CN205566789U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN205566789U CN205566789U CN201620205994.5U CN201620205994U CN205566789U CN 205566789 U CN205566789 U CN 205566789U CN 201620205994 U CN201620205994 U CN 201620205994U CN 205566789 U CN205566789 U CN 205566789U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- solder mask
- circuit board
- pcb
- layer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a printed circuit board, including the base plate, still include printed circuit layer, first solder mask and second solder mask, the printed circuit layer is the copper layer, and a surface of base plate is located at least on the printed circuit layer, and first solder mask lies in between second solder mask and the printed circuit layer, and first solder mask is the mute look oil reservoir that mute look hinders the printing of solder paste china ink, the bright oil reservoir of second solder mask for brightly hindering the printing of solder paste china ink, the printed circuit layer is an alligatoring face with the contact surface of first solder mask. The utility model discloses a quality is good, production efficiency is high.
Description
Technical field
This utility model relates to a kind of printed circuit board (PCB).
Background technology
Along with developing rapidly of printed circuit board industry manufacturing technology, the printed circuit board (PCB) of various base materials is used widely, and fine degree and the complexity of circuit design are substantially improved, and therefore have higher requirement printed circuit board manufacturing process.When printed circuit board (PCB) manufacturing industry is for the thick copper coin welding resistance printing of end copper >=2oz, because Copper Foil is thicker, during welding resistance white wire mark brush, a stamp-pad ink, Copper Foil corner and line face easily occur line face is rubescent and copper phenomenon is revealed at turning, the method that usual employing welding resistance mimeograph is twice solves the problem that line face is rubescent, and easily to occur that ink gathers oily, wrinkling simple twice stamp-pad ink that adds up, aperture and circuit turning, cause imposite ink colors uneven, aberration differs, and affects product appearance.In prior art, after general employing has printed an oil, stand ten minutes, make surface ink trickling uniform, then carry out the printing operation of second time.Stand ten minutes and carry out secondary stamp-pad ink again, occur though the wrinkling phenomenon of ink can be reduced, but the phenomenon of the poly-oil in lines turning still has existence；Simultaneously as stamp-pad ink need to stand ten minutes to second time stamp-pad ink for the first time, the waiting time is long, extends the production and processing time, reduces production efficiency.
Utility model content
For prior art because of poly-oil problem cause product quality difference and time of repose length and cause the problem that production efficiency is low, this utility model provide a kind of printed circuit board (PCB) that can overcome drawbacks described above.
In order to reach above-mentioned technique effect, the technical solution adopted in the utility model is:
A kind of printed circuit board (PCB), including substrate, also include layer printed circuit board, the first solder mask and the second solder mask, described layer printed circuit board is layers of copper, layer printed circuit board is at least located at a surface of substrate, and the first solder mask is between the second solder mask and layer printed circuit board, and the first solder mask is the cloudy colour oil reservoir of cloudy colour solder mask printing, second solder mask is the bright oil reservoir of light solder mask printing, and the contact surface of described layer printed circuit board and the first solder mask is roughening face.
Further, described first solder mask is covered on layer printed circuit board, and the area of the first solder mask is more than the circuit surface area of layer printed circuit board.
Further, described second solder mask is completely covered by the first solder mask.
Further, described substrate upper and lower surface is equipped with layer printed circuit board.
Further, described printed circuit board (PCB) is provided with edge PTH hole, and edge PTH hole is through hole.
Further, the thickness of described first solder mask is 5-10um.
Further, the thickness of described second solder mask is 8-12um.
The beneficial effects of the utility model are: this utility model is roughened by making the contact surface of layer printed circuit board and the first solder mask, it is arranged to roughening face, first solder mask is arranged to the cloudy colour oil reservoir of cloudy colour solder mask printing, decrease the quality hidden danger brought because of poly-oil problem, decrease the time interval of twice stamp-pad ink simultaneously, time is without waiting for, it is ensured that quality of the present utility model and improves production efficiency.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Each label and corresponding entitled in figure:
1. substrate, 2. layer printed circuit board, 3. the first solder mask, 4. the second solder mask.
Detailed description of the invention
With embodiment, this utility model is described in further details below in conjunction with the accompanying drawings:
A kind of printed circuit board (PCB), as shown in Figure 1, the layer printed circuit board 2 including substrate 1, being positioned at substrate 1 upper and lower surface, the first solder mask 3 being covered on layer printed circuit board 2, the second solder mask 4 of being completely covered by the first solder mask 3, and run through first solder mask the 3, second solder mask 4, layer printed circuit board 2 and the edge PTH hole 5 of substrate 1.Layer printed circuit board 2 is layers of copper, and the first solder mask 3 is the cloudy colour oil reservoir of the cloudy colour solder mask printing of cloudy colour mimeograph brush, and its thickness is 5-10um.Second solder mask 4 is the bright oil reservoir of light solder mask printing, and its thickness is 8-12um.The contact surface of layer printed circuit board 2 and the first solder mask 3 is roughening face.
This utility model first removes the stains such as the greasy dirt on layers of copper surface, oxide layer, impurity when producing pre-treatment, clean thoroughly and be roughened layers of copper face, then the scraping action utilizing polish-brush can remove impurity and the pollution of the overwhelming majority, ultrasound wave embathes, microetch, blots, dries up, dries again, it is then used by cloudy colour oil bottoming print oil for the first time (as finally required green oil, then the first impression is done by dumb light green oil when then using for the first time), on the basis of cloudy colour oil, finally increase once light solder mask print face oil.The simple pre-treatment of this utility model hinge structure increases roughening layers of copper face, first solder mask is arranged to dumb light oil reservoir, add first solder mask ink adhesion after layer printed circuit board prints, decrease the quality hidden danger brought because of poly-oil problem, simultaneously, reduce the time of repose of the first solder mask, the second oil reservoir can be printed without waiting for diameter, it is ensured that quality of the present utility model and improve production efficiency.
This utility model is not limited to above-mentioned specific embodiment, and for the person of ordinary skill of the art from above-mentioned design, without performing creative labour, done all conversion, within all falling within protection domain of the present utility model.
Claims (7)
1. a printed circuit board (PCB), including substrate, it is characterised in that also include layer printed circuit board, the first solder mask
With the second solder mask, described layer printed circuit board is layers of copper, and layer printed circuit board is at least located at a surface of substrate,
First solder mask is between the second solder mask and layer printed circuit board, and the first solder mask is cloudy colour solder mask print
The cloudy colour oil reservoir of brush, the second solder mask is the bright oil reservoir of light solder mask printing, described layer printed circuit board
It is roughening face with the contact surface of the first solder mask.
A kind of printed circuit board (PCB) the most according to claim 1, it is characterised in that described first solder mask covers
On layer printed circuit board, the area of the first solder mask is more than the circuit surface area of layer printed circuit board.
A kind of printed circuit board (PCB) the most according to claim 2, it is characterised in that described second solder mask is complete
It is covered on the first solder mask.
4. according to any one printed circuit board (PCB) described in claim 1-3, it is characterised in that following table on described substrate
Face is equipped with layer printed circuit board, and the outside of described layer printed circuit board is equipped with.
5. according to any one printed circuit board (PCB) described in claim 1-3, it is characterised in that described printed circuit board (PCB)
Being provided with edge PTH hole, edge PTH hole is through hole.
6. according to any one printed circuit board (PCB) described in claim 1-3, it is characterised in that described first solder mask
Thickness be 5-10um.
7. according to any one printed circuit board (PCB) described in claim 1-3, it is characterised in that described second solder mask
Thickness be 8-12um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620205994.5U CN205566789U (en) | 2016-03-17 | 2016-03-17 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620205994.5U CN205566789U (en) | 2016-03-17 | 2016-03-17 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205566789U true CN205566789U (en) | 2016-09-07 |
Family
ID=56814128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620205994.5U Expired - Fee Related CN205566789U (en) | 2016-03-17 | 2016-03-17 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205566789U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867270A (en) * | 2020-07-29 | 2020-10-30 | 深圳市正基电子有限公司 | Method for removing alkaline ink after solder mask laser exposure |
-
2016
- 2016-03-17 CN CN201620205994.5U patent/CN205566789U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867270A (en) * | 2020-07-29 | 2020-10-30 | 深圳市正基电子有限公司 | Method for removing alkaline ink after solder mask laser exposure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160907 Termination date: 20210317 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |