CN108966532A - A kind of production method of three rank HDI plates of the golden finger containing ladder - Google Patents
A kind of production method of three rank HDI plates of the golden finger containing ladder Download PDFInfo
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- CN108966532A CN108966532A CN201810949433.XA CN201810949433A CN108966532A CN 108966532 A CN108966532 A CN 108966532A CN 201810949433 A CN201810949433 A CN 201810949433A CN 108966532 A CN108966532 A CN 108966532A
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- daughter board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of production methods of three rank HDI plates of golden finger containing ladder, including internal layer daughter board and outer layer daughter board, comprising the following steps: drills on inner- electron plate, and carries out filling holes with resin after making hole metallization, plates one layer of layers of copper on the surface of resin；Internal layer circuit, electric gold wire and finger position are made on inner- electron plate；Protective glue band is pasted at corresponding ladder platform；Internal layer daughter board and outer layer daughter board are pressed into multi-layer board by not gummosis PP；It then successively drilled, heavy copper, electric plating of whole board, make outer-layer circuit and production solder mask；The outer layer daughter board corresponded at ladder platform on multi-layer board is cut away, two-sided ladder platform is formed；Heavy nickel gold processing is carried out after removal protective glue band；It tapes at ladder platform, and exposes finger position, electricity gold processing is carried out to finger position, forms golden finger；Then HDI plate is made in process after successively carrying out to multi-layer board.Ladder platform is made in such a way that patch protective glue band adds laser cutting to take off lid, can ensure the quality of HDI plate.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of three rank HDI plates of the golden finger containing ladder
Production method.
Background technique
HDI is the abbreviation of high density interconnection (High Density Interconnector), is the one kind for producing printed board
(technology) uses a kind of circuit board that route distribution density is relatively high of micro- blind buried via hole technology；Blind buried via hole order indicates its laser
The pressing number for stacking number or a certain level of blind hole or preceding process (containing internal layer → pressing → drilling) cycle-index, number
Being worth maximum project then is its order.
In the manufacturing process of assist side, the regional area of assist side forms height not by modes such as lamination, milling plates
One region (groove either step), it is such to can be considered that ladder wiring board, ladder wiring board have saving space, protect component
Advantage, but its manufacture craft is complex, especially in pressing and stepped groove molding procedure, needs to complete using special process.
The stepped groove production method of ladder wiring board at present generally first opens a window to flight, then in pressing, to windowing
The unilateral reduction 0.10mm of position pad and thickness PTFE identical with ladder groove depth (polytetrafluoroethylene (PTFE) is commonly called as: Teflon) gasket,
Since (glass transition temperature, resin are the temperature of rubbery state by glass transition, i.e. resin begins to change into stream for the Tg value of PTFE gasket
Dynamic temperature) it is higher than about 150 DEG C of Tg of FR-4 material, so gasket will not be with tree in the pressing working procedure of high temperature and pressure
Rouge or layers of copper are combined together, therefore after having pressed, gasket can be removed, to form stepped groove.
But stepped groove is made using the pressing method of PTFE gasket, even if gasket is very accurate, there is also certain error, pressures
It during conjunction, is influenced by high temperature, high pressure, prepreg flows, and in the corner of slot position, the prepreg of rubbery state is easy
It overflows, forms excessive glue phenomenon, the subsequent appearance that will affect groove body, performance, and the quality of plating etc..
Summary of the invention
It is an object of the invention to provide a kind of three rank HDI plates of golden finger containing ladder to overcome existing technological deficiency
Production method, this method using patch protective glue band add laser cutting to take off lid by the way of make ladder platform, can ensure HDI plate
Quality, and the window formed by the way of laser cutting is neatly smooth, will not generate burr, production efficiency is also higher.
In order to solve the above-mentioned technical problems, the present invention provides a kind of production sides of three rank HDI plates of golden finger containing ladder
Method, including internal layer daughter board and outer layer daughter board, the production method the following steps are included:
S1, drilling at ladder platform is corresponded on inner- electron plate, and hole metallization is made by heavy copper and electric plating of whole board；
Resin is clogged in S2, hole after metallization, the resin of protrusion plate face is then removed by nog plate；
S3, then the surface of resin is made to plate one layer of layers of copper by heavy copper and electric plating of whole board；
S4, internal layer circuit is made on inner- electron plate later, and produces electric gold wire at corresponding ladder platform together
With finger position；
S5, patch protective glue band at ladder platform is corresponded on inner- electron plate；
S6, it presses together internal layer daughter board and outer layer daughter board to form multi-layer board by not gummosis PP, and in not gummosis PP
It opens a window at upper corresponding ladder platform；
S7, it drills to multi-layer board, and hole metallization is made by heavy copper and electric plating of whole board；
S8, outer-layer circuit and production solder mask are successively made on multilayer boards；
S9, the mode being cut by laser cut away the outer layer daughter board corresponded at ladder platform on multi-layer board, are formed double
Face ladder platform；
Protective glue band at S10, removal ladder platform then carries out heavy nickel gold processing to multi-layer board；
S11, it tapes at ladder platform, and exposes finger position, electricity gold processing then is carried out to finger position, forms golden hand
Refer to；
S12, the pad pasting at ladder platform, and open a window at corresponding electric gold wire position, then pass through etching removal
Electric gold wire；
S13, molding and electric performance test process successively then are carried out to multi-layer board, HDI plate is made.
Preferably, in step S5, protective glue band and internal layer daughter board are fit together by quick pressing.
Preferably, the parameter of quick pressing are as follows: 110 DEG C of temperature, pressure 5-35KG, pressing time 25-60s.
Preferably, in step S5, the protective glue band is unilateral 0.2mm smaller than ladder platform.
Preferably, in step S6, the size of the windowing is unilateral 0-0.2mm bigger than ladder platform size.
Preferably, when the outer layer daughter board is core plate, first made on outer straton plate in step S6, before pressing in layer line
Road.
Preferably, the internal layer daughter board is pressed by multiple core plates for making internal layer circuit respectively.
Preferably, the internal layer daughter board includes five core plates, and the specific manufacturing process of the internal layer daughter board includes following step
It is rapid:
S00, internal layer circuit is made on five core plates respectively；
S01, first daughter board is pressed by prepreg and outer copper foil with two pieces of core plates therein, with therein another two
Block core plate is pressed into the second daughter board by prepreg and outer copper foil；
S02, it drills on the first daughter board and the second daughter board respectively, and hole metallization is made by heavy copper and electric plating of whole board；
Resin is clogged in S03, hole after metallization, the resin of protrusion plate face is then removed by nog plate；
S04, then the surface of resin is made to plate one layer of layers of copper by heavy copper and electric plating of whole board；
S05, internal layer circuit is made on the first daughter board and the second daughter board respectively later；
S06, the first daughter board, the second daughter board and remaining one piece of core plate are pressed together to form internal layer by prepreg
Daughter board, and core plate is placed between the first daughter board and the second daughter board.
Compared with prior art, the invention has the following beneficial effects:
The present invention first produces finger position and electric gold wire by corresponding on inner- electron plate at ladder platform, then right
Patch protective glue band at ladder platform is answered, for protecting finger position not oxidized and the later period being facilitated to take off lid, the later period is cut by laser
Mode carry out cutting on multilayer boards and form ladder platform, this method is using pasting by the way of protective glue band adds laser cutting to take off lid
Ladder platform is made, can ensure the quality of HDI plate, and the window formed by the way of laser cutting is neatly smooth, will not produce
Setation thorn, production efficiency are also higher；And when being pressed into multi-layer board using not gummosis PP piece substitution it is original can gummosis PP piece, one
It is that can be avoided the case where gummosis occur at ladder platform, second is that can be avoided the problem of plank is bent in pressing, ensures
Multiple-plate quality after pressing.
Specific embodiment
Fig. 1 is the schematic diagram of three rank HDI plates in embodiment.
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is described further and illustrates.
Embodiment
The present embodiment provides a kind of production methods of three rank HDI plates of golden finger containing ladder, the specific process is as follows:
(1), the first core plate, the second core plate, third core plate, the 4th core sawing sheet: are outputed by jigsaw size 518mm × 620mm
Plate, the 5th core plate, the 6th core plate and the 7th core plate, all core thickness are 0.1mm, and outer copper foil is with a thickness of 0.5OZ, wherein the
One core plate and the 7th core plate are used as outer layer daughter board.
(2), internal layer circuit production (negative film technique): inner figure transfer is coated with light-sensitive surface, light-sensitive surface with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) respectively in the first core plate to the 7th
Internal layer circuit exposure is completed on core plate, wherein the first core plate and the 7th core plate only carry out internal layer circuit to wherein one side in exposure
Exposure, another side, which carries out full exposure, prevents the face layers of copper to be etched in the later period；Inner line figure is formed after development；Internal layer erosion
It carves, the core plate after exposure development is etched into internal layer circuit, and retreat film, it is 3mil that internal layer line width, which measures,；Internal layer AOI, then
Check the defects of opening short circuit, route notch, route pin hole of internal layer circuit, defective to scrap processing, flawless product goes out to arrive
Downstream.
(3), brownification: by way of chemical reaction, in a kind of brown oxidation layer of all core plate layers of copper Surface Creations, make copper
The roughness in face becomes larger, enhancing pressing when and prepreg binding force.
(4), it presses: the second core plate, third core plate and outer copper foil is superimposed together (specific plate-laying in advance with prepreg
Sequence is outer copper foil, prepreg, the second core plate, prepreg, third core plate, prepreg, outer layer copper from top to bottom
Foil), then select lamination appropriate that superimposed sheet is pressed into the first daughter board according to plate Tg；By the 5th core plate, the 6th core
Plate and outer copper foil are superimposed together in advance with prepreg, and (specific plate-laying sequence is from top to bottom outer copper foil, prepreg, the
Five core plates, prepreg, the 6th core plate, prepreg, outer copper foil), lamination appropriate is then selected according to plate Tg
Superimposed sheet is pressed into the second daughter board.
(5), it drills: drilling on the first daughter board and the second daughter board respectively, and mesoporous metal is made by heavy copper and electric plating of whole board
Change.
(6), filling holes with resin: clogging resin in hole after metallization, then removes protrusion plate face by abrasive belt grinding
Resin then makes the surface of resin plate one layer of layers of copper by heavy copper and electric plating of whole board.
(7), light-sensitive surface, 8 μ of film thickness monitoring of light-sensitive surface internal layer circuit production (negative film technique): are coated with vertical application machine
M, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) respectively wherein the one of the first daughter board and the second daughter board
Internal layer circuit exposure is completed on surface, another surface, which carries out full exposure, prevents the face layers of copper to be etched in the later period；It is formed after development
Inner line figure；Two daughter boards after exposure development are etched internal layer circuit by internal layer etching, and retreat film, internal layer line width
Measuring is 3mil；Then internal layer AOI checks the defects of opening short circuit, route notch, route pin hole of internal layer circuit, defective report
Useless processing, flawless product go out to downstream.
(8), brownification: by way of chemical reaction, in a kind of palm fibre of the layers of copper Surface Creation of the first daughter board and the second daughter board
Color oxide layer makes the roughness of copper face become larger, enhancing pressing when and prepreg binding force
(9) it presses: the first daughter board, the second daughter board and the 4th core plate is superimposed together (specific plate-laying in advance with prepreg
Sequence is the first daughter board, prepreg, the 4th core plate, prepreg, the second daughter board from top to bottom), and the first daughter board and second
Production has the inside that is placed on one side of internal layer circuit to contact with prepreg on daughter board, then selects lamination appropriate according to plate Tg
Superimposed sheet is pressed into internal layer daughter board by condition.
(10), it drills: corresponding on inner- electron plate and drill at ladder platform, and mesoporous metal is made by heavy copper and electric plating of whole board
Change；
(11), filling holes with resin: clogging resin in hole after metallization, then removes protrusion plate face by abrasive belt grinding
Resin then makes the surface of resin plate one layer of layers of copper by heavy copper and electric plating of whole board；
(12) light-sensitive surface, 8 μ of film thickness monitoring of light-sensitive surface internal layer circuit production (negative film technique): are coated with vertical application machine
M completes internal layer circuit exposure, development with 5-6 lattice exposure guide rule (21 lattice exposure guide rule) using Full-automatic exposure machine on inner- electron plate
After form inner line figure；Internal layer etching, etches internal layer circuit for the internal layer daughter board after exposure development, and together in correspondence
Electric gold wire and finger position are produced at ladder platform, and retreats film, and it is 3mil that internal layer line width, which measures,；Internal layer AOI, then checks
The defects of opening short circuit, route notch, route pin hole of internal layer circuit, defective to scrap processing, flawless product goes out to next
Process.
(13), it pastes protective glue band: after internal layer daughter board brownification, pasting protective glue band corresponding at ladder platform, then pass through
Protective glue band is bonded on internal layer daughter board by the mode of quick pressing, and protective glue band is unilateral 0.2mm smaller than ladder platform, convenient
Later period removes the protective glue band, the parameter of quick pressing when taking off lid are as follows: and 110 DEG C of temperature, pressure 5-35KG, pressing time 25-
60s；Brownification processing is carried out to inner- electron plate again later.
(14), it presses: internal layer daughter board, the first core plate and the 7th core plate being superimposed together in advance with not gummosis PP and (specifically arranged
Plate sequence is the first core plate, not gummosis PP, internal layer daughter board, not gummosis PP, the 7th core plate from top to bottom), and on not gummosis PP
It opens a window at corresponding ladder platform, the size of windowing is unilateral 0-0.2mm bigger than ladder platform size, the first core plate and the 7th core
Production has the inside that is placed on one side of internal layer circuit to contact with not gummosis PP on plate, then selects lamination item appropriate according to plate Tg
Superimposed sheet is pressed into multi-layer board by part.
(15), it bores location hole: boring laser positioning hole in multiple-plate edges of boards.
(16), blind hole windowing figure: pasting dry film on multilayer boards, and opens at the corresponding position for needing drilling blind hole on dry film
Window, the size of the windowing is unilateral 0.075mm bigger than the blind hole size that need to be bored, and laser burns are to dry film when preventing the later period from drilling.
(17), drilling blind hole: the layers of copper at etching removal multi-layer board uplifting window is first passed through, the later period is facilitated to drill and can be improved brill
The precision in hole；Then laser drilling blind hole, the route of the blind hole depth bored to two surface of internal layer daughter board are carried out in the intermediate of windowing
At layer.
(18), outer layer drills: being drilled on multilayer boards according to borehole data using the mode of machine drilling.
(19), heavy copper: one layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(20), electric plating of whole board: according to the mechanism of electrochemical reaction, upper one layer of copper is electroplated on the basis of heavy copper, guarantees hole
Copper thickness reaches product requirement, sets electroplating parameter according to hole copper thickness is completed.
(21), outer-layer circuit (positive blade technolgy) is made: outer graphics transfer, it is luxuriant and rich with fragrance using Full-automatic exposure machine and positive route
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule) on multilayer boards, developed, is formed on multilayer boards
Outer-layer circuit figure；Outer graphics plating, then distinguishes copper facing and tin plating on multilayer boards, is set according to desired completion copper thickness
Electroplating parameter, copper facing are the current density electric plating of whole board 60min with 1.8ASD, and tin plating be electroplated with the current density of 1.2ASD
10min, 3-5 μm of tin thickness；Then film is successively moved back again, etches and move back tin, etches outer-layer circuit on multilayer boards；Outer layer AOI,
Detect whether outer-layer circuit has open circuit, notch, etching not by the comparison with CAM data using automatic optical detecting system
Only, the defects of short-circuit.
(22), welding resistance, silk-screen character: first carrying out consent before welding resistance, then makes green oil layer and silk-screen word on multilayer boards
Symbol.
(23), gong SET shape: multi-layer board is cut into multiple SET plates, and (SET is shipment unit, that is, finished product, the inside
Including a cell board or multiple cell boards), and the cover area both ends gong of taking off at later period ladder platform is gone out, but be unable to gong to rank
Electric gold wire at terraced platform.
(24), be cut by laser: the mode being cut by laser is cut the outer layer daughter board at ladder platform is corresponded on SET plate
Fall, forms two-sided ladder platform after taking off lid.
(25), surrender retaining tape: the protective glue band at removal ladder platform then carries out moving back brownification processing.
(26), surface treatment (heavy nickel gold): the pad copper face of welding resistance windowing position and finger position lead to the principles of chemistry, uniform deposition
Centainly require the nickel layer and layer gold of thickness, nickel layer thickness are as follows: 3-5 μm；Layer gold thickness are as follows: 0.05-0.1 μm.
(27), it tapes: taping at ladder platform, and expose finger position.
(28), electricity gold processing: and then electricity gold processing is carried out to finger position, the layer gold at finger position is thickeied, golden finger is formed.
(29), it removes electric gold wire: pasting dry film at ladder platform, and open a window at corresponding electric gold wire position,
Electric gold wire is then removed by etching.
(30), it forms: according to the prior art and pressing design requirement gong shape, three ranks are made in the +/- 0.05mm of external form tolerance
HDI plate.
(32), electrical testing: the electrically conducting performance of three rank HDI plates of test, this plate use test method are as follows: flying probe.
(33), appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness etc. of three rank HDI plates FQC: are checked
Whether the requirement of client is met.
(34), it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to three rank HDI plates,
And it is allowed to dry drying prescription and humidity card, then shipment.
As shown in Figure 1, L1-L2 layers are the first core plate, L4-L5 layers are the second core plate, and L6-L7 layers are third core plate, L9-
L10 layers are the 4th core plate, and L12-L13 layers are the 5th core plate, and L14-L15 layers are the 6th core plate, and L17-L18 layers are the 7th core plate.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (8)
1. a kind of production method of three rank HDI plates of golden finger containing ladder, including internal layer daughter board and outer layer daughter board, feature exist
In, the production method the following steps are included:
S1, drilling at ladder platform is corresponded on inner- electron plate, and hole metallization is made by heavy copper and electric plating of whole board；
Resin is clogged in S2, hole after metallization, the resin of protrusion plate face is then removed by nog plate；
S3, then the surface of resin is made to plate one layer of layers of copper by heavy copper and electric plating of whole board；
S4, internal layer circuit is made on inner- electron plate later, and produces electric gold wire and hand at corresponding ladder platform together
Refer to position；
S5, patch protective glue band at ladder platform is corresponded on inner- electron plate；
S6, it presses together internal layer daughter board and outer layer daughter board to form multi-layer board by not gummosis PP, and right on not gummosis PP
It answers and opens a window at ladder platform；
S7, it drills to multi-layer board, and hole metallization is made by heavy copper and electric plating of whole board；
S8, outer-layer circuit and production solder mask are successively made on multilayer boards；
S9, the mode being cut by laser cut away the outer layer daughter board corresponded at ladder platform on multi-layer board, form two-sided rank
Terraced platform；
Protective glue band at S10, removal ladder platform then carries out heavy nickel gold processing to multi-layer board；
S11, it tapes at ladder platform, and exposes finger position, electricity gold processing then is carried out to finger position, forms golden finger；
S12, the pad pasting at ladder platform, and open a window at corresponding electric gold wire position, then pass through etching removal electricity gold
Lead；
S13, molding and electric performance test process successively then are carried out to multi-layer board, HDI plate is made.
2. the production method of three rank HDI plates of the golden finger according to claim 1 containing ladder, which is characterized in that step S5
In, protective glue band and internal layer daughter board are fit together by quick pressing.
3. the production method of three rank HDI plates of the golden finger according to claim 2 containing ladder, which is characterized in that fast ram compression
The parameter of conjunction are as follows: 110 DEG C of temperature, pressure 5-35KG, pressing time 25-60s.
4. the production method of three rank HDI plates of the golden finger according to claim 3 containing ladder, which is characterized in that step S5
In, the protective glue band is unilateral 0.2mm smaller than ladder platform.
5. the production method of three rank HDI plates of the golden finger according to claim 1 containing ladder, which is characterized in that step S6
In, the size of the windowing is unilateral 0-0.2mm bigger than ladder platform size.
6. the production method of three rank HDI plates of the golden finger according to claim 1 containing ladder, which is characterized in that when described
When outer layer daughter board is core plate, in step S6, internal layer circuit first is made on outer straton plate before pressing.
7. the production method of three rank HDI plates of the golden finger according to claim 1 containing ladder, which is characterized in that in described
Straton plate is pressed by multiple core plates for making internal layer circuit respectively.
8. the production method of three rank HDI plates of the golden finger according to claim 7 containing ladder, which is characterized in that in described
Straton plate includes five core plates, the specific manufacturing process of the internal layer daughter board the following steps are included:
S00, internal layer circuit is made on five core plates respectively；
S01, first daughter board is pressed by prepreg and outer copper foil with two pieces of core plates therein, with another two pieces of cores therein
Plate is pressed into the second daughter board by prepreg and outer copper foil；
S02, it drills on the first daughter board and the second daughter board respectively, and hole metallization is made by heavy copper and electric plating of whole board；
Resin is clogged in S03, hole after metallization, the resin of protrusion plate face is then removed by nog plate；
S04, then the surface of resin is made to plate one layer of layers of copper by heavy copper and electric plating of whole board；
S05, internal layer circuit is made on the first daughter board and the second daughter board respectively later；
S06, the first daughter board, the second daughter board and remaining one piece of core plate are pressed together to form inner- electron by prepreg
Plate, and core plate is placed between the first daughter board and the second daughter board.
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| CN114679842A (en) * | 2022-03-02 | 2022-06-28 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of stepped plate with metalized hole of bonding pad in stepped groove |
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| CN115942651A (en) * | 2023-01-10 | 2023-04-07 | 浙江万正电子科技股份有限公司 | Manufacturing method of multilayer ultra-thick copper two-step buried blind hole circuit board |
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| CN110418511A (en) * | 2019-07-23 | 2019-11-05 | 领跃电子科技（珠海）有限公司 | Without lead gold finger galvanizing production method |
| CN111225510A (en) * | 2020-02-27 | 2020-06-02 | 惠州中京电子科技有限公司 | Manufacturing method of 5G optical module golden finger plate |
| CN111225510B (en) * | 2020-02-27 | 2021-12-17 | 惠州中京电子科技有限公司 | Manufacturing method of 5G optical module golden finger plate |
| CN112822878A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Manufacturing method of variable-frequency high-speed printed circuit board |
| CN112822878B (en) * | 2021-01-31 | 2023-07-25 | 惠州中京电子科技有限公司 | Manufacturing method of variable-frequency high-speed printed circuit board |
| CN113939087A (en) * | 2021-09-28 | 2022-01-14 | 东莞康源电子有限公司 | Special step type printed circuit board and manufacturing method thereof |
| CN113939087B (en) * | 2021-09-28 | 2023-07-04 | 东莞康源电子有限公司 | Special step type printed circuit board and manufacturing method thereof |
| CN114679842A (en) * | 2022-03-02 | 2022-06-28 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of stepped plate with metalized hole of bonding pad in stepped groove |
| CN114916140A (en) * | 2022-05-20 | 2022-08-16 | 胜宏科技（惠州）股份有限公司 | Method for etching PCB board by laser assistance |
| CN115942651A (en) * | 2023-01-10 | 2023-04-07 | 浙江万正电子科技股份有限公司 | Manufacturing method of multilayer ultra-thick copper two-step buried blind hole circuit board |
| CN115942651B (en) * | 2023-01-10 | 2023-06-06 | 浙江万正电子科技股份有限公司 | Manufacturing method of multilayer ultra-thick copper two-stage buried blind hole circuit board |
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