CN111225510B - Manufacturing method of 5G optical module golden finger plate - Google Patents

Manufacturing method of 5G optical module golden finger plate Download PDF

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Publication number
CN111225510B
CN111225510B CN202010124134.XA CN202010124134A CN111225510B CN 111225510 B CN111225510 B CN 111225510B CN 202010124134 A CN202010124134 A CN 202010124134A CN 111225510 B CN111225510 B CN 111225510B
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gold
thickness
nickel
finger
golden finger
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CN111225510A (en
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李清春
刘小刚
刘德威
黄生荣
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Huizhou Zhongjing Electronic Technology Co ltd
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Huizhou Zhongjing Electronic Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention provides a manufacturing method of a 5G optical module golden finger plate, which comprises the following specific steps: the method comprises the steps of the previous procedure, testing, outer layer, anti-welding, character, first pattern, gold-plated finger, laser windowing on a dry film, lead etching, film stripping, second pattern, gold or nickel-palladium-gold, film stripping, forming and the like; and if the golden finger board is processed to be golden finger + OSP, deleting the second graphic flow. The invention adopts twice pattern transfer, saves the flow and the cost, and finishes the gold-plated finger pattern and the etched gold finger lead pattern in one time without dislocation; the influence of the pattern transfer times and the exposure alignment precision on the appearance of the gold finger plate can be effectively reduced.

Description

Manufacturing method of 5G optical module golden finger plate
Technical Field
The invention belongs to the field of PCB (printed circuit board) processing methods, and particularly relates to a manufacturing method of a 5G optical module golden finger plate.
Background
With the rapid development of optical communication, the 'optical copper feeding and withdrawing' is realized in many scenes in work and life. That is, metal medium communication represented by coaxial cables and network cables is gradually replaced by optical fiber media. The optical module is one of core devices of an optical fiber communication system. The optical module operates at the physical layer, i.e., the lowest layer in the OSI model. Its role is said to be simple, namely to achieve photoelectric conversion. Converting an optical signal into an electrical signal and converting an electrical signal into an optical signal.
The golden finger optical module PCB is generally matched with gold or nickel-palladium gold, a golden finger is completed by adopting a pattern for 2 times, a dry film of the golden finger is plated for the first time, and the dry film is developed to expose the golden finger, so that the gold plating operation is facilitated; etching the gold finger lead wire by the 2 nd pattern, exposing the gold finger lead wire, and removing the lead wire part by alkaline etching liquid; and (3) shielding the golden finger by using the dry film for the 3 rd time, and exposing the pattern needing other surface treatment after exposure and development. However, since the number of pattern transfers involves a large number of pattern registration times, the exposure tends to be shifted.
Disclosure of Invention
In view of the above, the invention provides a method for manufacturing a 5G optical module gold finger plate, which adopts two-time pattern transfer, saves the flow and the cost, and completes the gold-plated finger pattern and the etched gold finger lead pattern in one test without dislocation; the influence of the pattern transfer times and the exposure alignment precision on the appearance of the gold finger plate can be effectively reduced.
The technical scheme of the invention is as follows:
a manufacturing method of a 5G optical module golden finger plate is characterized by comprising the following specific steps: the method comprises the steps of the previous procedure, testing, outer layer, anti-welding, character, first pattern, gold-plated finger, laser windowing on a dry film, lead etching, film stripping, second pattern, gold or nickel-palladium-gold, film stripping, forming and the like; and if the golden finger board is processed to be golden finger + OSP, deleting the second graphic flow.
According to the invention, on the basis of the first pattern transfer, the dry film pattern is windowed by adopting laser to expose the golden finger lead, so that one pattern transfer is reduced, and the exposure alignment influence of the former two pattern transfers is reduced.
Further, the former process includes performing a preliminary processing treatment on the initial plate.
Further, the outer layer process comprises the steps of filling photosensitive ink on holes to be protected on the circuit board and/or a preset golden finger area on the surface of the circuit board, wherein the thickness of the photosensitive ink is 5-15 mu m; at 100-2Carrying out exposure under the condition; and developing, etching and stripping the exposed circuit board to form an outer layer circuit of the circuit board.
Further, the solder mask process comprises the steps of coating a specific area with resin protection, using the specific area as an insulation part or a marking part, and coating solder mask ink on the plate, wherein the thickness of the solder mask ink is 5-15 mu m.
Further, the character flow comprises the steps of coating a character base layer on the surface of the circuit board and forming a character layer on the surface of the character base layer through silk-screen printing by using ink.
Further, the first pattern process comprises the step of forming a thickened copper layer on the surface of the outer layer circuit pattern in an acid copper electroplating mode, wherein the thickness of the copper layer is 35-55 microns.
Furthermore, the gold-plating finger process comprises the step of plating nickel gold with the required thickness on the position of the gold finger, wherein the nickel thickness is 50-80 mu m and the gold thickness is 4-8 mu m when the nickel gold is electroplated.
Furthermore, the dry film upward laser windowing process comprises the steps of shielding the circuit and the golden finger inside the circuit board by using a dry film, wherein the thickness of the dry film is 2.5mil, and the lead position is exposed; and windowing the dry film graph by laser to expose the golden finger lead.
Further, the lead etching and film stripping process comprises the steps of utilizing alkaline etching liquid medicine to bite the lead in the non-gold-plated area at the golden finger segmentation section, and stripping the dry film.
Further, the second graphic process comprises electroplating corresponding hole copper and surface copper on the drilled plate according to the requirements of customers.
Further, the gold plating process comprises the step of plating the bonding pad in the plate with nickel gold or nickel palladium gold with the required thickness through a gold plating process; the nickel thickness in the nickel layer is as follows: 100-; in the nickel-palladium gold layer, the thickness of nickel is as follows: 100-200 μm, the palladium thickness is 50-80 μm, and the gold thickness is 1-3 μm.
Further, the forming process comprises the step of cutting the circuit board subjected to film removal into a specified shape by using a CNC (computer numerical control) forming machine.
Furthermore, the test comprises electrical detection, and the electrical detection is to perform short circuit and open circuit electrical detection on the formed circuit board by using a detection machine and a jig.
The invention adopts twice pattern transfer, saves the flow and the cost, and finishes the gold-plated finger pattern and the etched gold finger lead pattern in one time without dislocation; the influence of the pattern transfer times and the exposure alignment precision on the appearance of the gold finger plate can be effectively reduced.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A manufacturing method of a 5G optical module golden finger plate is characterized by comprising the following specific steps: the method comprises the steps of the previous procedure, testing, outer layer, anti-welding, character, first pattern, gold-plated finger, laser windowing on a dry film, lead etching, film stripping, second pattern, gold or nickel-palladium-gold, film stripping, forming and the like; and if the golden finger board is processed to be golden finger + OSP, deleting the second graphic flow.
According to the invention, on the basis of the first pattern transfer, the dry film pattern is windowed by adopting laser to expose the golden finger lead, so that one pattern transfer is reduced, and the exposure alignment influence of the former two pattern transfers is reduced.
Further, the former process includes performing a preliminary processing treatment on the initial plate.
Further, the outer layer process comprises the steps of filling photosensitive ink on holes to be protected on the circuit board and/or a preset golden finger area on the surface of the circuit board, wherein the thickness of the photosensitive ink is 10 microns; at 200mJ/cm2Carrying out exposure under the condition; and developing, etching and stripping the exposed circuit board to form an outer layer circuit of the circuit board.
Further, the solder mask process comprises the steps of coating a specific area with resin protection, using the specific area as an insulation part or a marking part, and coating solder mask ink on the plate, wherein the thickness of the solder mask ink is 10 μm.
Further, the character flow comprises the steps of coating a character base layer on the surface of the circuit board and forming a character layer on the surface of the character base layer through silk-screen printing by using ink.
Further, the first pattern process comprises the step of forming a thickened copper layer on the surface of the outer layer circuit pattern in an acid copper electroplating mode, wherein the thickness of the copper layer is 45 microns.
Furthermore, the gold-plating finger process comprises the step of plating nickel gold with the required thickness on the gold finger part, wherein the nickel thickness is 70 μm and the gold thickness is 6 μm when the nickel gold is electroplated.
Furthermore, the dry film upward laser windowing process comprises the steps of shielding the circuit and the golden finger inside the circuit board by using a dry film, wherein the thickness of the dry film is 2.5mil, and the lead position is exposed; and windowing the dry film graph by laser to expose the golden finger lead.
Further, the lead etching and film stripping process comprises the steps of utilizing alkaline etching liquid medicine to bite the lead in the non-gold-plated area at the golden finger segmentation section, and stripping the dry film.
Further, the second graphic process comprises electroplating corresponding hole copper and surface copper on the drilled plate according to the requirements of customers.
Further, the gold plating process comprises the step of plating the bonding pad in the plate with nickel and gold with the required thickness through the gold plating process; the nickel thickness in the nickel layer is as follows: 150 μm and a gold thickness of 7 μm.
Further, the forming process comprises the step of cutting the circuit board subjected to film removal into a specified shape by using a CNC (computer numerical control) forming machine.
Furthermore, the test comprises electrical detection, and the electrical detection is to perform short circuit and open circuit electrical detection on the formed circuit board by using a detection machine and a jig.
The invention adopts twice pattern transfer, saves the flow and the cost, and finishes the gold-plated finger pattern and the etched gold finger lead pattern in one time without dislocation; the influence of the pattern transfer times and the exposure alignment precision on the appearance of the gold finger plate can be effectively reduced.
Example 2
A manufacturing method of a 5G optical module golden finger plate is characterized by comprising the following specific steps: the method comprises the steps of the previous procedure, testing, outer layer, anti-welding, character, first pattern, gold-plated finger, laser windowing on a dry film, lead etching, film stripping, second pattern, gold or nickel-palladium-gold, film stripping, forming and the like; and if the golden finger board is processed to be golden finger + OSP, deleting the second graphic flow.
According to the invention, on the basis of the first pattern transfer, the dry film pattern is windowed by adopting laser to expose the golden finger lead, so that one pattern transfer is reduced, and the exposure alignment influence of the former two pattern transfers is reduced.
Further, the former process includes performing a preliminary processing treatment on the initial plate.
Further, the outer layer process comprises the steps of filling photosensitive ink on holes to be protected on the circuit board and/or a preset golden finger area on the surface of the circuit board, wherein the thickness of the photosensitive ink is 12 microns; at 180mJ/cm2Carrying out exposure under the condition; and developing, etching and stripping the exposed circuit board to form an outer layer circuit of the circuit board.
Further, the solder mask process comprises the steps of coating a specific area with resin protection, using the specific area as an insulation part or a marking part, and coating solder mask ink on the plate, wherein the thickness of the solder mask ink is 8 μm.
Further, the character flow comprises the steps of coating a character base layer on the surface of the circuit board and forming a character layer on the surface of the character base layer through silk-screen printing by using ink.
Further, the first pattern process comprises the step of forming a thickened copper layer on the surface of the outer layer circuit pattern in an acid copper electroplating mode, wherein the thickness of the copper layer is 50 microns.
Furthermore, the gold-plating finger process comprises the step of plating nickel gold with the required thickness on the gold finger part, wherein the nickel thickness is 65 μm and the gold thickness is 5 μm when the nickel gold is electroplated.
Furthermore, the dry film upward laser windowing process comprises the steps of shielding the circuit and the golden finger inside the circuit board by using a dry film, wherein the thickness of the dry film is 2.5mil, and the lead position is exposed; and windowing the dry film graph by laser to expose the golden finger lead.
Further, the lead etching and film stripping process comprises the steps of utilizing alkaline etching liquid medicine to bite the lead in the non-gold-plated area at the golden finger segmentation section, and stripping the dry film.
Further, the second graphic process comprises electroplating corresponding hole copper and surface copper on the drilled plate according to the requirements of customers.
Further, the gold plating process comprises the step of plating the bonding pad in the plate with nickel-palladium-gold with the required thickness through a gold plating process; in the nickel-palladium gold layer, the thickness of nickel is as follows: 160 μm, 65 μm palladium and 2 μm gold.
Further, the forming process comprises the step of cutting the circuit board subjected to film removal into a specified shape by using a CNC (computer numerical control) forming machine.
Furthermore, the test comprises electrical detection, and the electrical detection is to perform short circuit and open circuit electrical detection on the formed circuit board by using a detection machine and a jig.
The invention adopts twice pattern transfer, saves the flow and the cost, and finishes the gold-plated finger pattern and the etched gold finger lead pattern in one time without dislocation; the influence of the pattern transfer times and the exposure alignment precision on the appearance of the gold finger plate can be effectively reduced.
Example 3
A manufacturing method of a 5G optical module golden finger plate is characterized by comprising the following specific steps: the method comprises the steps of the previous procedure, testing, outer layer, anti-welding, character, first pattern, gold-plated finger, laser windowing on a dry film, lead etching, film stripping, second pattern, gold or nickel-palladium-gold, film stripping, forming and the like; and if the golden finger board is processed to be golden finger + OSP, deleting the second graphic flow.
According to the invention, on the basis of the first pattern transfer, the dry film pattern is windowed by adopting laser to expose the golden finger lead, so that one pattern transfer is reduced, and the exposure alignment influence of the former two pattern transfers is reduced.
Further, the former process includes performing a preliminary processing treatment on the initial plate.
Further, the outer layer process comprises the steps of filling photosensitive ink on holes to be protected on the circuit board and/or a preset golden finger area on the surface of the circuit board, wherein the thickness of the photosensitive ink is 5 microns; at 100mJ/cm2Carrying out exposure under the condition; and developing, etching and stripping the exposed circuit board to form an outer layer circuit of the circuit board.
Further, the solder mask process comprises the steps of coating a specific area with resin protection, using the specific area as an insulation part or a marking part, and coating solder mask ink on the plate, wherein the thickness of the solder mask ink is 5 μm.
Further, the character flow comprises the steps of coating a character base layer on the surface of the circuit board and forming a character layer on the surface of the character base layer through silk-screen printing by using ink.
Further, the first pattern process comprises the step of forming a thickened copper layer on the surface of the outer layer circuit pattern in an acid copper electroplating mode, wherein the thickness of the copper layer is 35 microns.
Furthermore, the gold-plating finger process comprises the step of plating nickel gold with the required thickness on the gold finger part, wherein the nickel thickness is 50 microns and the gold thickness is 4 microns when the nickel gold is electroplated.
Furthermore, the dry film upward laser windowing process comprises the steps of shielding the circuit and the golden finger inside the circuit board by using a dry film, wherein the thickness of the dry film is 2.5mil, and the lead position is exposed; and windowing the dry film graph by laser to expose the golden finger lead.
Further, the lead etching and film stripping process comprises the steps of utilizing alkaline etching liquid medicine to bite the lead in the non-gold-plated area at the golden finger segmentation section, and stripping the dry film.
Further, the second graphic process comprises electroplating corresponding hole copper and surface copper on the drilled plate according to the requirements of customers.
Further, the gold plating process comprises the step of plating the bonding pad in the plate with nickel and gold with the required thickness through the gold plating process; the nickel thickness in the nickel layer is as follows: 100 μm, 5 μm thick; .
Further, the forming process comprises the step of cutting the circuit board subjected to film removal into a specified shape by using a CNC (computer numerical control) forming machine.
Furthermore, the test comprises electrical detection, and the electrical detection is to perform short circuit and open circuit electrical detection on the formed circuit board by using a detection machine and a jig.
The invention adopts twice pattern transfer, saves the flow and the cost, and finishes the gold-plated finger pattern and the etched gold finger lead pattern in one time without dislocation; the influence of the pattern transfer times and the exposure alignment precision on the appearance of the gold finger plate can be effectively reduced.
Example 4
A manufacturing method of a 5G optical module golden finger plate is characterized by comprising the following specific steps: the method comprises the steps of the previous procedure, testing, outer layer, anti-welding, character, first pattern, gold-plated finger, laser windowing on a dry film, lead etching, film stripping, second pattern, gold or nickel-palladium-gold, film stripping, forming and the like; and if the golden finger board is processed to be golden finger + OSP, deleting the second graphic flow.
According to the invention, on the basis of the first pattern transfer, the dry film pattern is windowed by adopting laser to expose the golden finger lead, so that one pattern transfer is reduced, and the exposure alignment influence of the former two pattern transfers is reduced.
Further, the former process includes performing a preliminary processing treatment on the initial plate.
Further, the outer layer process comprises the steps of filling photosensitive ink on holes to be protected on the circuit board and/or a preset golden finger area on the surface of the circuit board, wherein the thickness of the photosensitive ink is 15 microns; at 300mJ/cm2Carrying out exposure under the condition; and developing, etching and stripping the exposed circuit board to form an outer layer circuit of the circuit board.
Further, the solder mask process comprises the steps of coating a specific area with resin protection, using the specific area as an insulation part or a marking part, and coating solder mask ink on the plate, wherein the thickness of the solder mask ink is 15 μm.
Further, the character flow comprises the steps of coating a character base layer on the surface of the circuit board and forming a character layer on the surface of the character base layer through silk-screen printing by using ink.
Further, the first pattern process comprises the step of forming a thickened copper layer on the surface of the outer layer circuit pattern in an acid copper electroplating mode, wherein the thickness of the copper layer is 55 microns.
Furthermore, the gold-plating finger process comprises the step of plating nickel gold with the required thickness on the gold finger part, wherein the nickel thickness is 80 microns and the gold thickness is 8 microns when the nickel gold is electroplated.
Furthermore, the dry film upward laser windowing process comprises the steps of shielding the circuit and the golden finger inside the circuit board by using a dry film, wherein the thickness of the dry film is 2.5mil, and the lead position is exposed; and windowing the dry film graph by laser to expose the golden finger lead.
Further, the lead etching and film stripping process comprises the steps of utilizing alkaline etching liquid medicine to bite the lead in the non-gold-plated area at the golden finger segmentation section, and stripping the dry film.
Further, the second graphic process comprises electroplating corresponding hole copper and surface copper on the drilled plate according to the requirements of customers.
Further, the gold plating process comprises the step of plating the bonding pad in the plate with nickel-palladium-gold with the required thickness through a gold plating process; in the nickel-palladium gold layer, the thickness of nickel is as follows: 200 μm, palladium 80 μm thick and gold 3 μm thick.
Further, the forming process comprises the step of cutting the circuit board subjected to film removal into a specified shape by using a CNC (computer numerical control) forming machine.
Furthermore, the test comprises electrical detection, and the electrical detection is to perform short circuit and open circuit electrical detection on the formed circuit board by using a detection machine and a jig.
The invention adopts twice pattern transfer, saves the flow and the cost, and finishes the gold-plated finger pattern and the etched gold finger lead pattern in one time without dislocation; the influence of the pattern transfer times and the exposure alignment precision on the appearance of the gold finger plate can be effectively reduced.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.

Claims (3)

1. A manufacturing method of a 5G optical module golden finger plate is characterized by comprising the following specific steps: the method comprises the steps of the previous procedure, testing, outer layer, anti-welding, character, first pattern, gold-plated finger, laser windowing on a dry film, lead etching, film stripping, second pattern, gold or nickel-palladium-gold, film stripping, forming and the like; if the golden finger board is processed to be golden finger + OSP, deleting the second graphic process;
the outer layer process comprises the steps of filling photosensitive ink on holes to be protected on the circuit board and/or a preset golden finger area on the surface of the circuit board, wherein the thickness of the photosensitive ink is 5-15 mu m; at 100-2Carrying out exposure under the condition; developing, etching and stripping the exposed circuit board to form an outer circuit of the circuit board;
the solder mask process comprises the steps of coating resin protection on a specific area, using the specific area as an insulation part or a marking part, and coating solder mask ink on a plate, wherein the thickness of the solder mask ink is 5-15 mu m;
the character flow comprises the steps of coating a character base layer on the surface of the circuit board, and forming a character layer on the surface of the character base layer by silk-screen printing with ink;
the first graphic process comprises the steps of forming a thickened copper layer on the surface of the outer layer circuit graphic in an acid copper electroplating mode, wherein the thickness of the copper layer is 35-55 mu m;
the gold plating finger process comprises the steps of plating nickel gold with required thickness on the gold finger part, wherein the nickel thickness is 50-80 mu m and the gold thickness is 4-8 mu m when the nickel gold is electroplated;
the dry film upward laser windowing process comprises the steps that a dry film is used for shielding the internal circuit and the golden finger of the circuit board, the thickness of the dry film is 2.5mil, and the lead position is exposed; windowing the dry film graph by laser to expose the golden finger lead;
the lead etching and film stripping process comprises the steps of utilizing alkaline etching liquid medicine to bite the lead positioned in the non-gold-plated area at the golden finger subsection, and stripping the dry film.
2. The method for manufacturing the 5G optical module golden finger plate as claimed in claim 1, wherein the second graphic process comprises electroplating corresponding hole copper and surface copper on the drilled plate according to customer requirements.
3. The manufacturing method of the 5G optical module gold finger plate as claimed in claim 1, wherein the gold plating process comprises plating a pad in the plate with nickel gold or nickel palladium gold with a required thickness through a gold plating process; the nickel thickness in the nickel layer is as follows: 100-; in the nickel-palladium gold layer, the thickness of nickel is as follows: 100-200 μm, the palladium thickness is 50-80 μm, and the gold thickness is 1-3 μm.
CN202010124134.XA 2020-02-27 2020-02-27 Manufacturing method of 5G optical module golden finger plate Active CN111225510B (en)

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CN114302560A (en) * 2021-11-23 2022-04-08 江苏博敏电子有限公司 Surface treatment combined processing technology for printed circuit board

Citations (3)

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Publication number Priority date Publication date Assignee Title
KR20110002893A (en) * 2009-06-29 2011-01-11 주식회사 하이닉스반도체 Fabricating method for printed circuit board of memory card
CN108174510A (en) * 2017-12-29 2018-06-15 深圳欣强智创电路板有限公司 A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger
CN108966532A (en) * 2018-08-20 2018-12-07 深圳崇达多层线路板有限公司 A kind of production method of three rank HDI plates of the golden finger containing ladder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110002893A (en) * 2009-06-29 2011-01-11 주식회사 하이닉스반도체 Fabricating method for printed circuit board of memory card
CN108174510A (en) * 2017-12-29 2018-06-15 深圳欣强智创电路板有限公司 A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger
CN108966532A (en) * 2018-08-20 2018-12-07 深圳崇达多层线路板有限公司 A kind of production method of three rank HDI plates of the golden finger containing ladder

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