CN106961797A - Silver paste grouting base plate processing method - Google Patents
Silver paste grouting base plate processing method Download PDFInfo
- Publication number
- CN106961797A CN106961797A CN201710221846.1A CN201710221846A CN106961797A CN 106961797 A CN106961797 A CN 106961797A CN 201710221846 A CN201710221846 A CN 201710221846A CN 106961797 A CN106961797 A CN 106961797A
- Authority
- CN
- China
- Prior art keywords
- silver paste
- base plate
- processing method
- plate processing
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of silver paste grouting base plate processing method, it is characterised in that：When making outer-layer circuit, first wet film is coated respectively and drying, exposure, development, etching in the insertion leaf type fixture of the substrate after drying are then formed into line pattern in the two-sided of substrate.The silver paste grouting base plate processing method optimizes production procedure, the method i.e. wet film made of the circuit for being different from common PCB replaces traditional dry film, leaf type alignment mode replaces traditional manual mesh formula alignment mode, greatly reduce the cost of manufacture of this kind of double-clad board, the efficiency of the production of this kind of double-clad board is improved, the production quality of this kind of double-clad board is stabilized.
Description
Technical field
The present invention relates to PCB processing technique fields, a kind of silver paste grouting base plate processing method is particularly related to.
Background technology
Silver paste grouting substrate is also known as false dual platen, is a kind of printed board between single sided board and dual platen, it be by
Two sides circuit composition, but do not need a kind of special double-clad board of interlayer interconnection, its interlayer interconnection mode be not by
The mode of heavy copper → electro-coppering is realized.Its production cost greatly reduces production cost and reduces the destruction to environment.
Its interlayer interconnection mode realizes that it possesses the function of dual platen, but it generally by the mode of component pins or silver-colored grout
Processing mode again it is simpler than the processing mode of dual platen.
But, the fabrication processing of traditional silver paste grouting substrate is generally：Sawing sheet-drilling-patch dry film-visual manually
Contraposition-development-etching-outer layer AOI- welding resistance-word-spray tin-shaping-electrical measurement-FQC-FQA- packagings-storage.Passed according to this
Flow of uniting production, the photosensitive material used in process of production is the carrier that somewhat expensive dry film shapes as circuit, due to elder generation
At exposure aligning film egative film and hole must overlap for drilling, thus can only it is bad, inefficient using stability, to employee
The high manual mode visually aligned of contraposition technical ability is aligned, therefore, and this production procedure production cost is high, and stability is not
It is good, inefficient, high to employee's contraposition technical ability, it is difficult to commercially to form effective core competitiveness.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of silver paste grouting base plate processing method, product is not only reduced
Cost of manufacture, improves production efficiency, and improves product quality, meets the market demand.
The technical scheme that is used to solve its technical problem of the present invention is：A kind of silver paste grouting base plate processing method,
When making outer-layer circuit, first wet film is coated respectively and drying, the substrate after drying is then inserted into page in the two-sided of substrate
Exposure, development, etching form line pattern in formula fixture.
The beneficial effects of the invention are as follows：The silver paste grouting base plate processing method optimizes production procedure, with being different from traditional print
The method that the circuit of making sheet makes is that wet film replaces traditional dry film, and leaf type alignment mode replaces traditional manual mesh formula contraposition side
Formula, greatly reduces the cost of manufacture of this kind of double-clad board, improves the efficiency of the production of this kind of double-clad board, stabilizes
The production quality of this kind of double-clad board.Press dry the mode of film when making circuit instead of traditional film laminator by coating wet film, this
Sample not only greatly reduces production cost：The expense that dry film makes a square meter is 12 yuans and wet film makes a square meter
Expense is 6 yuans, and 50% has been saved in cost.Also greatly improve production efficiency.Leaf type pair when circuit is aligned
Position mode replaces traditional manual mesh formula alignment mode, so greatly improves the contraposition efficiency of circuit：Traditional manual mesh formula pair
Position mode requires high to contraposition employee's operative skill, by Employees'Emotions and fatigue strength disturbance degree is high and efficiency is also very low.Page
As long as formula alignment mode is not accused to the requirement of employee's operative skill can drive exposure machine, not by the mood and fatigue strength shadow of employee
Ring, the product yield made is high.
Embodiment
In conjunction with the embodiments, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiments, i.e., but
All simple equivalence changes made with scope of the present invention patent and description and modification, all still belong to patent of the present invention
Within covering scope.
A kind of silver paste grouting base plate processing method, when making outer-layer circuit, first coats wet film respectively in the two-sided of substrate
And dry, exposure, development, etching in the substrate insertion leaf type fixture after drying are then formed into line pattern.
Idiographic flow is：Sawing sheet-coating wet film-leaf type contraposition-development-etching-AOI- drillings-welding resistance-word-spray
Tin-shaping-electrical measurement-FQC-FQA- packagings-storage.The method i.e. wet film made of the circuit for being different from common PCB replaces passing
System dry film, so not only greatly reduces production cost：The expense that dry film makes a square meter is 12 yuans and wet film system
The expense for making a square meter is 6 yuans, and 50% has been saved in cost.Leaf type alignment mode replaces traditional manual mesh formula pair
The circuit manufacturing method of this novel patent of position mode substantially increases the efficiency of the production of this kind of double-clad board, stabilizes this
The production quality of class double-clad board.
As can be seen here, the silver paste grouting base plate processing method optimizes production procedure, with the line for being different from common PCB
The method that road makes is that wet film replaces traditional dry film, and leaf type alignment mode replaces traditional manual mesh formula alignment mode, dropped significantly
The low cost of manufacture of this kind of double-clad board, improves the efficiency of the production of this kind of double-clad board, stabilizes this kind of two-sided
The production quality of printed board.
Claims (1)
1. a kind of silver paste grouting base plate processing method, it is characterised in that：When making outer-layer circuit, first in the two-sided difference of substrate
Coat wet film and dry, exposure, development, etching in the substrate insertion leaf type fixture after drying are then formed into line pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710221846.1A CN106961797A (en) | 2017-04-06 | 2017-04-06 | Silver paste grouting base plate processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710221846.1A CN106961797A (en) | 2017-04-06 | 2017-04-06 | Silver paste grouting base plate processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106961797A true CN106961797A (en) | 2017-07-18 |
Family
ID=59483248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710221846.1A Pending CN106961797A (en) | 2017-04-06 | 2017-04-06 | Silver paste grouting base plate processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106961797A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562943A (en) * | 2008-04-15 | 2009-10-21 | 珠海方正科技多层电路板有限公司 | Method for melting nickel alloy by selective ink instead of dry film |
| CN102883535A (en) * | 2012-10-09 | 2013-01-16 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by masking holes by wet films |
| CN103826391A (en) * | 2014-02-26 | 2014-05-28 | 湖北龙腾电子科技有限公司 | Method for manufacturing wet membrane on outer circuit of circuit board |
| CN203761689U (en) * | 2014-03-12 | 2014-08-06 | 双鸿电子(惠州)有限公司 | Simple fixture for laminating auxiliary material in FPC (flexible printed circuit) assembling |
| CN104619122A (en) * | 2015-01-05 | 2015-05-13 | 惠州市星之光科技有限公司 | Printed circuit board manufacturing method |
| CN105338752A (en) * | 2015-11-13 | 2016-02-17 | 喜健环球科技有限公司 | Circuit forming method of outer layer of circuit board |
| CN105792529A (en) * | 2016-04-08 | 2016-07-20 | 梅州市中联精密电子有限公司 | Loose-leaf type circuit board Pin nail counterpoint technology |
-
2017
- 2017-04-06 CN CN201710221846.1A patent/CN106961797A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562943A (en) * | 2008-04-15 | 2009-10-21 | 珠海方正科技多层电路板有限公司 | Method for melting nickel alloy by selective ink instead of dry film |
| CN102883535A (en) * | 2012-10-09 | 2013-01-16 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by masking holes by wet films |
| CN103826391A (en) * | 2014-02-26 | 2014-05-28 | 湖北龙腾电子科技有限公司 | Method for manufacturing wet membrane on outer circuit of circuit board |
| CN203761689U (en) * | 2014-03-12 | 2014-08-06 | 双鸿电子(惠州)有限公司 | Simple fixture for laminating auxiliary material in FPC (flexible printed circuit) assembling |
| CN104619122A (en) * | 2015-01-05 | 2015-05-13 | 惠州市星之光科技有限公司 | Printed circuit board manufacturing method |
| CN105338752A (en) * | 2015-11-13 | 2016-02-17 | 喜健环球科技有限公司 | Circuit forming method of outer layer of circuit board |
| CN105792529A (en) * | 2016-04-08 | 2016-07-20 | 梅州市中联精密电子有限公司 | Loose-leaf type circuit board Pin nail counterpoint technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170718 |
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| RJ01 | Rejection of invention patent application after publication |