includes copper foil layer 1.2 on the first soft board layer 1.1, first, covers on first time copper foil layer 1.3, first
Film 1.4 and first time coverlay 1.5；It is provided with copper on five pieces about spaced first in the upper surface of the first soft board layer 1.1
Layers of foil 1.2, being provided with five pieces in the lower surface of the first soft board layer 1.1 is in the spaced first time copper foil layer 1.3 in left and right, is being located at
On the first of middle part, copper foil layer 1.2 is wrapped with coverlay 1.4 on first, in first time copper foil layer 1.3 outsourcing positioned at middle part
It is wrapped with first time coverlay 1.5；
Second soft board 2 includes copper foil layer 2.2 on the second soft board layer 2.1, second, covers on second time copper foil layer 2.3, second
Film 2.4 and second time coverlay 2.5；Being provided with five pieces in the upper surface of the second soft board layer 2.1 is on left and right spaced second
Copper foil layer 2.2, being provided with five pieces in the lower surface of the second soft board layer 2.1 is in the spaced second time copper foil layer 2.3 in left and right, in place
On the second of middle part, copper foil layer 2.2 is wrapped with coverlay 2.4 on second, outside second time copper foil layer 2.3 at middle part
It is enclosed with second time coverlay 2.5；
First hardboard 6 includes copper foil layer 6.2 and the three times copper foil layers 6.3 on the first hardboard layer the 6.1, the 3rd；Hard first
The upper surface of flaggy 6.1 is arranged at intervals with copper foil layer 6.2 on four piece the 3rd in left and right, in the lower surface of the first hardboard layer 6.1 is in
Left and right is arranged at intervals with four pieces of the three times copper foil layers 6.3；
Second hardboard 7 includes copper foil layer 7.2 and the four times copper foil layers 7.3 on the second hardboard layer the 7.1, the 4th；Hard second
The upper surface of flaggy 7.1 is arranged at intervals with copper foil layer 7.2 on four piece the 4th in left and right, in the lower surface of the second hardboard layer 7.1 is in
Left and right is arranged at intervals with four pieces of the four times copper foil layers 7.3；
5th copper foil layer 9 is connected with the first hardboard 6 by prepreg 8, and the first hardboard 6 passes through prepreg 8 and first
Soft board 1 is connected, and the first soft board 1 is connected with the second soft board 2 by prepreg 8, and the second soft board 2 passes through prepreg 8 and second
Hardboard 7 is connected, and the second hardboard 7 is connected with the 6th copper foil layer 10 by prepreg 8；
On first, the upper surface of coverlay 1.4 is provided with the first light-sensitive surface 3, sets in the lower surface of second time coverlay 2.5
There is the second light-sensitive surface 4, the lower surface and second of first time coverlay 1.5 is provided with bonding between the upper surface of coverlay 2.4
Glue 5.
The thickness of described first soft board layer 1.1 is 0.04 ~ 0.06mm.
The thickness of described second soft board layer 2.1 is 0.04 ~ 0.06mm.
The thickness of described first light-sensitive surface 3 is 0.04 ~ 0.06mm.
The thickness of described second light-sensitive surface 4 is 0.04 ~ 0.06mm.
The thickness of described adhesive glue 5 is 0.01 ~ 0.03mm.
The thickness of described first hardboard layer 6.1 is 0.12 ~ 0.13mm.
The thickness of described second hardboard layer 7.1 is 0.12 ~ 0.13mm.
The thickness of described prepreg 8 is 0.06 ~ 0.10mm.
The multilamellar soft or hard that this light-sensitive surface thickens combines printed substrate, and it can be obtained by following technique：
A, take ready-made first soft board 1, the first soft board 1 includes copper foil layer on the first soft board layer 1.1, first
1.2nd, coverlay 1.4 and first time coverlay 1.5 on first time copper foil layer 1.3, first；Upper surface in the first soft board layer 1.1
Being provided with five pieces is in copper foil layer 1.2 on left and right spaced first, and being provided with five pieces in the lower surface of the first soft board layer 1.1 is in left and right
Spaced first time copper foil layer 1.3, is wrapped with coverlay 1.4 on first in copper foil layer 1.2 on the first of middle part,
It is wrapped with first time coverlay 1.5 in the first time copper foil layer 1.3 positioned at middle part；
B, take ready-made second soft board 2, the second soft board 2 includes copper foil layer on the second soft board layer 2.1, second
2.2nd, coverlay 2.4 and second time coverlay 2.5 on second time copper foil layer 2.3, second；Upper surface in the second soft board layer 2.1
Being provided with five pieces is in copper foil layer 2.2 on left and right spaced second, and being provided with five pieces in the lower surface of the second soft board layer 2.1 is in left and right
Spaced second time copper foil layer 2.3, is wrapped with coverlay 2.4 on second in copper foil layer 2.2 on the second of middle part,
It is wrapped with second time coverlay 2.5 in the second time copper foil layer 2.3 positioned at middle part；
Coverlay on copper foil layer 1.2 and first on coverlay 1.4 and first on c, copper foil layer 1.2, first on first
The first light-sensitive surface 3 is pressed on the upper surface of the first soft board layer 1.1 between 1.4；
D, in second time copper foil layer 2.3, second time coverlay 2.5 and second time copper foil layer 2.3 and second time coverlay
The second light-sensitive surface 4 is pressed on the lower surface of the second soft board layer 2.1 between 2.5；
E, the first light-sensitive surface 3 outside coverlay on first 1.4 profile is passed through the conventional radium-shine cutting method of UV or
CO2Radium-shine cutting method removes, and obtains the first photosensitive soft board；
F, the second light-sensitive surface 4 outside second time coverlay 2.5 profile is removed, obtain the second photosensitive soft board；
G, in the following table face pressure of first time coverlay 1.5 of the first photosensitive soft board adhesive glue 5；
H, take ready-made first hardboard 6, the first hardboard 6 includes copper foil layer on the first hardboard layer the 6.1, the 3rd
6.2 and the three times copper foil layers 6.3；It is arranged at intervals with copper foil layer on four piece the 3rd in the upper surface of the first hardboard layer 6.1 in left and right
6.2, it is arranged at intervals with four pieces of the three times copper foil layers 6.3 in left and right in the lower surface of the first hardboard layer 6.1；
I, take ready-made second hardboard 7, the second hardboard 7 includes copper foil layer on the second hardboard layer the 7.1, the 4th
7.2 and the four times copper foil layers 7.3；It is arranged at intervals with copper foil layer on four piece the 4th in the upper surface of the second hardboard layer 7.1 in left and right
7.2, it is arranged at intervals with four pieces of the four times copper foil layers 7.3 in left and right in the lower surface of the second hardboard layer 7.1；
J, take prepreg 8, the 5th copper foil layer 9 and the 6th copper foil layer 10 holding window 8.1 in advance successfully, standby；
5th copper foil layer 9, prepreg 8, the first hardboard 6, prepreg 8, first are felt by k, the order pressed from top to bottom
Light soft board, prepreg 8, the second photosensitive soft board, prepreg 8, the second hardboard 7, prepreg 8 and the 6th copper foil layer 10 heap
Fold and compressing, obtain the multilamellar soft or hard that light-sensitive surface thickens and combine printed substrate.
In step a, in the first soft board 1, the first soft board layer 1.1 is provided by Song Yang Electron Material Co., Ltd, model A-
2005ED, the thickness of the first soft board layer 1.1 is 0.05mm；On first, coverlay 1.4 and first time coverlay 1.5 are by platform rainbow electronics
Company limited provides, model FGA 0525, and its thickness is about 0.033mm.
In step b, in the second soft board 2, the second soft board layer 2.1 is provided by Song Yang Electron Material Co., Ltd, model A-
2005ED, the thickness of the second soft board layer 2.1 is 0.05mm；On second, coverlay 2.4 and second time coverlay 2.5 are by platform rainbow electronics
Company limited provides, model FGA 0525, and its thickness is about 0.033mm.
In step c, the first light-sensitive surface 3 is provided by E.I.Du Pont Company, model PM250, and thickness is 0.05mm.
In step d, the second light-sensitive surface 4 is provided by E.I.Du Pont Company, model PM250, and thickness is 0.05mm.
In step g, adhesive glue 5 is provided by Tai Hong Electronics Co., Ltd., its model BT-25, and its thickness is 0.02mm.
In step h, the first hardboard layer 6.1 is provided by platform photoelectron material Kunshan company limited, its model 0.005 H/H
OZ, its thickness is 0.125mm.
In step i, the second hardboard layer 7.1 is provided by platform photoelectron material Kunshan company limited, its model 0.005 H/H
OZ, its thickness is 0.125mm.
In step j, prepreg 8 is provided by platform photoelectron material Kunshan company limited, its model 1080 Low
Flow, its thickness is 0.08mm, and prepreg 8 is low gummosis.
Claims (9)
1. the multilamellar soft or hard that a kind of light-sensitive surface thickens combines printed substrate, it is characterized in that it includes the first soft board（1）, second soft
Plate（2）, the first light-sensitive surface（3）, the second light-sensitive surface（4）, adhesive glue（5）, the first hardboard（6）, the second hardboard（7）, prepreg
（8）, the 5th copper foil layer（9）With the 6th copper foil layer（10）；
First soft board（1）Including the first soft board layer（1.1）, copper foil layer on first（1.2）, first time copper foil layer（1.3）, on first
Coverlay（1.4）With first time coverlay（1.5）；In the first soft board layer（1.1）Upper surface be provided with five pieces about interval settings
First on copper foil layer（1.2）, in the first soft board layer（1.1）Lower surface be provided with five pieces be in the spaced first time copper in left and right
Layers of foil（1.3）, in copper foil layer on the first of middle part（1.2）It is wrapped with coverlay on first（1.4）, positioned at middle part
First time copper foil layer（1.3）It is wrapped with first time coverlay（1.5）；
Second soft board（2）Including the second soft board layer（2.1）, copper foil layer on second（2.2）, second time copper foil layer（2.3）, on second
Coverlay（2.4）With second time coverlay（2.5）；In the second soft board layer（2.1）Upper surface to be provided with five pieces be between left and right every setting
Copper foil layer on second putting（2.2）, in the second soft board layer（2.1）Lower surface be provided with five pieces be in left and right spaced second under
Copper foil layer（2.3）, in copper foil layer on the second of middle part（2.2）It is wrapped with coverlay on second（2.4）, positioned at middle part
Second time copper foil layer（2.3）It is wrapped with second time coverlay（2.5）；
First hardboard（6）Including the first hardboard layer（6.1）, copper foil layer on the 3rd（6.2）With the three times copper foil layers（6.3）；?
One hardboard layer（6.1）Upper surface be arranged at intervals with copper foil layer on four piece the 3rd in left and right（6.2）, in the first hardboard layer（6.1）
Lower surface be arranged at intervals with four pieces of the three times copper foil layers in left and right（6.3）；
Second hardboard（7）Including the second hardboard layer（7.1）, copper foil layer on the 4th（7.2）With the four times copper foil layers（7.3）；?
Two hardboard layers（7.1）Upper surface be arranged at intervals with copper foil layer on four piece the 4th in left and right（7.2）, in the second hardboard layer（7.1）
Lower surface be arranged at intervals with four pieces of the four times copper foil layers in left and right（7.3）；
5th copper foil layer（9）By prepreg（8）With the first hardboard（6）It is connected, the first hardboard（6）By prepreg（8）
With the first soft board（1）It is connected, the first soft board（1）By prepreg（8）With the second soft board（2）It is connected, the second soft board（2）Pass through
Prepreg（8）With the second hardboard（7）It is connected, the second hardboard（7）By prepreg（8）With the 6th copper foil layer（10）It is connected；
Coverlay on first（1.4）Upper surface be provided with the first light-sensitive surface（3）, in second time coverlay（2.5）Lower surface
It is provided with the second light-sensitive surface（4）, in first time coverlay（1.5）Lower surface and second on coverlay（2.4）Upper surface between
It is provided with adhesive glue（5）.
2. the multilamellar soft or hard that light-sensitive surface as claimed in claim 1 thickens combines printed substrate, it is characterized in that：Described first is soft
Flaggy（1.1）Thickness be 0.04 ~ 0.06mm.
3. the multilamellar soft or hard that light-sensitive surface as claimed in claim 1 thickens combines printed substrate, it is characterized in that：Described second is soft
Flaggy（2.1）Thickness be 0.04 ~ 0.06mm.
4. the multilamellar soft or hard that light-sensitive surface as claimed in claim 1 thickens combines printed substrate, it is characterized in that：Described first sense
Light film（3）Thickness be 0.04 ~ 0.06mm.
5. the multilamellar soft or hard that light-sensitive surface as claimed in claim 1 thickens combines printed substrate, it is characterized in that：Described second sense
Light film（4）Thickness be 0.04 ~ 0.06mm.
6. the multilamellar soft or hard that light-sensitive surface as claimed in claim 1 thickens combines printed substrate, it is characterized in that：Described adhesive glue
（5）Thickness be 0.01 ~ 0.03mm.
7. the multilamellar soft or hard that light-sensitive surface as claimed in claim 1 thickens combines printed substrate, it is characterized in that：Described first is hard
Flaggy（6.1）Thickness be 0.12 ~ 0.13mm.
8. the multilamellar soft or hard that light-sensitive surface as claimed in claim 1 thickens combines printed substrate, it is characterized in that：Described second is hard
Flaggy（7.1）Thickness be 0.12 ~ 0.13mm.
9. the multilamellar soft or hard that light-sensitive surface as claimed in claim 1 thickens combines printed substrate, it is characterized in that：Described semi-solid preparation
Piece（8）Thickness be 0.06 ~ 0.10mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620900027.0U CN206005005U (en) | 2016-08-18 | 2016-08-18 | The multilamellar soft or hard that light-sensitive surface thickens combines printed substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620900027.0U CN206005005U (en) | 2016-08-18 | 2016-08-18 | The multilamellar soft or hard that light-sensitive surface thickens combines printed substrate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587973A (en) * | 2019-01-30 | 2019-04-05 | 高德（无锡）电子有限公司 | A kind of process for pressing of multilayer soft board Rigid Flex |
| CN110691477A (en) * | 2019-09-18 | 2020-01-14 | 九江明阳电路科技有限公司 | Method and system for manufacturing rigid-flex printing plate |
-
2016
- 2016-08-18 CN CN201620900027.0U patent/CN206005005U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587973A (en) * | 2019-01-30 | 2019-04-05 | 高德（无锡）电子有限公司 | A kind of process for pressing of multilayer soft board Rigid Flex |
| CN110691477A (en) * | 2019-09-18 | 2020-01-14 | 九江明阳电路科技有限公司 | Method and system for manufacturing rigid-flex printing plate |
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