CN107318231A - A kind of preparation method of golden finger, printed wiring board - Google Patents
A kind of preparation method of golden finger, printed wiring board Download PDFInfo
- Publication number
- CN107318231A CN107318231A CN201710593928.9A CN201710593928A CN107318231A CN 107318231 A CN107318231 A CN 107318231A CN 201710593928 A CN201710593928 A CN 201710593928A CN 107318231 A CN107318231 A CN 107318231A
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- Prior art keywords
- golden finger
- finger
- golden
- preparation
- film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The invention discloses a kind of preparation method of golden finger, a kind of printed wiring board is also disclosed, and printed wiring board is processed using the preparation method of golden finger as mentioned.A kind of preparation method of golden finger in the present invention, by setting cover lead and three outer graphics to shift, realizes the making of long golden finger, short golden finger and/or disconnected section golden finger, not only preparation method is simple, and can guarantee that golden finger quality, meets industry requirement.In addition, a kind of printed wiring board, due to making golden finger using the preparation method of the present invention, simplifies the Making programme of printed wiring board, improves the producing efficiency of wiring board.The present invention can be widely applied to PCB fields as a kind of preparation method of golden finger, printed wiring board.
Description
Technical field
The present invention relates to PCB fields, especially a kind of preparation method of golden finger, printed wiring board.
Background technology
As electronics techniques develop the demand with multifunction, in order to improve product performance, assembling product density, subtract
Miscellaneous goods volume and weight, PCB design is also maked rapid progress；Wherein, by taking the golden finger structure of pcb board as an example, general golden hand
The design configuration of finger is regular figure, and Making programme is generally：Sawing sheet → internal layer → internal layer AOI → pressing → drilling → heavy copper,
An electric plating of whole board → time dry film (outer-layer circuit includes golden finger) → graphic plating → outer layer etching → welding resistance → secondary dry film (dew
Going out golden finger) → electric thin gold → electric thick gold (electric golden finger position) → takes off film → tri- time dry film/orchid glue (protection golden finger) → surface
Processing → rear process；Existing technological process can only meet the making demand of regular golden finger, and for irregular golden finger (example
Such as long and short golden finger or disconnected section finger) when can not meet demand.
The content of the invention
In order to solve the above-mentioned technical problem, long and short golden finger, disconnected section golden finger are made it is an object of the invention to provide one kind
Golden finger preparation method, correspondingly, also provide a kind of utilization golden finger preparation method make printed wiring board.
The technical solution adopted in the present invention is：A kind of preparation method of golden finger, comprises the following steps：
S1, the PCB obtained after pressing is drilled, the processing of heavy copper, electric plating of whole board；
S2, progress first time outer graphics transfer, to produce the figure of outer-layer circuit, golden finger and finger lead, and
Carry out graphic plating, etch to form outer-layer circuit, golden finger area and finger lead areas on PCB, to the golden finger
Region and the windowing of finger lead areas, the PCB carry out welding resistance processing elsewhere；The golden finger includes long golden finger, short
Golden finger and/or disconnected section golden finger, the finger lead include being used to connect the connecting lead wire of all golden fingers, for making short gold
Finger, disconnected section golden finger form the cover lead of complete long golden finger；
S3, second of outer graphics transfer of progress, expose golden finger area, thick metal plated in golden finger area, complete
The making of long golden finger；
S4, progress third time outer graphics transfer, expose finger lead areas, and etching is formed with removing finger lead
Short golden finger and/or disconnected section golden finger.
Further, the preparation method of the golden finger also includes：
The surface treatment of process after being carried out again to PCB after S5, protection golden finger area.
Further, the method for the first time outer graphics transfer is：The dry film film is made, the dry film film is just
The piece film, film is pressed dry on PCB and exposure imaging is carried out and realizes that outer graphics are shifted, outer-layer circuit, golden finger and hand is produced
The figure of index wire.
Further, the step S3 includes：
S31, the making dry film film, expose golden finger area and finger lead areas, press dry film and carry out exposure imaging；
S32, the making wet film film, cover finger lead areas, silk-screen wet film simultaneously carries out exposure imaging；
It is S33, thick metal plated in exposed golden finger area.
Further, the step S4 includes：The dry film film is made, finger lead areas is exposed, etches to remove hand
Index wire, forms short golden finger and/or disconnected section golden finger.
Further, the width of the cover lead is identical with the width of short golden finger.
Further, the method for the protection golden finger area includes：
The dry film film is made, golden finger area is covered, press dry film and carry out exposure imaging；
Or print blue glue to protect golden finger in golden finger area.
Another technical scheme of the present invention is：A kind of printed wiring board, the printed wiring board is using as described
The preparation method of golden finger process.
The beneficial effects of the invention are as follows：A kind of preparation method of golden finger in the present invention, by setting cover lead and three
Secondary outer graphics transfer, realizes the making of long golden finger, short golden finger and/or disconnected section golden finger, not only preparation method is simple, and
And golden finger quality is can guarantee that, meet industry requirement.In addition, a kind of printed wiring board, due to the preparation method using the present invention
Golden finger is made, simplifies the Making programme of printed wiring board, the producing efficiency of wiring board is improved.
Brief description of the drawings
The embodiment to the present invention is described further below in conjunction with the accompanying drawings：
Fig. 1 is an a kind of specific embodiment method flow diagram of preparation method of golden finger in the present invention；
Fig. 2 is an a kind of specific embodiment schematic diagram of the golden finger of the preparation method of golden finger in the present invention.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.
A kind of preparation method of golden finger, comprises the following steps：
S1, the PCB obtained after pressing is drilled, the processing of heavy copper, electric plating of whole board；
S2, progress first time outer graphics transfer, to produce the figure of outer-layer circuit, golden finger and finger lead, and
Carry out graphic plating, etch to form outer-layer circuit, golden finger area and finger lead areas on PCB, to golden finger area
With the windowing of finger lead areas, PCB carries out welding resistance processing elsewhere；Golden finger includes long golden finger, short golden finger and/or broken
Golden finger is saved, finger lead is including the connecting lead wire for connecting all golden fingers, for making short golden finger, disconnected section golden finger shape
Into the cover lead of complete long golden finger；
S3, second of outer graphics transfer of progress, expose golden finger area, thick metal plated in golden finger area, complete
The making of long golden finger；
S4, progress third time outer graphics transfer, expose finger lead areas, and etching is formed with removing finger lead
Short golden finger and/or disconnected section golden finger.
A kind of preparation method of golden finger in the present invention, by setting cover lead and three outer graphics to shift, is realized
The making of long golden finger, short golden finger and/or disconnected section golden finger, not only preparation method is simple, and can guarantee that golden finger quality,
Meet industry requirement.
As the further improvement of technical scheme, with reference to Fig. 1, Fig. 1 is a kind of preparation method of golden finger in the present invention
One specific embodiment method flow diagram, when specifically producing, first to PCB sawing sheets, make internal layer circuit, internal layer AOI, pressing, drilling,
Heavy copper, electric plating of whole board processing；Then first time dry film process is carried out, the dry film film is made, the dry film film is the positive film,
Film is pressed dry on PCB and exposure imaging is carried out and realizes that outer graphics are shifted, the figure of outer-layer circuit, golden finger and finger lead is produced
Shape, wherein, with reference to Fig. 2, Fig. 2 is a kind of specific embodiment signal of golden finger of the preparation method of golden finger in the present invention
Figure, golden finger figure is bold portion, and golden finger figure includes the figure, the figure of short golden finger and/or disconnected section of long golden finger
The figure of golden finger, finger lead includes the connecting lead wire of one end for connecting all golden fingers, for making short golden finger, breaking
Section golden finger forms the cover lead of complete long golden finger, and cover lead is the dotted portion in Fig. 2, and general connecting lead wire connects
Same one end of all golden fingers is connect, all golden fingers of connection, the progress for the electroplating operations being easy in process below are realized；Cover draws
The width of line is identical with the width of short golden finger；Golden finger figure is consistent with the compensation of outer-layer circuit figure.Then figure is carried out
Plating, etching are with formation outer-layer circuit, golden finger area and finger lead areas, outer layer AOI, to golden finger area on PCB
With the windowing of finger lead areas, PCB carries out welding resistance processing elsewhere；Specifically, to outer-layer circuit, golden finger area and finger
Lead areas carry out figure electrolytic copper, electric tin (electric tin be in order to protected when alkali etching outer-layer circuit, golden finger area and
Finger lead areas), with meet device to hole, table copper requirement, take off film, alkali etching goes out outer graphics, golden finger and finger lead
Region, take off tin, then carry out welding resistance making, golden finger position (including finger lead areas) (exposed into needs when welding resistance makes
Welding, the place of assembling component) all windowings, green oil is applied elsewhere realizes welding resistance.
As the further improvement of technical scheme, with reference to Fig. 1, step S3 includes：
S31, second of dry film process of progress, make the dry film film, expose golden finger area and finger lead areas, press
Dry film simultaneously carries out exposure imaging；
S32, the making wet film film, cover finger lead areas, silk-screen wet film simultaneously carries out exposure imaging, after etching
Golden finger and finger lead are higher by substrate, there is difference in height, and dry film can not be covered, and wet film is that liquid can be with covering protection
Arrive, opponent's index wire shields when gold is electroplated below；
S33, connecting lead wire and cover lead not electric gold thick metal plated in exposed golden finger area；Specifically, first carry out
Electric nickel (hardness and wearability that improve golden finger), then electric thin gold, then electric thick gold, thick to complete customer requirement gold, finally takes off
Film.
As the further improvement of technical scheme, with reference to Fig. 1, step S4 includes：Third time dry film process is carried out, makes dry
The film film, exposes finger lead areas, and other regions are protected with dry film, and etching forms short golden finger to remove finger lead
And/or disconnected section golden finger.
As the further improvement of technical scheme, with reference to Fig. 1, the preparation method of golden finger also includes：
The surface treatment of process after being carried out again to PCB after S5, protection golden finger area.Further, protection golden finger area
The method in domain includes：
The 4th dry film process is carried out, the dry film film is made, golden finger area is covered, press dry film and carry out exposure imaging；
Or in the blue glue of golden finger area silk-screen to protect golden finger.
Protected by the way of the blue glue of the 4th dry film or silk-screen behind finger position, the surface treatment of rear process include turmeric,
Tin, OSP etc. are sprayed, film is taken off or removes blue glue, then the golden finger for completing whole pcb board makes.
A kind of printed wiring board, printed wiring board is processed using the preparation method of golden finger as mentioned.Due to profit
Golden finger is made with the preparation method of the present invention, simplifies the Making programme of printed wiring board, improves the producing efficiency of wiring board.
Above is the preferable implementation to the present invention is illustrated, but the invention is not limited to the implementation
Example, those skilled in the art can also make a variety of equivalent variations or replace on the premise of without prejudice to spirit of the invention
Change, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (8)
1. a kind of preparation method of golden finger, it is characterised in that comprise the following steps：
S1, the PCB obtained after pressing is drilled, the processing of heavy copper, electric plating of whole board；
S2, progress first time outer graphics transfer, to produce the figure of outer-layer circuit, golden finger and finger lead, and are carried out
Graphic plating, etching on PCB to form outer-layer circuit, golden finger area and finger lead areas, to the golden finger area
With the windowing of finger lead areas, the PCB carries out welding resistance processing elsewhere；The golden finger includes long golden finger, short golden hand
Refer to and/or disconnected section golden finger, the finger lead includes being used to connect the connecting lead wire of all golden fingers, for making short golden hand
Refer to, break and save the cover lead that golden finger forms complete long golden finger；
S3, second of outer graphics transfer of progress, expose golden finger area, thick metal plated in golden finger area, complete long gold
The making of finger；
S4, progress third time outer graphics transfer, expose finger lead areas, and etching forms short gold to remove finger lead
Finger and/or disconnected section golden finger.
2. the preparation method of golden finger according to claim 1, it is characterised in that the preparation method of the golden finger is also wrapped
Include：
The surface treatment of process after being carried out again to PCB after S5, protection golden finger area.
3. the preparation method of golden finger according to claim 1 or 2, it is characterised in that the first time outer graphics turn
The method of shifting is：The dry film film is made, the dry film film is the positive film, film is pressed dry on PCB and exposure imaging reality is carried out
Existing outer graphics transfer, produces the figure of outer-layer circuit, golden finger and finger lead.
4. the preparation method of golden finger according to claim 1 or 2, it is characterised in that the step S3 includes：
S31, the making dry film film, expose golden finger area and finger lead areas, press dry film and carry out exposure imaging；
S32, the making wet film film, cover finger lead areas, silk-screen wet film simultaneously carries out exposure imaging；
It is S33, thick metal plated in exposed golden finger area.
5. the preparation method of golden finger according to claim 1 or 2, it is characterised in that the step S4 includes：Make dry
The film film, exposes finger lead areas, and etching forms short golden finger and/or disconnected section golden finger to remove finger lead.
6. the preparation method of golden finger according to claim 1 or 2, it is characterised in that the width of the cover lead with
The width of short golden finger is identical.
7. the preparation method of golden finger according to claim 2, it is characterised in that the method for the protection golden finger area
Including：
The dry film film is made, golden finger area is covered, press dry film and carry out exposure imaging；
Or print blue glue to protect golden finger in golden finger area.
8. a kind of printed wiring board, it is characterised in that the printed wiring board is used as described in any one of claim 1 to 7
The preparation method of golden finger is processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710593928.9A CN107318231A (en) | 2017-07-20 | 2017-07-20 | A kind of preparation method of golden finger, printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710593928.9A CN107318231A (en) | 2017-07-20 | 2017-07-20 | A kind of preparation method of golden finger, printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107318231A true CN107318231A (en) | 2017-11-03 |
Family
ID=60178965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710593928.9A Pending CN107318231A (en) | 2017-07-20 | 2017-07-20 | A kind of preparation method of golden finger, printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107318231A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109005645A (en) * | 2018-08-30 | 2018-12-14 | 广合科技（广州）有限公司 | A kind of production method of the double electric thick gold finger of PCB |
| CN109348650A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of method of optical module plate etched plate lead |
| CN110418511A (en) * | 2019-07-23 | 2019-11-05 | 领跃电子科技（珠海）有限公司 | Without lead gold finger galvanizing production method |
| CN110856364A (en) * | 2019-11-21 | 2020-02-28 | 珠海市凯诺微电子有限公司 | Immersion gold plating method for manufacturing rigid-flex board |
| CN111093333A (en) * | 2018-10-23 | 2020-05-01 | 北大方正集团有限公司 | Circuit board processing method and electrical equipment |
| CN111093334A (en) * | 2019-12-30 | 2020-05-01 | 惠州市永隆电路有限公司 | Surface treatment method for long and short golden fingers on PCB |
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| CN101309556A (en) * | 2008-07-08 | 2008-11-19 | 深圳崇达多层线路板有限公司 | Production method of circuit board having long and short golden finger |
| CN101643927A (en) * | 2008-08-05 | 2010-02-10 | 北大方正集团有限公司 | Method for manufacturing printed circuit board edge connector |
| CN104661446A (en) * | 2015-02-10 | 2015-05-27 | 深圳市五株科技股份有限公司 | Circuit board processing method |
| CN104768332A (en) * | 2014-01-08 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board |
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- 2017-07-20 CN CN201710593928.9A patent/CN107318231A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309556A (en) * | 2008-07-08 | 2008-11-19 | 深圳崇达多层线路板有限公司 | Production method of circuit board having long and short golden finger |
| CN101643927A (en) * | 2008-08-05 | 2010-02-10 | 北大方正集团有限公司 | Method for manufacturing printed circuit board edge connector |
| CN104768332A (en) * | 2014-01-08 | 2015-07-08 | 深圳崇达多层线路板有限公司 | Printed circuit board with long and short metal pins, and manufacture method of printed circuit board |
| CN104661446A (en) * | 2015-02-10 | 2015-05-27 | 深圳市五株科技股份有限公司 | Circuit board processing method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109005645A (en) * | 2018-08-30 | 2018-12-14 | 广合科技（广州）有限公司 | A kind of production method of the double electric thick gold finger of PCB |
| CN109348650A (en) * | 2018-10-16 | 2019-02-15 | 欣强电子（清远）有限公司 | A kind of method of optical module plate etched plate lead |
| CN111093333A (en) * | 2018-10-23 | 2020-05-01 | 北大方正集团有限公司 | Circuit board processing method and electrical equipment |
| CN110418511A (en) * | 2019-07-23 | 2019-11-05 | 领跃电子科技（珠海）有限公司 | Without lead gold finger galvanizing production method |
| CN110856364A (en) * | 2019-11-21 | 2020-02-28 | 珠海市凯诺微电子有限公司 | Immersion gold plating method for manufacturing rigid-flex board |
| CN111093334A (en) * | 2019-12-30 | 2020-05-01 | 惠州市永隆电路有限公司 | Surface treatment method for long and short golden fingers on PCB |
| CN111093334B (en) * | 2019-12-30 | 2023-09-01 | 惠州市永隆电路有限公司 | Surface treatment method for long and short golden fingers on PCB |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Yonghui Inventor after: Sun Qishuang Inventor after: Sun Wenbing Inventor before: Zhang Yonghui Inventor before: Sun Qishuang |
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| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20181107 Address after: 332000 Jiangxi Jiujiang economic and Technological Development Zone Chengxi port area Hong Kong Avenue Applicant after: JIUJIANG MINGYANG CIRCUIT TECHNOLOGY CO., LTD. Address before: 518125 B, 32 South Ring Road, Second Star Industrial Zone, Baoan District Xinqiao street, Shenzhen, Guangdong. Applicant before: Shenzhen Mingyang circuit Polytron Technologies Inc |
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| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171103 |
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| RJ01 | Rejection of invention patent application after publication |