CN105792529A - Loose-leaf type circuit board Pin nail counterpoint technology - Google Patents
Loose-leaf type circuit board Pin nail counterpoint technology Download PDFInfo
- Publication number
- CN105792529A CN105792529A CN201610218490.1A CN201610218490A CN105792529A CN 105792529 A CN105792529 A CN 105792529A CN 201610218490 A CN201610218490 A CN 201610218490A CN 105792529 A CN105792529 A CN 105792529A
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- CN
- China
- Prior art keywords
- loose
- wiring board
- system wiring
- board pin
- leaf system
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Abstract
The present invention relates to the field of the printing circuit board processing technology, especially to a loose-leaf type circuit board Pin nail counterpoint technology. The loose-leaf type circuit board Pin nail counterpoint technology comprises the following steps: S1, making a loose-leaf type circuit board Pin nail counterpoint clamp; S2, fixing the prepared loose-leaf type circuit board Pin nail counterpoint clamp at the glass table of an exposure machine; and S3, disposing the printed circuit loose-leaf type circuit board cover to be counterpointed in the Pin nail counterpoint clamp to realize exposure work. Compared with the prior art, the loose-leaf type circuit board Pin nail counterpoint technology can be directly completed by exposure personnel with no need for configuration contraposition personnel to allow the type of work in contraposition to be easier to learn and reach the purposes of reducing the skilled workers' degree of dependency and greatly improving the contraposition precision and the production efficiency.
Description
Technical field
The present invention relates to printed circuit board machining process technical field, particularly relate to a kind of loose-leaf system wiring board Pin and follow closely alignment process.
Background technology
At present, printed circuit board manufacturing industry, what outer-layer circuit Graphic transitions commonly used is manual alignment technology, rely on knack workman, with the naked eye identify hole corresponding in film alignment sheets, after alignment, the film is pasted onboard, take in exposure machine shutter after the manual alignment in two sides and expose；This manual alignment technology continuing up use has following defect, has a strong impact on aligning accuracy and efficiency, also hinders the development of industry；Traditional manual alignment technological deficiency is as follows:
1.. the degree of being skilled in technique of workman is required significantly high: if the unskilled para-position arising that big ratio of para-position craftsmanship offsets and does over again；
2.. production efficiency is low: needs to be respectively aligned to four angles of first film hole corresponding on plate, then is pasted onboard by the film, repeats above action, and second film be attached to the another side of plate, then is taken by the plate that para-position is good and go exposure inside shutter；
3.. woman worker's interdependency is high: being rarely employed male worker in traditional manual alignment workman's industry, generally individually use woman worker, current recruitment market, the recruitment difficulty of woman worker is far longer than male worker；And the mobility of woman worker is higher；
4.. labor claim is significantly high: traditional-handwork para-position requires that workman does things carefully, phychology is gentle, adapt to long-time sedentary, and requires that vision must more than 1.0；Therefore the woman worker being suitable for doing this work can be found to be not easy very much；
5.. the training cycle is long: the training out skilled minimum needs of para-position workman more than 2 months, if comprehensibility is not high will take for the longer time；
Therefore, it is badly in need of providing a kind of loose-leaf system wiring board Pin to follow closely alignment process, to solve the deficiencies in the prior art.
Summary of the invention
It is an object of the invention to provide a kind of loose-leaf system wiring board Pin and follow closely alignment process, make para-position work post more easy to learn, reduce the dependency degree to skilled worker, be greatly improved the purpose of para-position precision and production efficiency.
For achieving the above object, the present invention adopts the following technical scheme that:
A kind of loose-leaf system wiring board Pin follows closely alignment process, comprises the following steps:
S1, making loose-leaf system wiring board Pin follow closely aligning clamp；
S2, by the loose-leaf system wiring board Pin made follow closely aligning clamp be fixed on exposure machine glass table top；
S3, will treat that the printed wire set loose-leaf system wiring board Pin of para-position follows closely inside aligning clamp, it is achieved exposure operation.
Specifically, in S1, the process making loose-leaf system wiring board Pin nail aligning clamp comprises the following steps:
S11, borehole data make: 2 circular holes of each increase on four angles of the surrounding technique edges of printed circuit board；
S12, the production film make: respectively plus four target holes on the front film and the reverse side film, described target hole is corresponding with the coordinate of described circular hole；
S13, the film punch: rushed out in four target holes on the described front film and the described reverse side film with CCD film perforating press or CCD target-shooting machine；
S14, it is fabricated to binding tool: the front film and reverse side film double faced adhesive tape are fixed on the sheet material bar of an eating away copper sheet；
S15, Pin nail is installed: pressed in by Pin nail hands in the hole being drilled with CCD target-shooting machine on the front film and the reverse side film；Seal fixing with 3M glue at the Pin back side followed closely again, in order to avoid coming off.
Specifically, in S11, the diameter of described circular hole is 3.2mm, and between two center of circular holes on each angle on described printed circuit board is 12mm, and circular hole limit is 4mm to the spacing of line pattern.
More preferably, in S12, the described front film and the target hole Heterogeneous Permutation on the described reverse side film.
More preferably, in S13, the precision controlling of film punching is within ± 0.025mm.
More preferably, in S14, the width of described sheet material bar is between 15～25mm, and described sheet material bar polishes smooth, in order to avoid break flour comes off.
More preferably, in S15, the diameter of described Pin nail is 3.15mm.
More preferably, in S2, with 3M glue, loose-leaf system wiring board Pin is followed closely aligning clamp and be fixed on exposure glass, before fixing, refuse cleaning under the reverse side film is clean, in order to avoid therefore short/road occurs out.
More preferably, in S3, further comprising the steps of, identify the hole, direction on printed substrate to be exposed, the circular hole on the printed substrate treating para-position is inserted in loose-leaf system wiring board Pin and follows closely Pin corresponding on aligning clamp and nail on.
The invention discloses a kind of loose-leaf system wiring board Pin and follow closely alignment process, comprise the following steps:
S1, making loose-leaf system wiring board Pin follow closely aligning clamp；
S2, by the loose-leaf system wiring board Pin made follow closely aligning clamp be fixed on exposure machine glass table top；
S3, will treat that the printed wire set loose-leaf system wiring board Pin of para-position follows closely inside aligning clamp, it is achieved exposure operation.
Compared with prior art, the loose-leaf system wiring board Pin of the present invention follows closely alignment process, it is not necessary to another configuration para-position personnel, is directly completed by exposure personnel, has following advantage technically:
1.. when production capacity is constant, an exposure machine can by saving 2～3 people；Cost of labor reduces by more than 70%；
2.. woman worker need not be configured, configure a male worker；No longer worry have nobody alive to do；
3.. the risk reduction more than 90% that the film scratches；Film cost reduces by more than 20%；
4.. because a beneath film is integrally fixed on shutter glass, after film surrounding 3M glue envelope is got up, rubbish cannot be introduced into, and electrical measurement yield can promote more than 15%；And the beneath side need not clean, save cost of labor and device efficiency；
5.. the training cycle of tradition para-position workman needs more than 2 months, and the training cycle of the exposure personnel of this technology has only to 2～12 hours；
6.. aligning platform and the activity space of para-position personnel need not be configured, therefore use reduced space 30～50% between this technology rear car.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of loose-leaf system wiring board Pin nail aligning clamp of the present invention.
Fig. 2 is another structural representation of a kind of loose-leaf system wiring board Pin nail aligning clamp of the present invention.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further illustrated, and this is presently preferred embodiments of the present invention.
Embodiment 1
As shown in accompanying drawing 1-2, a kind of loose-leaf system wiring board Pin follows closely alignment process, comprises the following steps:
S1, making loose-leaf system wiring board Pin follow closely aligning clamp 1；
S2, by the loose-leaf system wiring board Pin made follow closely aligning clamp 1 be fixed on exposure machine glass table top；
S3, the printed wire 2 treating para-position is overlapped loose-leaf system wiring board Pin follow closely inside aligning clamp 1, it is achieved exposure operation.
Specifically, in S1, the process making loose-leaf system wiring board Pin nail aligning clamp 1 comprises the following steps:
S11, borehole data make: 2 circular holes 21 and 22 of each increase on four angles of the surrounding technique edges of printed circuit board 2；
S12, the production film make: respectively plus four target holes 31 and 41 on the front film 3 and the reverse side film 4, described target hole 31 is corresponding with the coordinate of described circular hole 21 and 22 with 41；
S13, the film punch: rushed out in four the target holes 31 and 41 on the described front film 3 and the described reverse side film 4 with CCD film perforating press or CCD target-shooting machine；
S14, it is fabricated to binding tool: the front film 3 and the reverse side film 4 double faced adhesive tape are fixed on the sheet material bar 5 of an eating away copper sheet；
S15, Pin nail is installed: Pin is followed closely 6 and 7 and presses in hands in the hole being drilled with CCD target-shooting machine on the front film 3 and the reverse side film 4；Seal fixing with 3M glue at the Pin back side following closely 6 and 7 again, in order to avoid coming off.
Specifically, in S11, the diameter of described circular hole 21 and 22 is 3.2mm, and between two circular holes 21 and 22 center on each angle on described printed circuit board is 12mm, and circular hole limit is 4mm to the spacing of line pattern.
More preferably, in S12, the described front film 3 and the target hole on the described reverse side film 4 31 and 41 Heterogeneous Permutation.
More preferably, in S13, the precision controlling of film punching is within ± 0.025mm.
More preferably, in S14, the width of described sheet material bar 5 is between 15～25mm, and described sheet material bar 5 polishes smooth, in order to avoid break flour comes off.
More preferably, in S15, the height that the diameter of described Pin nail 6 and 7 is 3.15mm, Pin nail 6 and 7 can select according to thickness of slab, and the thickness of the head of a nail of Pin nail 6 and 7 gets over Bao Yuehao, contributes to exposure and inhales vacuum, seals suction high.
More preferably, in S2, with 3M glue, loose-leaf system wiring board Pin is followed closely aligning clamp 1 and be fixed on exposure glass, before fixing, refuse cleaning under the reverse side film is clean, in order to avoid therefore open circuit/short circuit occurs.
More preferably, in S3, further comprising the steps of, identify the hole, direction on printed substrate 2 to be exposed, the circular hole 21 and 22 on the printed substrate 2 treating para-position is inserted in loose-leaf system wiring board Pin and follows closely on the upper corresponding Pin nail 6 and 7 of para-position folder 1 tool.
The invention discloses a kind of loose-leaf system wiring board Pin and follow closely alignment process, comprise the following steps:
S1, making loose-leaf system wiring board Pin follow closely aligning clamp；
S2, by the loose-leaf system wiring board Pin made follow closely aligning clamp be fixed on exposure machine glass table top；
S3, will treat that the printed wire set loose-leaf system wiring board Pin of para-position follows closely inside aligning clamp, it is achieved exposure operation.
Compared with prior art, the loose-leaf system wiring board Pin of the present invention follows closely alignment process, it is not necessary to another configuration para-position personnel, is directly completed by exposure personnel, has following advantage technically:
1.. when production capacity is constant, an exposure machine can by saving 2～3 people；Cost of labor reduces by more than 70%；
2.. woman worker need not be configured, configure a male worker；No longer worry have nobody alive to do；
3.. the risk reduction more than 90% that the film scratches；Film cost reduces by more than 20%；
4.. because a beneath film is integrally fixed on shutter glass, after film surrounding 3M glue envelope is got up, rubbish cannot be introduced into, and electrical measurement yield can promote more than 15%；And the beneath side need not clean, save cost of labor and device efficiency；
5.. the training cycle of tradition para-position workman needs more than 2 months, and the training cycle of the exposure personnel of this technology has only to 2～12 hours；
6.. aligning platform and the activity space of para-position personnel need not be configured, therefore use reduced space 30～50% between this technology rear car.
Finally should be noted that; above example is only in order to illustrate technical scheme; but not limiting the scope of the invention; although having made to explain to the present invention with reference to preferred embodiment; it will be understood by those within the art that; technical scheme can be modified or equivalent replacement, without deviating from the spirit and scope of technical solution of the present invention.
Claims (9)
1. a loose-leaf system wiring board Pin follows closely alignment process, it is characterised in that comprise the following steps:
S1, making loose-leaf system wiring board Pin follow closely aligning clamp；
S2, by the loose-leaf system wiring board Pin made follow closely aligning clamp be fixed on exposure machine glass table top；
S3, the printed wire treating para-position is enclosed within loose-leaf system wiring board Pin follows closely inside aligning clamp, it is achieved exposure operation.
2. loose-leaf system wiring board Pin according to claim 1 follows closely alignment process, it is characterised in that in S1, and the process making loose-leaf system wiring board Pin nail aligning clamp comprises the following steps:
S11, borehole data make: 2 circular holes of each increase on four angles of the surrounding technique edges of printed circuit board；
S12, the production film make: respectively plus four target holes on the front film and the reverse side film, described target hole is corresponding with the coordinate of described circular hole；
S13, the film punch: rushed out in four target holes on the described front film and the described reverse side film with CCD film perforating press or CCD target-shooting machine；
S14, it is fabricated to binding tool: the front film and reverse side film double faced adhesive tape are fixed on the sheet material bar of an eating away copper sheet；
S15, Pin nail is installed: pressed in by Pin nail hands in the hole being drilled with CCD target-shooting machine on the front film and the reverse side film；Seal fixing with 3M glue at the Pin back side followed closely again, in order to avoid coming off.
3. loose-leaf system wiring board Pin according to claim 2 follows closely alignment process, it is characterized in that: in S11, the diameter of described circular hole is 3.2mm, and between two center of circular holes on each angle on described printed circuit board is 12mm, and circular hole limit is 4mm to the spacing of line pattern.
4. loose-leaf system wiring board Pin according to claim 2 follows closely alignment process, it is characterised in that: in S12, the described front film and the target hole Heterogeneous Permutation on the described reverse side film.
5. loose-leaf system wiring board Pin according to claim 2 follows closely alignment process, it is characterised in that: in S13, the precision controlling of film punching is within ± 0.025mm.
6. loose-leaf system wiring board Pin according to claim 2 follows closely alignment process, it is characterised in that: in S14, the width of described sheet material bar is between 15～25mm, and described sheet material bar polishes smooth, in order to avoid break flour comes off.
7. loose-leaf system wiring board Pin according to claim 2 follows closely alignment process, it is characterised in that: in S15, the diameter of described Pin nail is 3.15mm.
8. loose-leaf system wiring board Pin according to claim 1 follows closely alignment process, it is characterized in that: in S2, with 3M glue, loose-leaf system wiring board Pin is followed closely aligning clamp and be fixed on exposure glass, before fixing, refuse cleaning under the reverse side film is clean, in order to avoid therefore open circuit/short circuit occurs.
9. loose-leaf system wiring board Pin according to claim 1 follows closely alignment process, it is characterized in that: in S3, further comprising the steps of, identify the hole, direction on printed substrate to be exposed, the circular hole on the printed substrate treating para-position is inserted in loose-leaf system wiring board Pin and follows closely Pin corresponding on aligning clamp and nail on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610218490.1A CN105792529A (en) | 2016-04-08 | 2016-04-08 | Loose-leaf type circuit board Pin nail counterpoint technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610218490.1A CN105792529A (en) | 2016-04-08 | 2016-04-08 | Loose-leaf type circuit board Pin nail counterpoint technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105792529A true CN105792529A (en) | 2016-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610218490.1A Pending CN105792529A (en) | 2016-04-08 | 2016-04-08 | Loose-leaf type circuit board Pin nail counterpoint technology |
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| Country | Link |
|---|---|
| CN (1) | CN105792529A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106961797A (en) * | 2017-04-06 | 2017-07-18 | 昆山苏杭电路板有限公司 | Silver paste grouting base plate processing method |
| CN111885829A (en) * | 2020-06-18 | 2020-11-03 | 江门市众阳电路科技有限公司 | Double-sided alignment exposure production method for inner-layer circuit board |
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|---|---|---|---|---|
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN201828771U (en) * | 2010-08-25 | 2011-05-11 | 深圳中富电路有限公司 | Film semi-automatic alignment device |
| CN103025069A (en) * | 2012-11-21 | 2013-04-03 | 广东依顿电子科技股份有限公司 | Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins |
| CN203086856U (en) * | 2013-01-25 | 2013-07-24 | 四川超声印制板有限公司 | Pin nail film tooling used in PCB pattern transferring process |
| CN103345132A (en) * | 2013-06-25 | 2013-10-09 | 惠州中京电子科技股份有限公司 | Method for aligning outer layer film PIN nails |
| CN203934120U (en) * | 2014-05-19 | 2014-11-05 | 汕头市锐科电子有限公司 | The circuit of printed circuit board (PCB) and green oil film aligning mechanism |
| CN204482152U (en) * | 2015-02-13 | 2015-07-15 | 梅州市格兰沃电子有限公司 | Contraposition wiring board |
-
2016
- 2016-04-08 CN CN201610218490.1A patent/CN105792529A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN201828771U (en) * | 2010-08-25 | 2011-05-11 | 深圳中富电路有限公司 | Film semi-automatic alignment device |
| CN103025069A (en) * | 2012-11-21 | 2013-04-03 | 广东依顿电子科技股份有限公司 | Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins |
| CN203086856U (en) * | 2013-01-25 | 2013-07-24 | 四川超声印制板有限公司 | Pin nail film tooling used in PCB pattern transferring process |
| CN103345132A (en) * | 2013-06-25 | 2013-10-09 | 惠州中京电子科技股份有限公司 | Method for aligning outer layer film PIN nails |
| CN203934120U (en) * | 2014-05-19 | 2014-11-05 | 汕头市锐科电子有限公司 | The circuit of printed circuit board (PCB) and green oil film aligning mechanism |
| CN204482152U (en) * | 2015-02-13 | 2015-07-15 | 梅州市格兰沃电子有限公司 | Contraposition wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106961797A (en) * | 2017-04-06 | 2017-07-18 | 昆山苏杭电路板有限公司 | Silver paste grouting base plate processing method |
| CN111885829A (en) * | 2020-06-18 | 2020-11-03 | 江门市众阳电路科技有限公司 | Double-sided alignment exposure production method for inner-layer circuit board |
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Application publication date: 20160720 |
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