CN110418511A - Without lead gold finger galvanizing production method - Google Patents
Without lead gold finger galvanizing production method Download PDFInfo
- Publication number
- CN110418511A CN110418511A CN201910665547.6A CN201910665547A CN110418511A CN 110418511 A CN110418511 A CN 110418511A CN 201910665547 A CN201910665547 A CN 201910665547A CN 110418511 A CN110418511 A CN 110418511A
- Authority
- CN
- China
- Prior art keywords
- finger
- production method
- dry film
- film
- partition line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention discloses and provides a kind of no lead gold finger galvanizing production method, and being able to achieve using this method can be achieved with the plating of length finger without the electroplate lead wire for increasing short finger.After the present invention is by pasting dry film for the first time, applying the processes such as wet film, second of patch dry film, third time patch dry film, it realizes and can be achieved with the plating of length finger without the electroplate lead wire for increasing short finger, the production of the pcb board of the high speed particularly suitable for fining, miniaturization and transmission data.The present invention is applied to the technical field of gold finger galvanizing production.
Description
Technical field
The present invention relates to a kind of gold finger galvanizing production method, in particular to a kind of no lead gold finger galvanizing production side
Method.
Background technique
The increase of the high speed development of electronic technology, various functions is integrated, and originally single pcb board has been unable to meet demand,
Therefore various connectivity port connectors are designed on PCB.The connectors connector such as common PCI, PCI-Express is transported extensively
In consumption, server and industry, as the mutual downlink connection mainboard peripheral equipment of mainboard grade, passive backplane interconnection and as attached
The expansion card interface of splice.Corresponding golden finger snap-gauge is widely applied, in daily life, common network interface card, video card, USB flash disk etc., and all
In the connection conversion and signal transmission for using golden finger snap-gauge.
When connecting the plug of snap-gauge, loss of data or damage parts in order to prevent.It needs to need to make in Add-in Card
It is designed with " long and short hands " structure.Such as the hot plug of PCIE device, as shown in figure 1 above, PRSNT1# and PRSNT2# signal is used
Golden finger length is the half of other signals.Therefore when PCIe device is inserted into slot, PRSNT1# and PRSNT2# signal is at it
He completely attaches to golden finger with PCIe slot, and after one section of delay, could completely attach to slot；When PCIe device from
When extracting in PCIe slot, the two signals are first with PCIe slot disconnection, and after one section of delay, other signals could be with
Slot disconnection.This section of delay can be used in system software, carries out some hot-swappable processing.
Length finger design for golden finger snap-gauge, short finger originally are used from the plating of side lead or tail leads
The design methods such as plating, but with the fining of electronic product, miniaturization and the high speed for transmitting data, PCB design wiring
It is more and more intensive compact, it can be used to increase electroplate lead wire without enough spaces.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a kind of no lead golden finger electricity
Production method is plated, being able to achieve using this method can be achieved with the plating of length finger without the electroplate lead wire for increasing short finger.
The technical scheme adopted by the invention is that: the no lead gold finger galvanizing production method includes the following steps:
A, dry film is pasted in copper-clad plate, to line pattern and increased auxiliary conductor is assisted to develop, other parts are lost
It carves, cleaning is carried out after etching and moves back film, the line pattern includes that several upper end fingers, several lower end fingers and several lead
Logical line, the upper end finger and the lower end finger are electrically connected by the conductive line, the auxiliary conductor and the lower end
Finger is electrically connected；
B, expose and need thick metal plated upper end golden finger area, several described upper end fingers are respectively positioned on the upper end golden finger
In region, partition line is provided on the upper end finger of part, other outside the partition line and the upper end golden finger area
Region is covered with wet film, then thick metal plated to upper end finger progress, completes to carry out cleaning after being electroplated to move back film；
C, exposing needs the auxiliary conductor etched and the partition line, other regions to be covered with dry film, then to the auxiliary
Conducting wire and the partition line are etched, and the upper end finger after etching where the partition line generates two short hands up and down
Refer to, completes to carry out cleaning after etching to move back film；
D, expose and need thick metal plated lower end golden finger area, several described lower end fingers are respectively positioned on the lower end golden finger
In region, other regions are covered with dry film, then are carried out to the lower end finger thick metal plated.
The beneficial effects of the present invention are: due to the present invention use the design without lead, the present invention by for the first time paste dry film,
After applying the processes such as wet film, second of patch dry film, third time patch dry film, the electroplate lead wire realized without increasing short finger can be real
Existing length finger plating, the production of the pcb board of the high speed particularly suitable for fining, miniaturization and transmission data.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the hot plug of PCIE device；
Fig. 2 is the schematic diagram for pasting dry film for the first time；
Fig. 3 is the schematic diagram for applying wet film；
Fig. 4 is the schematic diagram of second of patch dry film
Fig. 5 is the schematic diagram that third time pastes dry film；
Fig. 6 is the structural schematic diagram of product.
Specific embodiment
The no lead gold finger galvanizing production method includes the following steps:
A, as shown in Fig. 2, pasting dry film in copper-clad plate, to line pattern 1 and increased auxiliary conductor 2 is assisted to develop,
He is partially etched, and cleaning is carried out after etching and moves back film, the line pattern 1 includes several upper end fingers 3, several lower ends
Finger 4 and several conductive lines 5, the upper end finger 3 and the lower end finger 4 are electrically connected by the conductive line 5, described
Auxiliary conductor 2 and the lower end finger 4 are electrically connected；
B, thick metal plated upper end golden finger area 6 is needed as shown in figure 3, exposing, several described upper end fingers 3 are respectively positioned on institute
It states in upper end golden finger area 6, partition line 7, the partition line 7 and upper end gold is provided on the upper end finger 3 of part
Other regions outside finger areas 6 are covered with wet film, then the upper end finger 3 is carried out it is thick metal plated, complete plating after carry out
Film is moved back in cleaning；
C, the auxiliary conductor 2 etched and the partition line 7, other regions is needed to be covered with dry film as shown in figure 4, exposing,
The auxiliary conductor 2 and the partition line 7 are etched again, the upper end finger 3 after etching where the partition line 7
Two short finger 8 up and down is generated, completes to carry out cleaning after etching to move back film；
D, thick metal plated lower end golden finger area 9 is needed as shown in figure 5, exposing, several described lower end fingers 4 are respectively positioned on institute
It states in lower end golden finger area 9, other regions are covered with dry film, then carry out to the lower end finger 4 thick metal plated, are finally completed
Product as shown in FIG. 6 realizes and can be achieved with the plating of length finger without the electroplate lead wire for increasing short finger, particularly suitable for
The production of the pcb board of the high speed of fining, miniaturization and transmission data.
The present invention is applied to the technical field of gold finger galvanizing production.
Although the embodiment of the present invention is described with practical solution, the limit to meaning of the present invention is not constituted
It makes, for those skilled in the art, is all to the modification of its embodiment and with the combination of other schemes according to this specification
Obviously.
Claims (2)
1. without lead gold finger galvanizing production method, it is characterised in that: the no lead gold finger galvanizing production method includes such as
Lower step:
A, dry film is pasted in copper-clad plate, is developed to line pattern (1) and the increased auxiliary conductor (2) of auxiliary, other parts
It is etched, cleaning is carried out after etching and moves back film, the line pattern (1) includes several upper end fingers (3), several lower end hands
Refer to (4) and several conductive lines (5), the upper end finger (3) and the lower end finger (4) by the conductive line (5) electrically
Connection, the auxiliary conductor (2) and the lower end finger (4) are electrically connected；
B, expose and need thick metal plated upper end golden finger area (6), several described upper end fingers (3) are respectively positioned on the upper end
In golden finger area (6), it is provided with partition line (7) on the upper end finger (3) of part, the partition line (7) and the upper end
Other regions of golden finger area (6) outside are covered with wet film, then thick metal plated, completion plating is carried out to the upper end finger (3)
After carry out cleaning move back film；
C, exposing needs the auxiliary conductor (2) etched and the partition line (7), other regions to be covered with dry film, then to institute
It states auxiliary conductor (2) and the partition line (7) is etched, the upper end finger after etching where the partition line (7)
(3) two short finger (8) up and down is generated, completes to carry out cleaning after etching to move back film.
2. no lead gold finger galvanizing production method according to claim 1, it is characterised in that: the no lead golden finger
It further includes following steps after step c that production method, which is electroplated: d, expose the thick metal plated lower end golden finger area (9) of needs, if
The dry lower end finger (4) is respectively positioned in the lower end golden finger area (9), other regions are covered with dry film, then to described
Lower end finger (4) carries out thick metal plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910665547.6A CN110418511A (en) | 2019-07-23 | 2019-07-23 | Without lead gold finger galvanizing production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910665547.6A CN110418511A (en) | 2019-07-23 | 2019-07-23 | Without lead gold finger galvanizing production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110418511A true CN110418511A (en) | 2019-11-05 |
Family
ID=68362521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910665547.6A Pending CN110418511A (en) | 2019-07-23 | 2019-07-23 | Without lead gold finger galvanizing production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110418511A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6838759B1 (en) * | 2003-11-10 | 2005-01-04 | Kingpak Technology Inc. | Small memory card |
| US20080308302A1 (en) * | 2007-06-15 | 2008-12-18 | Hon Hai Precision Ind. Co., Ltd. | Printed circuit board with anti-oxidation layer |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
| CN108174510A (en) * | 2017-12-29 | 2018-06-15 | 深圳欣强智创电路板有限公司 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
| CN108966532A (en) * | 2018-08-20 | 2018-12-07 | 深圳崇达多层线路板有限公司 | A kind of production method of three rank HDI plates of the golden finger containing ladder |
-
2019
- 2019-07-23 CN CN201910665547.6A patent/CN110418511A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6838759B1 (en) * | 2003-11-10 | 2005-01-04 | Kingpak Technology Inc. | Small memory card |
| US20080308302A1 (en) * | 2007-06-15 | 2008-12-18 | Hon Hai Precision Ind. Co., Ltd. | Printed circuit board with anti-oxidation layer |
| CN107318231A (en) * | 2017-07-20 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of golden finger, printed wiring board |
| CN108174510A (en) * | 2017-12-29 | 2018-06-15 | 深圳欣强智创电路板有限公司 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
| CN108966532A (en) * | 2018-08-20 | 2018-12-07 | 深圳崇达多层线路板有限公司 | A kind of production method of three rank HDI plates of the golden finger containing ladder |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210639540U (en) | OCP NIC3.0 adapter card capable of supporting Multihost | |
| CN106855847B (en) | Multi-slot plug-in card | |
| CN104425949B (en) | Electric connector and its manufacture method | |
| JP4771372B2 (en) | Electronic device connector, system and mounting method (PCI Express connector) | |
| CN212135411U (en) | IO module and OCP keysets | |
| US10879636B2 (en) | Connector and communications device | |
| CN207249558U (en) | A kind of expanded back panel, board card device and computer | |
| US7506092B2 (en) | Bridge card for converting a bus connection of a parallel daughter card mounted thereon to a different bus connection of a mother board | |
| US10617003B2 (en) | Method for manufacturing a surface mount technology (SMT) pad structure for next generation speeds | |
| CN113708112B (en) | Board ladder connection structure and signal connector | |
| CN102650979B (en) | Adapting card for peripheral component interface (PCI) Express X4 to compact peripheral component interconnect (CPCI) Express X4 | |
| CN109119793A (en) | The double contact High speed rear panel connectors of low crosstalk | |
| CN110418511A (en) | Without lead gold finger galvanizing production method | |
| CN102751639B (en) | PCIe (peripheral component interface express) electric signal transmission cable | |
| CN113363742A (en) | Connector blade card with improved wire connection geometry | |
| US10658772B1 (en) | Tiered circuit board for interfacing cables and connectors | |
| CN116107943A (en) | Signal transmission circuit and computing equipment | |
| CN106455292B (en) | A kind of wiring board, terminal and method for manufacturing circuit board | |
| CN211506475U (en) | Connecting device of OCP network card mutil-host | |
| KR100957875B1 (en) | High speed memory modules utilizing on-trace capacitors | |
| CN211789647U (en) | Connector and electronic equipment | |
| CN110990326B (en) | High-speed PCI Express switching drive unit for ATCA framework | |
| CN106255314B (en) | A kind of wiring board, terminal and method for manufacturing circuit board | |
| CN211150836U (en) | OCP erects and inserts fixed part based on golden finger connects | |
| CN213425247U (en) | MXM module bus circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191105 |
|
| RJ01 | Rejection of invention patent application after publication |