CN101562943A

CN101562943A - Method for melting nickel alloy by selective ink instead of dry film

Info

Publication number: CN101562943A
Application number: CN 200810104078
Authority: CN
Inventors: 胡誉; 金立奎
Original assignee: Peking University Founder Group Co Ltd; Zhuhai Founder Technology Multilayer PCB Co Ltd
Current assignee: Peking University Founder Group Co Ltd; Zhuhai Founder Technology Multilayer PCB Co Ltd
Priority date: 2008-04-15
Filing date: 2008-04-15
Publication date: 2009-10-21
Anticipated expiration: 2028-04-15
Also published as: CN101562943B

Abstract

The invention discloses a method for melting a nickel alloy by a selective ink instead of a dry film, which comprises the following steps: (1) selectively coating ageing resistant nickel alloy ink on a circuit board by a screen printing technology to form a wet film; (2) drying the ink; (3) exposing the ink; (4) developing the wet film so as to expose the required copper surface; (5) performing nickel alloy melting on the circuit board; and (6) removing the wet film. The selective ink instead of the dry film is used for selective nickel alloy melting, so the cost is greatly reduced, and the combination effect of the wet film and the board surface is superior to the combination effect of the dry film and the board surface, unfavorable phenomena such as diffusion coating and the like can be effectively prevented, the defective rate of production is reduced and the quality of products is ensured. In addition, the method simplifies the manufacturing flow, saves the ink, greatly reduces the emission of pollutants, saves the expenses of wastewater treatment and is simultaneously favorable for the protection of ecological environment.

Description

The selective ink printing replaces the method for dry film nickel gold

Technical field

Design circuit plate of the present invention is made the field, and particularly a kind of selective ink replaces the method for dry film nickel gold.

Background technology

The development of digital electronic goods such as current social cell phone is pushed ahead vigorously day by day, and develop towards light, thin, short, little direction, the electronic devices and components integrated level of its formation requires also more and more higher, especially circuit board, demand is also increasing, for satisfying this requirement, the circuit board manufacturing also progressively develops to the integrated interconnected HDI of line density height (Hight Density Interconnection).But no matter be traditional printed circuit board (PCB) (PCB) or present HDI plate is when carrying out selectivity nickel gold processing procedure, all be to adopt the mode of dry film to carry out selectivity nickel gold, promptly pass through press mold (dry film), exposure, development, volcanic ash pre-treatment (Pumice), change nickel gold, striping, totally 6 operations, it is very cumbersome to make flow process, and the production cycle is long, and the cost height is unfavorable for market development.

Summary of the invention

In view of this, the method that main purpose of the present invention is to provide a kind of selective ink to replace dry film nickel gold reducing production costs, and reduces pollutant discharge amount with the protection environment.

For achieving the above object, technical scheme of the present invention is achieved in that

A kind of selective ink replaces the method for dry film nickel gold, may further comprise the steps:

1) by screen printing technique resisting nickel bronze ink optionally is coated on the circuit board, forms wet film;

2) oven dry printing ink;

3) the above-mentioned printing ink that exposes;

4) develop this wet film to expose needed copper face;

5) to this circuit board nickel gold;

6) remove this wet film.

Preferably, before step 1), the plate face of described circuit board is carried out the volcanic ash pre-treatment.

As can be seen from the above technical solutions, the present invention utilizes the selective ink printing to replace dry film to carry out selectivity nickel gold, cost reduces greatly, and wet film combines effect and combines better effects if than dry film with the plate face with the plate face, effectively prevent bad phenomenon such as plating, reduce and produce fraction defective that quality is secure, have good competitive advantage, help developing, the development in market.In addition, the method that flow process and saving printing ink are made in this simplification also greatly reduces pollutant discharge amount, saves the expense of waste water treatment, also helps the protection of biological environment simultaneously.

Description of drawings

Fig. 1 replaces the flow chart of the method for dry film nickel gold for selective ink of the present invention.

Embodiment

Fig. 1 replaces the flow chart of the method for dry film nickel gold for selective ink of the present invention.As shown in Figure 1, selective ink of the present invention replaces the method for dry film nickel gold, comprises following steps:

1) go up printing ink: utilize ink coats that screen printer will resisting nickel gold need not the changing on the nickel gold zone of the clean circuit board of just cleaning, form one deck wet film, it is golden regional to expose needization nickel.Wet-film thickness is 20+5 μ m, replaces dry film with wet film, and cost can reduce to original 1/5, and wet film combines effect and combines better effects if than dry film with the plate face with the plate face, effectively prevents bad phenomenon such as plating, reduces and produces fraction defective, quality is secure, and the market competitiveness is strong;

2) oven dry: the circuit board that will apply anti-ization nickel bronze ink is put in the drying plant such as upright baking oven and toasts, and makes printing ink oven dry on the circuit board plate face, solidifies, and is incrust, better to the protection of plate face.Certainly also can be by natural airing, dry in the shade;

3) exposure: the wiring board after toasting is put into anti-welding exposure machine (ADTEC EngineeringADEX-3000S) to printing ink expose (exposure energy is set to 100mj/cm2), to PCB, be beneficial to the making of back operation with the image transfer on the egative film that will make of mode of exposure;

4) develop: pcb board is put into the development line develop.The part of needs nickel gold is not developed for the sodium carbonate of (1 ± 0.2) % with concentration, linear speed is set to 2.0m/min, and the wet film of unexposed mistake is developed to fall, and exposes needed copper face.(energy is set to 150 ± 20mj/cm2), itself and plate face is close to more the wet film polymerization, produces plating during avoiding nickel gold through the irradiation of ultraviolet light (UV) later again;

5) change the nickel gold: being put into of circuit board deployment nickel gold thread is carried out selective surfaceization nickel gold, plate one deck gold, promptly protected in needs nickel gold region surface, can oxidized, scratch, long service life, quality is guaranteed, certainly also can be by drying naturally, drying in the shade;

6) striping: circuit board deployment is put into the striping line, the curing that the plate face is applied anti-ization nickel bronze ink remove, promptly finish the making of whole selectivity nickel gold circuit board.

Certainly; in order to allow anti-ization nickel bronze ink combine better, protect better with the plate face when the silk screen printing; carry out circuit board deployment to be put into before the silk screen printing volcanic ash pre-treatment line (Pumice) and carry out the plate face and handle, clean the oxide layer of plate face and pollutant removal.

The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention.

Claims

1, a kind of selective ink replaces the method for dry film nickel gold, may further comprise the steps:

2) oven dry printing ink;

3) the above-mentioned printing ink that exposes;

4) develop this wet film to expose needed copper face;

5) to this circuit board nickel gold;

6) remove this wet film.

2, selective ink as claimed in claim 1 replaces the method for dry film nickel gold, it is characterized in that, before described step 1), the plate face of described circuit board is carried out the volcanic ash pre-treatment.