CN202353922U - Soft and hard combined circuit board structure - Google Patents
Soft and hard combined circuit board structure Download PDFInfo
- Publication number
- CN202353922U CN202353922U CN2011203950116U CN201120395011U CN202353922U CN 202353922 U CN202353922 U CN 202353922U CN 2011203950116 U CN2011203950116 U CN 2011203950116U CN 201120395011 U CN201120395011 U CN 201120395011U CN 202353922 U CN202353922 U CN 202353922U
- Authority
- CN
- China
- Prior art keywords
- adhesive sheet
- soft
- hard
- hardboard
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a soft and hard combined circuit board structure, comprising an upper hard board, a lower hard board, and a soft board arranged between the upper hard board and the lower hard board. A third splicing piece and a fourth splicing piece are arranged at the left side and the right side of the upper part of the soft board; a first Teflon gasket is arranged between the third splicing piece and the fourth splicing piece; a fifth splicing piece and a sixth splicing piece are arranged at the left side and the right side of the bottom of the soft board; and a second Teflon gasket is arranged between the fifth splicing piece and the sixth splicing piece. The Teflon gaskets are added at the middle parts of the upper part and the bottom of the soft board between the upper hard board and the lower hard board, and the difference of level of a bent area generated through superposition at soft and hard combined parts can be compensated, so that the production and machining of an outer layer can be facilitated.
Description
Technical field:
The utility model relates to the PCB manufacturing technology, and what be specifically related to is a kind of flexible and hard combined circuit board structure.
Background technology:
Rigid Flex is the printed board that soft board and rigid plate join, and is meant the circuit board that utilizes flexible substrate and process in the interconnection of zones of different and rigid base material.In the soft or hard land, the conductive pattern on flexible substrate and the rigid substrate all interconnects usually.The rigidity of its existing hardboard is so that piece; The pliability that soft board is arranged simultaneously is convenient to three-dimensional assembling.
At present in the PCB industry, the Rigid Flex development rapidly, the market demand cumulative year after year, the soft or hard bonded products sales volume increasing degree of the product number of plies also corresponding raising, especially the soft board number of plies >=6 layer is bigger.But soft board adds up more than 6 layers; Because of bonding sheet superposes at the soft or hard bound fraction; And soft board bending zone does not have bonding sheet; So the Rigid Flex of the soft board number of plies >=6 layer is bigger at the regional drop of bending, is unfavorable for production operation, the Copper Foil that is easy to the hardboard window edge that soft board is corresponding during such as the abrasive band nog plate grinds off; And during outer laminating dry film, the hardboard in dry film and bending zone can't bond or adhesion poor.
Summary of the invention:
For this reason, the purpose of the utility model is to provide a kind of flexible and hard combined circuit board structure, and is bigger at the bending zone drop that the stack of soft or hard bound fraction is produced to solve Rigid Flex, is unfavorable for the problem of production operation.
For realizing above-mentioned purpose, the utility model mainly adopts following technical scheme:
A kind of flexible and hard combined circuit board structure; By last hardboard (2), down hardboard (3) be positioned at hardboard (2), descend soft board (4) formation between the hardboard (3); Said soft board (4) left and right sides, top is provided with the 3rd adhesive sheet (401) and the 4th adhesive sheet (402), is provided with the first Teflon pad (404) between said the 3rd adhesive sheet (401), the 4th adhesive sheet (402); The left and right sides, said soft board (4) bottom is provided with the 5th adhesive sheet (405) and the 6th adhesive sheet (406), is provided with the second Teflon pad (407) between said the 5th adhesive sheet (405) and the 6th adhesive sheet (406).
Through range upon range of bonding the forming of adhesive sheet, said adhesive sheet is positioned at the left and right sides of soft central layer (403) top or bottom to wherein said soft board (4) by a plurality of soft central layers (403).
Wherein said go up hardboard (2) by the first upper hard-core plate (201) and the second upper hard-core plate (203) through bonding the forming of first adhesive sheet (202).
Wherein said down hardboard (3) by first time hard central layer (301) and second time hard central layer (303) through bonding the forming of second adhesive sheet (302).
The utility model is through at last hardboard, down add the Teflon pad in the middle of the soft board top between the hardboard and the bottom, the regional drop of bending that is produced in the stack of soft or hard bound fraction with compensation, thus help outer field production and processing.
Description of drawings:
Fig. 1 is the structural representation of the utility model Rigid Flex.
Fig. 2 is the generalized section of A-A direction among Fig. 1.
Identifier declaration among the figure: flexible and hard combined circuit board 1, go up hardboard 2, the first upper hard-core plate 201, first adhesive sheet 202, the second upper hard-core plate 203, the hard central layer of the hard central layer of hardboard 3, first time 301, second adhesive sheet 302, second time 303, soft board 4, the 3rd adhesive sheet 401, the 4th adhesive sheet 402, soft central layer 403, the first Teflon pad 404, the 5th adhesive sheet 405, the 6th adhesive sheet 406, the second Teflon pad 407 down.
Embodiment:
For setting forth the thought and the purpose of the utility model, will combine accompanying drawing and specific embodiment that the utility model is done further explanation below.
See also shown in Figure 1ly, Fig. 1 is the structural representation of the utility model Rigid Flex.The utility model provides a kind of flexible and hard combined circuit board structure, and it is bigger at the regional drop of bending to be mainly used in the Rigid Flex that solves the present soft board number of plies >=6 layers, is unfavorable for the problem of production operation.
Wherein this flexible and hard combined circuit board 1 is that said going up between hardboard 2, soft board 4 and the following hardboard 3 passed through adhesive sheet together by last hardboard 2, hardboard 3 and at last hardboard 2, the soft board 4 between the hardboard 3 constitutes down down.
As shown in Figure 2, Fig. 2 is the generalized section of A-A direction among Fig. 1.Wherein said soft board 4 be by a plurality of soft central layers 403 through range upon range of bonding the forming of adhesive sheet, said adhesive sheet is positioned at the left and right sides of soft central layer 403 tops or bottom, then is dead slot between wherein; Last hardboard 2 by the first upper hard-core plate 201 and the second upper hard-core plate 203 through first adhesive sheet, 202 bonding forming; Following hardboard 3 by first time hard central layer 301 and second time hard central layer 303 through second adhesive sheet, 302 bonding forming.
The left and right sides, soft board 4 top is provided with the 3rd adhesive sheet 401 and the 4th adhesive sheet 402, also is provided with the first Teflon pad 404 between said the 3rd adhesive sheet 401, the 4th adhesive sheet 402; The left and right sides, bottom of said soft board 4 is provided with the 5th adhesive sheet 405 and the 6th adhesive sheet 406, is provided with the second Teflon pad 407 between said the 5th adhesive sheet 405 and the 6th adhesive sheet 406.
The utility model is through being arranged on the Teflon pad between soft board and the hardboard; Drop with bending zone in the middle of the compensation soft board; Avoid causing flexible and hard combined circuit board carried out operations such as abrasive band nog plate and outer laminating dry film, existing inconvenient machining problem because of drop is excessive.
More than be that a kind of flexible and hard combined circuit board structure that the utility model is provided has been carried out detailed introduction; Used concrete example among this paper the structural principle and the execution mode of the utility model are set forth, above embodiment just is used to help to understand the method and the core concept thereof of the utility model; Simultaneously, for one of ordinary skill in the art, according to the thought of the utility model, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.
Claims (4)
1. flexible and hard combined circuit board structure; By last hardboard (2), down hardboard (3) be positioned at hardboard (2), descend soft board (4) formation between the hardboard (3); It is characterized in that said soft board (4) left and right sides, top is provided with the 3rd adhesive sheet (401) and the 4th adhesive sheet (402), be provided with the first Teflon pad (404) between said the 3rd adhesive sheet (401), the 4th adhesive sheet (402); The left and right sides, said soft board (4) bottom is provided with the 5th adhesive sheet (405) and the 6th adhesive sheet (406), is provided with the second Teflon pad (407) between said the 5th adhesive sheet (405) and the 6th adhesive sheet (406).
2. flexible and hard combined circuit board structure according to claim 1, it is characterized in that said soft board (4) by a plurality of soft central layers (403) through range upon range of bonding the forming of adhesive sheet, said adhesive sheet is positioned at the left and right sides of soft central layer (403) top or bottom.
3. flexible and hard combined circuit board structure according to claim 1, it is characterized in that said go up hardboard (2) by the first upper hard-core plate (201) and the second upper hard-core plate (203) through bonding the forming of first adhesive sheet (202).
4. flexible and hard combined circuit board structure according to claim 1, it is characterized in that said down hardboard (3) by first time hard central layer (301) and second time hard central layer (303) through bonding the forming of second adhesive sheet (302).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203950116U CN202353922U (en) | 2011-10-17 | 2011-10-17 | Soft and hard combined circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203950116U CN202353922U (en) | 2011-10-17 | 2011-10-17 | Soft and hard combined circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202353922U true CN202353922U (en) | 2012-07-25 |
Family
ID=46542875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203950116U Expired - Fee Related CN202353922U (en) | 2011-10-17 | 2011-10-17 | Soft and hard combined circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202353922U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125727A (en) * | 2014-07-31 | 2014-10-29 | 高德（无锡）电子有限公司 | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards |
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
-
2011
- 2011-10-17 CN CN2011203950116U patent/CN202353922U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125727A (en) * | 2014-07-31 | 2014-10-29 | 高德（无锡）电子有限公司 | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards |
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103327756B (en) | There is multilayer circuit board of local mixing structure and preparation method thereof | |
| CN103025051A (en) | High density interconnect (HDI) plate with mechanic back drilling structure and manufacturing method thereof | |
| CN103179790B (en) | Mixed pressing printed circuit board and preparation method thereof | |
| CN206136449U (en) | FPC board | |
| CN103345132A (en) | Method for aligning outer layer film PIN nails | |
| CN202958045U (en) | High-reliability hard and soft combined board | |
| CN101478858B (en) | Circuit board construction, manufacturing method and liquid crystal display | |
| CN202353922U (en) | Soft and hard combined circuit board structure | |
| CN104735923B (en) | A kind of preparation method of rigid-flex combined board | |
| CN204031568U (en) | Flexible printed circuit board | |
| CN206421054U (en) | A kind of polarizing coating | |
| CN202587601U (en) | Printed circuit board (PCB) multi-layer board with blind holes and buried holes | |
| CN206005005U (en) | The multilamellar soft or hard that light-sensitive surface thickens combines printed substrate | |
| US9041892B2 (en) | Tape substrate for chip on film structure of liquid crystal panel | |
| CN103732008B (en) | Connecting sheet circuit board and the manufacture method of connecting sheet circuit board | |
| CN202310299U (en) | Rigid-flex board | |
| CN106304622A (en) | A kind of FPC plate | |
| CN202035214U (en) | Six-layer flexible circuit board | |
| CN201839523U (en) | Superposed structure of soft/hard combined circuit board | |
| CN206611634U (en) | A kind of FPC | |
| CN114615804B (en) | Manufacturing method of flexible circuit board with 180-degree bending single-sided golden finger and two-sided plugging function | |
| CN201839508U (en) | Composite ultra-thin PCB | |
| CN204761846U (en) | FPC adsorbs adhesive tape changes subassembly | |
| CN204031569U (en) | A kind of flexible printed circuit board | |
| CN203560840U (en) | Backlight reinforcement frame, liquid crystal display module and liquid crystal display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20171017 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |