CN109673106B - Method and device for manufacturing substrate for embedded circuit - Google Patents
Method and device for manufacturing substrate for embedded circuit Download PDFInfo
- Publication number
- CN109673106B CN109673106B CN201811592959.3A CN201811592959A CN109673106B CN 109673106 B CN109673106 B CN 109673106B CN 201811592959 A CN201811592959 A CN 201811592959A CN 109673106 B CN109673106 B CN 109673106B
- Authority
- CN
- China
- Prior art keywords
- metal layer
- dry film
- covered
- electroplated
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method and a device for manufacturing a substrate for an embedded circuit, wherein the method comprises the following steps: covering two sides of the core plate with metal layers respectively; covering a first preset area of the metal layer by using a dry film, so that at least part of the metal layer is not covered by the dry film, wherein the first preset area comprises an area needing to be electroplated; removing the part of the metal layer, which is not covered by the dry film, so that the core board corresponding to the part of the metal layer, which is not covered by the dry film, is exposed; exposing the area needing electroplating on the metal layer; electroplating the exposed areas of the core plate and the metal layer which need to be electroplated; and removing the dry film on the metal layer. According to the scheme provided by the invention, the electroplated layer is formed on the edge of the core plate and is used for sealing and protecting the metal layer, so that the metal layer is prevented from being damaged or displaced due to external force in the production process, the traditional Chinese medicine water in subsequent production is prevented from permeating between the metal layer and the core plate, and the product yield is improved.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method and a device for manufacturing a substrate for an embedded circuit.
Background
With the development of the information society, the amount of information processing of various electronic devices is increasing day by day, and the demand for high-frequency and high-speed signal transmission is also increasing day by day. The semiconductor electronic element is embedded in the printed circuit board, so that the line length among the elements can be shortened, the electrical characteristic is improved, the powerful guarantee is provided for high-frequency and high-speed signal transmission, meanwhile, the effective packaging area of the printed circuit board is increased, a large number of welding points on the surface of the printed circuit board are reduced, the packaging reliability is improved, and the cost is reduced.
When a substrate of an existing embedded circuit board is manufactured, a metal layer is usually covered on each of two side surfaces of a core board, and then a metal groove is plated on the metal layer. Generally, the area of the metal layer is equal to the area of the core plate, that is, the edge of the metal layer coincides with the edge of the core plate, which may easily cause damage or separation of the metal layer from the core plate due to external impact during the production process, and further cause the liquid medicine to enter the area where the metal layer coincides with the core plate through the damaged part of the metal layer or the separated part of the core plate during the subsequent production process, thereby causing abnormal product quality.
Therefore, how to manufacture the embedded circuit board with stable quality, increase the production yield and reduce the production cost is a technical problem of long-term research by those skilled in the art.
Disclosure of Invention
In order to overcome the defects in the prior art, embodiments of the present invention provide a method and an apparatus for manufacturing a substrate for an embedded circuit, which are used to solve at least one of the above problems.
The embodiment of the application discloses: a manufacturing method of a substrate for an embedded circuit comprises the following steps:
covering two sides of the core plate with metal layers respectively;
covering a first preset area of the metal layer by using a dry film, so that at least part of the metal layer is not covered by the dry film, wherein the first preset area comprises an area needing to be electroplated;
removing the part of the metal layer, which is not covered by the dry film, so that the core board corresponding to the part of the metal layer, which is not covered by the dry film, is exposed;
exposing the area needing electroplating on the metal layer;
electroplating the exposed areas of the core plate and the metal layer which need to be electroplated;
and removing the dry film on the metal layer.
Specifically, the step of exposing the area to be electroplated on the metal layer includes:
and removing a second preset area of the dry film attached on the metal layer, wherein the second preset area corresponds to an area needing to be electroplated on the metal layer.
Specifically, the step of exposing the area to be electroplated on the metal layer includes:
removing the dry film adhered on the metal layer;
and pasting another dry film on the metal layer, wherein the other dry film only covers the region which is not required to be electroplated on the metal layer.
Specifically, the metal layer includes a copper foil, a nickel foil, a silver foil or a gold foil.
Specifically, in the step of removing the edge portion of the metal layer to expose the core board corresponding to the edge of the metal layer, the method of removing the edge portion of the metal layer includes etching.
The embodiment of the invention also discloses a manufacturing device of the embedded circuit substrate, which comprises a film pasting device for pasting the dry film on the metal layer, a metal removing device for removing part of the metal layer, an electroplating device for electroplating the metal layer and the core plate and a film removing device for removing the dry film on the metal layer.
Compared with the prior art, the invention has the following beneficial effects: according to the manufacturing method of the embedded circuit substrate, before the metal layer is electroplated, the edge part of the metal layer is removed to expose the core board corresponding to the edge part, when the metal layer is electroplated, an electroplated layer formed on the exposed core board can play a role in sealing and protecting the metal layer, the metal layer is prevented from being directly impacted by external force, the metal layer is prevented from being damaged or separated from the core board, the phenomenon that the quality of a product is influenced due to the fact that traditional Chinese medicine water in subsequent production permeates into the overlapped area of the metal layer and the core board is avoided, and the yield of the product is improved.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view of a core board and a metal layer in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a dry film structure according to an embodiment of the present invention;
FIG. 3 is a schematic view of an embodiment of the present invention with the edge of the metal layer removed;
FIG. 4 is a schematic diagram of a dry film for removing the area of the metal layer requiring electroplating according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an embodiment of the present invention after electroplating a core board and a metal layer;
FIG. 6 is a schematic diagram of the dry film removal after electroplating according to an embodiment of the present invention.
Reference numerals of the above figures: 10-core plate, 20-metal layer, 21-middle area, 22-edge, 30-dry film, 40-electroplated layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, a method for manufacturing a substrate for an embedded circuit according to an embodiment of the present invention includes the following steps:
as shown in fig. 1, both sides of the core 10 are covered with the metal layers 20, specifically, the core 10 is substantially rectangular, and the shape and size of the metal layers 20 substantially correspond to those of the core 10, so as to ensure accurate alignment of the metal layers 20 when the core 10 is stacked. The metal layer 20 includes a first preset region, the first preset region includes a region where the metal layer 20 needs to be electroplated, specifically, the metal layer 20 includes a middle region 21 and an edge 22 which are connected, and the first preset region is overlapped with the middle region 21 of the metal layer 20;
as shown in fig. 2, a first predetermined area of the metal layer 20, i.e., the middle area 21, is covered with a dry film 30 such that at least a portion of the metal layer 20 (i.e., the edge 22 of the metal layer 20) is not covered by the dry film 30. Preferably, a dry film 30 is centered on the middle region 21 of the metal layer 20, the dry film 30 having etching and plating resistance;
as shown in fig. 3, removing the edge 22 of the metal layer 20 to expose the core board 10 corresponding to the portion of the metal layer 20 not covered by the dry film 30 (i.e., the core board corresponding to the edge 22 of the metal layer 20 in this embodiment);
as shown in fig. 4, the area of the metal layer 20 to be plated is exposed;
as shown in fig. 5, electroplating is performed on the exposed core board 10 and the areas of the metal layer 20 that need to be electroplated, so as to generate an electroplated layer 40;
as shown in fig. 6, the dry film 30 on the metal layer 20 is removed, so that a groove for embedding the component is formed between two adjacent electroplated layers 40 formed on the metal layer 20 and the metal layer 20, and the exposed electroplated layer 40 formed on the core board 10 plays a role of edge sealing protection for the metal layer 20, so as to prevent the metal layer 20 from being directly impacted by an external force, thereby preventing the metal layer 20 from being damaged or separated from the core board 10, and preventing the traditional Chinese medicine water from permeating into the overlapped area of the metal layer 20 and the core board 10 in the subsequent production to affect the product quality.
By adopting the above scheme, in the method for manufacturing the embedded circuit substrate according to the embodiment of the invention, before the metal layer 20 is electroplated, the edge 22 of the metal layer 20 is partially removed to expose the core board 10 corresponding to the edge, when the metal layer 20 is electroplated, the exposed electroplated layer 40 formed on the core board 10 can perform an edge sealing protection function on the metal layer 10, so that the metal layer 20 is prevented from being directly impacted by an external force, the metal layer 20 is prevented from being damaged or separated from the core board 10, the phenomenon that the quality of a product is affected due to the fact that traditional Chinese medicine water in subsequent production permeates into the overlapped area of the metal layer 20 and the core board 10 is prevented, and the yield of the product is improved.
Specifically, the step of "exposing the area to be plated on the metal layer 20" includes two methods:
first, a second preset region of the dry film 30, which is already attached to the metal layer 20, is removed, and the second preset region corresponds to a region where the metal layer needs to be plated.
Secondly, removing the dry film 30 attached on the metal layer 20; another dry film 30 is attached on the metal layer 20, and the other dry film 30 only covers the region of the metal layer 20 where no electroplating is needed. The second method can prevent the etching solution remained on the dry film 30 from entering into the electroplating solution after the edge 22 of the metal layer 20 is removed by etching, which affects the quality of the electroplating solution.
Specifically, the metal layer 20 includes a copper foil, a nickel foil, a silver foil, or a gold foil to ensure good conductivity of the circuit.
Specifically, in the step of removing the edge 22 portion of the metal layer 20 to expose the core 10 corresponding to the edge 22 of the metal layer 20, the method of removing the edge 22 portion of the metal layer 20 includes etching, that is, etching away the edge 22 of the metal layer 20 not covered by the dry film 30 to expose the core 10 corresponding to the edge 22.
In addition, the embodiment of the invention also includes a manufacturing device of the substrate for the embedded circuit, which comprises a film pasting device for pasting the dry film 30 on the metal layer 20, a metal removing device for removing part of the metal layer 20, an electroplating device for electroplating the metal layer 20 and the core plate 10, and a film removing device for removing the dry film 30 on the metal layer 20.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (6)
1. A method for manufacturing a substrate for an embedded circuit, comprising the steps of:
covering two sides of the core plate with metal layers respectively;
covering a first preset area of a metal layer by using a dry film so that at least part of the metal layer is not covered by the dry film, wherein the first preset area comprises an area needing to be electroplated, and the part of the metal layer which is not covered by the dry film comprises an edge part of the metal layer;
removing the part of the metal layer, which is not covered by the dry film, so that the core board corresponding to the part of the metal layer, which is not covered by the dry film, is exposed;
exposing the area needing electroplating on the metal layer;
electroplating the exposed core plate and the region needing to be electroplated on the metal layer to form a metal groove for embedding the semiconductor electronic element on the metal layer;
and removing the dry film on the metal layer.
2. The method as claimed in claim 1, wherein the step of exposing the area of the metal layer to be plated comprises:
and removing a second preset area of the dry film attached on the metal layer, wherein the second preset area corresponds to an area needing to be electroplated on the metal layer.
3. The method as claimed in claim 1, wherein the step of exposing the area of the metal layer to be plated comprises:
removing the dry film adhered on the metal layer;
and pasting another dry film on the metal layer, wherein the other dry film only covers the region which is not required to be electroplated on the metal layer.
4. The method of manufacturing a substrate for an embedded circuit as set forth in claim 1, wherein the metal layer comprises a copper foil, a nickel foil, a silver foil, or a gold foil.
5. The method of claim 1, wherein the step of removing the portion of the metal layer not covered with the dry film to expose the core corresponding to the portion of the metal layer not covered with the dry film includes etching.
6. The utility model provides a preparation facilities of base plate for embedded circuit, the base plate for embedded circuit includes the core and covers the metal level of core both sides, its characterized in that includes the pad pasting device that is used for pasting the dry film on the metal level, the device that removes that is used for removing some metal level, the electroplating device that is used for electroplating metal level and core and the device that removes the membrane of removing the dry film on the metal level, wherein:
the film pasting device is used for covering a dry film in a first preset area of a metal layer, so that at least part of the metal layer is not covered by the dry film, wherein the first preset area comprises an area needing to be electroplated, and the part of the metal layer which is not covered by the dry film comprises the edge part of the metal layer;
the metal removing device is used for removing the part, which is not covered by the dry film, of the metal layer so as to expose the core plate corresponding to the part, which is not covered by the dry film, of the metal layer;
the electroplating device is used for electroplating the exposed core plate and the region needing to be electroplated on the metal layer, so that a metal groove used for embedding the semiconductor electronic element is formed on the metal layer;
the film removing device is used for removing a dry film on a region needing to be electroplated on the metal layer and/or removing the dry film on the electroplated metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811592959.3A CN109673106B (en) | 2018-12-25 | 2018-12-25 | Method and device for manufacturing substrate for embedded circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811592959.3A CN109673106B (en) | 2018-12-25 | 2018-12-25 | Method and device for manufacturing substrate for embedded circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109673106A CN109673106A (en) | 2019-04-23 |
| CN109673106B true CN109673106B (en) | 2020-06-30 |
Family
ID=66147189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811592959.3A Active CN109673106B (en) | 2018-12-25 | 2018-12-25 | Method and device for manufacturing substrate for embedded circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109673106B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447745A (en) * | 2020-04-29 | 2020-07-24 | 苏州群策科技有限公司 | Preparation method of embedded circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050064222A1 (en) * | 2003-09-18 | 2005-03-24 | Russell Miles Justin | Component and method for manufacturing printed circuit boards |
| KR100729046B1 (en) * | 2005-12-09 | 2007-06-14 | 삼성에스디아이 주식회사 | static electricity discharge structure for organic display device and fabricating method of there |
| CN107148153A (en) * | 2017-06-29 | 2017-09-08 | 珠海杰赛科技有限公司 | The preparation method and device of a kind of printed circuit board |
| CN107817774B (en) * | 2017-11-21 | 2019-12-17 | 吉安市满坤科技有限公司 | intelligent manufacturing process of printed circuit board |
-
2018
- 2018-12-25 CN CN201811592959.3A patent/CN109673106B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109673106A (en) | 2019-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102208389B (en) | Semiconductor package, substrate and manufacturing method thereof | |
| WO2015085933A1 (en) | Method for manufacturing leadless printed circuit board locally plated with hard gold | |
| CN104918421A (en) | Manufacturing method for PCB golden finger | |
| US20140054785A1 (en) | Chip package structure and method for manufacturing same | |
| US20090095508A1 (en) | Printed circuit board and method for manufacturing the same | |
| CN102244985A (en) | Processing method of surface-mounted pads on thick copper circuit board | |
| TW379429B (en) | Lead frame, the manufacturing method, semiconductor device and the manufacturing method | |
| CN104241231A (en) | Chip packaging substrate and manufacturing method thereof | |
| CN103489796B (en) | The manufacture method of element built-in type semiconductor package | |
| CN109673106B (en) | Method and device for manufacturing substrate for embedded circuit | |
| CN105451454A (en) | Fabrication method of gold-plated finger board | |
| KR100346899B1 (en) | A Semiconductor device and a method of making the same | |
| CN102136459B (en) | Packaging structure and manufacture method thereof | |
| KR20170041530A (en) | Printed circuit board and method of manufacturing the same | |
| KR20100041980A (en) | Printed circuit board having embedded electronic component and method of manufacturing the same | |
| KR102141102B1 (en) | Method for manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same | |
| KR20100011818A (en) | Printed circuit board and method of fabricating the same and method for fabricating memory card | |
| CN101990791B (en) | Printed circuit board and method of manufacturing the same | |
| CN107658286B (en) | Substrate for mounting semiconductor element, semiconductor device, and method for manufacturing semiconductor device | |
| CN111447745A (en) | Preparation method of embedded circuit board | |
| CN112349603A (en) | Manufacturing method of power device, power device and electronic equipment | |
| CN103037625B (en) | With chip window printed substrate remove short-circuiting method | |
| TWI768919B (en) | Circuit board and method for manufacturing the same | |
| CN113286440B (en) | Lead frame and manufacturing method thereof | |
| CN103391691B (en) | Circuit board and manufacture method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |