CN103345132A - Method for aligning outer layer film PIN nails - Google Patents
Method for aligning outer layer film PIN nails Download PDFInfo
- Publication number
- CN103345132A CN103345132A CN2013102554604A CN201310255460A CN103345132A CN 103345132 A CN103345132 A CN 103345132A CN 2013102554604 A CN2013102554604 A CN 2013102554604A CN 201310255460 A CN201310255460 A CN 201310255460A CN 103345132 A CN103345132 A CN 103345132A
- Authority
- CN
- China
- Prior art keywords
- film
- pin nail
- contraposition
- pin
- press strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000002390 adhesive tape Substances 0.000 claims abstract description 7
- 241000255777 Lepidoptera Species 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 2
- 239000000047 product Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a method for aligning outer layer film PIN nails. A outer layer film comprises a first film (A) and a second film (B), and the method comprises the following steps: forming 4 PIN holes (E), a plurality of butterfly clips (C) and a plurality of target holes (D) in the first film, and forming a plurality of butterfly clips (C) and target holes (D) correspondingly overlapped with the butterfly clips (C) and the target holes (D) in the first film (A) in the second film (B); overlapping and aligning the two outer layer films according to the butterfly clips (C) and the target holes (D); fixing a pressing strip (F) with one edge of the outer layer film, and then removing a double faced adhesive tape; nailing the PIN nails in the 4 PIN holes (E) in the first film (A); finally, placing the two integrated layers of films on the table top of an exposure machine. According to the method for aligning the outer layer film PIN, provided by the invention, the two outer layer films of a pattern transfer line are integrated by adding the pressing strip and are directly fixed on the table top of the exposure machine, and a product is located by the PIN nails on one film, so that the operation is relatively simple.
Description
Technical field
The present invention relates to the PCB figure and shift, particularly the method for a kind of outer film PIN nail contraposition.
Background technology
Generally adopt the mode of operation of manual alignment at PCB manufacturing ectomesoderm figure transfering process, the required personnel of in-process are more and relatively complicated to method for position, and every exposure once all will be carried out film contraposition again, increased the fussy degree of operation, production efficiency is low.
Summary of the invention
For overcoming the shortcomings and deficiencies of above-mentioned prior art, the invention provides the method that a kind of outer film PIN simple to operate follows closely contraposition.
The technical solution adopted in the present invention is:
The method of a kind of outer film PIN nail contraposition, the described outer film comprises first film (A) and second film (B), may further comprise the steps:
(1) first film make 4 PIN holes, some butterflies and some targets hole, outer film B make with outer film A on butterfly and some butterflies of the corresponding coincidence in target hole with the target hole; Described butterfly be the circular film zone that fan-shaped photic zone and shading region alternately occur.
(2) with two outer films according to butterfly and after the target hole overlaps aligning, be fixed together with double faced adhesive tape;
(3) one side with a press strip and the outer film is fixed together, and described press strip is bonded between the two outer layers film, then the double faced adhesive tape described in the step (2) is removed;
(4) with 4 on the first film first-class PIN nails in nail hole, be fixed with single face glue again;
(5) the two-layer film of at last step (4) being finished after the integration is placed on the exposure machine table top, and press strip and first film are bonded on the exposure machine table top.
Preferably, described butterfly (C) and target hole (D) all are located at the outer position of form wire of the film.
Preferably, the thickness of described press strip (F) is consistent with the production plate.
Further preferred, the width 20～25mm of described press strip (F), length is than the length of side 10～15mm of the place film, and press strip is placed from form wire 15～20mm.
Described PIN nail width is 3.15-3.18mm, highly is 1.2-1.5mm.
One that circuit in two outer films is more intensive as first film A.
The method of outer film PIN nail of the present invention contraposition, lean on the basis of manual contraposition original, by increasing, be bonded at the press strip between the two outer layers film, figure shifted the outer film in two sides of circuit and integrate, directly be fixed on then on the exposure machine table top, rely on the PIN nail that product is positioned, as long as product is directly put the PIN nail, just can directly expose, operate comparatively simple.In addition by butterfly and two aspects, some targets hole carry out film contraposition, simple to operate, precision is high.
Description of drawings
Fig. 1 is the synoptic diagram of first film of the present invention;
Fig. 2 is the synoptic diagram of second film of the present invention;
Fig. 3 is the synoptic diagram after the present invention's first film and second film are finished integration.
Embodiment
For making things convenient for those skilled in the art to understand technology contents of the present invention, the present invention is described in further detail below in conjunction with embodiment.
The method of a kind of outer film PIN nail contraposition, the described outer film comprises first film A and second film B, as first film A, concrete operations comprise step to circuit wherein than of comparatively dense:
(1) make 4 PIN hole E, some butterflies C and some targets hole D at first film, second film B make with outer film A on butterfly C and some butterflies C and the target hole D of the corresponding coincidence of target hole D; Described butterfly C and target hole D all are located at the outer position of form wire of the film.
(2) two outer films are overlapped aligning according to butterfly C and target hole D after, be fixed together with double faced adhesive tape;
(3) one side with a press strip F and the outer film is fixed together, and described press strip is bonded between the two outer layers film, then the double faced adhesive tape described in the step (2) is removed; The thickness of described press strip F is consistent with the production plate.Width 20～25mm of described press strip F, length is than the length of side 10～15mm of the place film, and press strip F places from form wire 15～20mm.
(4) with 4 on the first film A first-class PIN nails of nail hole E, be fixed with single face glue again; The boring aperture in PIN hole is generally 3.2mm, and the finished product aperture is generally 3.1mm, and electroplating back aperture will diminish, so when selecting PIN nail width, scope is set at 3.15-3.18mm; What the height (being the thickness of the PIN head of a nail) of PIN nail was commonly used is the thickness of 1.2-1.5mm, if blocked up words are easy to generate the thin bad phenomenon of ill-exposed line, gets over Bao Yuehao in the choice, and the thickness that still is lower than 1.2mm is not durable and very easily fractures.Best selection is 1.2mm, if PIN nail periphery does not have under the situation of circuit certainly, it also is manipulable selecting the thickness of 1.5mm.
(5) the two-layer film of at last step (4) being finished after the contraposition is placed on the exposure machine table top, and press strip F and first film A are bonded on the exposure machine table top.First film A fixes, and second film B can freely stir.
The present invention is as long as directly overlap product to PIN nail, and the exposure personnel catch up with gas to expose then, and whole operation flow process only need one people is finished and got final product, and need not independent contraposition personnel and carries out manual alignment, and the personnel that expose then expose again.
Above-described embodiment only is wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (6)
1. the method for outer film PIN nail contraposition, the described outer film comprises first film (A) and second film (B), it is characterized in that, may further comprise the steps:
(1) makes 4 PIN holes (E), some butterflies (C) and some targets hole (D) at first film (A), some butterflies (C) and target hole (D) that butterfly (C) on second film (B) making and first film (A) and position, target hole (D) are corresponding; Described butterfly (C) is the circular film zone that fan-shaped photic zone and shading region alternately occur;
(2) two outer films are overlapped aligning according to butterfly (C) and target hole (D) after, with double faced adhesive tape the two is fixed together;
(3) be fixed together with a press strip (F) one side with the outer film, described press strip is bonded between the two outer layers film, then the double faced adhesive tape described in the step (2) is removed;
(4) with the first-class PIN nail in 4 the PIN holes (E) on first film (A), with single face glue that the PIN nail is fixing again;
(5) the two-layer film of at last step (4) being finished after the contraposition is placed on the exposure machine table top, and the PIN nail in the upper right corner on press strip (F) and first film (A) and the lower right corner is bonded on the exposure machine table top, and second film (B) can freely stir.
2. the method for outer film PIN nail according to claim 1 contraposition is characterized in that, described butterfly (C) and target hole (D) all are located at the outer position of form wire of the film.
3. the method for outer film PIN nail according to claim 1 contraposition is characterized in that, the thickness of described press strip (F) is consistent with the production plate.
4. the method for outer film PIN nail according to claim 3 contraposition is characterized in that, the width 20～25mm of described press strip (F), and length is than the length of side 10～15mm of the place film, and press strip is placed from form wire 15～20mm place.
5. the method for outer film PIN nail according to claim 1 contraposition is characterized in that, described PIN nail width is 3.15-3.18mm, highly is 1.2-1.5mm.
6. the method for outer film PIN nail according to claim 1 contraposition is characterized in that one that circuit in two outer films is more intensive as first film (A).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310255460.4A CN103345132B (en) | 2013-06-25 | 2013-06-25 | A kind of outer film PIN follows closely the method for contraposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310255460.4A CN103345132B (en) | 2013-06-25 | 2013-06-25 | A kind of outer film PIN follows closely the method for contraposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103345132A true CN103345132A (en) | 2013-10-09 |
| CN103345132B CN103345132B (en) | 2016-01-20 |
Family
ID=49279939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310255460.4A Expired - Fee Related CN103345132B (en) | 2013-06-25 | 2013-06-25 | A kind of outer film PIN follows closely the method for contraposition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103345132B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105182682A (en) * | 2015-08-11 | 2015-12-23 | 深圳崇达多层线路板有限公司 | Film structure |
| CN105611752A (en) * | 2015-12-14 | 2016-05-25 | 谢兴龙 | Manufacture method adopting inner layer pattern transfer exposure |
| CN105682383A (en) * | 2016-03-31 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Page-type film group manufacturing method |
| CN105792529A (en) * | 2016-04-08 | 2016-07-20 | 梅州市中联精密电子有限公司 | Loose-leaf type circuit board Pin nail counterpoint technology |
| CN107278020A (en) * | 2017-06-30 | 2017-10-20 | 上达电子（深圳）股份有限公司 | Circuit board and locating tool |
| CN107877108A (en) * | 2017-12-05 | 2018-04-06 | 扬州华盟电子有限公司 | A kind of heat dissipation metal module and preparation method thereof |
| CN108267941A (en) * | 2018-02-05 | 2018-07-10 | 惠州联创宏科技有限公司 | A kind of PCB circuits exposure method |
| CN109548299A (en) * | 2018-11-21 | 2019-03-29 | 奥士康精密电路（惠州）有限公司 | A kind of semi-automatic and Full-automatic exposure machine the general film |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN201919243U (en) * | 2010-12-27 | 2011-08-03 | 深圳市翔宇电路有限公司 | Alignment device for pegs |
| CN202189230U (en) * | 2011-09-09 | 2012-04-11 | 惠州市星之光科技有限公司 | Hinge contraposition exposure device |
| CN202615116U (en) * | 2012-03-31 | 2012-12-19 | 骏亚（惠州）电子有限公司 | Para-position exposure auxiliary mechanism |
| CN202815413U (en) * | 2012-08-10 | 2013-03-20 | 东莞市五株电子科技有限公司 | Device for exposure and alignment of dry films |
| CN103025069A (en) * | 2012-11-21 | 2013-04-03 | 广东依顿电子科技股份有限公司 | Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins |
-
2013
- 2013-06-25 CN CN201310255460.4A patent/CN103345132B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN201919243U (en) * | 2010-12-27 | 2011-08-03 | 深圳市翔宇电路有限公司 | Alignment device for pegs |
| CN202189230U (en) * | 2011-09-09 | 2012-04-11 | 惠州市星之光科技有限公司 | Hinge contraposition exposure device |
| CN202615116U (en) * | 2012-03-31 | 2012-12-19 | 骏亚（惠州）电子有限公司 | Para-position exposure auxiliary mechanism |
| CN202815413U (en) * | 2012-08-10 | 2013-03-20 | 东莞市五株电子科技有限公司 | Device for exposure and alignment of dry films |
| CN103025069A (en) * | 2012-11-21 | 2013-04-03 | 广东依顿电子科技股份有限公司 | Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105182682A (en) * | 2015-08-11 | 2015-12-23 | 深圳崇达多层线路板有限公司 | Film structure |
| CN105611752A (en) * | 2015-12-14 | 2016-05-25 | 谢兴龙 | Manufacture method adopting inner layer pattern transfer exposure |
| CN105682383A (en) * | 2016-03-31 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Page-type film group manufacturing method |
| CN105792529A (en) * | 2016-04-08 | 2016-07-20 | 梅州市中联精密电子有限公司 | Loose-leaf type circuit board Pin nail counterpoint technology |
| CN107278020A (en) * | 2017-06-30 | 2017-10-20 | 上达电子（深圳）股份有限公司 | Circuit board and locating tool |
| CN107877108A (en) * | 2017-12-05 | 2018-04-06 | 扬州华盟电子有限公司 | A kind of heat dissipation metal module and preparation method thereof |
| CN107877108B (en) * | 2017-12-05 | 2019-09-03 | 扬州华盟电子有限公司 | A kind of heat dissipation metal mould group and preparation method thereof |
| CN108267941A (en) * | 2018-02-05 | 2018-07-10 | 惠州联创宏科技有限公司 | A kind of PCB circuits exposure method |
| CN109548299A (en) * | 2018-11-21 | 2019-03-29 | 奥士康精密电路（惠州）有限公司 | A kind of semi-automatic and Full-automatic exposure machine the general film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103345132B (en) | 2016-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103345132A (en) | Method for aligning outer layer film PIN nails | |
| US9706800B2 (en) | Face mask and method for making the same | |
| KR101499887B1 (en) | The manufacturing method of heat radiating sheet and the heat radiating sheet using the same | |
| CN106903964A (en) | A kind of preparation method of layer cloth seamless adhesion | |
| JP2009192902A (en) | Method of manufacturing optical film laminate | |
| CN105932168A (en) | Method for preparing OLED (Organic Light-Emitting Device) panel | |
| CN104658972A (en) | Manufacturing method of flexible display panel, flexible display panel and laminating equipment | |
| CN108237762B (en) | Die cutting device for multilayer conductive cloth | |
| CN103906374B (en) | rigid-flexible combined board and manufacturing method thereof | |
| CN204140581U (en) | Gum joint tool | |
| JP4918530B2 (en) | Method for producing optical film laminate | |
| CN205812648U (en) | A kind of connector braid of registration | |
| CN204322188U (en) | A kind of bond paper facing cutting knife modular structure | |
| CN202353922U (en) | Soft and hard combined circuit board structure | |
| TW201019806A (en) | Circuit board bearing device and the application thereof | |
| CN108407322B (en) | Production process of diffusion film with two sides attached with black single-sided adhesive tape | |
| CN103645579B (en) | The assemble method of backlight | |
| CN103970330A (en) | Touchpad manufacturing method | |
| CN103732008B (en) | Connecting sheet circuit board and the manufacture method of connecting sheet circuit board | |
| CN106144717A (en) | The slitless connection technique of two sections of adhesive tapes and the application of correspondence thereof | |
| CN206611634U (en) | A kind of FPC | |
| CN207808230U (en) | Compound voice diaphragm mold | |
| CN101562949B (en) | Manufacturing method of rigid-flexible plate | |
| CN206884314U (en) | A kind of multilayer copper-clad plate | |
| CN219164806U (en) | Auxiliary steel sheet of different thickness reinforcement pressfitting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 |