CN113939087B

CN113939087B - Special step type printed circuit board and manufacturing method thereof

Info

Publication number: CN113939087B
Application number: CN202111140599.5A
Authority: CN
Inventors: 刘磊; 林乐红; 张义文
Original assignee: Dongguan Hongyuen Electronics Co ltd
Current assignee: Dongguan Hongyuen Electronics Co ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2023-07-04
Anticipated expiration: 2041-09-28
Also published as: CN113939087A

Abstract

A manufacturing method of a special step type printed circuit board comprises the following steps: the inner layer high-density random interconnection processing of the product is completed; manufacturing a photosensitive solder resist film in the step area; pressing the photosensitive solder mask to the inner layer and finishing the last layer of blind hole lamination; finishing the outer layer graph manufacture; cutting to remove the outer copper layer; milling a through groove; the photosensitive solder resist is stripped. According to the invention, through adjusting the process, the step area is covered by the photosensitive solder mask and then the blind holes are overlapped, so that the operation difficulty is reduced, and the photosensitive solder mask can protect the step area more thoroughly; the inner and outer layers are covered with the solder resist ink, so that the solder resist areas of the inner and outer layers are effectively protected; the gong through groove is tangential with the cut bonding PAD, so that the problem of sharp cutting of the bonding PAD is greatly avoided; the photosensitive solder mask is removed by using alkaline liquid medicine, and can be stripped from the PCB to the greatest extent on the premise of ensuring that the PCB body is not damaged; the invention has strong practicability and has stronger popularization significance.

Description

Special step type printed circuit board and manufacturing method thereof

Technical Field

The invention relates to the field of printed circuit board manufacturing processes, in particular to a special step type printed circuit board and a manufacturing method thereof.

Background

A printed circuit board (abbreviated as PCB), also called a printed circuit board, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of the electronic components. Printed boards have evolved from single-layer to double-sided, multi-layer and flexible, and still maintain their respective trends, with High Density Interconnect (HDI) boards being one of the trends today.

Usually, the printed circuit board with steps is manufactured by firstly completing blind hole overlapping holes and then protecting the step areas by using photosensitive solder mask. However, the operation is extremely difficult, and the protection is difficult in place, so that the product qualification rate cannot be ensured.

Disclosure of Invention

Based on this, it is necessary to provide a method for manufacturing a special step-like printed wiring board in order to solve the drawbacks of the prior art.

A manufacturing method of a special step type printed circuit board comprises the following steps:

step 1: the method comprises the steps of completing high-density random interconnection processing of an inner layer of a product, punching through holes on a core substrate layer, filling resin, overlapping a copper foil layer and a PP layer on two sides of the core substrate layer, overlapping, and meanwhile, carrying out blind hole overlapping on the inner layer of the product and manufacturing steps on a surface layer;

step 2: manufacturing a layer of photosensitive solder resist film in the step area, and filling the photosensitive solder resist film into the step area;

step 3: pressing the photosensitive solder mask to the inner layer and finishing the last blind hole stacking, covering the PP layer on the non-photosensitive solder mask area to level the surface layer, covering a copper foil layer to press the photosensitive solder mask to the inner layer, and finishing the blind hole stacking of the last layer;

step 4: finishing the outer layer pattern manufacture, manufacturing steps on the outer layer, and filling solder resist ink in the solder resist area;

step 5: cutting to remove the outer copper layer, cutting off the outer copper foil which is just attached to the photosensitive solder mask area, and exposing the photosensitive solder mask of the step area;

step 6: the through groove is formed in the photosensitive solder mask protection area by adopting a mechanical groove forming method, and bonding PAD is cut while the groove forming method is performed;

step 7: stripping the photosensitive solder mask, and removing the photosensitive solder mask by soaking and corroding with medicinal water.

Further, each of the step 1 and the step 4 includes covering the solder resist ink on the solder resist area of the corresponding layer.

Further, the step 5 adopts a laser cutting mode to remove the outer copper.

Further, the through groove milled in the step 6 is tangential to the cut bonding PAD.

Further, the liquid medicine used in the step 7 is alkaline liquid medicine.

In addition, the invention also provides a special step type printed circuit board.

A special step-like printed wiring board manufactured by any one of the above methods.

In summary, the special step type printed circuit board and the manufacturing method thereof have the beneficial effects that: through the adjustment process, the step area is covered by the photosensitive solder mask and then blind hole overlapping is carried out, so that the operation difficulty is reduced, and the step area is thoroughly protected by the photosensitive solder mask; the inner and outer layers are covered with the solder resist ink, so that the solder resist areas of the inner and outer layers are effectively protected; the gong through groove is tangential with the cut bonding PAD, so that the problem of sharp cutting of the bonding PAD is greatly avoided, and the PCB is more attractive; the photosensitive solder mask is removed by using alkaline liquid medicine, and can be stripped from the PCB to the greatest extent on the premise of ensuring that the PCB body is not damaged; the invention has strong practicability and has stronger popularization significance.

Drawings

Fig. 1 is a process flow diagram of a method for manufacturing a special step-like printed wiring board according to the present invention.

Detailed Description

So that the manner in which the features and advantages of the invention, as well as the manner in which the features and advantages of the invention are attained and can be understood in detail, a more particular description of the invention, briefly summarized below, may be had by reference to the appended drawings and detailed description thereof which follow.

As shown in fig. 1, the invention provides a method for manufacturing a special step type printed circuit board, which comprises the following steps:

step 1: the inner layer high-density random interconnection processing of the product is finished, through holes are punched in the core substrate layer 10 and are filled with resin 20, the copper foil layers 30 and the PP layers 40 are overlapped on the two sides of the core substrate layer 10, blind holes are overlapped on the inner layer of the product, and steps are manufactured on the surface layer;

step 2: manufacturing a layer of photosensitive solder resist film 50 in the step area, and filling the photosensitive solder resist film 50 into the step area;

step 3: pressing the photosensitive solder mask 50 to the inner layer and finishing the last blind hole stacking, covering the PP layer 40 on the non-photosensitive solder mask area to level the surface layer, covering a copper foil layer 30 again to press the photosensitive solder mask 50 to the inner layer and finishing the blind hole stacking of the last layer;

step 4: finishing the outer layer pattern manufacture, manufacturing steps on the outer layer, and filling the solder resist areas with solder resist ink 60;

step 5: cutting to remove the outer copper, cutting off the outer copper foil which is just attached to the region of the photosensitive solder mask 50, and exposing the photosensitive solder mask 50 in the step region;

step 6: routing a through groove, wherein a mechanical routing groove is adopted to route out a through groove 70 in a protection area of the photosensitive solder mask 50, and bonding PAD is cut while the routing groove is cut;

step 7: the photosensitive resist film 50 is stripped, and the photosensitive resist film 50 is removed by immersing and etching with a medicinal water.

Both the step 1 and the step 4 include covering the solder resist areas of the corresponding layers with solder resist ink 60.

And 5, removing the outer copper layer by adopting a laser cutting mode.

And (3) the through groove milled in the step (6) is tangential with the cut bonding PAD.

The liquid medicine used in the step 7 is alkaline liquid medicine.

In addition, the invention also provides a special step type printed circuit board, which is manufactured by adopting any one of the methods.

In summary, the special step type printed circuit board and the manufacturing method thereof have the beneficial effects that: by adjusting the process, the step area is covered by the photosensitive solder mask 50 and then blind hole overlapping is carried out, so that the operation difficulty is reduced, and the photosensitive solder mask 50 can protect the step area more thoroughly; the inner and outer layers are covered with the solder resist ink 60, so that the solder resist areas of the inner and outer layers are effectively protected; the gong through groove 70 is tangential with the cut bonding PAD, so that the problem of sharp cutting of the bonding PAD is greatly avoided, and the PCB is more attractive; the photosensitive solder mask 50 is removed by using alkaline liquid medicine, and the photosensitive solder mask 50 can be stripped from the PCB to the greatest extent on the premise of ensuring that the PCB body is not damaged; the invention has strong practicability and has stronger popularization significance.

The above examples illustrate only one embodiment of the invention, which is described in more detail and is not to be construed as limiting the scope of the invention. It should be noted that variations and modifications can be made by those skilled in the art without departing from the inventive concept, which fall within the scope of the invention. Accordingly, the scope of the invention should be determined from the following claims.

Claims

1. The manufacturing method of the special step type printed circuit board is characterized by comprising the following steps of:

2. The method for manufacturing the special step-like printed wiring board as claimed in claim 1, wherein: and (3) covering the solder resist ink on the solder resist area of the corresponding layer in both the step (1) and the step (4).

3. The method for manufacturing the special step-like printed wiring board as claimed in claim 1, wherein: and 5, removing the outer copper layer by adopting a laser cutting mode.

4. The method for manufacturing the special step-like printed wiring board as claimed in claim 1, wherein: and (3) the through groove milled in the step (6) is tangential with the cut bonding PAD.

5. The method for manufacturing the special step-like printed wiring board as claimed in claim 1, wherein: the liquid medicine used in the step 7 is alkaline liquid medicine.

6. A special step type printed wiring board is characterized in that: the special step-like printed wiring board is manufactured by the method as claimed in any one of claims 1 to 5.